PIC16F15356-E/ML - 8-Bit 32MHz MCU, 28KB Flash, 28-QFN | Microchip
N.º de pieza: PIC16F15356-E/ML ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1.69 | $1,69 |
| 10 | $1.52 | $15,20 |
| 100 | $1.35 | $135,00 |
| 500 | $1.18 | $590,00 |
| 1.000 | $1.05 | $1.050,00 |
PIC16F15356-E/ML Descripción general
An 8-bit microcontroller (MCU) is a compact processor on a single integrated circuit containing a CPU, RAM, Flash program memory, and configurable peripherals. PIC microcontrollers use a Harvard RISC architecture optimized for deterministic interrupt response and low power. The PIC16F153xx family specifically extends the mid-range core with peripheral-rich features for mixed-signal embedded designs, positioning this part at the high end of Microchip's 8-bit portfolio for general-purpose applications.
Key features include four 10-bit PWM channels, a 5-bit and 10-bit DAC, comparators with selectable references, a 10-bit ADC, Complementary Waveform Generator (CWG), four Configurable Logic Cells (CLC), and dual EUSART plus SPI/I2C interfaces. These integrated CIPs enable complex waveform, logic, and signal-chain functions without CPU intervention, reducing code size and power consumption.
The architecture pairs the enhanced mid-range core (49 instructions, 16-bit instruction width) with nanoWatt XLP sleep modes supporting currents below 1 microamp, plus peripheral module disable to shut down unused peripherals and further reduce active power. Internal 32 MHz and 32 kHz oscillators eliminate external crystal cost in many designs.
Typical applications include low-power IoT sensor nodes, home automation controllers, consumer appliance front panels, battery-powered instrumentation, LED lighting control, and industrial sensor interfaces. The wide operating voltage range and rich analog peripherals suit mixed-signal designs where the MCU must both read sensors and drive actuators.
When designing with this device, take advantage of the CWG, CLC, and PWM peripherals to offload repetitive tasks from the CPU and minimize active time. Use the nanoWatt XLP sleep modes with peripheral interrupt wake-up to maximize battery life, and verify the QFN thermal pad is soldered to a sufficient copper area for thermal performance under full peripheral load.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the PIC16F153xx family, and practical design notes that complement the manufacturer datasheet for sourcing and engineering decisions.
Alternativas directas para PIC16F15356-E/ML — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC16F15356-E/ML (mismo factor de forma y huella) — difiere en Package, Program Memory (Flash), Operating Temperature, PWM Channels, DAC.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC16F15355-E/ML
✅ Sustitución directa✓ En stock
$1.12 / unidad
Ver hoja de datos →PIC16F15354-E/ML
✅ Sustitución directa✓ En stock
$1.18 / unidad
Ver hoja de datos →PIC16F15356-E/MV
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC16F15355-I/ML
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC16F15354-E/ML
✅ Sustitución directa✓ En stock
$1.18 / unidad
Ver hoja de datos →PIC16F15356T-I/ML
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1.15 / unidad
Ver hoja de datos →PIC16F15356-E/ML Valores máximos y características eléctricas
| Core Architecture | PIC16 Enhanced Mid-Range 8-bit RISC |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Data SRAM | 2 KB |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 2.3 V to 5.5 V |
| ADC | 10-bit |
| DAC | 5-bit and 10-bit |
| PWM Channels | 4 x 10-bit |
| Comparators | Yes (with selectable reference) |
| CWG (Complementary Waveform Generator) | Yes |
| CLC (Configurable Logic Cell) | 4 |
| EUSART | 2 |
| SPI | Yes |
| I2C | Yes |
| Internal Oscillator | 31 kHz to 32 MHz selectable |
| XLP (eXtreme Low-Power) Sleep Current | < 1 uA typical (per family datasheet) |
| Rango de temperatura de funcionamiento | -40C to +125C (E = Extended) |
| Encapsulado | 28-pin QFN (6x6 mm) with exposed pad |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
Guía de configuración de pines de PIC16F15356-E/ML 28-pin qfn (6x6 mm) with exposed pad
Configuración de pines para PIC16F15356-E/ML (encapsulado 28-pin qfn (6x6 mm) with exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PIC16F15356-E/ML.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PIC16F15356-E/ML es adecuado para 6 aplicacións: Battery-Powered IoT Sensor Node, Home Appliance Control Panel, Industrial Sensor Interface Module, LED Lighting Controller, Consumer Remote Control, Portable Medical Monitoring Device.
Battery-Powered IoT Sensor Node
The PIC16F15356-E/ML fits battery-powered IoT sensor nodes because its eXtreme Low-Power (XLP) sleep modes draw less than 1 microamp, while its 10-bit ADC and comparators handle analog sensor reads on wake-up. With 28 KB Flash and 2 KB SRAM, the device can run a small TCP/IP or LoRaWAN stack plus sensor drivers without external memory. The 2.3 V to 5.5 V range supports direct connection to single-cell lithium or two-cell alkaline batteries, eliminating the need for boost converters and extending battery life to years in typical duty-cycled deployments.
Recomendado
Home Appliance Control Panel
The PIC16F15356-E/ML is well-suited to home appliance front panels because it integrates four PWMs, a DAC, comparators, and a CWG to drive LED indicators, buzzer tones, and triac-controlled loads without external circuitry. The 28-QFN footprint fits inside compact appliance enclosures while exposing enough pins for keypad scanning, LED matrices, and rotary encoder inputs. CIPs like the CLC offload button-debounce and PWM timing from the CPU, simplifying firmware and improving response time for user interface interactions.
Recomendado
Industrial Sensor Interface Module
The PIC16F15356-E/ML handles industrial 4-20 mA sensor interfaces through its 10-bit ADC, comparators with selectable voltage references, and dual EUSART for RS-485 half-duplex communication. The Extended -40C to +125C temperature grade enables deployment in factory floor enclosures near motors or heaters without thermal derating. The CWG module generates stable excitation signals for ratiometric sensor bridges, while the 32 MHz core executes linearization and calibration routines within millisecond sample windows.
Recomendado
LED Lighting Controller
The PIC16F15356-E/ML suits LED lighting controllers because its four 10-bit PWM channels and Complementary Waveform Generator (CWG) can drive high-frequency dimming and dead-band control for half-bridge LED driver stages. The CLCs combine PWM signals with comparator feedback for color mixing or thermal foldback without CPU overhead, allowing smooth dimming curves down to 0.1% duty cycle. The wide 2.3 V to 5.5 V supply range simplifies integration with constant-current LED drivers and supports both 3.3 V and 5 V system architectures.
Recomendado
Consumer Remote Control
The PIC16F15356-E/ML drives consumer IR or RF remote controls through its low-power sleep modes that extend coin-cell battery life to multiple years of typical use. The CLC and PWM peripherals generate 38 kHz IR carrier signals directly, eliminating external timer ICs and reducing BOM cost. The dual EUSART enables simultaneous IR transmit and optional RF link, while internal pull-ups on digital inputs allow direct matrix keypad scanning without external resistors.
Recomendado
Portable Medical Monitoring Device
The PIC16F15356-E/ML fits portable medical monitors because its low-power architecture supports continuous vital-sign sensing on a single lithium coin cell, while the 10-bit ADC and comparators capture pulse oximetry or temperature signals with adequate resolution for screening-grade devices. The 32 MHz core executes digital filtering algorithms within real-time constraints, and the dual EUSART links to BLE modules or USB-CDC bridges for data upload. The Extended -40C to +125C temperature range allows operation in refrigerated transport and outdoor environments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC16F15356-E/ML — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC16F15355-E/ML | PIC16F15354-E/ML | PIC16F15356-E/MV | PIC16F15355-I/ML | PIC16F15356T-I/ML |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6) with EP | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-UQFN (4x4) - smaller | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 28 KB | 14 KB | 7 KB | 28 KB | 14 KB | 28 KB |
| SRAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Temperature Grade | Extended -40C to +125C | Extended -40C to +125C | Extended -40C to +125C | Extended -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C |
| PWM Channels | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit |
| CLC Count | 4 | 4 | 4 | 4 | 4 | 4 |
Diferenciadores clave
- Largest Flash memory in the 28-QFN (6x6) PIC16F153xx family at this temperature grade (frente a PIC16F15355-E/ML)
- More on-chip logic peripherals than PIC16F152xx generation (frente a PIC16F15256-E/SP)
- Same silicon die and firmware as PIC16F15356-E/MV in a smaller footprint option (frente a PIC16F15356-E/MV)
Notas de diseño
The 28-QFN (6x6) package has an exposed thermal pad that must be soldered to a copper pour on the PCB to meet the datasheet thermal specifications and provide a low-impedance ground return. Provide at least 0.5 square inches of 1 oz copper connected to the EP for typical applications, increasing to 1 square inch when the MCU drives multiple peripherals at full duty cycle. Stitching vias in the thermal pad area improve heat transfer to inner PCB layers.
Place a 100 nF decoupling capacitor as close as possible to the VDD pin and a 10 uF bulk capacitor on each major supply rail feeding the MCU. For battery-powered designs, the 2.3 V minimum supply requires careful analog reference selection - use the internal 1.024 V or 2.048 V reference rather than VDD when monitoring low-voltage battery rails. Disable unused peripherals via the PMDx registers to minimize active current consumption.
Do not skip configuration of the PPS (Peripheral Pin Select) module before using EUSART, SPI, or I2C - by default these peripherals are not routed to physical pins after reset. The Configuration Words must be set correctly including WDTE (watchdog timer enable), BORV (brown-out reset voltage), and LVP (low-voltage programming) before the device operates predictably. Always read-back Configuration Words after programming to verify the values match the intended fuse map.
When using the 10-bit ADC for precision measurements, add an external voltage reference (e.g., MCP1525) rather than VDD if the supply rail is shared with switching loads. Add a 100 ohm series resistor and 10 nF capacitor at each ADC input to limit current injection during overvoltage events. Average multiple ADC samples to improve effective resolution beyond the native 10 bits for low-frequency signals.
Información de cumplimiento
RoHS and REACH compliant per Microchip product page. E temperature grade extends to -40C to +125C but is not AEC-Q100 automotive qualified; choose PIC16F15356-E/MLVAO or similar automotive-grade variants for vehicle applications.
