PIC32MK1024GPD064T-I/MR - 120MHz MCU, 1MB Flash, 64-QFN | Microchip
N.º de pieza: PIC32MK1024GPD064T-I/MR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.78 | $57,80 |
| 100 | $5.13 | $513,00 |
| 500 | $4.62 | $2.310,00 |
| 1.000 | $4.1 | $4.100,00 |
PIC32MK1024GPD064T-I/MR Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O into one package. The PIC32MK family belongs to the broader PIC32 family, which uses the MIPS32 microAptiv core architecture; the GPD sub-family is a dual-partition variant with separate Flash and SRAM regions optimized for deterministic real-time control. Within Microchip's portfolio, PIC32MK MCUs sit between the lower-pin-count PIC32MX and the higher-performance dsPIC33CH dual-core DSP controllers.
Key features include 120 MHz core speed with DSP instructions and FPU, 1 MB dual-bank Flash, 256 KB SRAM, four independent analog comparators with 32 ns response, multiple 12-bit ADCs up to 3.5 MSPS, three 4-channel high-speed PWM modules (250 ps resolution), six UART, three SPI, four I2C, USB-FS, and CAN-FD. The device also integrates a Cryptographic Engine, a Random Number Generator, and an RTCC.
Technically, the PIC32MK1024GPD064T-I/MR uses a Harvard architecture with separate instruction and data paths, dual partition Flash for live update, and a 32-channel DMA controller. The 12-bit ADC includes oversampling and a shared 1.5 MSPS SAR core; the motor-control PWM (MCPWM) supports up to 12 outputs with 250 ps edge resolution. Operating voltage is 2.3V to 3.6V, with a -40C to +85C industrial temperature range, and the chip is supplied in tape-and-reel.
Typical applications include digital power conversion (DC-DC, PFC, inverters), field-oriented motor control (BLDC, PMSM), industrial PLC modules, and functional safety designs. The part is recommended for new motor-control and digital-power designs by Microchip.
When designing with the PIC32MK1024GPD064T-I/MR, ensure adequate decoupling on AVDD rails (4.7 uF plus 0.1 uF ceramic) and route the analog ground plane to minimize ADC noise coupling. The 9x9 mm QFN has a thermal pad that must be soldered to a continuous ground plane for heat dissipation, especially at full 120 MHz with all peripherals active.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the PIC32MK1024GPD064T-I/MR, including same-family PIC32MK variants and direct cross-brand equivalents not found in the manufacturer datasheet.
Alternativas directas para PIC32MK1024GPD064T-I/MR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MK1024GPD064T-I/MR (mismo factor de forma y huella) — difiere en Package, ADC, Operating Temperature, Program Memory (Flash), USB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MK1024GPD064-I/MR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MK1024GPD064-E/MR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MK1024GPD064-I/PT
✅ Sustitución directa✓ En stock
$8.95 / unidad
Ver hoja de datos →PIC32MK0512GPD064-E/PT
✅ Sustitución directa✓ En stock
$4.21 / unidad
Ver hoja de datos →PIC32MK0256GPD064-I/R4X
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MK1024GPD064T-I/MR Valores máximos y características eléctricas
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-bit |
| Maximum CPU Speed | 120 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Data Memory (SRAM) | 256 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Temperatura de funcionamiento | -40C to +85C |
| Encapsulado | 64-pin QFN (9x9 mm) with exposed pad |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 |
| ADC | 12-bit, up to 3.5 MSPS |
| PWM Channels | 12 high-speed (250 ps resolution) |
| UART | 6 |
| SPI | 3 |
| I2C | 4 |
| CAN-FD | Yes |
| USB | USB-FS |
| Estado RoHS | Compliant |
Guía de configuración de pines de PIC32MK1024GPD064T-I/MR 64-pin qfn (9x9 mm) with exposed pad
Configuración de pines para PIC32MK1024GPD064T-I/MR (encapsulado 64-pin qfn (9x9 mm) with exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PIC32MK1024GPD064T-I/MR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PIC32MK1024GPD064T-I/MR es adecuado para 6 aplicacións: Field-Oriented Motor Control (FOC) for PMSM/BLDC, Digital Power Conversion (DC-DC, PFC, Inverters), Industrial PLC and Control Modules, Functional Safety and SIL-rated Industrial Systems, Solar Microinverters and Power Optimizers, USB-Connected Industrial Data Acquisition.
Field-Oriented Motor Control (FOC) for PMSM/BLDC
The PIC32MK1024GPD064T-I/MR is purpose-built for FOC of PMSM and BLDC motors. Its 12-output MCPWM module with 250 ps edge resolution delivers clean 20-100 kHz switching with sub-1% current ripple, and the 12-bit ADC samples at 3.5 MSPS for accurate phase current sensing. The 120 MHz MIPS32 core with FPU and DSP executes the FOC loop (Clarke/Park transform, SVPWM modulation) in under 5 us, leaving CPU headroom for sensor handling and CAN communication. The 1 MB Flash fits full motor-control firmware plus communication stacks.
Recomendado
Digital Power Conversion (DC-DC, PFC, Inverters)
The PIC32MK1024GPD064T-I/MR's high-resolution PWM and fast ADC make it ideal for digital power supplies including buck/boost converters, totem-pole PFC, and solar inverters. The 250 ps PWM resolution enables peak-current-mode control at 1 MHz switching frequency, while the 3.5 MSPS ADC samples voltage and current loops with minimal phase lag. The dual-bank 1 MB Flash supports field-upgradeable firmware for grid-tied inverter firmware updates, and the CAN-FD interface enables real-time telemetry in industrial power systems.
Recomendado
Industrial PLC and Control Modules
The PIC32MK1024GPD064T-I/MR is well-suited to industrial PLC I/O modules and process controllers. Six UARTs support RS-232/RS-485 multi-drop industrial networks, four I2C buses handle sensor aggregation, and CAN-FD provides deterministic industrial bus communication. The 256 KB SRAM supports TCP/IP stacks via external PHYs, while 1 MB Flash stores firmware for IEC 61131-3 logic plus Modbus/CANopen stack. The industrial -40C to +85C operating range ensures reliable operation in factory cabinets and outdoor enclosures.
Recomendado
Functional Safety and SIL-rated Industrial Systems
The PIC32MK1024GPD064T-I/MR's ECC-protected Flash, dual-bank A/B boot, and integrated safety peripherals support IEC 61508 SIL-2 capable designs. The dual-partition Flash enables fail-safe firmware updates without downtime, and the watchdog timer plus clock fail-safe monitor provide hardware fault detection. The 250 ps PWM resolution and fast ADC enable precise control loops in safety-critical applications like robotic motion control and emergency shutdown systems. Microchip provides safety manuals and FMEDA reports for this device.
Recomendado
Solar Microinverters and Power Optimizers
The PIC32MK1024GPD064T-I/MR's combination of dual-bank Flash, fast ADC, and high-resolution PWM is ideal for solar microinverters and module-level power optimizers. The 1 MB Flash stores MPPT algorithms plus grid-tie compliance firmware, and dual-bank operation enables over-the-air firmware updates per NEC 2017 rapid shutdown requirements. The 6 UART channels support daisy-chained module communication, and CAN-FD enables real-time panel-level telemetry to central inverters for arc-fault detection and rapid shutdown coordination.
Recomendado
USB-Connected Industrial Data Acquisition
The PIC32MK1024GPD064T-I/MR's integrated USB-FS and 12-bit ADC make it suitable for USB-connected industrial data acquisition modules. The USB-FS device interface enumerates as a CDC or vendor-class device for high-speed streaming of ADC samples, while the 256 KB SRAM buffers multi-channel ADC acquisitions at 3.5 MSPS. Six UARTs allow multi-protocol sensor aggregation, and the 1 MB Flash stores USB stack plus application firmware with room for future expansion.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MK1024GPD064T-I/MR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MK1024GPD064-I/MR | PIC32MK1024GPD064-E/MR | PIC32MK1024GPD064-I/PT | PIC32MK0512GPD064-E/PT | PIC32MK0256GPD064-I/R4X |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-TQFP (10x10 mm) - same pins | 64-TQFP (10x10 mm) - same pins | 64-QFN (9x9 mm) - same |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB | 256 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 64 KB | 32 KB |
| Core Speed | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +85C |
| ADC Speed | 3.5 MSPS | 3.5 MSPS | 3.5 MSPS | 3.5 MSPS | 3.5 MSPS | 3.5 MSPS |
| PWM Resolution | 250 ps | 250 ps | 250 ps | 250 ps | 250 ps | 250 ps |
Diferenciadores clave
- Highest ADC throughput in PIC32MK GPD family at 3.5 MSPS (frente a PIC32MK1024GPK064)
- Dual-bank 1 MB Flash for live firmware updates (frente a PIC32MK0512GPD064-E/PT)
- Compact 64-pin QFN package with full peripheral set (frente a PIC32MK1024GPD064-I/PT)
- Industrial -40C to +85C operating range as standard (frente a PIC32MK1024GPD064-E/MR)
Notas de diseño
The PIC32MK1024GPD064T-I/MR requires separate AVDD/AVSS analog supplies for the 12-bit ADC; place a 4.7 uF tantalum plus 0.1 uF ceramic decoupling pair within 5 mm of the AVDD pins. The internal 1.2V core regulator needs a 1 uF ceramic on the VCAP pin. Inrush current at startup can exceed 80 mA on the 3.3V rail; ensure upstream DC-DC has sufficient bulk capacitance (>= 47 uF) for clean rise. Brown-out reset (BOR) must be enabled to prevent code execution at low voltage.
Estimated: at maximum 120 MHz with all peripherals active, the 64-QFN package dissipates approximately 0.45W, yielding a junction temperature rise of about 30C above ambient (theta_JA = 65 C/W on a 4-layer PCB). For designs operating above 70C ambient, solder the exposed thermal pad to a continuous ground pour of at least 1 square inch. Avoid placing the MCU directly above high-current switching components; thermal coupling from MOSFETs can push the junction above 105C during FOC operation.
The 64-QFN 9x9 mm package has a 0.5 mm pitch and exposed thermal pad requiring precise PCB layout. Use NSMD pads with a 1:1 pad-to-pitch ratio and 0.3 mm via-in-pad thermal array (8-12 vias, 0.3 mm drill) under the EP for thermal dissipation. Route analog signals (ADC inputs) on the top layer with ground guard traces, and keep PWM traces away from analog inputs by at least 3 mm to prevent switching noise coupling into ADC samples.
Do not attempt live firmware updates on a single-bank Flash configuration - the PIC32MK1024GPD064T-I/MR's dual-bank feature must be enabled in the FBOOT configuration bits, otherwise the MCU will fail to boot after a bad update. The MCPWM module requires specific unlock sequence before accessing protected PWM control registers; failure to unlock causes silent PWM output disable. USB-FS requires a 48 MHz clock from the Primary Oscillator with PLL; crystal accuracy must be within 50 ppm for USB compliance.
Información de cumplimiento
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - automotive applications should use -A or -V automotive-graded PIC32MK variants. Lead-free and halogen-free packaging confirmed.
