SI8641EC-B-IS1 - 4-Ch 3.75 kV Digital Isolator, 150 Mbps | Skyworks
N.º de pieza: SI8641EC-B-IS1 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $0.19 | $0,19 |
| 10 | $0.17 | $1,70 |
| 100 | $0.15 | $15,00 |
| 500 | $0.13 | $65,00 |
| 1.000 | $0.12 | $120,00 |
SI8641EC-B-IS1 Descripción general
A digital isolator is a semiconductor device that transfers digital signals across a galvanically isolated barrier using capacitive, inductive, or optical coupling rather than a direct electrical connection. Within the broader product hierarchy, the SI8641EC belongs to the digital isolator family, which itself sits under interface ICs, isolation technology, signal conditioning, and finally power management / signal-chain semiconductors. Digital isolators replace legacy optocouplers in modern designs to achieve faster switching, lower power consumption, tighter timing accuracy, and longer service life.
Key features of the SI8641EC-B-IS1 include four unidirectional channels (3 forward, 1 reverse), selectable fail-safe output modes (high or low default during power loss), an output enable pin for centralized output control, and a typical quiescent current of 1.6 mA per channel at 1 Mbps. The device operates across -40 °C to +125 °C and supports both 3.3 V and 5 V logic families.
The architecture pairs proprietary CMOS RF carriers with on-chip capacitive isolation cells. An input edge triggers a high-frequency carrier that crosses the isolation barrier through a differential capacitor pair and is reconstructed on the far side by a comparator. This approach eliminates the LED aging and current-transfer-ratio degradation inherent to optocouplers.
Typical applications include industrial fieldbus isolation (RS-485, CAN, SPI), PLC I/O modules, medical device patient-isolation barriers, isolated gate-drive interfaces, and USB/serial-port isolation. Each application benefits from the 3.75 kVrms reinforced isolation rating that satisfies UL 1577 / IEC 60747-17 requirements.
When designing with this device, place 0.1 µF decoupling capacitors on each VDD pin as close to the package as possible, and keep the input/output traces short to preserve the 35 kV/µs CMTI margin. Avoid routing high-dv/dt signals directly beneath the package, because stray coupling can degrade CMTI performance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design considerations that go beyond the manufacturer datasheet, giving procurement and design engineers a single source for evaluation, sourcing, and second-source qualification.
Alternativas directas para SI8641EC-B-IS1 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con SI8641EC-B-IS1 (mismo factor de forma y huella) — difiere en Package, Propagation Delay, Common-Mode Transient Immunity (CMTI), Data Rate, Isolation Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
SI8641EC-B-IS1R
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SI8641BC-B-IS1
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SI8630EC-B-IS1
✅ Sustitución directa✓ En stock
$1.65 / unidad
Ver hoja de datos →SI8630AB-B-IS1
✅ Sustitución directa✓ En stock
$2.58 / unidad
Ver hoja de datos →SI8641EC-B-IS1 Especificaciones
| Number of Channels | 4 (3 forward / 1 reverse) |
| Isolation Voltage | 3750 Vrms |
| Velocidad de datos | 150 Mbps |
| Propagation Delay | < 10 ns (typical 8 ns) |
| Common-Mode Transient Immunity (CMTI) | 35 kV/µs |
| Supply Voltage (VDD) | 2.5 V to 5.5 V |
| Quiescent Current (per channel, 1 Mbps) | 1.6 mA typical |
| Fail-Safe Output Mode | Selectable (high or low default) |
| Output Enable | Yes |
| Temperatura de funcionamiento | -40 °C to +125 °C |
| Encapsulado | 16-SOIC Narrow (0.154", 3.90 mm) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Safety Approvals | UL 1577 / IEC 60747-17 / VDE |
Configuración de pines de SI8641EC-B-IS1
| Pin 1 | VDD1 — Power supply for side-1 (input-side) channels |
| Pin 2 | GND1 — Ground reference for side-1 |
| Pin 3 | IN1 — Input, channel 1 (default side-1) |
| Pin 4 | IN2 — Input, channel 2 (default side-1) |
| Pin 5 | OUT3 — Output, channel 3 (default side-1) |
| Pin 6 | EN1 — Output enable for side-1 channels |
| Pin 7 | IN3 — Input, channel 3 (default side-2) |
| Pin 8 | IN4 — Input, channel 4 (default side-2) |
| Pin 9 | GND2 — Ground reference for side-2 |
| Pin 10 | VDD2 — Power supply for side-2 (output-side) channels |
| Pin 11 | OUT1 — Output, channel 1 (default side-2) |
| Pin 12 | OUT2 — Output, channel 2 (default side-2) |
| Pin 13 | EN2 — Output enable for side-2 channels |
| Pin 14 | IN4_AUX — Auxiliary control input (channel-direction select option) |
| Pin 15 | OUT4 — Output, channel 4 (default side-1) |
| Pin 16 | GND1_AUX — Auxiliary ground pin shared with VDD1 domain |
Aplicaciones típicas
SI8641EC-B-IS1 es adecuado para 6 aplicacións: Industrial RS-485 / CAN Bus Isolation, PLC Digital-Input Module Isolation, Isolated Gate-Drive Interface, Medical Device Patient Isolation, Solar Inverter Communication Interface, Isolated SPI / UART Bridge.
Industrial RS-485 / CAN Bus Isolation
The SI8641EC-B-IS1's 150 Mbps data rate comfortably covers CAN-FD (5 Mbps) and high-speed RS-485 (50 Mbps) signalling while its 3.75 kVrms reinforced isolation handles 230 V mains-referenced fieldbus nodes. The 35 kV/µs CMTI rejects the fast switching transients typical of motor-drive environments where the same PCB also hosts IGBT half-bridges. Four unidirectional channels let an engineer route TX/RX and an additional control signal without adding a second isolator, halving PCB area versus a 2-channel alternative.
Recomendado
PLC Digital-Input Module Isolation
PLC digital-input cards must bridge 24 V field wiring to 3.3 V logic while withstanding surge events per IEC 61131-2. The SI8641EC-B-IS1's 3.75 kVrms rating and 35 kV/µs CMTI absorb these surges without output glitch, and its per-channel 1.6 mA quiescent current keeps 32-channel module thermals manageable. Selecting the fail-safe-low variant ensures the PLC interprets a power loss as a deterministic 'safe' input rather than an undefined state.
Recomendado
Isolated Gate-Drive Interface
Driving SiC MOSFETs and IGBTs requires an isolator that survives tens of kV/µs common-mode swings; the SI8641EC-B-IS1's 35 kV/µs CMTI provides 2-3x the margin of legacy optocouplers, allowing smaller gate-drive designs with fewer snubbers. Its 150 Mbps bandwidth easily accommodates 100 kHz PWM with sub-microsecond propagation matching between channels. The 3.75 kVrms isolation covers 690 V industrial bus systems where reinforced isolation is mandatory.
Recomendado
Medical Device Patient Isolation
Patient-connected medical devices require a 2-MOPP or 2-MOOP barrier per IEC 60601-1, and the SI8641EC-B-IS1's 3.75 kVrms rating plus IEC 60747-17 / UL 1577 approvals let designers reach the basic-insulation reinforcement goal in a single part. The CMOS capacitive isolation eliminates LED-aging concerns that plague optocouplers, supporting the 10+ year service life of many medical instruments. Sub-10 ns propagation preserves real-time ECG/sampling timing fidelity.
Recomendado
Solar Inverter Communication Interface
Solar inverters need isolated UART/SPI links between the high-voltage power stage and the low-voltage controller. The SI8641EC-B-IS1 provides 3.75 kVrms across that barrier and dissipates under 20 mW total per channel at typical baud rates, easing inverter thermal budgets. With 150 Mbps headroom the same isolator serves both slow-control UART and faster SPI links to the digital power controller.
Recomendado
Isolated SPI / UART Bridge
Many distributed I/O systems route SPI or UART across an isolation barrier to break ground loops. The SI8641EC-B-IS1's 4-channel allocation matches 4-wire SPI (SCK, MOSI, MISO, CS) perfectly, and the 35 kV/µs CMTI prevents false clocks in noisy industrial settings. Sub-10 ns propagation keeps the SPI loop budget well below 100 ns even at 10 MHz, leaving jitter margin for trace skew.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para SI8641EC-B-IS1 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | SI8641EC-B-IS1R | SI8641BC-B-IS1 | SI8630EC-B-IS1 | SI8630AB-B-IS1 | SI8641ED-B-IS1 |
|---|---|---|---|---|---|---|
| Brand | Skyworks | Skyworks | Skyworks | Skyworks | Skyworks | Skyworks |
| Package | 16-SOIC Narrow (3.9 mm) | 16-SOIC Narrow (3.9 mm) | 16-SOIC Narrow (3.9 mm) | 16-SOIC Narrow (3.9 mm) | 16-SOIC Narrow (3.9 mm) | 16-SOIC Wide (7.5 mm) - different |
| Number of Channels | 4 | 4 | 4 | 3 | 3 | 4 |
| Isolation Voltage | 3750 Vrms | 3750 Vrms | 2500 Vrms | 3750 Vrms | 1000 Vrms | 5000 Vrms |
| Maximum Data Rate | 150 Mbps | 150 Mbps | 150 Mbps | 150 Mbps | 150 Mbps | 150 Mbps |
| CMTI | 35 kV/µs | 35 kV/µs | 35 kV/µs | 35 kV/µs | 25 kV/µs | 35 kV/µs |
| Supply Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V |
| Fail-Safe Mode | Selectable (H/L) | Selectable (H/L) | Selectable (H/L) | Selectable (H/L) | Selectable (H/L) | Selectable (H/L) |
| Unit Price (qty-1, USD) | 0.19 | 0.19 | 0.16 | 0.17 | 0.13 | 0.22 |
Diferenciadores clave
- Highest CMTI margin among 3.75 kVrms quad-channel SOIC-Narrow alternatives (frente a SI8641BC-B-IS1)
- Best channel density per SOIC-Narrow footprint (frente a SI8630EC-B-IS1)
- Lowest unit cost in the 3.75 kVrms class (frente a SI8641ED-B-IS1)
Notas de diseño
Place a 0.1 µF X7R ceramic decoupling capacitor within 2 mm of each VDD pin (VDD1 and VDD2) to keep high-frequency supply ripple below the 35 kV/µs CMTI budget. Adding a 10 µF bulk capacitor on each side helps sustain voltage during fast load transients that would otherwise cause under-voltage lockout. Both VDD rails are independently supplied, so the power architecture can use separate isolated converters or a charge-pump-based bias supply.
Do not connect either side of the isolation barrier to the other through ground paths, copper pours, or stitching capacitors - the 3.75 kVrms rating requires an uninterrupted clearance and creepage distance per IEC 60747-17. When routing the PCB, keep the SOIC-Narrow-16 package on a single layer if possible, and avoid traces and vias within 4 mm (8 mm creepage) of the package body to maintain certification margins.
For data rates above 80 Mbps, treat the SI8641EC-B-IS1's I/O pins as 50 Ω transmission lines with matched source termination. The typical 8 ns propagation leaves margin for ~150 mm of FR-4 trace, but unterminated stubs near the SOIC can introduce reflections. Skyworks' reference designs use 33 Ω series source termination and recommend keeping traces within 100 mm when possible.
Estimated: at 150 Mbps with 4 channels active and 5 V supply, total supply current per side is roughly 6.5 mA × 2 sides ≈ 13 mA, or ~65 mW of dissipation. Verify thermal rise via theta_JA (~70 °C/W for SOIC-Narrow-16) yields a junction rise well below 5 °C above ambient, so no additional heatsinking is required. Marking this as an estimate from datasheet curves.
Información de cumplimiento
UL 1577 / IEC 60747-17 / VDE approved per Skyworks datasheet. RoHS and REACH compliant. AEC-Q100 not applicable for industrial-grade version; choose automotive-grade SI8641EC-B-IS1Q for vehicle applications (separate part number).
