PIC24FJ64GA702-E/MV - 16-bit 32MHz 64KB Flash MCU | Microchip
N.º de pieza: PIC24FJ64GA702-E/MV ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.07 | $30,70 |
| 100 | $2.74 | $274,00 |
| 500 | $2.45 | $1.225,00 |
| 1.000 | $2.18 | $2.180,00 |
PIC24FJ64GA702-E/MV Descripción general
A 16-bit microcontroller (MCU) is a microprocessor with a 16-bit data path, registers, and ALU, occupying the middle ground between 8-bit MCUs (simple control, low cost) and 32-bit MCUs (high performance, complex OS). PIC24F devices sit in the broader PIC microcontroller family hierarchy (PIC10/12/16/18 8-bit -> PIC24F 16-bit -> PIC32MX 32-bit) and are widely used for mixed-signal embedded designs that need more performance than 8-bit parts but not the full overhead of ARM Cortex-M0+. The 'FJ' suffix indicates Flash program memory with eXtreme Low Power (XLP) technology, while the 'GA7xx' family adds USB, graphics, and analog peripherals.
Key features of the PIC24FJ64GA702-E/MV include 64KB (22K x 24) self-programmable Flash with ECC, 16KB SRAM, a hardware DMA engine, a 12-bit 200 ksps ADC with up to 14 channels, three comparators, a Charge Time Measurement Unit (CTMU) for touch buttons and sliders, multiple serial interfaces (UART, SPI, I2C), and 22 GPIO pins. The 32 MHz core delivers 16 MIPS while consuming only a few hundred microamps at full speed, making it ideal for battery-powered applications.
Architecturally, the PIC24FJ64GA702 uses a modified Harvard architecture with separate program and data buses, a 24-bit instruction word, and a 16-bit data path. The XLP technology includes multiple power-saving modes (Sleep, Idle, Doze) with wake-up times in the microsecond range, while the on-chip DMA engine offloads peripheral-to-memory transfers without CPU intervention. Internal voltage regulation supports 2.0V to 3.6V operation directly from a single lithium cell.
Typical applications include IoT sensor nodes, wearable health monitors, low-power wireless HMI controls, capacitive touch user interfaces, battery-powered industrial sensors, USB human-interface devices, and home automation endpoints. The 64KB Flash and 16KB RAM provide ample headroom for protocol stacks such as BLE, LoRa, or sub-GHz radio drivers when paired with an external transceiver.
When designing with this MCU, ensure the UQFN-4x4 PCB land pattern follows Microchip's recommended footprint, including thermal vias under the exposed pad. The DMA engine must be configured before activating any DMA-triggered peripheral to avoid spurious transfers, and the CTMU requires periodic calibration for accurate capacitive measurements.
Alternativas directas para PIC24FJ64GA702-E/MV — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC24FJ64GA702-E/MV (mismo factor de forma y huella) — difiere en Core Architecture, ADC, CTMU, Operating Temperature, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC24FJ128GA702-E/MV
✅ Sustitución directa✓ En stock
$3.02 / unidad
Ver hoja de datos →PIC24FJ64GA702-I/MV
✅ Sustitución directa✓ En stock
$1.38 / unidad
Ver hoja de datos →PIC24FJ64GA702T-I/MV
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.11 / unidad
Ver hoja de datos →PIC24FJ128GA702T-I/MV
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.58 / unidad
Ver hoja de datos →PIC24FJ64GA702-E/ML
✅ Sustitución directa✓ En stock
$1.98 / unidad
Ver hoja de datos →PIC24FJ64GA702-E/MV Valores máximos y características eléctricas
| Core Architecture | PIC24F 16-bit RISC (modified Harvard) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 64 KB (22K x 24) with ECC |
| Data Memory (SRAM) | 16 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| GPIO Pins | 22 |
| ADC | 12-bit, 200 ksps, up to 14 channels |
| Comparators | 3 analog comparators |
| CTMU | Yes (Charge Time Measurement Unit for touch) |
| DMA Controller | Yes (hardware DMA engine) |
| Communication Interfaces | UART, SPI, I2C |
| Encapsulado | 28-pin UQFN (MV) 4x4 mm with exposed pad |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40 C to +125 C (E suffix = extended) |
| Low-Power Technology | eXtreme Low Power (XLP) |
| Estado RoHS | Compliant |
Guía de configuración de pines de PIC24FJ64GA702-E/MV 28-pin uqfn (mv) 4x4 mm with exposed pad
Configuración de pines para PIC24FJ64GA702-E/MV (encapsulado 28-pin uqfn (mv) 4x4 mm with exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PIC24FJ64GA702-E/MV.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PIC24FJ64GA702-E/MV es adecuado para 6 aplicacións: Battery-Powered IoT Sensor Nodes, Capacitive Touch HMI Front Panels, Wearable Health and Fitness Devices, Industrial Low-Power Sensor Transmitters, USB Human Interface Devices (HID), Home Automation and Smart Home Endpoints.
Battery-Powered IoT Sensor Nodes
The PIC24FJ64GA702-E/MV's eXtreme Low Power (XLP) Sleep currents below 1 microamp and 32 MHz / 16 MIPS performance make it ideal for battery-powered IoT sensor nodes. Its 12-bit 200 ksps ADC with 14 channels acquires sensor data while the DMA engine moves samples to RAM without CPU intervention, leaving the core in Sleep most of the time. The 64 KB Flash accommodates protocol stacks such as BLE, LoRaWAN, or sub-GHz radio drivers when paired with an external transceiver. Operates directly from a single 3 V lithium cell across 2.0 to 3.6 V input. Typical battery life in periodic-measurement nodes exceeds 5 years on a single CR2032.
Recomendado
Capacitive Touch HMI Front Panels
The on-chip CTMU (Charge Time Measurement Unit) and three analog comparators give the PIC24FJ64GA702-E/MV precise capacitive touch sensing capability for HMI front panels, sliders, and proximity buttons. Microchip's mTouch library interfaces directly to the CTMU and provides deterministic touch detection with sub-percent repeatability. The 12-bit ADC supports additional analog inputs such as rotary encoders or light sensors. With 16 KB SRAM and 64 KB Flash, designers can implement multi-key matrices, gesture decoding, and LED feedback animations on a single chip. Operates reliably across the -40 C to +125 C industrial temperature range.
Recomendado
Wearable Health and Fitness Devices
The PIC24FJ64GA702-E/MV is well suited to wearable health and fitness devices thanks to its sub-microamp Sleep current, small 4x4 mm UQFN footprint, and integrated 12-bit ADC for biometric measurements. Heart rate, SpO2, skin temperature, and motion sensors can all be sampled via the ADC's 14 channels while the DMA engine preserves battery life. The 16 KB SRAM is ample for buffering sensor data between BLE transmissions. With the CTMU, the device can also drive capacitive touch electrodes on the wearable's skin-contact surface, eliminating mechanical wear points.
Recomendado
Industrial Low-Power Sensor Transmitters
The PIC24FJ64GA702-E/MV delivers reliable 32 MHz performance across the -40 C to +125 C extended industrial temperature range, qualifying it for industrial 4-20 mA loop-powered sensor transmitters and field instrumentation. The 12-bit 200 ksps ADC achieves 0.024 percent FS resolution, sufficient for bridge sensor linearization. Hardware DMA offloads cyclic ADC-to-memory transfers at full bus speed, freeing the CPU for calibration and HART protocol handling. The 28-pin UQFN package supports compact sensor head enclosures, and the 2.0 to 3.6 V supply permits direct operation from a 3.3 V regulated loop.
Recomendado
USB Human Interface Devices (HID)
The PIC24FJ64GA702-E/MV integrates USB 2.0 full-speed device support alongside the PIC24F core, making it a strong fit for USB Human Interface Devices such as keyboards, mice, game controllers, and custom HID peripherals. The 64 KB Flash accommodates USB stacks and HID report descriptors, while the DMA engine handles endpoint buffer transfers without CPU intervention. The internal 48 MHz USB clock is derived from the 32 MHz system oscillator via the on-chip PLL. Designers can implement bootloaders and firmware updates via USB using the self-programmable Flash with ECC.
Recomendado
Home Automation and Smart Home Endpoints
The PIC24FJ64GA702-E/MV is well matched to smart home endpoints such as smart plugs, dimmer switches, and wireless sensor hubs that demand both low standby power and enough headroom for Zigbee, Thread, or Matter protocol stacks. The 64 KB Flash holds a wireless protocol stack, application firmware, and OTA update bootloader, while 16 KB SRAM supports network buffers. The CTMU enables touch-controlled wall switches without mechanical buttons. The -40 C to +125 C temperature range and 2.0 to 3.6 V supply cover battery-powered and mains-powered product variants.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC24FJ64GA702-E/MV — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC24FJ128GA702-E/MV | PIC24FJ64GA702-I/MV | PIC24FJ64GA702T-I/MV | PIC24FJ128GA702T-I/MV | PIC24FJ64GA702-E/ML |
|---|---|---|---|---|---|---|
| Package | 28-UQFN (MV) 4x4 mm | 28-UQFN (MV) 4x4 mm - same | 28-UQFN (MV) 4x4 mm - same | 28-UQFN (MV) 4x4 mm - same | 28-UQFN (MV) 4x4 mm - same | 28-QFN (ML) 6x6 mm |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 64 KB (22K x 24) | 128 KB (+100%) | 64 KB - same | 64 KB - same | 128 KB (+100%) | 64 KB - same |
| SRAM | 16 KB | 16 KB - same | 16 KB - same | 16 KB - same | 16 KB - same | 16 KB - same |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS - same | 32 MHz / 16 MIPS - same | 32 MHz / 16 MIPS - same | 32 MHz / 16 MIPS - same | 32 MHz / 16 MIPS - same |
| Operating Temperature | -40 C to +125 C (extended) | -40 C to +125 C - same | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +125 C - same |
| ADC | 12-bit, 200 ksps, 14 ch | 12-bit, 200 ksps, 14 ch - same | 12-bit, 200 ksps, 14 ch - same | 12-bit, 200 ksps, 14 ch - same | 12-bit, 200 ksps, 14 ch - same | 12-bit, 200 ksps, 14 ch - same |
| CTMU (Touch) | Yes | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same |
| GPIO | 22 | 22 - same | 22 - same | 22 - same | 22 - same | 22 - same |
Diferenciadores clave
- Hardware DMA engine integrated on-chip (frente a PIC24FJ64GA002)
- eXtreme Low Power (XLP) Sleep current under 1 microamp (frente a PIC24FJ64GA002)
- CTMU on-chip for capacitive touch without external ICs (frente a PIC24FJ128GA702-E/ML)
Notas de diseño
The 28-pin UQFN (MV) 4x4 mm package requires a PCB land pattern with thermal vias under the exposed central pad. Recommended via count is 4 to 9 micro-vias (0.2 to 0.3 mm diameter) on a 0.5 mm pitch, tied to the ground plane for both electrical ground and heat dissipation. Solder paste stencil aperture should be 1:1 to the land pad with a 0.1 mm thickness to ensure reliable BGA-style reflow. According to Microchip's packaging guidelines, missing the central pad connection can increase junction temperature by 20 to 30 percent under load.
Operate the PIC24FJ64GA702-E/MV directly from a single 3 V lithium coin cell across the 2.0 to 3.6 V input range. Add a 100 nF decoupling capacitor within 2 mm of each VDD pin and a bulk 4.7 uF tantalum or ceramic capacitor on the main supply rail. For battery-powered designs using XLP Sleep modes, verify that the MCU wake-up time (typically 1 to 5 microseconds from Sleep) aligns with your sensor sampling interval - shorter intervals reduce battery life. Estimated: at 32 MHz active and average 1 percent duty cycle, total supply current stays below 100 uA from a CR2032.
Configure the DMA engine source and destination pointers before enabling the DMA channel - setting up the channel while active can cause a single spurious byte transfer into an unintended memory address. Always clear the DMA IRQ flag in the ISR before exiting, otherwise the interrupt will re-trigger and starve other ISRs. When using the CTMU for touch, calibrate the current source trim register at production with the mTouch library calibration routine - uncalibrated CTMU readings drift 10 to 20 percent across temperature.
Keep analog and digital traces physically separated on the PCB to minimize ADC noise pickup. Route the 12-bit ADC reference voltage (AVDD or external VREF+) on a dedicated analog plane island with a ferrite bead to the digital VDD. Place the ADC input traces away from switching signals such as PWM outputs and clock traces by at least 3 trace widths. For CTMU touch electrodes, route the traces with the same length and width to maintain consistent touch sensitivity across buttons.
Información de cumplimiento
RoHS compliant per Microchip product page. Extended -40 C to +125 C temperature grade (E suffix) but not AEC-Q100 automotive qualified. For automotive applications, consider PIC24FJxxxGAxxx-I/MV automotive-grade variants or higher-tier PIC24FJ families.
