PIC32MX120F032D-I/ML - 32-bit 40MHz MCU, 32KB Flash, 44-QFN | Microchip
N.º de pieza: PIC32MX120F032D-I/ML ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2.95 | $2,95 |
| 10 | $2.66 | $26,60 |
| 100 | $2.36 | $236,00 |
| 500 | $2.13 | $1.065,00 |
| 1.000 | $1.95 | $1.950,00 |
PIC32MX120F032D-I/ML Descripción general
A PIC32MX microcontroller is a 32-bit RISC MCU based on the MIPS32 M4K core that combines the throughput of a 32-bit architecture with the familiar PIC peripheral set, targeting cost-sensitive embedded designs. Within the broader taxonomy, PIC32MX sits between the 16-bit PIC24F and the high-performance PIC32MZ families, providing USB, audio, and graphics peripherals for human-machine interface (HMI) applications.
Key features of the PIC32MX120F032D-I/ML include up to 21 general-purpose I/O pins, five 16-bit and up to two 32-bit timers, a 10-bit ADC with up to 1 Msps conversion rate, four DMA channels, and an operating voltage range of 2.3 V to 3.6 V. The CTMU enables cost-effective capacitive touch buttons, sliders, and proximity sensing without external analog components.
The 44-pin QFN (ML) package integrates an exposed thermal pad for improved heat dissipation in compact designs. According to the Microchip datasheet, the device supports an industrial operating temperature range of -40 °C to +105 °C and includes JTAG and two-wire programming/debug interfaces for in-circuit development. The architecture achieves less than 0.5 mA/MHz active current consumption, supporting battery-powered and energy-conscious designs.
Typical applications include USB peripherals, audio playback devices, low-cost graphics HMI panels, capacitive touch user interfaces, sensor hubs, and general-purpose embedded control. The combination of small package, USB support, and CTMU makes it well-suited for consumer appliances and industrial control panels.
When designing with this part, allocate sufficient ground copper under the exposed pad of the QFN for thermal dissipation and place decoupling capacitors within 3 mm of each supply pin. Ensure programming/debug pin routing accommodates in-circuit serial programming (ICSP) without signal integrity loss.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the PIC32MX120F032D-I/ML, complementing the manufacturer datasheet with engineering-focused cross-reference and application insight.
Alternativas directas para PIC32MX120F032D-I/ML — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MX120F032D-I/ML (mismo factor de forma y huella) — difiere en Package, ADC, Timers, I/O Pins, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MX120F032DT-I/ML
✅ Sustitución directa✓ En stock
$1.92 / unidad
Ver hoja de datos →PIC32MX120F032D-V/ML
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX150F128B-I/ML
✅ Sustitución directa✓ En stock
$3.3 / unidad
Ver hoja de datos →PIC32MX130F064B-I/ML
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX110F016D-I/PT
✅ Sustitución directa✓ En stock
$1.84 / unidad
Ver hoja de datos →PIC32MX120F032BT-I/ML
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX120F032D-I/ML Valores máximos y características eléctricas
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 40 MHz |
| Program Flash Memory | 32 KB (32K x 8) |
| Data SRAM | 8 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| General-Purpose I/O Pins | 21 |
| Encapsulado | 44-pin QFN (8x8 mm) with exposed pad |
| Tipo de montaje | Surface Mount |
| Rango de temperatura de funcionamiento | -40 °C to +105 °C (Industrial) |
| ADC | 10-bit, 1 Msps |
| DMA Channels | 4 |
| Timers | Five 16-bit and two 32-bit |
| Communication Peripherals | I2S/SPI x2, PMP, USB, I2C, UART |
| Special Features | Peripheral Pin Select (PPS), CTMU, JTAG |
| Active Current Consumption | < 0.5 mA/MHz |
| Estado RoHS | Compliant |
Configuración de pines de PIC32MX120F032D-I/ML
| Pin 1 | RA0 — General purpose I/O / analog input |
| Pin 2 | RA1 — General purpose I/O / analog input |
| Pin 3 | RA2 — General purpose I/O / analog input |
| Pin 4 | RA3 — General purpose I/O / analog input |
| Pin 5 | RA4 — General purpose I/O / analog input |
| Pin 6 | RA5 — General purpose I/O / analog input |
| Pin 7 | RA6 — General purpose I/O / analog input |
| Pin 8 | RA7 — General purpose I/O / analog input |
| Pin 9 | RB0 — General purpose I/O / programming |
| Pin 10 | RB1 — General purpose I/O / programming |
| Pin 11 | RB2 — General purpose I/O |
| Pin 12 | RB3 — General purpose I/O |
| Pin 13 | RB4 — General purpose I/O |
| Pin 14 | RB5 — General purpose I/O |
| Pin 15 | RB6 — General purpose I/O |
| Pin 16 | RB7 — General purpose I/O |
| Pin 17 | RC0 — General purpose I/O |
| Pin 18 | RC1 — General purpose I/O |
| Pin 19 | RC2 — General purpose I/O |
| Pin 20 | RC3 — General purpose I/O |
| Pin 21 | RC4 — General purpose I/O |
| Pin 22 | RC5 — General purpose I/O |
| Pin 23 | RC6 — General purpose I/O |
| Pin 24 | RC7 — General purpose I/O |
| Pin 25 | RD0 — General purpose I/O |
| Pin 26 | RD1 — General purpose I/O |
| Pin 27 | RD2 — General purpose I/O |
| Pin 28 | RD3 — General purpose I/O |
| Pin 29 | RD4 — General purpose I/O |
| Pin 30 | RD5 — General purpose I/O |
| Pin 31 | RD6 — General purpose I/O |
| Pin 32 | RD7 — General purpose I/O |
| Pin 33 | RE0 — General purpose I/O |
| Pin 34 | RE1 — General purpose I/O |
| Pin 35 | RE2 — General purpose I/O |
| Pin 36 | RE3 — General purpose I/O |
| Pin 37 | RE4 — General purpose I/O |
| Pin 38 | RE5 — General purpose I/O |
| Pin 39 | RE6 — General purpose I/O |
| Pin 40 | RE7 — General purpose I/O |
| Pin 41 | VSS — Ground reference |
| Pin 42 | VDD — Positive supply input (2.3V to 3.6V) |
| Pin 43 | VUSB — USB transceiver supply (3.3V typical) |
| Pin 44 | EP — Exposed thermal pad - connect to ground |
Aplicaciones típicas
PIC32MX120F032D-I/ML es adecuado para 7 aplicacións: USB Human Interface Devices (HID), Capacitive Touch User Interfaces (mTouch), Low-Cost Graphics HMI Panels, Audio Playback Devices, Industrial Sensor Hubs and Data Loggers, Consumer Appliance Control Boards, Battery-Powered IoT Sensor Nodes.
USB Human Interface Devices (HID)
The PIC32MX120F032D-I/ML integrates a USB full-speed device controller alongside 32 KB Flash and 8 KB SRAM, providing a cost-effective platform for USB HID-class peripherals such as keyboards, mice, game controllers, and custom input devices. The 40 MHz MIPS32 M4K core delivers sufficient throughput for HID report generation at the 1 kHz USB FullSpeed poll interval, while the 21 GPIO pins support matrix-scanned key arrays and LED indicators. For USB HID designs, the PIC32MX120 is typically paired with a USB Type-B micro receptacle, ESD protection diode array, and the Microchip USB stack (MLA). The on-chip USB peripheral handles endpoint management and DMA-assisted data transfer, offloading the CPU for responsive HID handling. Compared to Cortex-M0+ alternatives, this part adds CTMU capacitive touch sensing at a similar price point, enabling touch-sensing HID products.
Recomendado
Capacitive Touch User Interfaces (mTouch)
The PIC32MX120F032D-I/ML integrates the CTMU (Charge Time Measurement Unit) which, combined with the 10-bit ADC and peripheral pin select, enables capacitive touch buttons, sliders, and proximity sensors without external analog ICs. The CTMU provides a constant current source and timing measurement that resolves capacitance changes of a few femtofarads, supporting reliable touch sensing through plastic overlays up to 3 mm thick. In a typical mTouch design, the PIC32MX120 scans 4 to 12 touch electrodes with sub-10 ms response time while the MIPS core runs the user interface logic on the 32 KB Flash. The 8 KB SRAM comfortably holds a 50-page UI state machine and touch debounce buffers. This combination replaces a dedicated touch controller plus MCU with a single chip, reducing BOM cost and PCB area in consumer appliances and industrial control panels.
Recomendado
Low-Cost Graphics HMI Panels
The PIC32MX120F032D-I/ML features a Parallel Master Port (PMP) that interfaces directly to external graphics controllers, TFT LCDs, and SRAM/PSRAM, enabling low-cost graphical HMI panels without an external display controller IC. The PMP supports 8-bit and 16-bit parallel data with separate read/write enables, addressing external memory up to 64 KB, and pairs with the two I2S/SPI modules for codec and audio output. For HMI designs, the 32 KB Flash holds a typical menu-driven UI with custom fonts, while the 8 KB SRAM buffers partial-frame updates at 30 fps. The 40 MHz CPU performance is sufficient to drive 320x240 QVGA displays with simple bitmapped UI. Compared to higher-end PIC32MZ parts, this device targets the entry-level HMI market under $5 BOM cost, with industrial -40 °C to +105 °C temperature range suitable for factory control panels.
Recomendado
Audio Playback Devices
The PIC32MX120F032D-I/ML includes two I2S/SPI modules that interface directly to audio DACs and codecs, supporting uncompressed WAV playback, MP3 streaming from external Flash, and tone generation. Combined with DMA-assisted I2S transfers, the CPU remains free for user-interface and display tasks. The 32 KB Flash can store small voice prompts and audio clip metadata, while external SPI Flash holds the bulk audio data. Typical designs include doorbells, alarm panels, voice prompt modules, and simple audio players. The CTMU can be used for touch-button playback control, while the 10-bit ADC handles battery voltage monitoring. Compared to dedicated audio DSP parts, this MCU achieves competitive audio performance for the sub-$10 BOM target market with the added benefit of full microcontroller flexibility.
Recomendado
Industrial Sensor Hubs and Data Loggers
The PIC32MX120F032D-I/ML provides 21 GPIO, four DMA channels, 10-bit ADC at 1 Msps, and multiple UART/I2C/SPI peripherals, forming a capable sensor hub or data logger for industrial monitoring applications. The 32 KB Flash stores calibration tables and protocol stacks (Modbus RTU, custom sensor protocols), while the 8 KB SRAM buffers sensor data between writes to external EEPROM or SD cards. In a typical sensor hub, the PIC32MX120 aggregates data from 4 to 8 I2C sensors, runs local filtering and threshold detection, and reports to a host PLC over UART or Modbus. The -40 °C to +105 °C industrial temperature range and 2.3 V to 3.6 V operating voltage tolerance suit factory environments with noisy power rails. Compared to discrete 8-bit MCU implementations, this part provides the headroom to add USB diagnostics and on-chip touch HMIs.
Recomendado
Consumer Appliance Control Boards
The PIC32MX120F032D-I/ML is well-suited for consumer appliance control boards such as coffee machines, washing machine HMIs, microwave ovens, and air conditioner control panels. Its combination of CTMU capacitive touch, USB diagnostics, PMP graphics for LCD displays, and industrial temperature range covers the full appliance design requirement. The 32 KB Flash stores UI state machines and fault logs, while the 40 MHz CPU executes control loops with deterministic timing. In typical white-goods designs, the PIC32MX120 handles touch-button scanning, drives a 4x40 segment LCD via PMP, monitors temperature sensors via ADC, and controls TRIAC-driven loads via PWM timers. The compact 44-QFN (8x8 mm) package fits behind the appliance control panel. Compared to PIC24F alternatives, this part provides higher CPU throughput and USB connectivity for factory programming and field firmware updates without external programmer hardware.
Recomendado
Battery-Powered IoT Sensor Nodes
The PIC32MX120F032D-I/ML's sub-0.5 mA/MHz active current consumption, sleep modes down to microampere range, and 2.3 V to 3.6 V operating voltage make it a viable MCU for battery-powered IoT sensor nodes. Combined with external sub-GHz or BLE modules over SPI/UART, the MCU handles sensor aggregation, threshold detection, and secure transmission scheduling. The 32 KB Flash accommodates light-weight TLS stacks or LoRaWAN device firmware. In typical battery-powered designs, the PIC32MX120 spends most of its life in sleep, waking on a CTMU touch event or RTC alarm to read sensors and transmit via companion radio. The exposed pad on the 44-QFN provides thermal dissipation during periodic radio transmissions. Compared to ultra-low-power Cortex-M0+ alternatives, this part trades slightly higher active current for significantly more peripherals and Flash headroom in the same package footprint.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MX120F032D-I/ML — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MX120F032DT-I/ML | PIC32MX120F032D-V/ML | PIC32MX150F128B-I/ML | PIC32MX130F064B-I/ML | PIC32MX110F016D-I/PT | PIC32MX120F032BT-I/ML |
|---|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 32 KB | 32 KB | 32 KB | 128 KB | 64 KB | 16 KB | 32 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 32 KB | 16 KB | 4 KB | 8 KB |
| Maximum Clock Speed | 40 MHz | 40 MHz | 40 MHz | 50 MHz | 50 MHz | 40 MHz | 40 MHz |
| USB Peripheral | USB Full-Speed Device | USB Full-Speed Device | USB Full-Speed Device | USB OTG | USB Full-Speed Device | USB Full-Speed Device | No USB |
| Operating Temperature | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C (Industrial) |
| GPIO Count | 21 | 21 | 21 | 21 | 21 | 21 | 21 |
Diferenciadores clave
- On-chip USB Full-Speed peripheral without external PHY (frente a PIC32MX120F032BT-I/ML)
- PMP parallel master port for direct graphics LCD interface (frente a PIC32MX110F016D-I/PT)
- CTMU capacitive touch sensing on-chip (frente a PIC32MX150F128B-I/ML)
Notas de diseño
The 44-QFN (8x8 mm) package features an exposed thermal pad (pin 44 / EP) that MUST be soldered to a sufficient ground copper pour for both thermal dissipation and electrical grounding. Recommended: a ground plane of at least 10x10 mm directly beneath the QFN, connected via an array of 0.3 mm thermal vias (4x4 minimum). Without proper EP soldering, junction temperature can rise 20-30 C above ambient, and signal integrity of high-speed USB lines degrades.
Place decoupling capacitors within 3 mm of each VDD pin (pin 42 and any other supply pin). Use 100 nF X7R ceramic per supply pin plus a single 10 uF bulk capacitor. For USB applications, add a 10 uF + 100 nF pair on the VUSB pin (pin 43) to suppress USB transceiver noise. The internal voltage regulator requires a 10 uF + 100 nF pair on the VCORE pin for stable 1.8V core operation.
When migrating code from the PIC32MX110F016D to the PIC32MX120F032D, verify that the Peripheral Pin Select (PPS) mapping reflects the 44-pin QFN package variant - pin counts and mappings differ across the B/C/D suffixes. Avoid confusing this D-suffix 44-pin part with the B-suffix 28-pin PIC32MX120F032B-I/ML, which lacks USB and uses a different footprint. Also note that -I suffix denotes -40C to +105C industrial temperature; -V denotes automotive grade; -E denotes extended.
For USB designs, route the D+/D- lines as a 90 ohm differential pair with matched length (delta < 50 mil), keep them short, and surround them with a continuous ground pour on the same layer. Place the 15 kohm pull-down resistor on D- close to the MCU. Series ferrite beads on VUSB (pin 43) improve conducted EMI compliance. Per Microchip USB design notes, do not route USB signals beneath the QFN or across power planes to avoid impedance discontinuities.
Estimated: At 40 MHz active, with all peripherals enabled, the PIC32MX120F032D-I/ML typically consumes around 20 mA (0.5 mA/MHz x 40 MHz). With a 2.5V supply this is 50 mW; at 3.3V it rises to 66 mW. The QFN theta_JA of approximately 30 C/W (with proper EP soldering) keeps junction rise below 2 C above ambient - well within the 105 C limit. Without EP soldering, thermal dissipation drops by roughly 50%, which can cause thermal shutdown in enclosed designs at high ambient temperatures.
Información de cumplimiento
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +105C); automotive-grade variant is PIC32MX120F032D-V/ML. Lead-free and halogen-free per Microchip environmental compliance data.
