PTN3460IBS/F2MP - eDP to LVDS Bridge 56-HVQFN | NXP
N.º de pieza: PTN3460IBS/F2MP ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.92 | $6,92 |
| 10 | $6.5 | $65,00 |
| 100 | $5.9 | $590,00 |
| 500 | $5.4 | $2.700,00 |
| 1.000 | $4.95 | $4.950,00 |
PTN3460IBS/F2MP Descripción general
An eDP-to-LVDS bridge is a video interface IC that sits between a graphics source (CPU, GPU or chipset) with a modern embedded DisplayPort output and a legacy LVDS panel that expects differential LVDS data pairs. It belongs to the display interface family: bridge IC -> video interface IC -> signal converter -> semiconductor interface device. Such bridges are essential in embedded systems where the panel interface standard lags behind the SoC's native output.
Key features include dual high-speed ports (an eDP receive port facing the source and an LVDS transmit port facing the panel), DP-to-LVDS protocol conversion performed on-chip, and operation from a single 3.3 V supply. According to NXP product documentation, the PTN3460I processes the incoming DisplayPort stream, performs DP to LVDS protocol conversion and transmits the processed stream in LVDS format, enabling connectivity between an eDP source and an LVDS display panel.
Technically, the device integrates a DisplayPort receiver, protocol translation logic, LVDS serializer, and configuration support that lets designers adapt mapping to different panel timing requirements. The 56-HVQFN exposed-pad package provides low-inductance high-speed signal integrity and good thermal dissipation for continuous video operation.
Typical applications include industrial HMI and touch-panel displays, embedded motherboards and single-board computers, medical and test-instrumentation displays, and digital signage where an eDP-capable chipset must drive an LVDS panel. The part is explicitly positioned by NXP for industrial and embedded applications.
A key design consideration: verify panel timing, LVDS mapping (JEIDA vs VESA), and link rate configuration against the 42-page NXP PTN3460I datasheet (Rev. 2.1, 16 August 2016) before finalizing the board, since bridge configuration determines display compatibility.
This page synthesizes distributor pricing, same-family drop-in options, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para PTN3460IBS/F2MP — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PTN3460IBS/F2MP (mismo factor de forma y huella) — difiere en Function, Input Interface, Output Interface, Supply Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PTN3460IBS/F1MP
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.55 / unidad
Ver hoja de datos →PTN3460IBS/F2,518
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
PTN3460IBZ/F1MP
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
PTN3460IBS/F2MP Especificaciones
| Función | eDP (DisplayPort) to LVDS bridge |
| Applications | LVDS interface, industrial and embedded displays |
| Tensión de alimentación | 3.3 V |
| Encapsulado / Carcasa | 56-VFQFN Exposed Pad |
| Supplier Device Package | 56-HVQFN (7x7) |
| Tipo de montaje | Surface Mount |
| Part Status | Active |
| Input Interface | Embedded DisplayPort (eDP) receive port |
| Output Interface | LVDS transmit port |
| Protocol Conversion | DP to LVDS |
| Condition | New and original |
| Quality Guarantee | 365 days (supplier stated) |
| Datasheet Pages | 42 pages (PTN3460I Rev. 2.1, 16 August 2016) |
Guía de configuración de pines de PTN3460IBS/F2MP 56-hvqfn (7x7)
Configuración de pines para PTN3460IBS/F2MP (encapsulado 56-hvqfn (7x7)). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para PTN3460IBS/F2MP.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PTN3460IBS/F2MP es adecuado para 6 aplicacións: Industrial HMI and Touch Displays, Embedded Single-Board Computers, Medical and Diagnostic Display Systems, Digital Signage and Kiosk Displays, Test and Measurement Instrument Displays, Automotive and Rugged Display Clusters.
Industrial HMI and Touch Displays
Industrial human-machine interfaces frequently pair modern x86 or ARM chipsets that only expose embedded DisplayPort with long-lifecycle LVDS panels that remain qualified in the field. The PTN3460IBS/F2MP bridges this gap: its eDP receive port connects to the CPU/GPU output while its LVDS transmitter drives the panel, performing full DP-to-LVDS protocol conversion from a single 3.3 V rail. The 56-HVQFN (7x7 mm) exposed-pad package keeps differential-pair routing short, protecting eye diagrams at video data rates. Because NXP explicitly positions the PTN3460I for industrial applications, it suits long-availability designs where a display bridge cannot be redesigned mid-lifecycle.
Recomendado
Embedded Single-Board Computers
Embedded motherboards and SBCs increasingly ship with SoCs whose native display output is eDP, yet many embedded and panel-mount displays still accept LVDS. Placing the PTN3460IBS/F2MP between the SoC eDP port and the LVDS connector lets the board support the installed base of LVDS panels without changing the processor. The device converts the incoming DP stream on-chip and transmits it in LVDS format, requiring only a 3.3 V supply and standard decoupling. The exposed-pad HVQFN also aids thermal dissipation during continuous video operation, and its 7x7 mm footprint fits typical SBC display-routing regions.
Recomendado
Medical and Diagnostic Display Systems
Medical monitors and diagnostic equipment favor LVDS panels for their proven noise performance and long qualification cycles, while newer compute modules provide eDP only. The PTN3460IBS/F2MP performs the protocol conversion transparently, so the validated medical-grade display subsystem can be retained when the compute module is refreshed. Its deterministic DP-to-LVDS conversion avoids frame-buffer latency, which matters for real-time imaging. The single 3.3 V supply simplifies the power tree in patient-adjacent equipment, and the 56-HVQFN (7x7) package supports the compact, shielded layouts typical of medical imaging head units.
Recomendado
Digital Signage and Kiosk Displays
Signage players built around modern media processors with eDP outputs can drive cost-effective LVDS open-frame panels through the PTN3460IBS/F2MP. The bridge's two high-speed ports - eDP receive toward the media SoC and LVDS transmit toward the panel - handle the full conversion path without external frame memory, keeping BOM cost and latency low. Operation from a single 3.3 V rail aligns with standard signage power architectures, and the surface-mount 56-HVQFN (7x7 mm) package withstands the extended operating hours and elevated ambient temperatures typical of always-on signage installations.
Recomendado
Test and Measurement Instrument Displays
Bench instruments and automated-test equipment often integrate LVDS-based display modules while using contemporary FPGA or processor platforms that output eDP. The PTN3460IBS/F2MP supplies the protocol bridge so instrument designers can qualify displays independently of the processing platform. Its on-chip DP-to-LVDS conversion minimizes component count in the video path, preserving the clean signal environment that measurement front ends demand. The 3.3 V supply and 56-HVQFN exposed-pad thermal design support continuous full-brightness operation inside enclosed instrument chassis without additional heatsinking in typical configurations.
Recomendado
Automotive and Rugged Display Clusters
Rugged vehicles, marine consoles, and off-highway equipment use LVDS panels for immunity to the electrically noisy power environments around engines and motor drives. When the system controller provides only an eDP interface, the PTN3460IBS/F2MP bridges to the LVDS cluster display, converting the DP stream and transmitting it in LVDS format over short shielded harnesses. The compact 7x7 mm HVQFN survives vibration-dominated environments better than larger packages, and NXP's industrial-grade positioning aligns with extended-temperature embedded designs. Verify final grade and environmental data against the NXP PTN3460I datasheet Rev. 2.1.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PTN3460IBS/F2MP — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PTN3460IBS/F1MP | PTN3460IBS/F2,518 | PTN3460IBZ/F1MP |
|---|---|---|---|---|
| Package | 56-HVQFN (7x7) Exposed Pad | 56-HVQFN (7x7) - same | 56-HVQFN (7x7) - same | 56-HVQFN (7x7) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Function | eDP to LVDS bridge | eDP to LVDS bridge | eDP to LVDS bridge | eDP to LVDS bridge |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Protocol Conversion | DP to LVDS, on-chip | DP to LVDS, on-chip | DP to LVDS, on-chip | DP to LVDS, on-chip |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Diferenciadores clave
- Purpose-built industrial eDP-to-LVDS bridge (frente a PTN3460IBS/F1MP)
- Integrated protocol conversion reduces BOM (frente a Generic LVDS transmitter ICs (e.g., SN65LVDS105PWR))
- Single 3.3 V supply architecture (frente a Multi-rail display bridge solutions)
Notas de diseño
The PTN3460IBS/F2MP carries high-speed eDP main-link lanes in and LVDS differential pairs out. Keep each differential pair as a tightly coupled 100-ohm impedance pair, match intra-pair skew, and route them on inner layers with solid reference planes. Length-match pairs within the pair first, then between lanes. Avoid routing video pairs near switching supplies or clock traces. The 7x7 mm HVQFN pad pitch supports escape routing on standard 4-layer boards without microvias in most layouts.
The 56-HVQFN exposed pad is the primary ground return for the high-speed ports - solder it to a contiguous ground plane with an array of vias directly under the pad. Provide a 3.3 V plane or thick trace with local 100 nF ceramic decoupling at each supply pin group plus bulk 10 uF near the device. Follow the land-pattern recommendation in the NXP PTN3460I datasheet (Rev. 2.1) exactly; the exposed pad also dissipates device heat during continuous video operation.
Confirm the panel's LVDS mapping convention (VESA vs JEIDA), pixel clock range, and lane configuration against the PTN3460I configuration options before releasing the board - mismatches are the most common cause of blank or corrupted panels. Verify the eDP AUX and HPD connections, since link training depends on them. Also verify the meaning of the /F2MP ordering-code suffix in NXP's ordering information when qualifying second sources within the PTN3460 family.
Información de cumplimiento
NXP's official PTN3460IBS product page includes an Environmental section covering RoHS/REACH status; exact compliance values for PTN3460IBS/F2MP were not present in the retrieved data and must be confirmed on nxp.com/part/PTN3460IBS.
