SPC560P34L1CEFAR - 32-bit 64MHz Auto MCU 192KB Flash | STMicroelectronics
N.º de pieza: SPC560P34L1CEFAR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.85 | $5,85 |
| 10 | $5.27 | $52,70 |
| 100 | $4.68 | $468,00 |
| 500 | $4.21 | $2.105,00 |
| 1.000 | $3.8 | $3.800,00 |
SPC560P34L1CEFAR Descripción general
An automotive MCU (microcontroller) is a single-chip processor integrating CPU, memory, timers, ADC, and communication peripherals, designed to operate reliably under harsh vehicle conditions such as temperature extremes, voltage transients, and EMC stress. Within the broader semiconductor hierarchy it sits at: microcontroller -> embedded processor -> SoC -> semiconductor. SPC560P34L1CEFAR specifically belongs to ST's SPC56 Power Architecture family, optimized for chassis and body-domain automotive ECUs.
Key features include 192 KB (192K x 8) Flash program memory, 64 MHz CPU frequency, and the e200z0h Power Architecture core delivering deterministic single-cycle execution. The 64-pin LQFP (10x10 mm) package supports surface-mount assembly and provides ample I/O for vehicle network control. Peripherals expected from this family include multiple CAN, LIN, SPI, SCI/UART channels, timers/PWM channels, and ADC channels suitable for chassis domain tasks.
The architecture integrates on-chip voltage regulators, watchdog, and debug (JTAG/Nexus) blocks, reducing BOM cost for chassis modules. Its automotive-grade qualification makes it suitable for safety-relevant applications when used in conjunction with appropriate system-level safety processes; this part is not formally ASIL-rated but is used in chassis-domain designs alongside ASIL-capable SPC56 siblings.
Typical applications include vehicle body controllers, HVAC modules, seat/window/mirror control units, instrument clusters, and lighting ECUs. Its CAN/LIN/PWM/Timer peripheral mix also fits small motor-control auxiliary modules such as HVAC flap drivers and seat-position actuators.
Design tip: When migrating from the SPC560P34L1 family to the SPC560P40L1 family, verify toolchain and errata compatibility since Flash size and peripheral count differ. Always run the ST-provided BSP (SPC5Studio / SPC56x BSP) against the device errata sheet before committing to a layout.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers evaluate supply, pin-compatible replacements, and engineering trade-offs.
Alternativas directas para SPC560P34L1CEFAR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con SPC560P34L1CEFAR (mismo factor de forma y huella) — difiere en Package, Core, Supply Voltage, Automotive Grade, Series.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
SPC560P34L1CEFAY
✅ Sustitución directa✓ En stock
$5.95 / unidad
Ver hoja de datos →SPC560P34L1CEFAX
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC560P34L1CEFBR
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
SPC560P40L1CEFAY
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC5602BAMLL4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC5602BAMLL6R
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
SPC560P34L1CEFAR Valores máximos y características eléctricas
| Core | Power Architecture e200z0h |
| CPU Bit Width | 32-bit |
| Maximum CPU Frequency | 64 MHz |
| Program Flash | 192 KB (192K x 8) |
| Tensión de alimentación | 5 V (automotive range) |
| Encapsulado | 64-LQFP (10x10 mm) |
| Recuento de pines | 64 |
| Tipo de montaje | Surface Mount |
| Communication Interfaces | CAN, LIN, SPI, SCI/UART (per family datasheet) |
| Debug Interface | JTAG / Nexus |
| Estado RoHS | Compliant |
| Automotive Grade | Yes (AEC-Q100 qualified) |
| Series | SPC560P34x (SPC56 Power Architecture) |
| Lead-Free | Yes |
| Packaging | Tape & Reel |
Guía de configuración de pines de SPC560P34L1CEFAR 64-lqfp (10x10 mm)
Configuración de pines para SPC560P34L1CEFAR (encapsulado 64-lqfp (10x10 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para SPC560P34L1CEFAR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
SPC560P34L1CEFAR es adecuado para 7 aplicacións: Vehicle Body Control Module (BCM), HVAC Climate Control Module, Seat and Mirror Control ECU, Instrument Cluster Sub-Processor, Lighting ECU (Interior/Exterior LED), Door Module and Window Lift, Auxiliary Motor Control (HVAC Flaps, Pump).
Vehicle Body Control Module (BCM)
The SPC560P34L1CEFAR's combination of 192 KB Flash, 64 MHz e200z0h CPU, and integrated CAN/LIN peripherals makes it a strong fit for body control modules that coordinate lighting, central locking, wipers, and accessory loads. Its AEC-Q100 qualification and 5 V automotive supply tolerance support the harsh 12 V bus environment with load-dump and cold-crank events. Per ST's SPC560P34L1 product page, the device targets chassis and body domain ECUs, where 64-LQFP integration reduces PCB area. The MCU's multiple PWM outputs can drive LED drivers and small motors directly via external FETs. Compared with a discrete CAN + LIN stack, the integrated peripheral mix cuts BOM cost by eliminating an external transceiver for LIN sub-nodes.
Recomendado
HVAC Climate Control Module
For HVAC climate control, the SPC560P34L1CEFAR delivers 64 MHz of deterministic compute and PWM channels suitable for blower-motor control, mode-door actuators, and temperature-sensor acquisition. The 192 KB Flash stores calibration tables for multi-zone climate algorithms. AEC-Q100 grade supports the under-dash thermal environment. ST's SPC5Studio BSP exposes ADC and PWM drivers that map directly to flap-position feedback and DC-motor command paths. Versus higher-end SPC56 parts, this device keeps BOM cost low while retaining ASIL-friendly software architecture support when paired with system-level safety processes.
Recomendado
Seat and Mirror Control ECU
Seat and mirror control ECUs use the SPC560P34L1CEFAR's PWM outputs and ADC channels to drive small DC motors for position adjustment and memory presets. With 192 KB Flash, position tables for multiple drivers can be stored without external EEPROM. The 64-LQFP package supports compact PCB integration inside the seat module housing. CAN connectivity enables body-domain communication, while LIN allows satellite switch-pack interfacing. The MCU's low power modes help meet quiescent-current budgets for parked-vehicle networks. ST's application notes on SPC56 motor-control PWM simplify software development for H-bridge drivers.
Recomendado
Instrument Cluster Sub-Processor
In instrument cluster architectures the SPC560P34L1CEFAR can serve as a sub-processor that handles telltale indicators, gauges, and body-domain CAN/LIN routing while a graphics MCU manages the display. Its 64 MHz CPU and 192 KB Flash handle CAN diagnostics (UDS), trip computer logic, and turn-signal chime generation. The 64-LQFP package keeps the board footprint compact inside the cluster housing. ST's SPC56 family errata sheets list known silicon issues, which the BSP works around transparently. Compared with 8/16-bit automotive MCUs, the SPC560P34L1CEFAR offers better deterministic interrupt latency for safety telltale timing.
Recomendado
Lighting ECU (Interior/Exterior LED)
The SPC560P34L1CEFAR is suited for lighting ECUs driving interior ambient LEDs, daytime running lights, or rear-combination lamps via LIN-controlled LED drivers. Its 192 KB Flash accommodates dimming curves, color-mixing tables, and CAN-based diagnostics; PWM channels enable direct LED-current control through external constant-current drivers. AEC-Q100 grade ensures reliability under hood and cabin temperature extremes. The 64-LQFP package allows the module to fit behind headlamp housings. Compared with discrete timer-IC solutions, the integrated MCU enables software-configurable turn-signals and animation sequences without firmware-host coordination issues.
Recomendado
Door Module and Window Lift
Door modules and window-lift ECUs use the SPC560P34L1CEFAR for motor control, anti-pinch algorithms, and LIN communication to the BCM. The 64 MHz CPU evaluates current-sense ADC inputs at the PWM rate to detect pinch events; 192 KB Flash stores calibration data. CAN connectivity is optional via an external transceiver. AEC-Q100 grade and 5 V supply tolerance meet automotive EMC requirements. ST's SPC5Studio BSP includes a PWM-ADC synchronization driver that simplifies anti-pinch implementation. The 64-LQFP footprint supports compact PCB designs constrained by the door cavity.
Recomendado
Auxiliary Motor Control (HVAC Flaps, Pump)
For small auxiliary motors such as HVAC recirculation flaps, water pumps, or oil-level sensors, the SPC560P34L1CEFAR provides 64 MHz compute, ADC for current/voltage feedback, and PWM for H-bridge control. The 192 KB Flash stores sensor calibration and adaptive control loops. LIN enables low-cost wiring to the body-domain network. AEC-Q100 grade is required for under-hood auxiliary modules. The device's debug (JTAG/Nexus) interface supports real-time motor-control tuning. Compared with discrete analog motor controllers, this MCU adds software-configurability for varying pump/valve characteristics without hardware rework.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para SPC560P34L1CEFAR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | SPC560P34L1CEFAY | SPC560P34L1CEFAX | SPC560P34L1CEFBR | SPC560P40L1CEFAY | SPC5602BAMLL4 | SPC5602BAMLL6R |
|---|---|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | LQFP-64 family - verify | LQFP-64 family - verify |
| CPU Core | e200z0h (Power Architecture) | e200z0h | e200z0h | e200z0h | e200z0h | e200z0h family | e200z0h family |
| Supply Voltage | 5 V automotive | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Packaging Medium | Tape & Reel | Tray | Large Reel | Tape & Reel (variant) | Tray | Tray | Tape & Reel |
| Automotive Grade | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
Diferenciadores clave
- Same-footprint tape-and-reel packaging for high-volume assembly (frente a SPC560P34L1CEFAY (tray))
- Balanced 192 KB Flash for typical body/chassis firmware (frente a SPC560P40L1CEFAY (256 KB Flash))
- Proven SPC56 platform with mature SPC5Studio toolchain (frente a Cross-brand parametric equivalents)
Notas de diseño
The SPC560P34L1CEFAR integrates an on-chip voltage regulator that derives core 1.2 V from the 5 V automotive supply. Place a 4.7 uF decoupling capacitor on the VDD pin and a 100 nF on each VSS/VDD pair to suppress transients from load-dump events. ST's SPC5Studio BSP documents the recommended decoupling network; following it eliminates most reset-related debug time. Estimated: total MCU supply current at 64 MHz with all peripherals active is in the tens of mA range.
The 64-LQFP package has a theta_JA of approximately 50-60 C/W on a standard 4-layer JEDEC test board. At typical automotive ECU operating temperatures (up to 85 C ambient for cabin, 105 C under-hood), the junction temperature stays well within the 150 C automotive limit. For under-hood modules add a copper pour on the top layer under the exposed pad area to reduce junction temperature by 10-15 C. Estimated: at 50 mA core current and 5 V supply, power dissipation is approximately 0.25 W.
Common pitfalls when designing with the SPC560P34L1CEFAR: (1) Always check the SPC56 errata sheet before committing to a layout - known errata for this family include specific ADC and timer issues that the BSP works around but a bare-metal implementation will not. (2) Configure the watchdog timer during initialization - leaving it disabled is a common mistake on early prototypes. (3) Verify the JTAG pinout matches your debug adapter (10-pin or 14-pin Cortex-style); SPC56 uses Nexus which requires the correct adapter. (4) Use automotive-grade external CAN/LIN transceivers (e.g., TJA1043, TLE7259) - the MCU does not include physical-layer transceivers.
Layout guidelines for the SPC560P34L1CEFAR: keep the oscillator traces short (less than 5 mm) and surround them with a ground guard ring to minimize EMI susceptibility. Route CAN_H/CAN_L as a differential pair with 120 ohm termination at the cable end. Place decoupling capacitors as close as possible to their respective pins. Maintain a continuous ground plane under the MCU to provide thermal dissipation and a low-impedance return path for high-speed signals.
Información de cumplimiento
AEC-Q100 qualified per ST automotive portfolio; RoHS and REACH compliant per DigiKey product listing. Halogen-free status not explicitly stated in the verified web data.
