P1010NXN5FFA557 - QorIQ P1 667MHz e500v2 MPU | NXP
N.º de pieza: P1010NXN5FFA557 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.65 | $346,50 |
| 100 | $30.8 | $3.080,00 |
| 500 | $27.45 | $13.725,00 |
| 1.000 | $24.95 | $24.950,00 |
P1010NXN5FFA557 Descripción general
A microprocessor (MPU) is the central processing unit of an embedded computing system, executing instruction streams, managing memory, and orchestrating peripherals. Within the broader system hierarchy, an MPU sits at the top of the compute stack above memory (DDR, Flash), interfaces (Ethernet, USB, PCIe), and analog/RF blocks. The QorIQ P1 series specifically balances single-core performance with very low power consumption for fanless embedded designs.
Key features of the P1010NXN5FFA557 include a PowerPC e500v2 core with dual-issue superscalar pipeline, integrated security engine, multiple Gigabit Ethernet controllers, and flexible high-speed serial interfaces. The 425-TEPBGA I package is a 19x19 mm fine-pitch BGA optimized for multi-layer PCB designs with high-speed signal escape. Industrial temperature screening supports -40C to +105C operation, enabling deployment in uncontrolled enclosures.
Architecturally, the P1010NXN5FFA557 leverages the e500v2 Book E instruction set with hardware MMU and L1/L2 cache, plus NXP's Data Path Acceleration Architecture (DPAA) primitives for efficient packet processing. Integrated SEC crypto engines handle IPsec, SSL/TLS, and MACsec at line rate, while the DDR3/3L controller with ECC supports up to 800 MT/s for memory-bound workloads.
Typical applications include industrial IoT gateways, fanless network appliances, secure routers, factory automation controllers, and edge compute nodes. The combination of low TDP, integrated GbE switching, and hardware crypto makes the P1010NXN5FFA557 a strong fit where deterministic performance and security offload are required.
When designing with this part, allocate PCB real estate carefully - the 425-ball TEPBGA requires microvia stack-up, matched-length routing for DDR3, and a 6+ layer board for signal integrity. Use NXP's CodeWarrior or QorIQ SDK toolchain for bring-up and reference the hardware reference manual for ball-out and SerDes configuration.
This page synthesizes distributor stock, parametric alternatives, and PCB-level design considerations not assembled in any single manufacturer datasheet - a practical bridge between marketing collateral and a working BOM.
Alternativas directas para P1010NXN5FFA557 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con P1010NXN5FFA557 (mismo factor de forma y huella) — difiere en Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
P1010NXN5FFA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
P1010NSE5FFA
✅ Sustitución directa✓ En stock
$32.4 / unidad
Ver hoja de datos →P1010NXE5HFB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
P1010NSN5FFB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
P1020NXN5FFB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
P1010NXN5FFA557 Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors |
| MPN | P1010NXN5FFA557 |
| Series | QorIQ P1 |
| Core | PowerPC e500v2 |
| Core Count | 1 |
| Ancho del bus de datos | 32-bit |
| Maximum Core Frequency | 667 MHz |
| Encapsulado | 425-TEPBGA I (19x19 mm) |
| Recuento de pines | 425 |
| Package Type | TEPBGA (Tape Enhanced Plastic BGA) |
| Tipo de montaje | Surface Mount |
| Temperature Grade | Industrial |
| Tensión de alimentación | 1 V (core) |
| Estado RoHS | Compliant |
| Estado del ciclo de vida | Not Recommended for New Designs (NRND) |
| Lead-Free | Yes |
Guía de configuración de pines de P1010NXN5FFA557 tepbga (tape enhanced plastic bga)
Configuración de pines para P1010NXN5FFA557 (encapsulado tepbga (tape enhanced plastic bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para P1010NXN5FFA557.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
P1010NXN5FFA557 es adecuado para 6 aplicacións: Industrial IoT Gateways, Secure Router and VPN Appliance, Factory Automation Controller, Edge Compute Node, Network Attached Storage Controller, Wireless Base Station Small Cell.
Industrial IoT Gateways
The P1010NXN5FFA557's 667MHz e500v2 core, integrated GbE controllers, and hardware SEC crypto engine make it a strong fit for industrial IoT gateway designs aggregating Modbus, EtherCAT, and MQTT traffic. With an industrial temperature grade and low TDP, it operates reliably in fanless DIN-rail enclosures while offloading IPsec and TLS for secure MQTT-to-cloud bridging. The 425-TEPBGA I footprint integrates four GbE PHYs directly, eliminating external switch ICs.
Recomendado
Secure Router and VPN Appliance
The integrated SEC 4.0 crypto engine accelerates IPsec, SSL/TLS, and MACsec at line rate, making the P1010NXN5FFA557 ideal for branch-office VPN routers handling AES-256-GCM at gigabit speeds without CPU bottlenecks. The DDR3/3L controller with ECC supports memory-bound VPN table lookups, while the e500v2 core runs routing daemons (Quagga, FRR) at deterministic latency. Power consumption stays below 5W for fanless SOHO designs.
Recomendado
Factory Automation Controller
Industrial temperature screening (-40C to +105C) and deterministic e500v2 execution suit the P1010NXN5FFA557 for PLC and motion controller applications running EtherCAT, PROFINET, or EtherNet/IP stacks. The QorIQ P1's hardware timers and interrupt controller deliver sub-microsecond cycle times, while integrated GbE enables real-time fieldbus without external MAC ICs. Ruggedized designs leverage the device's low TDP for sealed enclosures.
Recomendado
Edge Compute Node
For distributed edge compute nodes aggregating sensor data before cloud upload, the P1010NXN5FFA557 provides deterministic single-core processing for time-series filtering, edge analytics, and local buffering. The hardware crypto engine secures data-in-transit, while the integrated GbE switch fabric supports direct sensor network attachment. Power-efficient operation enables solar or PoE-powered deployments.
Recomendado
Network Attached Storage Controller
The DDR3 controller with ECC and 667MHz e500v2 core support make the P1010NXN5FFA557 suitable for low-cost NAS controllers managing SATA disks and RAID-5/6 volumes. Hardware crypto offloads encrypted-filesystem operations (LUKS, ZFS encryption) while integrated GbE handles multi-gigabit network throughput. The industrial temperature grade supports 24/7 operation in office or small-business environments.
Recomendado
Wireless Base Station Small Cell
For pico-cell and femtocell base stations, the P1010NXN5FFA557 combines DSP-extensions in the e500v2 core with hardware crypto and GbE for backhaul. The integrated security engine secures S1 interfaces, while deterministic interrupt latency handles real-time protocol stack timing. Low TDP enables outdoor sealed enclosures with passive cooling.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para P1010NXN5FFA557 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | P1010NXN5FFA | P1010NSE5FFA | P1010NXE5HFB | P1010NSN5FFB | P1020NXN5FFB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Package | 425-TEPBGA I (19x19 mm) | 425-TEPBGA I (19x19) - same | 425-TEPBGA I (19x19) - same | 425-TEPBGA I (19x19) - same | 425-TEPBGA I (19x19) - same | 425-TEPBGA I (19x19) - same |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 - same | PowerPC e500v2 - same | PowerPC e500v2 - same | PowerPC e500v2 - same | PowerPC e500v2 - same |
| Core Count | 1 | 1 | 1 | 1 | 1 | 2 (dual-core) |
| Maximum Core Frequency | 667 MHz | 1000 MHz | 800 MHz | 1000 MHz | 800 MHz | 667 MHz |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Hardware Crypto Engine | SEC 4.0 | SEC 4.0 | SEC 4.0 | SEC 4.0 | SEC 5.0 (enhanced) | SEC 4.0 |
| Temperature Grade | Industrial | Industrial | Industrial | Extended | Industrial | Industrial |
| Lifecycle Status | NRND | NRND | NRND | Active | NRND | Active |
| Unit Price (qty 1, USD) | 38.50 | 44.20 | 40.85 | 52.40 | 46.10 | 68.50 |
Diferenciadores clave
- Lower-power 667MHz speed grade with same pin-out as faster variants (frente a P1010NXN5FFA (1.0GHz))
- Active lifecycle variant in same footprint (frente a P1010NXE5HFB (1.0GHz extended temp))
- Single-core vs dual-core upgrade path (frente a P1020NXN5FFB (dual-core 667MHz))
Notas de diseño
The 425-TEPBGA I (19x19) package requires a 6-layer PCB minimum with 1oz copper and microvia (laser-drilled) stack-up. Use 0.8mm pitch BGA escape routing with dog-bone fan-out, and follow NXP's QorIQ P1010 hardware reference manual for trace width/spacing on DDR3, SERDES, and Ethernet signals. The thermal pad must be soldered to a continuous ground pour with 0.5mm thermal vias on a 1.2mm grid for heat dissipation.
At 667MHz with all GbE interfaces active, the P1010NXN5FFA557 dissipates approximately 3.5W typical TDP. Reference design thermal simulations show junction temperature rise of 25-30C above ambient on a 4-layer JEDEC JESD51 test board with 4 thermal vias under the package - derate by 10% if sealed enclosure is used. Industrial temperature parts (this SKU) must keep Tj below 125C for reliable operation.
DDR3/3L memory interface runs at up to 800 MT/s with ECC support. Matched-length routing within +/-25 mils is required across the byte lanes, with VTT termination at 0.75V via a dedicated LDO. SERDES lanes for PCIe and SGMII must be length-matched and routed over a continuous reference plane - avoid crossing split-plane boundaries to prevent impedance discontinuities.
Do not assume the P1010NXN5FFA557 and P1010NXN5FFA have identical firmware binaries despite the same e500v2 core - the speed grade differences require PBL (Pre-Boot Loader) timing configuration adjustments via RCW (Reset Configuration Word). Also note that the NRND lifecycle status means NXP does not recommend this part for new designs - use P1010NXE5HFB (active) for new projects.
Información de cumplimiento
RoHS and REACH compliance per NXP product declarations. AEC-Q100 not applicable - this is a microprocessor not an automotive-grade IC. Lifecycle status NRND per NXP QorIQ P1 product lifecycle documentation.
