PI7C9X3G1224GPAHFCE - PCIe Gen3 12-Port 24-Lane Switch | Diodes
N.º de pieza: PI7C9X3G1224GPAHFCE ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
PI7C9X3G1224GPAHFCE Descripción general
A PCIe packet switch is a switching fabric device that connects a root complex or upstream host port to multiple downstream endpoints, arbitrating and routing PCIe transaction-layer packets between ports. Within the system hierarchy, it sits at the fabric level of the PCIe architecture - above individual endpoint controllers and below the root complex - and is a key building block of server, storage, and expansion platforms that need more PCIe connectivity than a host CPU natively provides.
Key features of the PI7C9X3G1224GP family include the flexible tile-based port architecture, where a basic cell called a tile consists of 8 ports and 16 lanes for Tile 0, allowing variable lane-width allocation per port; support for the PCIe Gen3 data rate of 8 GT/s per lane; and 24 total lanes that can be aggregated into wide ports (x4, x8) or split into narrow ports (x1, x2) depending on system topology requirements.
Technically, the switch implements the full PCIe packet routing engine: it decodes TLP headers, performs address-based routing in the switch's internal hierarchy of virtual PCI-to-PCI bridges, and manages link training, equalization, and lane reversal on each SERDES interface. The architecture allows the flexible port configuration by allocating variable lane width for each port, so designers can tailor fan-out without changing silicon.
Typical applications include server expansion backplanes, NVMe SSD storage controllers with multiple drive bays, PCIe expansion chassis, industrial host adapter cards, and communications platforms aggregating multiple endpoint cards onto a single host root port.
When designing with this device, verify the port-to-lane mapping of the chosen package option against your board topology, and plan the power delivery and SERDES layout (controlled-impedance differential pairs, AC coupling, reference clock distribution) early, since 24 Gen3 lanes place significant demands on stackup and trace budget.
This page synthesizes distributor availability data, drop-in alternatives within the PI7C9X3G1224GP family, and practical design notes not found in a single manufacturer datasheet.
Alternativas directas para PI7C9X3G1224GPAHFCE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PI7C9X3G1224GPAHFCE (mismo factor de forma y huella) — difiere en Architecture, Interface Standard, Package, Packaging, SERDES Data Rate.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PI7C9X3G1224GPBHFCE
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PI7C9X3G1224GPAHFCE Valores máximos y características eléctricas
| Interface Standard | PCI Express Gen3 (8 GT/s per lane) |
| Total Lanes | 24 |
| Port Count | Flexible 3-port to 12-port configurations |
| SERDES Data Rate | 8 Gb/s per lane (Gen3) |
| Architecture | Tile-based packet switch (Tile 0: 8 ports / 16 lanes) |
| Lane Width Allocation | Variable lane width per port |
| Encapsulado | 324-ball H-FCBGA, 19 x 19 mm |
| Tipo de montaje | Surface Mount |
| Packaging | Tray, 84 pieces |
Guía de configuración de pines de PI7C9X3G1224GPAHFCE 324-ball h-fcbga, 19 x 19 mm
Configuración de pines para PI7C9X3G1224GPAHFCE (encapsulado 324-ball h-fcbga, 19 x 19 mm). Este dispositivo de potencia presenta terminales de puerta, drenador y fuente. Para encapsulados no polarizados, consulte la hoja de datos del fabricante para conocer la orientación exacta del pin 1 y los detalles del footprint. Las aplicaciones habituales incluyen el diseño de fuentes de alimentación, el accionamiento de motores y la conmutación de cargas.
No hay datos detallados de patillaje disponibles para PI7C9X3G1224GPAHFCE.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PI7C9X3G1224GPAHFCE es adecuado para 6 aplicacións: NVMe SSD Storage Controllers, Server Expansion Backplanes, PCIe Expansion Chassis, Industrial Host Adapter Cards, Networking and Communications Platforms, GPU and Accelerator Add-in Cards.
NVMe SSD Storage Controllers
The PI7C9X3G1224GPAHFCE fits NVMe storage platforms because its 24 PCIe Gen3 lanes can be split as one x4 upstream host link plus up to five x4 downstream ports, each delivering the full Gen3 x4 bandwidth of approximately 3.9 GB/s that a single NVMe drive can consume. The flexible tile-based lane allocation means a 6-drive M.2 backplane or a U.2 JBOD controller can be served by a single switch without lane starvation. Placed between the host root port and the drive slots, the switch translates each drive into its own virtual PCI-to-PCI bridge domain, simplifying enumeration and hot-plug handling; the trade-off is added latency of roughly 100-150 ns per traversal, negligible for storage workloads.
Recomendado
Server Expansion Backplanes
Server and blade-chassis backplanes use the PI7C9X3G1224GPAHFCE to fan a single CPU root-complex x8 or x16 link out to a dozen slot endpoints at Gen3 speed. With 24 lanes in a 3-to-12-port flexible configuration, one switch can serve a 12-slot x1 topology or mix x2/x4 slots to match slot population, which fixed-configuration switches cannot do. The 324-ball H-FCBGA (19 x 19 mm) package concentrates 24 SERDES pairs into a compact area, keeping differential pair routing on the backplane manageable. Design consideration: the switch should be positioned centrally on the backplane to equalize trace lengths, and Gen3 equalization settings must be validated across the longest backplane routes to guarantee link training at 8 GT/s on all ports.
Recomendado
PCIe Expansion Chassis
Thunderbolt-to-PCIe or host-bus-adapter expansion enclosures rely on a packet switch to present multiple card slots to a single upstream cable link. The PI7C9X3G1224GPAHFCE provides 24 Gen3 lanes that can be arranged as one upstream x4 port and multiple downstream x1/x4 slots, so a 4-slot expansion chassis keeps full x4 bandwidth per graphics, capture, or NVMe card. According to the manufacturer, the tile-based architecture (Tile 0: 8 ports/16 lanes) supports variable lane-width allocation per port, enabling slot-population-dependent configurations without board respins. Because the enclosure is thermally sealed, verify switch power dissipation from the datasheet and budget enclosure airflow accordingly, as high lane-count Gen3 switches dissipate meaningful power under full load.
Recomendado
Industrial Host Adapter Cards
Industrial frame-grabber, motion-control, and data-acquisition host cards use the PI7C9X3G1224GPAHFCE to aggregate multiple FPGA or endpoint devices onto one host PCIe link. A typical design dedicates an x4 Gen3 upstream port to the host (approximately 3.9 GB/s) and splits the remaining 20 lanes across four to six onboard FPGAs or capture engines at x4 or x2 each, per the flexible port allocation described by Diodes Incorporated. Because industrial cards must operate over extended temperature ranges, confirm the operating temperature option code of the GPAHFCE suffix against the datasheet before committing the BOM, and ensure the card's power tree supplies the core and SERDES rails specified in the datasheet's power management section.
Recomendado
Networking and Communications Platforms
Switch, router, and 5G baseband line cards use PCIe packet switches to connect network processors, accelerators, and control-plane CPUs. The PI7C9X3G1224GPAHFCE's 24 Gen3 lanes give designers enough fabric to link a control CPU (x4), a traffic accelerator (x8), and several I/O endpoints (x1/x2) within a single hierarchy of virtual PCI-to-PCI bridges, keeping enumeration deterministic. The variable lane-width allocation per port, a core feature of the PI7C9X3G1224GP architecture, allows one PCB platform to be populated for multiple SKU bandwidth tiers. Design consideration: on long board routes to front-panel modules, verify Gen3 link equalization and consider retimers, since 8 GT/s signaling over more than approximately 12 inches of trace requires careful SI budgeting.
Recomendado
GPU and Accelerator Add-in Cards
Add-in cards that host multiple GPUs or AI accelerators use the PI7C9X3G1224GPAHFCE to arbitrate between an upstream host link and several peer devices, enabling peer-to-peer DMA transfers that do not traverse the host memory controller. With 24 lanes, a card can implement an x8 upstream link to the host plus one or two x8 downstream GPU links, all at Gen3's 8 GT/s, per the manufacturer's flexible port configuration description. Peer traffic through the switch adds approximately 100-150 ns of latency per traversal, which is acceptable for data-parallel workloads but should be modeled for latency-sensitive inference. Thermal design must account for the switch's power under full SERDES activity; consult the datasheet thermal section for the H-FCBGA package's junction-to-ambient resistance.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PI7C9X3G1224GPAHFCE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PI7C9X3G1224GPBHFCE | PI7C9X3G1224GP |
|---|---|---|---|
| Package | 324-HFCBGA (19x19) | 324-HFCBGA (19x19) - same | 324-HFCBGA (19x19) - same family |
| Brand | Diodes Incorporated | Diodes Incorporated | Diodes Incorporated |
| PCIe Generation | Gen3 (8 GT/s) | Gen3 (8 GT/s) | Gen3 (8 GT/s) |
| Total Lanes | 24 | 24 | 24 |
| Port Configuration | 3 to 12 ports, flexible | 12 ports / 24 lanes | 3 to 12 ports, flexible |
| Lane Width Allocation | Variable per port | Variable per port | Variable per port |
| Distributor Stock (as of 2026-10-19) | Mouser, DigiKey, Arrow listed | DigiKey, ships today | Manufacturer product page (family) |
Diferenciadores clave
- Flexible 3-to-12-port tile-based configuration (frente a PI7C9X3G1224GPBHFCE)
- Full 24-lane Gen3 fabric in one 19 x 19 mm package (frente a PI7C9X3G1224GP)
- Trade-off: proprietary fabric, limited cross-brand second sources (frente a PI7C9X3G1224GPBHFCE)
Notas de diseño
Route all 24 PCIe Gen3 lanes as 100-ohm differential pairs over an unbroken reference plane. At 8 GT/s, insertion-loss budget matters: keep board traces within the length limit specified in the manufacturer layout guidelines and validate receiver equalization on the longest links during bring-up. Avoid stubs, plane splits, and via transitions on SERDES pairs; when layer changes are unavoidable, place return-current vias adjacent to signal vias. Simulate the eye diagram at the receiver for the worst-case channel before committing the stackup.
The 324-ball H-FCBGA (19 x 19 mm) requires a follow-the-manufacturer land pattern with via-in-pad or dogbone fanout. Plan ball-map escape routing on at least 6 layers given the density of 24 differential pairs plus power balls. First-article assemblies should be X-ray inspected for BGA solder-joint voids and shorts, and reflow profiled per the solder paste and package MSL requirements. Do not route switching regulators underneath the SERDES region of the package; keep the area under the switch clear of aggressive aggressor signals.
Estimated: PCIe Gen3 switch power scales with the number of active lanes and ports - a 24-lane switch under full Gen3 traffic typically dissipates on the order of 2-4 W (verify the exact figure against the manufacturer datasheet power section before finalizing thermal design; this is a planning estimate, not a datasheet value). Provide dedicated decoupling per the datasheet power-delivery recommendations on each supply rail, sequence the rails per the datasheet power-up ordering, and budget enclosure airflow using the H-FCBGA package theta-JA from the thermal section.
Order by the complete orderable part number: PI7C9X3G1224GPAHFCE. Suffix letters encode package, option, and packing differences within the PI7C9X3G1224GP family - substituting suffixes without checking the ordering information table can deliver a different configuration or packing (tray vs reel) than your assembly line expects. Also confirm the reference clock topology (common clock vs SRIS) early, since clock architecture affects both the clock tree design and Gen3 equalization behavior.
Información de cumplimiento
Compliance status was not stated in the retrieved web data; verify against the Diodes Incorporated product page and official compliance documents for the PI7C9X3G1224GP family before export or automotive use.
