PIC32MX110F016B-V/SP - 40MHz 32-bit MCU, 16KB Flash | Microchip
N.º de pieza: PIC32MX110F016B-V/SP ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.78 | $37,80 |
| 100 | $3.36 | $336,00 |
| 500 | $2.94 | $1.470,00 |
| 1.000 | $2.52 | $2.520,00 |
PIC32MX110F016B-V/SP Descripción general
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich peripheral set on one die. Within the broader taxonomy, PIC32MX devices sit between 8-bit PIC16/PIC18 MCUs and higher-end Cortex-M parts, forming Microchip's mid-range 32-bit MCU family targeting audio/graphics, USB, and advanced analog applications. The PIC32MX110F016B-V/SP is positioned as the entry-level Flash member of the PIC32MX1XX/2XX 28/36/44-pin family, optimized for cost-sensitive designs that still need DSP-class throughput and USB connectivity.
Key differentiating features include Peripheral Pin Select (PPS) for flexible function-to-pin remapping, a Parallel Master Port (PMP) for graphics interfaces, two I2S/SPI modules for codec/serial audio, a 10-bit ADC with multiple analog channels, and a Charge Time Measurement Unit (CTMU) for mTouch capacitive touch sensing. Direct Memory Access (DMA) offloads CPU data movement, while five 16-bit timers (and up to two 32-bit timers) give flexible event timing. AEC-Q100 qualification supports automotive deployment, especially in the -V (industrial-grade) operating range.
Architecturally, the MIPS32 M4K core executes most instructions in a single cycle with hardware multiply/divide and a 5-stage pipeline. The 16 KB Flash and 4 KB SRAM are sized for compact control loops, USB device stacks (CDC/HID/MSD), and small graphical user interfaces rendered via PMP to external LCD controllers. DMA channels move peripheral data to RAM without CPU intervention, leaving headroom for application code.
Typical applications include low-cost USB peripherals, capacitive touch human-machine interfaces (HMIs), audio/graphic control panels using external PMP-attached LCDs, sensor conditioning nodes with on-chip ADC, and general-purpose industrial controllers. The automotive-grade (-V) variant also suits body-electronics and HMI modules where AEC-Q100 qualification is required.
Design consideration: with less than 0.5 mA/MHz active current, regulator choice should focus on low-noise, low-IQ LDOs; bulk decoupling of 10 µF ceramic plus 0.1 µF HF bypass near each VDD pin is recommended per the family datasheet. PPS routing must be reconfigured after each reset, so save PPS maps in non-volatile configuration.
This page synthesizes distributor pricing (as of 2026-10-01), drop-in same-package alternatives from Microchip's PIC32MX1XX/2XX family, and practical design notes not aggregated on a single manufacturer or distributor page.
Alternativas directas para PIC32MX110F016B-V/SP — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MX110F016B-V/SP (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Mounting Type, DMA Channels, Core Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MX110F016B-I/SP
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX110F016B-V/ML
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
PIC32MX110F016B-V/SS
✅ Sustitución directa✓ En stock
$1.55 / unidad
Ver hoja de datos →PIC32MX210F016B-I/SP
✅ Sustitución directa✓ En stock
$2.1 / unidad
Ver hoja de datos →PIC32MX130F064B-I/SP
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX110F016BT-V/SP
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
PIC32MX110F016B-V/SP Valores máximos y características eléctricas
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 40 MHz |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Memory (SRAM) | 4 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Temperatura de funcionamiento | -40 °C to +105 °C |
| GPIO Pins | 21 |
| ADC | 10-bit |
| ADC Input Channels | 12 |
| Timers | 5 x 16-bit, up to 2 x 32-bit |
| I2S/SPI Modules | 2 |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| Charge Time Measurement Unit (CTMU) | Yes (mTouch capacitive touch) |
| DMA | Yes |
| Encapsulado | 28-pin SPDIP |
| AEC-Q100 Qualification | Qualified (industrial/V grade) |
| Active Current | < 0.5 mA/MHz |
| Tipo de montaje | Through-Hole (SPDIP) |
| Estado RoHS | Compliant |
Configuración de pines de PIC32MX110F016B-V/SP
| Pin 1 | MCLR — Master Clear (reset) input, active-low |
| Pin 2 | PGED3/AN0/CVD3/RPB0/CTED1/RB0 — Programming data / analog input / GPIO RB0 |
| Pin 3 | PGEC3/AN1/CVD1/RPB1/CTED2/RB1 — Programming clock / analog input / GPIO RB1 |
| Pin 4 | AN2/CVD2/RPB2/SDA2/RB2 — Analog input / I2C2 SDA / GPIO RB2 |
| Pin 5 | AN3/CVD3/RPB3/SCL2/RB3 — Analog input / I2C2 SCL / GPIO RB3 |
| Pin 6 | PGED2/AN4/RPB4/RB4 — Programming data / analog input / GPIO RB4 |
| Pin 7 | PGEC2/AN5/RPB5/RB5 — Programming clock / analog input / GPIO RB5 |
| Pin 8 | VSS — Ground reference |
| Pin 9 | OSC1/CLKI/RA0 — Crystal oscillator input / GPIO RA0 |
| Pin 10 | OSC2/CLKO/RA1 — Crystal oscillator output / GPIO RA1 |
| Pin 11 | RA2 — GPIO RA2 (PPS-mappable) |
| Pin 12 | RA3 — GPIO RA3 (PPS-mappable) |
| Pin 13 | TMS/RA4 — JTAG TMS / GPIO RA4 |
| Pin 14 | TCK/RA5 — JTAG TCK / GPIO RA5 |
| Pin 15 | TDO/RA6 — JTAG TDO / GPIO RA6 |
| Pin 16 | TDI/RA7 — JTAG TDI / GPIO RA7 |
| Pin 17 | VCAP — Internal voltage regulator decoupling |
| Pin 18 | VDD — Positive supply voltage (2.3 V to 3.6 V) |
| Pin 19 | VSS — Ground reference |
| Pin 20 | RPB6/PC0/RB6 — GPIO RB6 (PPS-mappable) |
| Pin 21 | RPB7/PC1/RB7 — GPIO RB7 (PPS-mappable) |
| Pin 22 | AN6/RPB8/RB8 — Analog input / GPIO RB8 |
| Pin 23 | AN7/RPB9/RB9 — Analog input / GPIO RB9 |
| Pin 24 | AN8/RPB10/RB10 — Analog input / GPIO RB10 |
| Pin 25 | AN9/RPB11/RB11 — Analog input / GPIO RB11 |
| Pin 26 | AN10/RPB12/RB12 — Analog input / GPIO RB12 |
| Pin 27 | AN11/RPB13/RB13 — Analog input / GPIO RB13 |
| Pin 28 | AVDD — Analog positive supply |
Aplicaciones típicas
PIC32MX110F016B-V/SP es adecuado para 7 aplicacións: Low-Cost USB HID Peripheral, Capacitive Touch HMI Panel, Sensor Conditioning Node, Audio Codec Control Interface, Automotive Body Electronics Module, Battery-Powered IoT Edge Node, Graphics-Attached Control Panel.
Low-Cost USB HID Peripheral
The PIC32MX110F016B-V/SP fits USB HID-class peripherals (keyboards, mice, custom joysticks, sensor readout dongles) by combining a 40 MHz MIPS32 M4K core with 16 KB Flash and 4 KB SRAM — enough for HID report descriptors, debouncing, and small command parsers. For designs that need true USB OTG, the pin-compatible PIC32MX210F016B drops into the same SPDIP-28 socket. Engineers typically route D+/D- to the USB connector with 27 Ω series resistors, supply VBUS sensing through a divider, and use the on-chip DMA to move HID reports without CPU overhead.
Recomendado
Capacitive Touch HMI Panel
On-chip CTMU (Charge Time Measurement Unit) and PPS flexibility let the PIC32MX110F016B-V/SP drive up to 8–12 mTouch capacitive buttons or a slider without an external touch IC. The 10-bit ADC and 12 analog channels simplify over-temperature and proximity sensing alongside the touch pads. Designers typically configure CTMU timing for 100 ms scan rate, debounce in firmware, and drive LED feedback through PWM-tied GPIO. The -V grade (-40 °C to +105 °C) supports automotive interior HMI modules and appliance front panels.
Recomendado
Sensor Conditioning Node
The PIC32MX110F016B-V/SP's 10-bit ADC with 12 input channels, 5 × 16-bit timers, and PPS field selects make it a multi-signal collector for industrial sensor nodes (temperature, pressure, flow). DMA offloads ADC result storage to SRAM, freeing the M4K core for averaging, linearization, and Modbus/serial reporting over UART. AEC-Q100 qualification on the -V variant supports under-hood and chassis-mounted sensor modules. Typical designs pair it with a 4–20 mA current loop or RS-485 transceiver for wired field deployment.
Recomendado
Audio Codec Control Interface
Two I2S/SPI modules make the PIC32MX110F016B-V/SP a flexible audio codec host for low-channel-count systems (mono voice prompts, intercom panels, hearing-aid accessories). The Parallel Master Port (PMP) can simultaneously drive a small character LCD for status display. The DMA controller moves I2S sample streams to/from internal buffers without CPU intervention, supporting 16 kHz–48 kHz sample rates at moderate bit depths. Compact through-hole SPDIP-28 packaging simplifies prototyping on breadboard and through-hole audio PCBs.
Recomendado
Automotive Body Electronics Module
The -V (AEC-Q100) grade and -40 °C to +105 °C operating range let the PIC32MX110F016B-V/SP control body-electronics loads such as interior lighting, seat controllers, mirror adjusters, and HVAC flap motors. PWM-tied timers drive MOSFET gates via the GPIO/PPS pins, while the ADC reads position feedback from potentiometers. CAN/LIN bus communication is typically handled by an external MCP2551 or MCP2003B transceiver. The 21 GPIO count and PPS remapping accommodate multiple load drivers and sense inputs in one MCU.
Recomendado
Battery-Powered IoT Edge Node
Active current below 0.5 mA/MHz plus deep-sleep modes let the PIC32MX110F016B-V/SP operate for years on a 3 V coin cell or 2 × AA batteries when configured for periodic sensor reads and ULP wake events. The 2.3 V minimum VDD supports direct Li-MnO2 or 2× alkaline stacks without boost conversion. PPS routing lets the UART, I2C, and ADC peripherals share pins flexibly across low-pin-count sensor breakouts. Typical edge nodes use the on-chip ADC to digitize analog sensors and DMA to write results to SRAM before radio wake via external sub-GHz module.
Recomendado
Graphics-Attached Control Panel
The PIC32MX110F016B-V/SP's Parallel Master Port (PMP) interfaces directly to external graphics controllers or character/graphic LCDs, enabling compact control-panel designs (appliance front panels, simple kiosks, point-of-sale keypads). With 16 KB Flash and 4 KB SRAM, the firmware holds menu structures and bitmaps while DMA refreshes the display buffer. Two I2S/SPI modules also support simultaneous touch controllers or audio feedback. The through-hole SPDIP-28 simplifies hand-soldering prototypes in low-volume industrial designs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MX110F016B-V/SP — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MX110F016B-I/SP | PIC32MX210F016B-I/SP | PIC32MX130F064B-I/SP |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin SPDIP | 28-pin SPDIP - same | 28-pin SPDIP - same | 28-pin SPDIP - same |
| Core | MIPS32 M4K, 32-bit | MIPS32 M4K, 32-bit | MIPS32 M4K, 32-bit | MIPS32 M4K, 32-bit |
| Max Clock Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 16 KB | 16 KB | 16 KB | 64 KB (+300%) |
| SRAM | 4 KB | 4 KB | 4 KB | 8 KB (+100%) |
| USB OTG | No | No | Yes (USB 2.0 FS OTG) | No |
| Temperature Grade | -40 °C to +105 °C (-V, AEC-Q100) | -40 °C to +85 °C (-I, no AEC-Q100) | -40 °C to +85 °C (-I, no AEC-Q100) | -40 °C to +85 °C (-I, no AEC-Q100) |
| GPIO Count | 21 | 21 | 21 | 21 |
Diferenciadores clave
- AEC-Q100 qualification for automotive deployments (frente a PIC32MX110F016B-I/SP)
- Through-hole SPDIP-28 footprint for easy prototyping (frente a PIC32MX110F016B-V/SS (SSOP-28))
- Compact 16 KB Flash / 4 KB SRAM profile (frente a PIC32MX130F064B-I/SP)
Notas de diseño
Pair the PIC32MX110F016B-V/SP with a low-IQ LDO such as MCP1700 (1.6 µA quiescent) or MCP1755 (5 µA) on the 2.3 V–3.6 V VDD rail. Place a 10 µF ceramic bulk capacitor plus a 0.1 µF HF bypass within 5 mm of each VDD pin. For sleep-dominated designs, gate the analog supply with a load switch to drop total quiescent below 10 µA in deep-sleep mode. The AVDD pin may share the same rail or be filtered through a ferrite to keep ADC noise below 1 LSB.
Estimated: at full 40 MHz activity and typical 20 mA core current on a 3.3 V rail, the SPDIP-28 dissipates ~66 mW. With θJA near 80 °C/W for SPDIP-28, junction rise above ambient is roughly 5 °C — well within the -40 °C to +105 °C operating window. No thermal mitigation is required for typical use; however, in sealed enclosures with no airflow, derate VDD to 3.0 V or cap CPU duty cycle at 80 % to keep Tj below 100 °C ambient.
Route the crystal traces (OSC1/OSC2) symmetrically and keep them under 5 mm with a guard trace tied to ground. Place the VCAP decoupling capacitor within 3 mm of the VCAP pin to stabilize the internal 1.8 V core regulator. Keep analog ADC traces away from PWM/GPIO switching lines by at least 3 × the trace width. PPS reassignment at runtime lets you remap peripherals to less-noisy pins if EMI measurements fail on the first PCB revision.
Do not leave the MCLR pin floating — tie it to VDD through a 10 kΩ resistor and place a 100 nF cap to ground for noise immunity. The JTAG pins (TMS/TCK/TDO/TDI on RA4–RA7) must be configured as GPIO or PPS-mapped after programming, otherwise high-impedance inputs can cause unwanted current draw. PPS mappings are NOT retained across reset unless saved in non-volatile configuration; re-apply them in the startup routine before peripheral use.
Información de cumplimiento
AEC-Q100 qualified in the -V (automotive/industrial) temperature grade per Microchip product page. RoHS compliant and lead-free per Microchip packaging material declaration. Conflict-minerals reporting compliant per Microchip CMRT filings.
