PIC18F45K80-E/ML - 64MHz 8-bit MCU with ECAN, 32KB Flash | Microchip
N.º de pieza: PIC18F45K80-E/ML ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $3.8 | $3,80 |
| 10 | $3.42 | $34,20 |
| 100 | $3.04 | $304,00 |
| 500 | $2.71 | $1.355,00 |
| 1.000 | $2.43 | $2.430,00 |
PIC18F45K80-E/ML Descripción general
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and peripherals on one die. The PIC18 family sits within Microchip's 8-bit MCU hierarchy: PIC10/12/16/18 -> 8-bit PIC -> microcontroller -> embedded processor -> semiconductor. The 'K' family designation denotes nanoWatt XLP low-power operation, while the '80' suffix marks the ECAN-equipped variant, targeting automotive and industrial CAN-bus applications.
Key features of the PIC18F45K80 include integrated ECAN 2.0B with six programmable receive/transmit buffers, a 12-bit A/D converter with up to 12 channels, three dedicated transmit buffers, hardware CTMU (Charge Time Measurement Unit) for capacitive touch and precise time measurement, and enhanced PWM/capture/compare peripherals for precision timing. The device supports SPI, I2C, and USART connectivity alongside ECAN, making it suitable for industrial and automotive networking.
The device uses an enhanced Harvard RISC architecture with a 16-bit instruction word and an 8-bit data path, achieving 16 MIPS performance at 64MHz. Sleep current is reduced to nanowatt levels through XLP technology, and an internal oscillator option reduces external component count for space-constrained designs.
Typical applications include automotive body and chassis ECAN nodes, industrial building control, elevator control systems, HVAC fan control, sensor interfacing, and low-power remote sensor nodes. The combination of ECAN + 12-bit ADC + nanoWatt XLP makes this part particularly well suited for distributed industrial control networks operating on 3.3V or 5V rails.
When designing with this MCU, ensure the exposed thermal pad on the QFN package is soldered to a sufficient copper pour (recommended >= 1 sq. inch) to meet thermal and electrical grounding requirements. Programming and debugging are supported via MPLAB X IDE and ICD 3 / PICkit 4 tools.
This page synthesizes current distributor pricing, parametric drop-in alternatives, and practical design notes beyond the manufacturer datasheet, giving procurement and embedded engineers a faster selection path.
Alternativas directas para PIC18F45K80-E/ML — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC18F45K80-E/ML (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Program Memory (Flash), ADC, Maximum CPU Speed.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC18F45K80-I/ML
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC18F46K80-I/ML
✅ Sustitución directa✓ En stock
$4.23 / unidad
Ver hoja de datos →PIC18F4585-I/ML
✅ Sustitución directa✓ En stock
$5.53 / unidad
Ver hoja de datos →PIC18F4585-E/ML
✅ Sustitución directa✓ En stock
$6.04 / unidad
Ver hoja de datos →PIC18F45K80-E/ML Valores máximos y características eléctricas
| Core Architecture | PIC 8-bit Harvard RISC |
| Core Size | 8-bit |
| Series | PIC® XLP™ 18K |
| Program Memory (Flash) | 32 KB (16K x 16) |
| RAM | 3.6 KB |
| EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Operating Voltage | 1.8 V to 5.5 V |
| Number of I/O | 35 |
| Connectivity | ECAN, I2C, LIN, SPI, UART/USART |
| Peripherals | Brown-out Detect, CTMU, POR, PWM, WDT |
| ADC | 12-bit, up to 11 channels |
| Encapsulado | 44-VQFN (8x8 mm) Exposed Pad |
| Tipo de montaje | Surface Mount |
| Oscillator Type | Internal/External |
| Temperatura de funcionamiento | -40 °C to +125 °C (E = Extended) |
| Estado RoHS | Compliant |
| Nivel MSL | 1 (unlimited at <=30 C/85 %RH) |
| Data Converters | A/D 11x12b |
| Program Memory Type | FLASH |
Configuración de pines de PIC18F45K80-E/ML
| Pin 1 | RA0 — PORTA bit 0 / analog input AN0 |
| Pin 2 | RA1 — PORTA bit 1 / analog input AN1 |
| Pin 3 | RA2 — PORTA bit 2 / analog input AN2 |
| Pin 4 | RA3 — PORTA bit 3 / analog input AN3 / VREF+ |
| Pin 5 | RA4 — PORTA bit 4 / analog input AN4 |
| Pin 6 | RA5 — PORTA bit 5 / analog input AN5 / VREF- |
| Pin 7 | RA6 — PORTA bit 6 / OSC2 |
| Pin 8 | RA7 — PORTA bit 7 / OSC1 |
| Pin 9 | VDD — Positive supply |
| Pin 10 | VSS — Ground reference |
| Pin 11 | RB0 — PORTB bit 0 / interrupt-on-change |
| Pin 12 | RB1 — PORTB bit 1 / interrupt-on-change |
| Pin 13 | RB2 — PORTB bit 2 / interrupt-on-change |
| Pin 14 | RB3 — PORTB bit 3 / interrupt-on-change |
| Pin 15 | RB4 — PORTB bit 4 / interrupt-on-change |
| Pin 16 | RB5 — PORTB bit 5 / interrupt-on-change |
| Pin 17 | RB6 — PORTB bit 6 / PGED (ICSP data) |
| Pin 18 | RB7 — PORTB bit 7 / PGEC (ICSP clock) |
| Pin 19 | VDD — Positive supply |
| Pin 20 | VSS — Ground reference |
| Pin 21 | RC0 — PORTC bit 0 |
| Pin 22 | RC1 — PORTC bit 1 |
| Pin 23 | RC2 — PORTC bit 2 |
| Pin 24 | RC3 — PORTC bit 3 / SCL (I2C) |
| Pin 25 | RC4 — PORTC bit 4 / SDA (I2C) |
| Pin 26 | RC5 — PORTC bit 5 |
| Pin 27 | RC6 — PORTC bit 6 / TX (USART) |
| Pin 28 | RC7 — PORTC bit 7 / RX (USART) |
| Pin 29 | RE0 — PORTE bit 0 / analog input AN6 |
| Pin 30 | RE1 — PORTE bit 1 / analog input AN7 |
| Pin 31 | RE2 — PORTE bit 2 / analog input AN8 |
| Pin 32 | RE3 — PORTE bit 3 |
| Pin 33 | MCLR — Master Clear (reset) input |
| Pin 34 | CANRX — ECAN receive input |
| Pin 35 | CANTX — ECAN transmit output |
| Pin 36 | RD0 — PORTD bit 0 |
| Pin 37 | RD1 — PORTD bit 1 |
| Pin 38 | RD2 — PORTD bit 2 |
| Pin 39 | RD3 — PORTD bit 3 |
| Pin 40 | RD4 — PORTD bit 4 |
| Pin 41 | RD5 — PORTD bit 5 |
| Pin 42 | RD6 — PORTD bit 6 |
| Pin 43 | RD7 — PORTD bit 7 |
| Pin 44 | EP — Exposed thermal pad (must be soldered to ground) |
Aplicaciones típicas
PIC18F45K80-E/ML es adecuado para 6 aplicacións: Automotive ECAN Body Control Modules, Industrial Building Control Networks, Elevator Control Systems, Low-Power Remote Sensor Nodes, HVAC Fan and Blower Controllers, LIN Bus Automotive Subnodes.
Automotive ECAN Body Control Modules
The PIC18F45K80-E/ML fits automotive body and chassis ECAN nodes because of its integrated ECAN 2.0B controller, 1.8 V to 5.5 V VDD tolerance for direct 12 V battery node connection, and -40 °C to +125 °C extended-temperature qualification. Its 16 MIPS at 64 MHz is sufficient to handle the CAN protocol stack plus window/lift/seat control logic simultaneously. Placed on a 5 V regulator downstream of a battery input with ECAN bus transceivers such as MCP2561 or MCP2551, the device consumes <100 nA in sleep between CAN messages thanks to nanoWatt XLP technology, extending quiescent battery drain to negligible levels.
Recomendado
Industrial Building Control Networks
Building automation nodes (HVAC, lighting, access control) benefit from the PIC18F45K80-E/ML's ECAN peripheral for networked sensor and actuator control, its 12-bit ADC for temperature/light/humidity sensing, and 1.8 V to 5.5 V operation for direct 3.3 V or 5 V system rails. The 35 I/O pins drive relays, triacs, and LEDs directly without external expanders. Its nanoWatt XLP sleep reduces quiescent current to under 100 nA, ideal for battery-backed wireless sensors. The 44-QFN (8x8 mm) package suits compact wall-switch form factors common in European building-control installations.
Recomendado
Elevator Control Systems
Elevator door and floor-level controllers rely on the PIC18F45K80-E/ML's enhanced PWM and capture/compare peripherals to drive three-phase motor control loops, plus ECAN for the multi-node elevator network. Its 16 MIPS handles the deterministic timing-critical encoder decoding and ECAN message scheduling without offloading to a DSP. Operating at extended -40 °C to +125 °C range and 5 V supply, the device handles unheated-shaft temperature swings; 32 KB Flash fits full CANopen/Elevator v1.0 application profile plus diagnostics.
Recomendado
Low-Power Remote Sensor Nodes
Battery-powered wireless sensor endpoints benefit from the PIC18F45K80-E/ML's nanoWatt XLP sleep current below 100 nA, integrated 12-bit ADC for direct sensor interface, and ECAN for cabled backhaul. Combined with a sub-GHz radio module over SPI, the device can spend >99% of its time in sleep and wake periodically to sample sensors and transmit. The 32 KB Flash accommodates LoRaWAN-style or proprietary sensor protocol stacks with margin. 44-QFN package allows compact IP67 enclosures for outdoor deployment in -40 °C to +125 °C ranges.
Recomendado
HVAC Fan and Blower Controllers
Variable-speed HVAC blower motor controllers use the PIC18F45K80-E/ML's enhanced PWM channels to generate complementary PWM at 20-25 kHz, its 12-bit ADC for closed-loop current sensing, and ECAN to integrate with building-automation backbones. Its 16 MIPS provides the response time for sensorless BLDC commutation algorithms, and the 35 I/O lines handle Hall-effect sensor inputs plus gate-driver outputs without expanders. The -40 °C to +125 °C temperature range covers unconditioned attic installations where temperatures can exceed 70 °C in summer.
Recomendado
LIN Bus Automotive Subnodes
Subordinate LIN bus nodes (window switches, mirror adjusters, seat controllers) pair well with the PIC18F45K80-E/ML's UART/USART plus ECAN capabilities; the on-chip enhanced UART supports LIN 1.3/2.0/2.1 with auto-baud detection, while ECAN enables gateway designs where the PIC18 bridges LIN and CAN segments. The 1.8 V to 5.5 V VDD range tolerates automotive crank-start voltage drops, and nanoWatt XLP provides <1 µA sleep for parked-vehicle quiescent current budgets. With 32 KB Flash, the device fits LIN device drivers plus cluster diagnostics.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC18F45K80-E/ML — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC18F45K80-I/ML | PIC18F46K80-I/ML | PIC18F4585-I/ML | PIC18F4585-E/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Program Memory (Flash) | 32 KB | 32 KB | 64 KB | 48 KB | 48 KB |
| RAM | 3.6 KB | 3.6 KB | 4 KB | 3.6 KB | 3.6 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| ECAN | Yes (integrated) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 to +125 C (E) | -40 to +85 C (I) | -40 to +85 C (I) | -40 to +85 C (I) | -40 to +125 C (E) |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V |
| Maximum CPU Speed | 64 MHz | 64 MHz | 64 MHz | 40 MHz | 40 MHz |
Diferenciadores clave
- Integrated ECAN 2.0B in lowest-cost PIC18 family tier (frente a PIC18F4585-I/ML)
- Doubled Flash capacity in identical 44-QFN footprint (frente a PIC18F45K80-I/ML)
- Wide 1.8 V to 5.5 V VDD supports direct 3.3 V and 5 V rails (frente a PIC18F4585-E/ML)
Notas de diseño
The 44-QFN (8x8 mm) package dissipates up to ~1 W under sustained 64 MHz operation. The exposed thermal pad (EP, pin 44) must be soldered to a ground copper pour of at least 1 sq. inch on the top layer with multiple thermal vias to inner ground planes. Without proper EP soldering, junction temperature can exceed 125 C at room ambient, causing thermal shutdown or reliability degradation. Use Microchip's Thermal Management application note (DS01065) for stack-up recommendations.
Place decoupling capacitors as close as possible to each VDD/VSS pair (pins 9-10, 19-20). Use one 100 nF X7R ceramic per pair plus a bulk 4.7 µF tantalum or ceramic on the main VDD rail. The PIC18F45K80 datasheet (DS39977C) specifies that inadequate decoupling can cause ADC noise and ECAN communication errors. Keep CANRX/CANTX traces short and routed as a differential pair to the MCP2561/MCP2551 transceiver to maintain CAN signal integrity.
Route the ICSP pins (PGED/RB6 and PGEC/RB7) directly to a 6-pin header with no series resistors. The MCLR pin (pin 33) requires a 10 kΩ pull-up to VDD and a 100 nF cap to ground for proper reset; adding an in-line diode or reset supervisor IC is recommended for noisy industrial environments. Place the 20 MHz or 16 MHz crystal within 5 mm of OSC1/OSC2 (RA6/RA7) with guard traces to reduce EMI susceptibility.
Do not assume the PIC18F45K80 and PIC18F45K22 share firmware - the K22 variant lacks the ECAN peripheral registers and bit names differ. Always verify device ID (0x9560 for PIC18F45K80) in your firmware initialization code to catch device mismatches at runtime. Configuring CONFIG words for the wrong oscillator mode (HS vs. EC vs. internal PLL) is a common cause of 'dead' boards; use MPLAB X IDE's configuration-bit viewer before programming.
For ECAN bus designs, add a 120 Ω termination resistor at each end of the CAN bus, and use a twisted-pair cable between MCP2561 transceiver and bus. The CAN bus common-mode voltage should be biased through a split termination network (2 × 60 Ω with 10 nF to ground) for improved EMI immunity. The ECAN peripheral requires a clean bit-time clock; set the CANCON register's BRP/CAN baud-rate prescalers per the dsPIC33/PIC18 CAN bit-timing calculator in MPLAB X.
Información de cumplimiento
RoHS compliant per Microchip product page; lead-free reflow profile JEDEC J-STD-020. AEC-Q100 automotive-grade qualification status: not_applicable - this E suffix denotes extended temperature grade but does not constitute full automotive certification; consult Microchip's automotive-qualified catalog for AEC-Q100 K80 variants.
