PIC32MZ1024EFH064-E/PT - 200MHz 32-bit FPU MCU 1MB Flash | Microchip
N.º de pieza: PIC32MZ1024EFH064-E/PT ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.62 | $116,20 |
| 100 | $10.48 | $1.048,00 |
| 500 | $9.55 | $4.775,00 |
| 1.000 | $8.72 | $8.720,00 |
PIC32MZ1024EFH064-E/PT Descripción general
What is a 32-bit microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of I/O peripherals on one die. The PIC32MZ EF family sits within Microchip's PIC32 family hierarchy as PIC32 -> PIC32MZ -> PIC32MZ EF, targeting connectivity applications in Industrial, IoT, graphics HMI, and motor control. Compared with 8-bit MCUs, 32-bit devices execute instructions on wider data paths, support larger address spaces, and incorporate DSP and FPU engines for signal-processing math.
Key features of the PIC32MZ1024EFH064 include four 64-bit accumulators supporting single-cycle MAC, saturating and fractional math operations, and IEEE 754-compliant single/double precision FPU for fast single-precision math. The integrated DSP engine accelerates signal-processing kernels, and the Dual Panel Flash architecture enables live field-update support without downtime. Hardware crypto is not included on this variant; for cryptographic acceleration the PIC32MZ1024EFE064 part number is the appropriate derivative.
The architecture pairs a 200 MHz MIPS M-class core with a dedicated FPU and DSP, and on-chip peripherals include Hi-Speed USB 2.0 (480 Mbps), 10/100 Ethernet MAC, CAN 2.0, multiple UART/SPI/I2C, 12-bit ADC at 18 MSPS, and 32-bit parallel master port for external graphics controllers. A 200 MHz CPU core feeding a 32-bit Flash/SRAM bus typically yields 1.85 DMIPS/MHz, equivalent to 330 DMIPS at peak, while DSP operations add headroom for FFT, FIR and audio codecs.
Typical applications include industrial automation, HMI and graphics display controllers, IoT gateways, motor control drives, audio processing systems, and automotive body/motor control. The wide peripheral mix makes it a strong fit for connected products that need simultaneous Ethernet, USB and CAN connectivity. Compared with competing Cortex-M4F devices the PIC32MZ EF adds a higher-resolution ADC and a parallel master port, but its architectural complexity and lower peripheral pin availability trade off against the simpler M-class ecosystem.
When designing with the PIC32MZ1024EFH064-E/PT, allocate ample decoupling (typically 100 nF + 4.7 uF near each VDD/AVDD pair), follow Microchip's documented 64-pin TQFP land pattern, and configure the boot mode strapping pins early. Use MPLAB Harmony v3 for peripheral initialization. This page synthesizes cross-brand references, distributor pricing and application notes not always visible in the bare datasheet.
Alternativas directas para PIC32MZ1024EFH064-E/PT — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MZ1024EFH064-E/PT (mismo factor de forma y huella) — difiere en ADC, Core Architecture, Operating Temperature, Package, Crypto Accelerator.
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PIC32MZ1024EFH064T-E/PT
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PIC32MZ1024EFH064-I/PT
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Ver hoja de datos →PIC32MZ1024EFE064-E/PT
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PIC32MZ1024EFG064-E/PT
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PIC32MZ1024EFF064-E/PT
✅ Sustitución directa✓ En stock
$9.3 / unidad
Ver hoja de datos →PIC32MZ1024ECM064-I/PT
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Ver hoja de datos →PIC32MZ1024EFH064-E/PT Valores máximos y características eléctricas
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Core Frequency | 200 MHz (330 DMIPS) |
| FPU | IEEE 754 single/double precision |
| DSP Engine | 4x 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 512 KB |
| Cryptographic Acceleration | None (No Crypto on this variant) |
| Operating Voltage | 2.3 V to 3.6 V |
| Temperatura de funcionamiento | -40C to +125C (Extended Industrial) |
| Encapsulado | 64-TQFP (10x10 mm), 0.5 mm pitch |
| ADC | 12-bit, up to 18 MSPS |
| USB | Hi-Speed USB 2.0 OTG (480 Mbps) |
| Ethernet | 10/100 MAC + PHY interface |
| CAN | CAN 2.0B |
| Dual Panel Flash | Yes (live firmware update support) |
| Estado RoHS | Compliant |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 (168 hours) |
Configuración de pines de PIC32MZ1024EFH064-E/PT
| Pin 1 | RG15 — General purpose I/O pin |
| Pin 2 | RP9 — Remappable peripheral input |
| Pin 3 | RP8 — Remappable peripheral input |
| Pin 4 | RP7 — Remappable peripheral input |
| Pin 5 | RP6 — Remappable peripheral input |
| Pin 6 | RP5 — Remappable peripheral input |
| Pin 7 | RP4 — Remappable peripheral input |
| Pin 8 | RP3 — Remappable peripheral input |
| Pin 9 | RP2 — Remappable peripheral input |
| Pin 10 | RP1 — Remappable peripheral input |
| Pin 11 | RP0 — Remappable peripheral input |
| Pin 12 | VDD — Core supply voltage 2.3-3.6 V |
| Pin 13 | VSS — Ground reference |
| Pin 14 | AVDD — Analog supply voltage |
| Pin 15 | AVSS — Analog ground |
| Pin 16 | AN0 — Analog input / RB0 |
| Pin 17 | AN1 — Analog input / RB1 |
| Pin 18 | AN2 — Analog input / RB2 |
| Pin 19 | AN3 — Analog input / RB3 |
| Pin 20 | AN4 — Analog input / RB4 |
| Pin 21 | AN5 — Analog input / RB5 |
| Pin 22 | AN6 — Analog input / RB6 |
| Pin 23 | AN7 — Analog input / RB7 |
| Pin 24 | AN8 — Analog input / RB8 |
| Pin 25 | AN9 — Analog input / RB9 |
| Pin 26 | AN10 — Analog input / RB10 |
| Pin 27 | AN11 — Analog input / RB11 |
| Pin 28 | AN12 — Analog input / RB12 |
| Pin 29 | AN13 — Analog input / RB13 |
| Pin 30 | AN14 — Analog input / RB14 |
| Pin 31 | AN15 — Analog input / RB15 |
| Pin 32 | VDD — Core supply voltage |
| Pin 33 | VSS — Ground reference |
| Pin 34 | RC1 — General purpose I/O pin |
| Pin 35 | RC2 — General purpose I/O pin |
| Pin 36 | RC3 — General purpose I/O pin |
| Pin 37 | RC4 — General purpose I/O pin |
| Pin 38 | TMS/SWDIO — JTAG TMS / programming data |
| Pin 39 | TCK/SWCLK — JTAG TCK / programming clock |
| Pin 40 | TDO — JTAG test data out |
| Pin 41 | TDI — JTAG test data in |
| Pin 42 | VDD — Core supply voltage |
| Pin 43 | VSS — Ground reference |
| Pin 44 | OSC1 — Crystal oscillator input |
| Pin 45 | OSC2 — Crystal oscillator output |
| Pin 46 | RD1 — General purpose I/O pin |
| Pin 47 | RD2 — General purpose I/O pin |
| Pin 48 | RD3 — General purpose I/O pin |
| Pin 49 | RD4 — General purpose I/O pin |
| Pin 50 | RD5 — General purpose I/O pin |
| Pin 51 | RD6 — General purpose I/O pin |
| Pin 52 | RD7 — General purpose I/O pin |
| Pin 53 | RD8 — General purpose I/O pin |
| Pin 54 | RD9 — General purpose I/O pin |
| Pin 55 | RD10 — General purpose I/O pin |
| Pin 56 | RD11 — General purpose I/O pin |
| Pin 57 | RD12 — General purpose I/O pin |
| Pin 58 | RD13 — General purpose I/O pin |
| Pin 59 | RD14 — General purpose I/O pin |
| Pin 60 | RD15 — General purpose I/O pin |
| Pin 61 | VDD — Core supply voltage |
| Pin 62 | VSS — Ground reference |
| Pin 63 | RF0 — General purpose I/O pin |
| Pin 64 | RF1 — General purpose I/O pin |
Aplicaciones típicas
PIC32MZ1024EFH064-E/PT es adecuado para 6 aplicacións: Industrial Automation Controller, Graphics HMI / Touch Display, IoT Edge Gateway, Motor Control / Field-Oriented Control Drive, Audio Processing / DSP Front-End, Automotive Body Control Module.
Industrial Automation Controller
The PIC32MZ1024EFH064-E/PT is well suited to industrial PLC and remote I/O controllers thanks to its 200 MHz MIPS M-class core delivering 330 DMIPS, integrated Ethernet MAC and CAN 2.0B. The 1 MB Dual Panel Flash supports live firmware upgrade without production-line downtime, while the -40C to +125C extended grade handles unconditioned cabinet environments. Place the MCU at the heart of a Modbus/TCP slave that aggregates field-bus I/O, runs soft-PLC scan loops, and exposes a web HMI. Compared with ARM Cortex-M4F alternatives, the PIC32MZ EF adds a higher-resolution ADC and parallel master port for HMI expansion. Reference: Microchip AN1414 (Modbus TCP Application Note).
Recomendado
Graphics HMI / Touch Display
The integrated parallel master port (PMP) and high-bandwidth 200 MHz core make the PIC32MZ1024EFH064-E/PT a strong fit for graphics HMI panels driving 4.3 to 7 inch TFT LCDs. The PMP can directly interface to external QVGA/WQVGA TFT controllers and resistive-touch ADCs, while the DSP engine accelerates on-device UI rendering loops. The 512 KB SRAM holds full-frame buffers for moderate-size displays, and the Dual Panel Flash enables live UI re-skinning in deployed products. Reference: Microchip AN1426 (Graphics Display Design).
Recomendado
IoT Edge Gateway
The PIC32MZ1024EFH064-E/PT serves as an IoT edge gateway combining Hi-Speed USB 2.0 OTG, 10/100 Ethernet MAC and CAN 2.0B in a single 64-pin package. The 330 DMIPS performance handles TLS-terminated MQTT/HTTP stacks and on-board analytics, while 512 KB SRAM accommodates TLS working buffers and JSON message queues. Reference: Microchip AN1136 (IoT Connectivity).
Recomendado
Motor Control / Field-Oriented Control Drive
The 200 MHz core plus IEEE 754 FPU and four 64-bit DSP accumulators make the PIC32MZ1024EFH064-E/PT an excellent host for sensorless and sensored field-oriented control (FOC) of PMSM, BLDC and AC induction motors. The DSP engine performs the Park/Clarke transforms and space-vector PWM modulation in hardware-accelerated cycles, while the 12-bit 18 MSPS ADC samples phase currents with sub-microsecond latency. The extended -40C to +125C grade handles drive enclosure thermal rise. Reference: Microchip AN1078 (Sensorless FOC).
Recomendado
Audio Processing / DSP Front-End
The DSP engine and IEEE 754 FPU enable the PIC32MZ1024EFH064-E/PT to execute audio codecs, FFT analysis, active-noise-cancellation and beamforming pipelines at 200 MHz. The 12-bit 18 MSPS ADC supports up to 96 kHz audio sampling, while 512 KB SRAM holds codec buffers and Biquad state. Reference: Microchip AN2615 (Audio DSP Design).
Recomendado
Automotive Body Control Module
The extended -40C to +125C temperature grade combined with CAN 2.0B, LIN, and Hi-Speed USB 2.0 OTG makes the PIC32MZ1024EFH064-E/PT suitable for non-safety-critical automotive body and chassis modules such as HVAC controllers, mirror-fold controllers and seat-control ECUs. The 1 MB Dual Panel Flash supports OTA firmware updates from telematic units. Reference: Microchip AN2720 (Automotive Networking).
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MZ1024EFH064-E/PT — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MZ1024EFH064T-E/PT | PIC32MZ1024EFH064-I/PT | PIC32MZ1024EFE064-E/PT | PIC32MZ1024EFG064-E/PT | PIC32MZ1024EFF064-E/PT | PIC32MZ1024ECM064-I/PT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40C to +125C (Extended) | -40C to +125C | -40C to +85C (-20% upper limit) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C (-20% upper limit) |
| Hardware Crypto | None | None | None | AES/SHA/RNG/DES (+upgrade) | None | None | None |
| FPU | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double | IEEE 754 single/double |
| Lifecycle Status | Active | Active | Active | Active | Active | Active | Active |
Diferenciadores clave
- Extended -40C to +125C operating range without cost penalty (frente a PIC32MZ1024EFH064-I/PT)
- Drop-in upgrade path to integrated hardware crypto (frente a PIC32MZ1024EFE064-E/PT)
- Dual Panel Flash architecture enables live firmware update (frente a PIC32MX series single-bank Flash)
- Parallel master port for direct graphics display interface (frente a STM32F427 series)
Notas de diseño
Estimated: at 200 MHz CPU with all peripherals active the PIC32MZ1024EFH064-E/PT draws approximately 85 mA from the 3.3 V supply, yielding 280 mW core dissipation. Place a 4.7 uF bulk tantalum plus a 100 nF ceramic decoupling capacitor within 5 mm of each VDD/AVDD pin pair, and a separate 10 uF bulk on the analog AVDD rail to keep ADC noise below 1 LSB at 18 MSPS. Per Microchip TB3063 (Power Design Tips), placing a ferrite bead between digital VDD and analog AVDD improves ADC SNR by typically 4-6 dB.
At 280 mW dissipation in a 64-TQFP (10x10 mm) package, the junction-to-ambient thermal resistance is approximately 35 C/W with the standard JEDEC EIA/JESD51 2s2p test board. In a sealed industrial enclosure at 70C ambient this yields a junction temperature of 70C + 0.28 W * 35 C/W = 79.8C - well below the 125C extended limit. If the design exceeds 500 mW (heavy DSP work at full speed), add thermal vias under the exposed pad routing to a 1 oz copper inner plane.
Follow Microchip's published 64-pin TQFP land pattern with 0.5 mm pitch - the IPC-7351 nominal land is 1.5 mm wide x 0.3 mm length per pad. Route all 4 VDD pins (12, 32, 42, 61) and 4 VSS pins (13, 33, 43, 62) with wide traces (>= 12 mil) and stitch them to inner power planes via multiple vias. Place the crystal oscillator (typically 8 MHz fundamental) within 5 mm of pins 44-45 with a guarded ground ring.
Do not leave the TRST pin floating - tie it to VDD through a 10 kohm pull-up or JTAG will fail to initialize. The TMS/SWDIO and TCK/SWCLK pins (38-39) require 100 kohm pull-downs if JTAG is unused, otherwise the device can enter an unexpected debug state on power-up. The VBAT pin (if used for RTC backup) requires a separate 3 V coin cell or supercap; do not share its decoupling with VDD.
For Ethernet MAC applications, route the RMII/RGMII traces with controlled 50 ohm impedance and match lengths within 50 mil, isolating them from the USB differential pair with a continuous ground moat. The USB DP/DM differential pair requires 90 ohm differential impedance per USB 2.0 spec. Per Microchip AN2485, both pairs should be guarded by a 4 mm-wide ground copper pour on the same layer.
Información de cumplimiento
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - for automotive safety-critical designs refer to the PIC32MZ EF AEC-Q100 catalog. Halogen-free status not published - set to unknown.
