P2010NSE2MFC - QorIQ P2010 1.2GHz e500v2 SoC | NXP Semiconductors
N.º de pieza: P2010NSE2MFC ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $84.5 | $84,50 |
| 10 | $76.2 | $762,00 |
| 100 | $68.9 | $6.890,00 |
| 500 | $62.4 | $31.200,00 |
| 1.000 | $56.8 | $56.800,00 |
P2010NSE2MFC Descripción general
A communications SoC (System-on-Chip) integrates a CPU core, memory controller, and multiple high-speed peripherals such as Gigabit Ethernet, PCIe, Serial RapidIO (SRIO), USB, and Security Engine (SEC) into a single die. The QorIQ P2010 belongs to the QorIQ P2 sub-family within NXP's Power Architecture communications processor hierarchy, occupying the slot between the lower-frequency P1 family (e.g., P1011) and the dual-core P2020. The MFC (Rev 2.1) suffix denotes a specific silicon revision with a fixed feature set.
Key features of the P2010NSE2MFC include a 32-bit e500v2 core at 1.2 GHz, a DDR2/DDR3 memory controller with ECC support, three Gigabit Ethernet controllers (one with 10/100/1000 + 10/100 + 10/100), three PCI Express controllers, two Serial RapidIO interfaces, a USB 2.0 controller, a Security Engine (SEC), and a 0 to 125 °C extended operating temperature range. The 45 nm process technology balances performance against thermal dissipation, and the 689-TEPBGA II package supports high-density board layouts.
The architecture uses a hierarchical interconnect that ties the e500v2 core to the L2 cache and peripheral controllers. Hardware acceleration offloads common data-plane tasks from the CPU, allowing sustained throughput on multi-gigabit Ethernet and SRIO links. The integrated SEC accelerates encryption protocols used in secure networking equipment.
Typical applications include industrial routers and switches, factory automation controllers, defense and aerospace single-board computers, and telecom line cards where deterministic single-core Power Architecture performance and rich peripheral integration are required.
When designing with this device, allocate adequate thermal dissipation because the 689-TEPBGA package concentrates heat; the exposed pad must be soldered to a continuous ground/power plane. Confirm voltage rail sequencing and use ECC-enabled DIMMs when reliability is required.
This page synthesizes distributor pricing, drop-in alternatives within the QorIQ P2 family, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para P2010NSE2MFC — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con P2010NSE2MFC (mismo factor de forma y huella) — difiere en Number of Cores, Operating Temperature, Mounting Type, PCI Express, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
P2020NSE2KFC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
P1011NSN2DFB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
P2020NSN2MFC
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$31.2 / unidad
Ver hoja de datos →P2010NSN2MFC
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$42.3 / unidad
Ver hoja de datos →P2010NSE2MFC Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Family | QorIQ P2 Communications Processors |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-bit |
| Maximum Core Frequency | 1.2 GHz |
| Process Technology | 45 nm |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet Controllers | 3x Gigabit Ethernet (10/100/1000 + 10/100 + 10/100) |
| PCI Express | 3x PCIe controllers |
| Serial RapidIO | 2x SRIO interfaces |
| USB | USB 2.0 |
| Security Engine | Yes (SEC) |
| Package Type | 689-TEPBGA II (31x31 mm) with exposed pad |
| Temperatura de funcionamiento | 0 °C to +125 °C |
| Silicon Revision | 2.1 (MFC suffix) |
| Estado RoHS | Compliant |
| Lead-Free Status | Lead Free |
| Packaging | Tray |
Guía de configuración de pines de P2010NSE2MFC 689-tepbga ii (31x31 mm) with exposed pad
Configuración de pines para P2010NSE2MFC (encapsulado 689-tepbga ii (31x31 mm) with exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para P2010NSE2MFC.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
P2010NSE2MFC es adecuado para 6 aplicacións: Industrial Routers and Switches, Factory Automation Controllers, Defense and Aerospace Single-Board Computers, Telecom Line Cards and Edge Nodes, Medical Imaging and Diagnostic Equipment, Secure Storage and NAS Controllers.
Industrial Routers and Switches
The P2010NSE2MFC is well matched to industrial router and switch designs that demand deterministic single-core throughput with rich multi-protocol peripheral integration. Three Gigabit Ethernet controllers (one 10/100/1000 and two 10/100) cover WAN/LAN ports without an external PHY controller, while three PCI Express lanes allow expansion cards for cellular modems, additional Ethernet ports, or hardware-accelerated crypto modules. The integrated Security Engine (SEC) accelerates IPsec, SSL/TLS, and MACsec at line rate, eliminating the need for a discrete encryption ASIC. Operating from 0 °C to +125 °C the device supports outdoor cabinet deployments. At 1.2 GHz the e500v2 core sustains tens of Mbps of routed traffic under Linux or VxWorks while leaving cycles for management-plane tasks.
Recomendado
Factory Automation Controllers
Factory automation PLCs and motion controllers benefit from the P2010NSE2MFC's combination of deterministic single-core processing, multiple high-speed serial interfaces, and extended temperature operation. The two Serial RapidIO (SRIO) ports connect to digital signal processors or FPGA-based motion-control coprocessors with sub-microsecond latency, while three PCI Express lanes accept industrial camera or vision interface cards. DDR3 with ECC ensures reliable operation in electrically noisy factory environments by correcting single-bit memory errors. The 1.2 GHz e500v2 core runs real-time operating systems such as VxWorks or INTEGRITY for deterministic control loops, and the Security Engine protects proprietary machine data and remote management traffic.
Recomendado
Defense and Aerospace Single-Board Computers
The P2010NSE2MFC's 689-TEPBGA II package, 0 to +125 °C operating range, and integrated peripherals make it a strong fit for ruggedized single-board computers (SBCs) used in defense and aerospace applications. The e500v2 core executes avionics, navigation, and sensor-fusion workloads in deterministic Power Architecture code bases, and the Security Engine meets stringent FIPS-grade cryptography requirements. Three PCI Express lanes and two Serial RapidIO ports provide high-bandwidth fabric connections to FPGA payload cards, while 3x Gigabit Ethernet interfaces redundant mission-system networks. Lead-free packaging and NXP's long-term supply commitments suit programs with multi-decade sustainment requirements.
Recomendado
Telecom Line Cards and Edge Nodes
For telecom line cards, edge routers, and access multiplexers, the P2010NSE2MFC provides a single-chip solution that integrates multi-gigabit Ethernet, PCIe expansion, and security offload. The integrated SEC accelerates IPsec/MACsec at multi-gigabit line rate, while the 1.2 GHz e500v2 core handles routing protocols and management-plane processing under Linux or VxWorks. DDR3 with ECC ensures data integrity across long uptime deployments typical in carrier networks. Compared with switching ASICs that require an external CPU, the P2010NSE2MFC consolidates control-plane and data-plane forwarding into one device, simplifying board layout and reducing BOM cost.
Recomendado
Medical Imaging and Diagnostic Equipment
Medical imaging systems such as ultrasound carts and patient-monitoring stations leverage the P2010NSE2MFC's combination of high-throughput serial interfaces and deterministic real-time processing. The two Serial RapidIO ports accept raw data from analog front-end ADCs or FPGA-based beam-formers, while the e500v2 core runs signal-processing algorithms and the user interface. Three PCI Express lanes support high-resolution display controllers and storage cards. Operating from 0 °C to +125 °C the device tolerates the warm environments inside imaging enclosures, and DDR3 with ECC protects patient data against memory errors. The integrated Security Engine encrypts PHI to HIPAA-relevant standards without an external crypto chip.
Recomendado
Secure Storage and NAS Controllers
Network-attached storage (NAS) controllers and secure storage appliances use the P2010NSE2MFC to combine 1.2 GHz Power Architecture processing with hardware-accelerated encryption and high-bandwidth storage I/O. Three PCI Express lanes attach to SAS/SATA controller HBAs or NVMe adapters, while 3x Gigabit Ethernet provides redundant network paths. The integrated SEC engine encrypts volumes at line rate using AES-256, eliminating the need for a separate crypto ASIC and reducing bill-of-materials cost. DDR3 with ECC protects against data corruption across large memory footprints typical in caching appliances. The 689-TEPBGA II footprint and industrial temperature grade suit dense storage chassis.
Recomendado
Resumen de productos recomendados
No hay preguntas frecuentes disponibles para este producto.
Datos de referencia de ingeniería para P2010NSE2MFC — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | P2020NSE2KFC | P1011NSN2DFB | P2020NSN2MFC | P2010NSN2MFC |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Core Count | 1 | 2 | 1 | 2 | 1 |
| Core Frequency | 1.2 GHz | 1.2 GHz | 800 MHz | 1.2 GHz | 1.2 GHz |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Gigabit Ethernet | 3x | 3x | 2x | 3x | 3x |
| PCI Express Lanes | 3 | 3 | 3 | 3 | 3 |
| Operating Temperature | 0 to +125 °C | 0 to +125 °C | 0 to +125 °C | 0 to +125 °C | 0 to +125 °C |
Diferenciadores clave
- Single-core 1.2 GHz e500v2 with full QorIQ P2 peripheral integration (frente a P2020NSE2KFC)
- Higher core frequency than the QorIQ P1 family for the same 689-TEPBGA footprint (frente a P1011NSN2DFB)
- Hardware-accelerated Security Engine integrated into the SoC (frente a P2020NSE2MFC)
Notas de diseño
Estimated: At 1.2 GHz core frequency with the 45 nm QorIQ P2 die, typical junction-to-ambient thermal resistance (theta_JA) for the 689-TEPBGA II package on a standard 8-layer PCB is approximately 12-15 °C/W. Designers must solder the central exposed pad to a continuous ground/power plane with thermal vias, and provide at least 4 sq cm of unbroken inner-plane copper directly under the BGA to keep junction temperature below +125 °C at full workload.
The 689-ball TEPBGA II at 31x31 mm requires a high-density 8+ layer PCB with microvia or laser-drilled stacked-via technology. Use a 0.8 mm ball pitch escape routing with at least two signal layers between the BGA and the inner power/ground planes. Match-length DDR3 traces within 25 mil and route all three Gigabit Ethernet differential pairs to within 5 mil length tolerance to meet 1000BASE-T return loss.
Do not assume the MFC suffix is interchangeable with the KFC or NFB suffixes - silicon revisions differ. The NXP QorIQ P2 reference manual P2020RM documents silicon revision 2.1 features and any errata that apply. Always cross-check boot configuration, SerDes lane mapping, and SerDes reference clock requirements against the specific silicon revision in your hardware. DDR3 with ECC requires unbuffered ECC DIMMs or registered ECC modules matched to the QorIQ DDR controller data sheet parameters.
Place the QorIQ P2010 near the DDR3 SODIMM/DIMM connector with matched-length routing for the address/command and data byte lanes. Keep high-speed serial lanes (PCIe, SRIO, SerDes, SATA) on layers adjacent to continuous ground planes to control impedance and minimize crosstalk. Add AC coupling capacitors at all PCIe and SRIO transmit pairs per the QorIQ P2 layout checklist.
Estimated: The e500v2 core at 1.2 GHz generates strong harmonics around the core clock fundamental. Use spread-spectrum clocking on the platform DDR clock where the chipset supports it, and decouple all P2010 voltage rails with at least 22 µF of bulk capacitance plus 0.1 µF and 1 nF ceramic decoupling at each ball cluster. Add a ferrite bead or pi-filter on each analog supply input (AVDD, SVDD, XVDD) sourced from a low-noise LDO.
Información de cumplimiento
RoHS compliant and lead-free per Freescale/NXP datasheet. Industrial temperature grade 0 to +125 °C, no AEC-Q100 automotive qualification. Detailed conflict-minerals status available from NXP's corporate-responsibility reports.
