STM32F446ZCJ6 - 180MHz Cortex-M4 256KB MCU | STMicroelectronics
N.º de pieza: STM32F446ZCJ6 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $15.1985 | $15,20 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
STM32F446ZCJ6 Descripción general
A microcontroller is a programmable semiconductor device that combines a CPU core, memory, peripherals, and communication interfaces on one integrated circuit. STM32 devices belong to the embedded processor hierarchy and use the ARM Cortex-M4 core for real-time control, connected equipment, industrial automation, audio, communications, and data-acquisition applications. The Cortex-M4 architecture supports efficient C-based firmware development and a broad STM32 software ecosystem.
Key verified features include a maximum 180 MHz operating frequency and 256 KB Flash memory. The STM32F446 family also provides DSP and FPU capabilities, while the STM32F446 product family is identified as supporting 225 DMIPS, SDRAM, audio interfaces, and dual Quad SPI. These features make the device suitable for systems requiring high processing throughput, peripheral connectivity, and deterministic embedded control.
The STM32F446ZCJ6 uses a 144-UFBGA package, specified by the distributor data as 10 x 10 mm. Its 3.3 V-oriented device listing and 2.5 V/3.3 V supply information appear in the supplied distributor results, but complete electrical limits, pin functions, memory-map details, peripheral inventory, and temperature ratings require confirmation from the manufacturer datasheet.
Typical application areas include industrial control, communications equipment, audio processing, motor and motion systems, data acquisition, and embedded platforms requiring a high-performance Cortex-M4 MCU. The STM32F446 family is supported by STMicroelectronics development resources and related STM32F4 software and programming documentation listed in the supplied sources.
Designers should verify power-supply sequencing, decoupling, pin multiplexing, PCB escape routing, memory settings, clock configuration, firmware startup, and peripheral pin assignments against the official datasheet before layout release. A 144-UFBGA package also requires careful ball-access planning, via placement, assembly capability, and thermal design.
This page consolidates verified distributor and manufacturer information, application guidance, procurement details, and engineering-oriented cautions. Parameters not explicitly present in the supplied verified data are marked as unavailable rather than inferred, preserving traceability for design review and sourcing.
Alternativas directas para STM32F446ZCJ6 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con STM32F446ZCJ6 (mismo factor de forma y huella) — difiere en Package, Core, ADC, Operating Temperature, Performance.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
STM32F446ZCH6
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →STM32F446ZCH7
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →STM32F429ZGT6
✅ Sustitución directa✓ En stock
$10.95 / unidad
Ver hoja de datos →STM32F407ZGT6TR
✅ Sustitución directa✓ En stock
$5.25 / unidad
Ver hoja de datos →STM32F407ZGT6
✅ Sustitución directa✓ En stock
$5.25 / unidad
Ver hoja de datos →STM32F429VGT6
✅ Sustitución directa✓ En stock
$10.85 / unidad
Ver hoja de datos →STM32F446ZCJ6 Valores máximos y características eléctricas
| Core | ARM Cortex-M4 32-bit RISC |
| Maximum Frequency | 180 MHz |
| Flash Memory | 256 KB |
| Flash Organization | 256K x 8 |
| Encapsulado | 144-UFBGA (10x10 mm) |
| Tensión de alimentación | 2.5 V/3.3 V |
| Device Family | STM32F4 |
| DSP Capability | DSP |
| FPU Capability | FPU |
| Performance | 225 DMIPS |
| External Memory Interfaces | SDRAM |
| Serial Peripheral Interfaces | Dual Quad SPI |
| Audio Interfaces | Audio interfaces |
Guía de configuración de pines de STM32F446ZCJ6 144-ufbga (10x10 mm)
Configuración de pines para STM32F446ZCJ6 (encapsulado 144-ufbga (10x10 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para STM32F446ZCJ6.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
STM32F446ZCJ6 es adecuado para 6 aplicacións: Industrial Control, Communications Equipment, Audio Processing, Data Acquisition, Motor and Motion Control, Embedded Graphical and HMI Systems.
Industrial Control
The STM32F446ZCJ6 fits industrial controller designs requiring a high-performance ARM Cortex-M4 core at up to 180 MHz, 256 KB of Flash, and deterministic real-time control. Its verified DSP and FPU support can assist digital signal processing, while SDRAM and dual Quad SPI expand the options for external memory and serial peripherals. The device can sit between sensors, actuators, communications hardware, and a human-machine interface. Before finalizing a controller design, verify the exact peripheral inventory, analog performance, operating-temperature range, safety requirements, and 144-UFBGA layout against the manufacturer documentation.
Recomendado
Communications Equipment
The STM32F446ZCJ6 is suitable for communications equipment where a 180 MHz Cortex-M4 core, 256 KB Flash, SDRAM support, and dual Quad SPI can balance protocol processing with external data movement. These features are useful in gateways, protocol bridges, serial concentrators, and embedded network equipment where deterministic firmware execution is valuable. The verified data does not enumerate every UART, USB, Ethernet, or CAN resource, so the designer must confirm the exact pin mux and peripheral requirements. A production design should also validate clocking, transceiver interfaces, impedance-controlled routing, grounding, and firmware drivers for the selected communications standards.
Recomendado
Audio Processing
The STM32F446ZCJ6 can serve as the control and signal-processing core in embedded audio products because the verified STM32F446 family information identifies audio interfaces, DSP, an FPU, and operation up to 180 MHz. These attributes support digital audio control, filtering, mixing, interface management, and real-time peripheral coordination in a compact embedded design. The supplied evidence does not specify codec formats, sample-rate limits, audio-interface pin assignments, or DAC and ADC performance, so those details must be taken from the exact datasheet. Layout should isolate sensitive analog sections, provide clean power and clocking, and keep high-speed digital and audio routing controlled.
Recomendado
Data Acquisition
The STM32F446ZCJ6 can be used in data-acquisition equipment that needs fast control-loop execution, DSP, FPU support, and external-memory expansion through the verified SDRAM capability. A practical system can coordinate sensors, amplifiers, ADC or sensor interfaces, buffers, and a communications link from one microcontroller. The supplied data does not identify the exact ADC count, resolution, sampling rate, input impedance, or timer resources, so those parameters cannot be assumed. Engineering validation should include analog front-end settling time, anti-alias filtering, calibration, grounding, reference-noise control, and timing-budget analysis before production release.
Recomendado
Motor and Motion Control
The STM32F446ZCJ6 is a plausible fit for motor-control and motion-control subsystems that benefit from the Cortex-M4 core operating up to 180 MHz, DSP capability, and an FPU. These resources support control-loop computation, PWM coordination, encoder processing, and supervisory logic in embedded motor systems. The supplied data does not confirm advanced timer counts, encoder-interface resources, operating-temperature limits, or analog protection features, so a motor-drive design requires a full peripheral and electrical review. Keep high-current switching paths isolated from sensitive control signals, verify grounding and return-current paths, and validate thermal performance under the worst-case switching and environmental conditions.
Recomendado
Embedded Graphical and HMI Systems
The STM32F446ZCJ6 can support embedded human-machine interfaces where the 180 MHz core, 256 KB Flash, SDRAM capability, and dual Quad SPI provide useful processing and expansion options. A practical product may use external display memory, serial displays, touch controls, and communication transceivers while keeping supervisory logic in the STM32F446 family. The verified data does not provide LCD or camera interface details, so the exact display engine and pin assignments must be checked before design commitment. Layout and firmware planning should address high-speed display-bus integrity, memory timing, power sequencing, touch noise, and boot-time behavior.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para STM32F446ZCJ6 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | STM32F446ZCH6 | STM32F446ZCH7 | STM32F429ZGT6 | STM32F407ZGT6TR |
|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
Diferenciadores clave
- Exact verified identity (frente a STM32F446ZCH6)
- Verified family performance position (frente a STM32F407ZGT6TR)
- Verified memory and expansion features (frente a STM32F429ZGT6)
- Source traceability (frente a STM32F446ZCH7)
Notas de diseño
Treat the 144-UFBGA as a fine-pitch assembly constraint rather than a conventional leaded package. Use the manufacturer land pattern, ball map, and assembly process requirements during footprint creation and stack-up planning. Confirm escape-routing density, via-in-pad policy, solder-mask and paste design, and whether the selected assembly house supports the package before committing to a PCB release. The verified data confirms a 10 x 10 mm 144-UFBGA package, but it does not provide the complete ball table.
Plan the power rails from the verified 2.5 V/3.3 V supply information, but do not infer the exact core and I/O voltage limits from that abbreviated distributor description. Use the official datasheet to separate analog, digital, and external-memory supplies as required, then place local bypass capacitors at each relevant supply ball according to the manufacturer recommendation. Validate startup sequencing, decoupling-loop geometry, ground-return continuity, and worst-case current before schematic freeze.
Route high-speed clocks, memory interfaces, and serial links with short, controlled-impedance paths, while keeping switching supplies and high-current return paths away from sensitive analog and communication nodes. The verified family information confirms SDRAM, audio interfaces, and dual Quad SPI capability, but exact timing, edge-rate, and topology requirements are not supplied. Therefore, derive all trace-width, length, via, shielding, and grounding rules from the final peripheral configuration and the official electrical characteristics.
Do not treat a family label or package ball count as proof of drop-in compatibility. The supplied search results include conflicting descriptions of the package, and the alternative search did not expose verified pin mapping or electrical equivalence. Before substituting any STM32F4 candidate, compare every ball, supply rail, ground, decoupling requirement, clock input, reset/boot signal, peripheral mux, and firmware device identifier. A PCB respin or firmware rework may be required if any item differs.
Thermal design must be based on the final clock, I/O activity, supply voltage, ambient temperature, and board construction. The verified data identifies a 180 MHz maximum frequency and a 144-UFBGA package but supplies no junction-temperature limit, thermal resistance, or power dissipation table. Before release, obtain the official thermal data and estimate worst-case dissipation from actual load conditions; provide the required exposed thermal construction, copper, vias, airflow, or heat-spreading features specified by the manufacturer.
Información de cumplimiento
The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for STM32F446ZCJ6. Obtain the current manufacturer product and environmental compliance documentation before making a compliance claim.
