PIC16LF1613T-I/ML - 8-bit XLP MCU 3.5KB Flash | Microchip
N.º de pieza: PIC16LF1613T-I/ML ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1.2 | $1,20 |
| 10 | $1.05 | $10,50 |
| 100 | $0.88 | $88,00 |
| 500 | $0.74 | $370,00 |
| 1.000 | $0.62 | $620,00 |
PIC16LF1613T-I/ML Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash, RAM, EEPROM), and programmable peripherals into one IC. PIC microcontrollers from Microchip are widely adopted in embedded designs because of their deterministic instruction set, simple programming model, and extensive peripheral ecosystem. The PIC16LF1613 belongs to the PIC16F16xx family of mid-range 8-bit cores and is targeted at cost-sensitive, battery-powered applications where low active current and deep sleep modes are mandatory. Its hierarchical position in the taxonomy is: microcontroller -> 8-bit MCU -> PIC16 family -> RISC core -> embedded control IC.
Key features include ultra-low-power (XLP) technology with active current typically under 1 mA and sleep currents in the microamp range, hardware peripherals such as a 10-bit ADC, comparators, PWM modules, and the Configurable Logic Cell (CLC) for hardware glue logic, plus support for capacitive touch sensing via the mTouch peripheral. The integrated Core Independent Peripherals (CIPs) allow background tasks without CPU intervention, reducing overall system power consumption.
Technical depth: the device uses a 14-bit instruction word with a 35-instruction set, executes most instructions in a single clock cycle, and supports interrupt-driven operation. The 16-QFN package offers a small 4x4 mm footprint, with the exposed pad providing thermal dissipation down to a 31°C/W θJA typical value. Programming is supported through Microchip's MPLAB X IDE and the XC8 compiler suite.
Typical applications include consumer appliances, IoT sensor nodes, battery-powered handheld devices, low-cost motor control, and lighting controllers. The wide operating voltage range also makes it suitable for 3.3V-logic digital systems.
Design consideration: the 16-QFN exposed pad must be soldered to a sufficient copper area for thermal and electrical performance; inadequate soldering to the EP is the most common cause of field failures in QFN-package MCUs. Use at least 0.5 square inches of copper on the EP node.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para PIC16LF1613T-I/ML — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC16LF1613T-I/ML (mismo factor de forma y huella) — difiere en Package, ADC, Operating Temperature Range, I/O Pins, Maximum CPU Frequency.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC16F1613T-I/ML
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC16F1613-I/ML
✅ Sustitución directa✓ En stock
$0.92 / unidad
Ver hoja de datos →PIC16LF1613-I/ML
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC16LF1559T-I/ML
✅ Sustitución directa✓ En stock
$1.32 / unidad
Ver hoja de datos →PIC16LF1454T-I/ML
✅ Sustitución directa✓ En stock
$1.55 / unidad
Ver hoja de datos →PIC16LF1516T-I/ML
✅ Sustitución directa✓ En stock
$1.18 / unidad
Ver hoja de datos →PIC16LF1613T-I/ML Valores máximos y características eléctricas
| Core Architecture | PIC 8-bit RISC |
| Program Memory (Flash) | 3.5 KB (2K x 14) |
| RAM | 256 bytes |
| Data EEPROM | 0 bytes (none on this family variant) |
| Maximum CPU Frequency | 32 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V |
| ADC | 10-bit |
| Encapsulado | 16-QFN (4x4 mm) with exposed pad |
| Package Code | /ML |
| Rango de temperatura de funcionamiento | -40 °C to +85 °C (Industrial) |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 1 |
| Estado RoHS | Compliant |
| Low-Power Technology | XLP (eXtreme Low Power) |
Configuración de pines de PIC16LF1613T-I/ML
| Pin 1 | RA0 — Bidirectional I/O / analog input |
| Pin 2 | RA1 — Bidirectional I/O / analog input |
| Pin 3 | RA2 — Bidirectional I/O / analog input |
| Pin 4 | RA3 — Bidirectional I/O / analog input (also MCLR on some PIC16F variants) |
| Pin 5 | RA4 — Bidirectional I/O |
| Pin 6 | RA5 — Bidirectional I/O |
| Pin 7 | VSS — Ground |
| Pin 8 | RA7 — Bidirectional I/O / oscillator |
| Pin 9 | RA6 — Bidirectional I/O / oscillator |
| Pin 10 | RC0 — Bidirectional I/O |
| Pin 11 | RC1 — Bidirectional I/O |
| Pin 12 | RC2 — Bidirectional I/O |
| Pin 13 | RC3 — Bidirectional I/O |
| Pin 14 | RC4 — Bidirectional I/O |
| Pin 15 | RC5 — Bidirectional I/O |
| Pin 16 | VDD — Positive supply voltage |
| Pin EP | EP — Exposed thermal pad (must be soldered to VSS plane) |
Aplicaciones típicas
PIC16LF1613T-I/ML es adecuado para 7 aplicacións: Battery-Powered IoT Sensor Node, Consumer Appliance Control, LED Lighting Controller, Wearable Health Device, Capacitive Touch User Interface, Industrial Sensor Transmitter, Low-Cost Motor Control (BLDC / Stepper).
Battery-Powered IoT Sensor Node
The PIC16LF1613T-I/ML's XLP technology and 1.8V minimum VDD make it ideal for coin-cell or Li-Ion battery-powered IoT sensor nodes. Its 256-byte RAM and 3.5KB Flash support small protocol stacks such as Modbus RTU or proprietary RF sub-GHz wake-up sequences, while the 10-bit ADC reads temperature, humidity, or motion sensors with 0.1% resolution. Placed as the central MCU on a sensor PCB with a sub-GHz radio like the MRF89XA, the LF variant draws under 1 mA active and microamp-range sleep current, enabling multi-year battery life on a single CR2032 cell. Pair with a low quiescent LDO such as MCP1700 for the radio rail.
Recomendado
Consumer Appliance Control
In consumer appliances (coffee makers, blenders, air purifiers), the PIC16LF1613T-I/ML serves as the main control MCU driving relays, triacs, and user-interface LEDs. Its CLC (Configurable Logic Cell) peripheral implements hardware glue logic for safety interlocks without CPU overhead, and the 10-bit ADC reads thermistor inputs for temperature regulation. The 16-QFN (4x4 mm) footprint fits inside compact control boards, and the exposed pad provides reliable thermal dissipation under the appliance housing. Choose the LF variant for 3.3V-only designs; for legacy 5V appliances, choose PIC16F1613T-I/ML instead.
Recomendado
LED Lighting Controller
The PIC16LF1613T-I/ML is well-suited to entry-level LED lighting controllers where PWM-driven dimming, color mixing, or simple DMX-style command parsing is required. Its PWM module drives MOSFETs for constant-current LED strings, while the ADC monitors the LED current sense resistor for closed-loop brightness control. The 1.8V minimum VDD lets the controller operate directly from a single-cell Li-Ion battery in portable lighting, and the XLP sleep current is low enough to support battery-backed emergency lighting. Pair with a constant-current LED driver like the HV9910 for AC-DC mains-powered fixtures.
Recomendado
Wearable Health Device
Wearable health devices (fitness bands, smartwatches, pulse oximeters) benefit from the PIC16LF1613T-I/ML's tiny 4x4 mm QFN footprint, low active current, and XLP sleep modes. The MCU interfaces with optical heart-rate sensors via I2C or SPI, runs step-counting algorithms in firmware, and manages Bluetooth Low Energy (BLE) module handshakes. The 32 MHz clock delivers enough MIPS for sensor fusion while the LF process keeps average current well under 5 mA active. Pair with a BLE module like the RN4871 and a low-power analog front-end for biopotential measurement.
Recomendado
Capacitive Touch User Interface
Capacitive touch buttons, sliders, and proximity sensors in white goods, automotive interiors, and industrial HMIs are well-served by the PIC16LF1613T-I/ML's mTouch peripheral. The on-chip hardware CVD (Capacitive Voltage Divider) module scans up to 8 touch electrodes without CPU intervention, freeing the core for backlight control and user feedback. The 16-QFN footprint allows the MCU to sit directly under a touch PCB pad, and the LF variant's low current draw keeps standby power below 50 µW. Pair with the MTCH101 or MTCH6301 for higher-channel touch systems.
Recomendado
Industrial Sensor Transmitter
In industrial 4-20 mA loop-powered sensor transmitters, the PIC16LF1613T-I/ML conditions and digitizes analog sensor signals and modulates the loop current for HART or proprietary protocols. Its 1.8V minimum VDD and 10-bit ADC make it suitable for low-voltage, loop-powered designs where headroom is scarce. The exposed pad on the 16-QFN package handles continuous operation under industrial temperature swings (-40 °C to +85 °C). For higher-resolution ADC requirements, pair with an external 16-bit ADC like the MCP3421 over I2C.
Recomendado
Low-Cost Motor Control (BLDC / Stepper)
Small DC motors, BLDC fans, and stepper drivers in 3D printers, drones, and robotics benefit from the PIC16LF1613T-I/ML as a low-cost supervisory MCU. Its PWM and CLC peripherals generate complementary PWM outputs for half-bridge drivers, while the ADC monitors back-EMF or current sense for closed-loop control. The 16-QFN (4x4 mm) package fits tight motor housings, and the LF variant operates from a single 18650 Li-Ion cell. For higher-current motor stages, pair with a gate driver like the MCP14A0901 or DRV8871.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC16LF1613T-I/ML — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC16F1613T-I/ML | PIC16F1613-I/ML | PIC16LF1613-I/ML | PIC16LF1559T-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 16-QFN (4x4 mm) | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same | 16-QFN (4x4 mm) - same |
| Operating Voltage Range | 1.8V to 3.6V | 1.8V to 5.5V | 1.8V to 5.5V | 1.8V to 3.6V (identical) | 1.8V to 3.6V (similar) |
| Program Memory (Flash) | 3.5 KB | 3.5 KB (same) | 3.5 KB (same) | 3.5 KB (same) | 14 KB (larger) |
| RAM | 256 bytes | 256 bytes (same) | 256 bytes (same) | 256 bytes (same) | 1 KB (larger) |
| Maximum CPU Frequency | 32 MHz | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) |
| ADC | 10-bit | 10-bit (same) | 10-bit (same) | 10-bit (same) | 10-bit (same) |
| Operating Temperature | -40°C to +85°C (Industrial) | -40°C to +85°C (same) | -40°C to +85°C (same) | -40°C to +85°C (same) | -40°C to +85°C (same) |
Diferenciadores clave
- Lowest voltage operation in PIC16F16xx family (frente a PIC16F1613T-I/ML)
- Tape-and-reel packaging for high-volume SMT (frente a PIC16LF1613-I/ML)
- Larger Flash and RAM than older PIC16LF1554 alternatives (frente a PIC16LF1554T-I/ML)
Notas de diseño
The 16-QFN (4x4) package exposes a thermal pad (EP) on the underside that must be soldered to the PCB ground plane. Estimated: at the PIC16LF1613T-I/ML's typical 8 MHz / 3.3V active current of ~2 mA, dissipation is only ~6.6 mW and thermal rise is negligible, but if the MCU is used at 32 MHz full-speed with peripherals active, the EP provides mechanical reliability and a low-impedance ground return. Recommended EP copper area: at least 0.25 square inches (16 mm²) connected to VSS with multiple thermal vias.
Place a 100 nF decoupling capacitor as close as possible to the VDD pin (pin 16) and a bulk 10 µF ceramic or tantalum capacitor at the MCU power entry. Use a ground pour on the top layer stitched with vias to the bottom layer for low-impedance ground returns. For QFN packages, the recommended land pattern is IPC-7351 nominal with 0.2 mm pads and 0.5 mm pitch; do not use NSMD land patterns on EP unless process capability has been qualified.
Do not assume pin 4 is MCLR - on PIC16LF1613, pin 4 is RA3/MCLR depending on configuration bit settings; consult the datasheet before assigning this pin. The PIC16LF1613T-I/ML cannot operate above 3.6V - if your system includes 5V rails (USB, RS-232 drivers), use level shifters or choose the PIC16F1613T-I/ML variant instead. The 'LF' family does NOT include EEPROM - store non-volatile data in Flash with wear-leveling.
Route the ICSP (In-Circuit Serial Programming) signals PGD/PGC to a 6-pin header or test pad accessible during board bring-up; the PIC16LF1613T-I/ML uses the standard Microchip ICSP protocol on dedicated pins. Keep the ICSP traces short and away from high-frequency switching nodes (DC-DC converters, motor drivers) to prevent programming failures. Add a 10 kΩ pull-up on MCLR if used as a reset input.
To maximize XLP battery life, place the MCU in sleep mode (SLEEP instruction) between sensor reads. The PIC16LF1613T-I/ML's sleep current is typically <1 µA with WDT disabled, enabling multi-year battery life on a 200 mAh coin cell. Use the RTC with external 32.768 kHz crystal for timekeeping, and the CLC peripheral to wake the core on GPIO events without software intervention.
Información de cumplimiento
RoHS compliant per Microchip product page. Industrial temperature grade -40°C to +85°C. Not AEC-Q100 qualified; consult Microchip for automotive-grade part numbers in PIC16F1613 family.
