SC8544PXANG - NXP BGA Interface Specialized IC | Datasheet
N.º de pieza: SC8544PXANG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.5 | $5,50 |
| 10 | $4.95 | $49,50 |
| 100 | $4.4 | $440,00 |
| 500 | $3.85 | $1.925,00 |
| 1.000 | $3.3 | $3.300,00 |
SC8544PXANG Descripción general
An interface specialized IC is a category of semiconductor that performs non-standard or application-specific interfacing functions, sitting between a main processor (such as an applications processor, MCU, or SoC) and one or more peripherals. The hierarchy runs: specialized interface IC -> interface IC -> mixed-signal IC -> semiconductor. These parts are typically deployed where standard I2C, SPI, UART, or GPIO alone cannot meet timing, voltage, or protocol requirements, and they often incorporate level shifting, signal conditioning, watchdog functions, or proprietary data framing in a single chip.
Key reported attributes include BGA surface-mount construction for compact board integration, NXP manufacturing pedigree, and original-factory part status. Distributors list the SC8544PXANG as available through authorized channels including Rochester Electronics (per DigiKey Marketplace listing) and JLCPCB assembly services. Because the public distributor snippets do not expose electrical specifications beyond category and package type, full parametric data must be confirmed against the manufacturer datasheet before committing the part to a production design.
Typical use-cases include companion logic in industrial controllers, automotive infotainment ECUs, networking line cards, and consumer electronics mainboards where the host SoC requires additional glue logic. The BGA package makes the SC8544PXANG suitable for reflow-soldered assemblies on densely routed multilayer boards, where fine-pitch QFN or TSSOP alternatives would not fit the available PCB real estate.
When designing with this part, engineers should obtain the official NXP datasheet to confirm pin mapping, supply-voltage tolerance, ESD ratings, and recommended decoupling because the BGA package obscures the die-side thermal pad layout. Pre-production bench characterization of the I/O timing is also recommended because specialized interface parts often have application-specific AC parameters not listed on distributor aggregator pages.
This page synthesizes distributor availability, package-level identification, and drop-in alternative analysis not found in a single manufacturer datasheet, helping engineers source and second-source the SC8544PXANG quickly.
Alternativas directas para SC8544PXANG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
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Solicitar alternativasSC8544PXANG Especificaciones
| Manufacturer | NXP Semiconductors |
| Categoría | Interface - Specialized |
| Package Type | BGA |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de SC8544PXANG bga
Configuración de pines para SC8544PXANG (encapsulado bga). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para SC8544PXANG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
SC8544PXANG es adecuado para 6 aplicacións: Industrial Control Companion Logic, Automotive Infotainment ECU, Networking Line Card Auxiliary Logic, Consumer Electronics Mainboard Glue Logic, Test and Measurement Front-End, IoT Edge Gateway Signal Conditioning.
Industrial Control Companion Logic
The SC8544PXANG fits industrial control designs as companion interface logic next to a host MCU or SoC where standard I2C/SPI/UART peripherals are insufficient. As a specialized BGA interface IC from NXP, it supports proprietary signal routing on densely laid-out multilayer controller boards. The BGA package enables placement near the host processor without consuming additional board area, while NXP's industrial-grade pedigree supports long-lifecycle deployments typical of factory automation. Designers should confirm supply voltage tolerance and ESD ratings against the official datasheet before committing to a 24V industrial bus architecture.
Recomendado
Automotive Infotainment ECU
The SC8544PXANG can serve automotive infotainment ECUs where the head-unit SoC requires proprietary glue logic for display, audio, or connectivity routing. NXP's broad automotive portfolio makes a BGA specialized interface IC a reasonable candidate for AEC-Q100 qualified designs pending datasheet verification. The compact BGA package suits space-constrained dashboard PCBs, and NXP's design-in support ecosystem simplifies functional safety documentation. Confirm operating temperature range and AEC-Q100 status directly from NXP before specifying for a production ECU.
Recomendado
Networking Line Card Auxiliary Logic
The SC8544PXANG suits networking line cards as auxiliary interface logic between the network processor and physical-layer or framer devices. Specialized interface ICs in BGA packages are commonly placed near high-speed SERDES lanes where fine-pitch QFN parts cannot be routed. NXP's networking portfolio and the BGA's high-density interconnect support switch and router line-card layouts. Validate signal-integrity margins and supply-rail sequencing against the NXP datasheet before taping out the PCB.
Recomendado
Consumer Electronics Mainboard Glue Logic
The SC8544PXANG can be deployed in consumer electronics mainboards - set-top boxes, smart-home hubs, or wearables - where the host SoC needs proprietary voltage translation, watchdog, or protocol conversion. Its BGA package fits the high-density PCB layouts typical of compact consumer devices. NXP's consumer supply chain support and broad second-source ecosystem help mitigate sourcing risk for high-volume production. Confirm I/O timing, ESD, and standby current against the NXP datasheet before committing to mass production.
Recomendado
Test and Measurement Front-End
The SC8544PXANG fits test-and-measurement front-ends where specialized signal routing or proprietary hand-shaking is needed between the measurement ASIC and the host controller. BGA construction supports the dense layouts of modern oscilloscope and data-acquisition front-ends. NXP's precision analog heritage makes the part a credible choice for instrumentation designs. Verify input-voltage tolerance and timing specifications against the NXP datasheet before integration.
Recomendado
IoT Edge Gateway Signal Conditioning
The SC8544PXANG suits IoT edge gateways as specialized glue logic between low-power wireless MCUs and backhaul processors. Its BGA package is well-matched to compact gateway PCBs that combine Wi-Fi, BLE, and Ethernet PHYs. NXP's broad IoT portfolio and reference-design ecosystem simplify software integration. Confirm low-power standby modes and GPIO count against the official NXP datasheet before specifying for battery-backed edge deployments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para SC8544PXANG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MAX1285BCSA | MAX1285BESA | MAX1284BCSA |
|---|---|---|---|---|
| Brand | NXP Semiconductors | Analog Devices | Analog Devices | Analog Devices |
| Package | BGA | SOIC-8 - package mismatch, not true drop-in | SOIC-16 - package mismatch, not true drop-in | SOIC-16 - package mismatch, not true drop-in |
| Category | Interface - Specialized | ADC - Interface | ADC - Interface | ADC - Interface |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Lifecycle Status | Active | Active | Active | Active |
| Manufacturer Cross-Reference Listed | N/A (origin part) | No formal cross-reference to SC8544PXANG | No formal cross-reference to SC8544PXANG | No formal cross-reference to SC8544PXANG |
| Distributor Availability | Rochester Electronics, JLCPCB, AIChipLink | DigiKey, Mouser | DigiKey, Mouser | DigiKey, Mouser |
| Second-Source Risk | Single-source niche part | Multi-source broad-market part | Multi-source broad-market part | Multi-source broad-market part |
Diferenciadores clave
- NXP specialized interface IC pedigree (frente a MAX1285BCSA (Analog Devices))
- BGA high-density packaging (frente a MAX1285BCSA (SOIC-8))
- Application-specific design-in support (frente a MAX1290ACEI (SSOP-28))
Notas de diseño
The SC8544PXANG ships in a BGA package, which requires careful PCB land-pattern and stencil design to avoid solder bridging and voiding. Use NSMD (non-solder-mask-defined) pads with via-in-pad or tented vias, and follow NXP's recommended reflow profile from the official datasheet. Confirm ball count and pitch against the mechanical drawing before generating the footprint in your CAD library.
Distinguishing the SC8544PXANG from the unrelated Silan SC8521 infrared remote-control transmitter (which shares an 'SC85xx' prefix) is critical. The Silan part is a 16-pin infrared transmitter IC, not an interface IC, and confusing the two will result in a non-functional PCB. Always confirm the manufacturer prefix (NXP vs Silan) on the top-side package marking and on the purchase order paperwork.
Place the SC8544PXANG decoupling capacitors as close as possible to its BGA power balls, ideally on the opposite side of the PCB directly beneath the package or in the same layer with short trace lengths. Use a 0.1 uF ceramic for high-frequency noise plus a 10 uF bulk capacitor per rail. Estimated: a typical BGA specialized interface IC needs at least one decoupling cap per power ball within 2 mm of the via.
Información de cumplimiento
Compliance data not exposed in the verified public distributor snippets; confirm against the official NXP material declaration sheet or RoHS certificate before claiming compliance for production assemblies.
