P1022NSE2HFB - QorIQ P1 1.055GHz Dual-Core PowerPC MPU | NXP
N.º de pieza: P1022NSE2HFB ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $89.5 | $895,00 |
| 100 | $84 | $8.400,00 |
| 250 | $79.5 | $19.875,00 |
| 500 | $75 | $37.500,00 |
P1022NSE2HFB Descripción general
An embedded microprocessor (MPU) is a system-on-chip (SoC) integrating one or more processor cores, memory controllers, and a rich peripheral set onto a single die. The QorIQ P1 family (P1011/P1013/P1022) sits within NXP's Power Architecture hierarchy below higher-core P2/P3/P4/P5 devices and above legacy PowerQUICC II/III devices. P1022 represents a multi-core step up from the single-core P1013, sharing the same platform architecture and peripheral set but doubling parallel compute for control-plane or media-plane processing.
Key differentiating specifications for the P1022NSE2HFB include 1.055 GHz core frequency (versus the slower speed grades 800/667 MHz and the 400 MHz variant referenced on Mouser), 32 KB I-cache and 32 KB D-cache per core, integrated 32-bit DDR2/DDR3 memory controller with ECC, two GbE controllers, three PCIe controllers, USB 2.0, integrated LCD controller, security accelerator (SEC), and an industrial-grade 0 to 105 C junction operating range.
The P1022 silicon uses 45 nm SOI process technology, integrates dual e500v2 cores with hardware virtualization support, MMU, and a high-bandwidth interconnect fabric. It supports up to 1 GB of DDR3 memory, offering up to 6.4 GB/s peak memory throughput to the dual cores and on-chip peripherals.
Typical applications include IP networking gateways, factory automation controllers, industrial routers, single-board computers, networked printers, secure POS terminals, line-card controllers, and converged access network equipment. The P1022NSE2HFB is well-suited to designs that previously used PowerQUICC III but require modern security and virtualization features.
When designing with this MPU, ensure the PCB footprint matches the 689-TEPBGA II 31x31 mm package with exposed pad and that adequate via-array thermal dissipation is provided for 0 to 105 C operation. JTAG boundary-scan and a BootROM source must be considered for production board bring-up.
This page synthesizes NXP product-page information, distributor pricing, and drop-in compatible alternatives within the QorIQ P1 family not found in any single distributor listing.
Alternativas directas para P1022NSE2HFB — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con P1022NSE2HFB (mismo factor de forma y huella) — difiere en Security Engine, Memory Controller, Operating Temperature, USB, LCD Controller.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
P1022NSN2EFB
✅ Sustitución directa✓ En stock
$55.8 / unidad
Ver hoja de datos →P1013NSN2HFB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
P1022NSE2EFB
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
P1013NSE2HFB
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$58.9 / unidad
Ver hoja de datos →P1022NSE2HFB Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | QorIQ P1 |
| Processor Type | PowerPC e500v2 MPU |
| Number of Cores | 2 |
| Core Architecture | Power Architecture (e500 v2), 32-bit |
| Maximum Core Frequency | 1.055 GHz |
| L1 Cache (per core) | 32 KB instruction + 32 KB data |
| Memory Controller | 32-bit DDR2/DDR3 with ECC |
| Ethernet | 2x integrated Gigabit Ethernet (GbE) |
| PCI Express | 3x PCIe controllers |
| USB | USB 2.0 |
| Security Engine | SEC (cryptographic accelerator) |
| LCD Controller | Integrated |
| Encapsulado / Carcasa | 689-TEPBGA II (31 x 31 mm) with exposed pad |
| Temperatura de funcionamiento | 0 C to +105 C (junction) |
| Estado RoHS | Compliant |
| Lead Free Status | Lead Free |
| Packaging | Tray |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de P1022NSE2HFB 689-tepbga ii (31 x 31 mm) with exposed pad
Configuración de pines para P1022NSE2HFB (encapsulado 689-tepbga ii (31 x 31 mm) with exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para P1022NSE2HFB.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
P1022NSE2HFB es adecuado para 6 aplicacións: Industrial IP Networking Gateways, Factory Automation Controllers, Secure Networked POS Terminals, Industrial Single-Board Computers, Converged Access Network Equipment, Medical and Diagnostic Equipment.
Industrial IP Networking Gateways
The P1022NSE2HFB fits industrial IP networking gateways because its dual e500v2 cores at 1.055 GHz can run Linux control-plane and a real-time data-plane task concurrently while the integrated GbE controllers, three PCIe lanes and SEC security accelerator provide the connectivity and crypto needed for protocol translation. Compared with a switching regulator, the deterministic core behavior of a PowerPC MPU delivers predictable latency for routing protocols. Place the device on a 6-layer PCB with a via-array thermal pad under the 689-TEPBGA II package and use ECC DDR3 to maximize uptime in factory-floor cabinets.
Recomendado
Factory Automation Controllers
For factory automation controllers, the P1022NSE2HFB pairs dual e500v2 cores with the industrial 0 to 105 C junction temperature range, three PCIe controllers for motion/IO expansion, and a USB 2.0 interface for HMI panels. The integrated SEC engine accelerates industrial cryptography for OPC-UA security. Unlike a microcontroller-only design, the MPU runs Linux + RTOS virtualization and a deterministic motion control loop on separate cores. ECC DDR3 and industrial-grade BOM make the controller reliable on the shop floor.
Recomendado
Secure Networked POS Terminals
The P1022NSE2HFB supports secure networked POS terminals through the integrated SEC cryptographic accelerator and dual e500v2 cores that isolate payment processing from UI/multimedia workloads. The integrated LCD controller drives the operator display directly, while GbE connects to the store network. Hardware virtualization provides a trusted execution partition for payment PIN handling. The 689-TEPBGA II package supports compact terminal enclosures, and the 0 to 105 C junction rating handles warm retail environments.
Recomendado
Industrial Single-Board Computers
Single-board computers based on the P1022NSE2HFB leverage the integrated GbE, PCIe, USB, DDR3 controller and LCD interfaces to deliver a compact SBC with minimal external glue logic. Designers can stack networking, storage, and display daughter cards via the three PCIe controllers. The 689-TEPBGA II package is well documented in NXP reference designs, allowing rapid custom carrier-board development. ECC memory and the 105 C junction rating support harsh industrial deployments such as vehicle telematics and outdoor cabinets.
Recomendado
Converged Access Network Equipment
Converged access network equipment uses the P1022NSE2HFB for both subscriber-line control and IP services aggregation, where dual e500v2 cores handle the bonded-line protocol and routing stack in parallel. The hardware virtualization extensions allow service providers to run tenant-isolated Linux containers on the same SoC. Three PCIe lanes connect DSL/GPON MAC chips while GbE uplinks reach the metro ring. The SEC engine accelerates IPsec MACsec used for subscriber authentication.
Recomendado
Medical and Diagnostic Equipment
The P1022NSE2HFB suits medical imaging gateways, bedside monitor controllers, and diagnostic instruments requiring deterministic real-time control plus a full OS for networking. Dual cores separate the data acquisition DSP loop from the user-interface application; the integrated LCD controller drives the bedside touchscreen. Although note that medical safety certification (IEC 60601) requires additional isolation and EMC measures beyond the MPU itself. The 0 to 105 C industrial grade supports continuous-operation medical carts.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para P1022NSE2HFB — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | P1022NSN2EFB | P1013NSN2HFB | P1022NSE2EFB | P1013NSE2HFB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Core Count | 2 (dual e500v2) | 2 (dual e500v2) | 1 (single e500v2) | 2 (dual e500v2) | 1 (single e500v2) |
| Maximum Core Frequency | 1.055 GHz | 800/667 MHz speed grade | 1.055 GHz | 1.055 GHz | 1.055 GHz |
| Memory Controller | 32-bit DDR2/DDR3 with ECC | 32-bit DDR2/DDR3 with ECC | 32-bit DDR2/DDR3 with ECC | 32-bit DDR2/DDR3 with ECC | 32-bit DDR2/DDR3 with ECC |
| Ethernet | 2x GbE | 2x GbE | 2x GbE | 2x GbE | 2x GbE |
| PCIe Controllers | 3x PCIe | 3x PCIe | 3x PCIe | 3x PCIe | 3x PCIe |
| Security Engine | SEC (integrated) | SEC (integrated) | SEC (integrated) | SEC (integrated) | SEC (integrated) |
| Operating Temperature (junction) | 0 to 105 C | 0 to 105 C | 0 to 105 C | 0 to 105 C | 0 to 105 C |
Diferenciadores clave
- Dual-core e500v2 at 1.055 GHz vs single-core P1013 at same frequency (frente a P1013NSN2HFB)
- Higher speed bin than P1022NSN2EFB (frente a P1022NSN2EFB)
- Integrated SEC security accelerator (frente a P1013NSE2HFB)
Notas de diseño
The 689-TEPBGA II package dissipates a significant amount of heat at 1.055 GHz under dual-core load. Use a via-array thermal pad directly under the exposed pad of the BGA, with thermal vias stitched to inner ground planes. A 6-layer PCB with 1 oz copper pours is the minimum recommended stack-up. Industrial junction temperature rating (0-105 C) requires verifying with a thermal probe during worst-case workload before committing to fanless enclosures.
Place DDR3 DRAMs on the same side of the PCB as the MPU and within 25 mm of the ball array to keep the DDR3 fly-in/out fixed transit-time short. Use matched-length pairs within +/- 25 mils for the DDR3 byte lanes and follow NXP's P1022 hardware reference manual for trace impedance (50 ohm single-ended, 100 ohm differential). Route PCIe lanes as 85 ohm differential pairs with length matching and AC coupling capacitors.
The P1022NSE2HFB uses the BootROM source pin (cfg_rcw_src) which must be pulled to the correct default state at power-up, otherwise the MPU will not boot. Ensure the JTAG pins have the recommended pull resistors and that the PORESET sequencing matches the datasheet timing diagram. Many board bring-up failures are traced to incorrect Reset Configuration Word (RCW) source rather than silicon faults. Always use the latest NXP QorIQ SDK and u-boot release that matches the silicon revision (Rev 2).
Keep analog and digital grounds separated at the PCB level for the GbE PHY magnetics. Route the RGMII signals with controlled impedance and length-match within 50 mils across the byte lanes. The USB 2.0 differential pair needs 90 ohm differential impedance and a common-mode choke near the connector. PCIe reference clock routing must follow the PCIe CEM specification for 100 MHz differential pair skew.
Información de cumplimiento
RoHS compliant and lead-free per DigiKey and Mouser listings. AEC-Q100 not applicable for industrial communications processor. REACH, halogen-free and conflict-minerals status not explicitly published in provided data; set to unknown.
