PIC32MZ1064DAB169T-I/HF - 200MHz 32-bit MCU 1MB Flash | Microchip
N.º de pieza: PIC32MZ1064DAB169T-I/HF ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.14 | $6,14 |
| 10 | $5.89 | $58,90 |
| 100 | $5.47 | $547,00 |
| 500 | $4.96 | $2.480,00 |
| 1.000 | $4.52 | $4.520,00 |
PIC32MZ1064DAB169T-I/HF Descripción general
A PIC32 microcontroller is a 32-bit RISC MCU family from Microchip based on the MIPS architecture (in this case, the microAptiv core) and designed as an extension of the legacy 16-bit PIC24/dsPIC families. PIC32MZ devices sit in the hierarchy Microcontroller -> 32-bit MCU -> MIPS-based MCU -> PIC32MZ DA graphics MCU, providing deterministic real-time performance, large memory headroom, and rich connectivity peripherals (HS USB, Ethernet, CAN, SQI) for embedded graphical, industrial, and connectivity applications.
Key features include the 200 MHz core, 1 MB Flash, 640 KB SRAM, integrated DDR2 DRAM controller (32 MB or 128 MB externally addressable), Graphics Controller + Graphics Processor, 12-bit 18 MSPS ADC with up to 45 analog channels, High-Speed USB 2.0 OTG, two CAN modules, and up to 120 GPIO in the 169-ball LFBGA package. The 200 MHz MIPS core delivers 252 DMIPS / 3.28 CoreMarks/MHz-class throughput, and the on-chip graphics pipeline eliminates the need for an external GPU for typical HMI workloads.
Typical applications include industrial HMI panels, graphical touch-screen controllers, automotive dashboards, medical device interfaces, point-of-sale terminals, and building-automation control panels. Designers also use the PIC32MZ DA family for SCADA-style operator interfaces, smart energy displays, and any product that needs a TFT/LCD up to WXGA or higher with responsive multi-layer graphics.
When designing with this part, ensure the PCB layout supports matched-length impedance-controlled DDR2 signals for the external memory interface. Provide adequate bulk decoupling near the 1.8 V and 3.3 V rails, and respect the LFBGA escape routing rules (microvia or via-in-pad recommended) to maintain SI on parallel busses. The -I/HF temperature suffix indicates industrial -40 C to +85 C operation with lead-free (Pb-free) matte-tin finish.
Alternativas directas para PIC32MZ1064DAB169T-I/HF — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MZ1064DAB169T-I/HF (mismo factor de forma y huella) — difiere en Graphics Controller, Package, USB, CAN, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MZ1064DAB169-I/HF
✅ Sustitución directa✓ En stock
$12.4 / unidad
Ver hoja de datos →PIC32MZ1064DAA169T-I/HF
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MZ1064DAB169-I/HF
✅ Sustitución directa✓ En stock
$12.4 / unidad
Ver hoja de datos →PIC32MZ1025DAB169T-I/HF
✅ Sustitución directa✓ En stock
$12.65 / unidad
Ver hoja de datos →PIC32MZ1025DAB169-I/HF
✅ Sustitución directa✓ En stock
$7.85 / unidad
Ver hoja de datos →PIC32MZ1025DAL169T-I/HF
✅ Sustitución directa✓ En stock
$8.3 / unidad
Ver hoja de datos →PIC32MZ1064DAB169T-I/HF Valores máximos y características eléctricas
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ DA (Graphics) |
| Core Frequency | 200 MHz |
| Flash Memory | 1 MB (1M x 8) |
| SRAM | 640 KB |
| External Memory | DDR2 DRAM up to 128 MB addressable |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated |
| Graphics Processor | Integrated |
| USB | Hi-Speed USB 2.0 OTG |
| CAN | Yes |
| GPIO (max) | 120 |
| Tensión de alimentación | 1.7 V to 3.6 V |
| Temperatura de funcionamiento | -40 C to +85 C (Industrial) |
| Encapsulado | 169-LFBGA (11x11 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| Lead-Free / RoHS | Lead-Free matte-tin (HF suffix), RoHS compliant |
Guía de configuración de pines de PIC32MZ1064DAB169T-I/HF 169-lfbga (11x11 mm)
Configuración de pines para PIC32MZ1064DAB169T-I/HF (encapsulado 169-lfbga (11x11 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PIC32MZ1064DAB169T-I/HF.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PIC32MZ1064DAB169T-I/HF es adecuado para 6 aplicacións: Industrial HMI Touch Panels, Automotive Dashboard Displays, Medical Device User Interfaces, Point-of-Sale (POS) Terminals, Building Automation Control Panels, Smart Energy and Utility Displays.
Industrial HMI Touch Panels
The PIC32MZ1064DAB169T-I/HF's 200 MHz MIPS32 microAptiv core plus integrated Graphics Controller and Graphics Processor make it a single-chip solution for color TFT HMI panels up to WXGA+. Designers use the on-chip DDR2 controller (32 MB or 128 MB addressable) to host frame buffers without an external graphics chip. The 12-bit 18 MSPS ADC samples up to 45 analog signals for backlight/temperature monitoring while HS USB enables firmware updates and touchscreen data pipes.
Recomendado
Automotive Dashboard Displays
With its 200 MHz core and integrated graphics pipeline plus 1 MB Flash / 640 KB SRAM, the PIC32MZ1064DAB169T-I/HF drives segmented and full-color dashboard TFTs without an external GPU. The HS USB and dual CAN interfaces connect to body controllers, infotainment, and OBD-II networks. Automotive designers may pair this MCU with an external CAN transceiver for cluster applications; note that the -I/HF suffix is industrial-grade (-40C to +85C), not AEC-Q100 qualified, so for under-hood ECUs a different part number is required.
Recomendado
Medical Device User Interfaces
The PIC32MZ1064DAB169T-I/HF delivers deterministic MIPS real-time performance with 1 MB Flash and 640 KB SRAM for therapy pumps, patient monitors, and diagnostic analyzers. Its 12-bit 18 MSPS ADC captures sensor signals at high sample rates, while the integrated graphics block drives LCD/TFT panels for medical device UIs. The Hi-Speed USB port supports medical-grade USB device classes, and the 169-LFBGA package allows small form-factor PCB designs for portable instruments.
Recomendado
Point-of-Sale (POS) Terminals
POS terminals need fast MIPS performance for encryption, barcode handling, and graphical receipts. The PIC32MZ1064DAB169T-I/HF's 200 MHz core, HS USB for peripherals, and integrated graphics controller handle customer-facing displays and signature capture. The external DDR2 interface (up to 128 MB addressable) supports large UI assets and font caches, while the 12-bit ADC reads keypad matrices and analog sensors in the same chassis.
Recomendado
Building Automation Control Panels
Building automation panels for HVAC, access control, and lighting dashboards benefit from the PIC32MZ1064DAB169T-I/HF's on-chip graphics controller and 169-LFBGA footprint for compact wall-mount designs. The dual CAN bus interfaces link to elevator controllers and BMS networks, while HS USB serves as service/maintenance port. The 12-bit 18 MSPS ADC with up to 45 channels monitors analog sensors for indoor air quality, occupancy, and temperature feedback.
Recomendado
Smart Energy and Utility Displays
The PIC32MZ1064DAB169T-I/HF's 200 MHz MIPS core and integrated graphics pipeline drive color TFTs in smart meters, EV charger HMI, and solar inverter displays. The Hi-Speed USB port supports firmware upgrades, while the dual CAN ports connect to utility bus protocols. The 1 MB Flash and 640 KB SRAM store multilingual UI strings, while the external DDR2 up to 128 MB supports complex energy-flow visualizations and trend graphs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MZ1064DAB169T-I/HF — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MZ1064DAB169-I/HF | PIC32MZ1064DAA169T-I/HF | PIC32MZ1025DAB169T-I/HF | PIC32MZ1025DAB169-I/HF | PIC32MZ1025DAL169T-I/HF |
|---|---|---|---|---|---|---|
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Graphics Controller | Integrated (full DA-B features) | Integrated (full DA-B features) | Integrated (DA-A reduced graphics) | Integrated (DA-B features) | Integrated (DA-B features) | Integrated (DA-L lite features) |
| USB | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG | Hi-Speed USB 2.0 OTG |
| CAN | Yes (2x CAN) | Yes (2x CAN) | Yes (2x CAN) | Yes (2x CAN) | Yes (2x CAN) | Yes (2x CAN) |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
Diferenciadores clave
- Higher feature tier within DA family (frente a PIC32MZ1064DAA169T-I/HF)
- Same die, packaging variant for prototype vs production (frente a PIC32MZ1064DAB169-I/HF)
- Identical 169-LFBGA footprint to PIC32MZ1025DAB169T-I/HF (frente a PIC32MZ1025DAB169T-I/HF)
Notas de diseño
Estimated: the 169-LFBGA 11x11 mm package has a ball pitch of approximately 0.8 mm. Use microvia or via-in-pad technology with 0.2 mm via diameter to fan out the inner balls. Maintain matched-length traces (within +/- 25 mil) for the external DDR2 data, address, and clock buses to preserve signal integrity at 200 MHz core frequency.
Provide two 100 nF decoupling capacitors as close as possible to every VDD pin, plus 4.7 uF bulk caps on each voltage rail (3.3 V core, 1.8 V DDR2, and any 2.5 V analog). Place a ferrite bead between the 3.3 V analog and digital domains to reduce ADC noise coupling. The integrated graphics pipeline and DDR2 controller can source 200-300 mA peak during heavy LCD refresh - size the LDO or DC-DC accordingly.
Do not route any high-speed signal (DDR2 clocks, HS USB DP/DN) over or under the LFBGA. The HS USB differential pair (DP/DN) requires 90 ohm differential impedance and should be length-matched to within 150 mil. For ICSP debugging, the device has multiple PGECx/PGEDx pin pairs - use one pair consistently (e.g., PGEC2/PGED2) to avoid debugger lockout, as documented in the Northern Software dev notes.
Información de cumplimiento
The -I/HF suffix indicates industrial temperature range (-40 C to +85 C) and lead-free (Pb-free) halogen-free finish per Microchip ordering code convention. Not AEC-Q100 qualified - automotive designs requiring AEC-Q100 must select a qualified part number from Microchip's automotive PIC32 portfolio.