RW612HN - Wi-Fi 6 + BLE 5.4 Tri-Radio Wireless MCU | NXP
N.º de pieza: RW612HN ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.2 | $62,00 |
| 100 | $5.55 | $555,00 |
| 500 | $5.1 | $2.550,00 |
| 1.000 | $4.65 | $4.650,00 |
RW612HN Descripción general
A wireless MCU (microcontroller unit) integrates both a radio transceiver and a processing core on a single die, collapsing what would traditionally require a separate MCU and RF module into one component. Within the power-management and connectivity hierarchy, the RW612 sits above simple BLE-only SoCs and below full application processors, occupying the wireless-system-on-chip (SoC) tier used for connected devices.
Key features include tri-radio concurrency (Wi-Fi 6 plus BLE 5.4 plus 802.15.4 for Thread/Zigbee), TrustZone-M hardware security isolation, and 1.2 MB of on-chip SRAM. A Quad SPI interface with high bandwidth and an on-the-fly decryption engine enables secure execute-in-place (XIP) access to off-chip flash and PSRAM, letting designers extend code and data memory cost-effectively.
Architecturally, the 260 MHz Cortex-M33 with Armv8-M TrustZone-M provides a root-of-trust foundation, while the integrated Wi-Fi 6 radio delivers 802.11ax efficiency features such as OFDMA and target wake time for lower power and higher network capacity. The RF front end covers 2400 MHz to 2483.5 MHz and 5170 MHz to 5895 MHz per Arrow listings.
Typical applications include connected smart home devices, enterprise and industrial automation, smart accessories, and smart energy products where Wi-Fi, Thread/Matter, and BLE coexistence on one chip reduces BOM cost and board area.
A key design consideration is RF layout: the dual-row VFQFN exposed pad requires a solid ground pour and via stitching directly beneath the part to ensure RF performance and thermal dissipation.
This page synthesizes distributor listings, datasheet links, drop-in alternative analysis, and practical design notes not found in the NXP datasheet alone.
Alternativas directas para RW612HN — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
RW612HN/A2IMP
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
RW612HN/A2IK
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
RW612HN/A0IK
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
RW610HN
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
RW612HN Valores máximos y características eléctricas
| Product Type | Tri-radio Wireless MCU |
| Core | Arm Cortex-M33 with TrustZone-M |
| Core Frequency | 260 MHz |
| On-chip SRAM | 1.2 MB |
| Wi-Fi Standard | Wi-Fi 6 (802.11ax), 1x1 |
| Bluetooth | Bluetooth Low Energy 5.4 |
| 802.15.4 Radio | Yes (Thread / Zigbee capable) |
| Frequency Bands | 2.4 GHz (2400 MHz to 2483.5 MHz) and 5 GHz (5170 MHz to 5895 MHz) |
| External Memory Interface | Quad SPI with on-the-fly decryption (XIP flash / PSRAM) |
| Security | Arm TrustZone-M, secure boot, on-the-fly decryption engine |
| Encapsulado | 116-VFQFN Dual Rows, Exposed Pad |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
Guía de configuración de pines de RW612HN 116-vfqfn dual rows, exposed pad
Configuración de pines para RW612HN (encapsulado 116-vfqfn dual rows, exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para RW612HN.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
RW612HN es adecuado para 6 aplicacións: Connected Smart Home Devices, Enterprise and Industrial Automation, Smart Energy and Metering, Smart Accessories and Wearables, Security Cameras and Video Doorbells, Smart Lighting and Building Control.
Connected Smart Home Devices
The RW612HN fits smart home products that must bridge multiple ecosystems: its Wi-Fi 6 radio delivers cloud connectivity with 802.11ax efficiency (OFDMA and target wake time reduce airtime contention and standby power), while the 802.15.4 radio speaks Thread for Matter-native local control and the BLE 5.4 radio handles commissioning from phones. All three radios share one 260 MHz Cortex-M33 with 1.2 MB SRAM, eliminating a second MCU and its BOM cost. Placed on a 4-layer board with the exposed pad soldered to a continuous ground plane, the part achieves reliable RF performance in sealed plastic enclosures typical of thermostats, plugs, and sensors. The secure XIP engine allows application code to live in low-cost external flash, keeping total memory cost low while TrustZone-M protects key material.
Recomendado
Enterprise and Industrial Automation
In factories and commercial buildings, the RW612HN serves as a single-chip connectivity node where 802.11ax capacity in dense AP environments matters: Wi-Fi 6's OFDMA scheduling reduces latency jitter versus 802.11n parts, and concurrent 802.15.4 support enables Thread mesh backhaul for battery-powered end devices. The 260 MHz Cortex-M33 headroom runs protocol stacks plus local control logic without an external host processor, and 1.2 MB SRAM buffers sensor telemetry across network outages. TrustZone-M provides hardware isolation of provisioning keys and secure OTA boot via the on-the-fly decryption engine on Quad SPI flash. Designers should budget separate antenna paths or a tri-band switch for 2.4 GHz and 5 GHz operation and follow NXP reference designs for RF matching.
Recomendado
Smart Energy and Metering
Smart meters and energy gateways benefit from the RW612HN's multi-protocol flexibility: 802.15.4 supports Zigbee/Thread utility mesh networks, Wi-Fi 6 provides high-throughput data upload to head-end systems, and BLE 5.4 enables local in-home displays and commissioning tools. The 260 MHz Cortex-M33 processes metering algorithms while cryptography offload through TrustZone-M and the Quad SPI decryption engine protects billing data and firmware images end to end. Low-power modes allow periodic wake-and-report duty cycles, and the single-chip integration shrinks meter PCB area versus discrete MCU-plus-module solutions. Exposed-pad thermal and ground design is critical inside sealed meter enclosures that dissipate heat only through the PCB.
Recomendado
Smart Accessories and Wearables
Connected accessories such as trackers, remotes, and smart badges use the RW612HN's BLE 5.4 link for phone pairing while retaining Wi-Fi 6 for direct-to-cloud updates without a phone relay - a capability BLE-only SoCs cannot offer. The 260 MHz Cortex-M33 runs voice/UI middleware that would overwhelm Cortex-M0-class parts, and 1.2 MB SRAM supports graphics buffers for small displays. Wi-Fi 6 target wake time bounds radio-on time to protect battery life in charging-case products, while 802.15.4 future-proofs the design for Thread accessory ecosystems. Board designers should prioritize antenna keep-out areas in the compact dual-row QFN footprint and follow NXP RF layout guidelines for metal-adjacent enclosures.
Recomendado
Security Cameras and Video Doorbells
Battery- or bus-powered security devices need both high-throughput Wi-Fi and low-power presence links, and the RW612HN delivers both concurrently: Wi-Fi 6 802.11ax on the 5 GHz band provides cleaner spectrum for video streaming at reduced interference from congested 2.4 GHz networks, while BLE maintains low-latency wake and app-provisioning channels between recording sessions. The 260 MHz Cortex-M33 with 1.2 MB SRAM handles network stacks and video transport offload logic, and the Quad SPI XIP interface streams firmware from encrypted external flash so OTA images cannot be tampered with. The on-the-fly decryption engine keeps key material out of plaintext external memory - an important consideration for security-grade products subject to privacy audits.
Recomendado
Smart Lighting and Building Control
Lighting controllers and occupancy systems adopt the RW612HN to unify control planes: the 802.15.4 radio joins Zigbee/Thread lighting meshes natively, BLE 5.4 supports installer commissioning apps, and Wi-Fi 6 backhauls to building management systems without a gateway bridge MCU. The tri-radio concurrency removes protocol gateway components, cutting BOM cost and PCB area in form-factor-constrained drivers and ceiling fixtures. With a 260 MHz Cortex-M33, the part executes lighting scenes, PWM scheduling, and network management locally even when the uplink is down, an availability advantage over cloud-dependent designs. Designers must validate thermal performance since fully enclosed drivers rely on PCB copper and the exposed pad as the primary heat path.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para RW612HN — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | RW612HN/A2IMP | RW612HN/A2IK | RW612HN/A0IK | RW610HN |
|---|---|---|---|---|---|
| Package | 116-VFQFN Dual Rows, Exposed Pad | 116-VFQFN Dual Rows, Exposed Pad - same | 116-VFQFN Dual Rows, Exposed Pad - same | 116-VFQFN Dual Rows, Exposed Pad - same | 116-VFQFN Dual Rows, Exposed Pad - same family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Frequency | Arm Cortex-M33, 260 MHz | Cortex-M33, 260 MHz | Cortex-M33, 260 MHz | Cortex-M33, 260 MHz | Cortex-M33, 260 MHz |
| Radios | Wi-Fi 6 + BLE 5.4 + 802.15.4 | Wi-Fi 6 + BLE 5.4 + 802.15.4 | Wi-Fi 6 + BLE 5.4 + 802.15.4 | Wi-Fi 6 + BLE 5.4 + 802.15.4 | Wi-Fi 6 + BLE + 802.15.4 (cost-reduced subset) |
| Quality / Grade Suffix | HN base grade | A2 grade, tape & reel | A2 grade, tray | A0 grade, tray | HN base grade |
Diferenciadores clave
- Tri-radio single-chip integration (frente a ESP32-C6 class SoCs)
- Grade-suffix flexibility within the same footprint (frente a RW612HN/A2IMP)
- Secure external memory via hardware decryption (frente a BLE-only SoCs such as nRF51822)
Notas de diseño
The RW612HN's 116-VFQFN dual-row exposed pad demands disciplined land-pattern work: use the NXP-recommended footprint withvia-stitched ground pour directly under the exposed pad, and design the stencil with segmented apertures (typically 50-70% coverage) to avoid solder voiding that degrades both RF ground return and heat dissipation. The dual perimeter rows require a fine, well-controlled reflow profile - hand rework of the inner row is practically impossible, so plan inspection (X-ray or AOI) into your production line. Estimated: with typical combo-SoC dissipation of a few hundred milliwatts, a solid 4-layer board with dedicated ground plane is sufficient without a heatsink.
Because the RW612HN covers both 2.4 GHz (2400-2483.5 MHz) and 5 GHz (5170-5895 MHz), RF front-end planning is a first-order design task. Follow the matching network in the NXP RW612 reference design rather than deriving your own, and keep antenna keep-out zones free of copper and components per NXP application guidelines. For tri-radio coexistence, enable the hardware coexistence arbitration in the NXP SDK so Wi-Fi, BLE, and 802.15.4 traffic do not collide in the shared front end. Use NXP's certified antenna/reference modules list to shortcut regulatory (FCC/CE) testing for the 5 GHz band.
Memory architecture is the most common design mistake with the RW612 family: the Quad SPI XIP path with on-the-fly decryption must use NXP-supported flash/PSRAM devices and correctly programmed key blobs, or boot will fail silently. Budget SRAM carefully - 1.2 MB is shared among the Wi-Fi 6 stack, BLE/802.15.4 stacks, and your application, so large application images should reside in external XIP flash rather than internal SRAM. Also confirm the correct orderable grade suffix (A0/A1/A2) at ordering time: suffixes differ in qualification level and packaging and are not interchangeable on existing POs without supplier agreement.
Información de cumplimiento
RoHS compliant and lead-free per NXP product/distributor listings. REACH, halogen-free, and conflict-minerals statements should be obtained from NXP's compliance certificate package for formal documentation.