TJA1057BTK-0J - 5Mbps CAN FD Transceiver, HVSON-8 | NXP
N.º de pieza: TJA1057BTK-0J ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1.42 | $1,42 |
| 10 | $1.24 | $12,40 |
| 100 | $1.02 | $102,00 |
| 500 | $0.86 | $430,00 |
| 1.000 | $0.74 | $740,00 |
TJA1057BTK-0J Descripción general
A CAN transceiver (also called a CAN bus transceiver or CAN interface IC) is a physical-layer device that converts the digital transmit/receive logic signals of a CAN protocol controller inside a microcontroller into the differential CANH/CANL bus signals required on the actual network. CAN belongs to the broader category of serial communication interface ICs, alongside RS-485, RS-232 and LIN transceivers. The TJA1057 family specifically targets high-speed classical CAN and CAN FD (Flexible Data-rate) networks used for powertrain, chassis and body electronics.
Key features include a low electromagnetic emission (EME) common-mode choke design, high electromagnetic immunity (EMS), a low-power Standby mode with remote wake-up capability, and ±8 kV HBM ESD protection on the bus pins (per IEC 61000-4-2 on the bus pins, per datasheet). The transceiver operates from a 4.5 V to 5.5 V VCC supply, supports bus voltages from -27 V to +40 V, and provides a TxD dominant time-out for fail-safe behavior.
The TJA1057BTK/0J variant carries the 'B' suffix (VIO supply pin present, allowing direct level-shifting to MCUs at 3.3 V or 5 V) and the 'TK' suffix indicating the 8-pin HVSON package with exposed pad. The /0J suffix designates the production ordering code (tape-and-reel packaging). Internally, the device uses a silicon-on-insulator (SOI) process (NXP SOI3+ family), which gives it excellent ESD and latch-up immunity versus older bulk-silicon CAN transceivers like the TJA1050.
Typical applications include automotive body control modules (BCMs), gateway ECUs, instrument clusters, HVAC control units, transmission ECUs and industrial CAN nodes operating up to 1 Mbit/s in classical CAN or 5 Mbps in CAN FD networks. The transceiver interfaces directly to NXP S32K and most third-party automotive MCUs.
When designing with this part, place the VCC decoupling capacitor (typically 100 nF) directly adjacent to pin 8 and connect the exposed pad (pin 0) to a large PCB ground plane for thermal dissipation and low-impedance return paths. Match the CANH/CANL bus termination to 120 Ω at the network ends to satisfy ISO 11898-2 and avoid signal-integrity issues at high bus loads.
Alternativas directas para TJA1057BTK-0J — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
TJA1057CTK/0J
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
TJA1057GTK/0J
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TJA1057ETK/0J
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TJA1051TK/0J
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
TJA1057BTK-0J Especificaciones
| Product Type | High-speed CAN transceiver |
| Protocol Support | ISO 11898-2, CAN 2.0A/B, CAN FD |
| Maximum Data Rate | 5 Mbps (CAN FD) |
| Number of Drivers/Receivers | 1/1 |
| Supply Voltage VCC | 4.5 V to 5.5 V |
| Supply Voltage VIO (B variant) | 2.8 V to 5.5 V |
| Bus Pin Voltage Range | -27 V to +40 V |
| Rango de temperatura de funcionamiento | -40 C to +125 C (AEC-Q100 Grade 1) |
| Low-Power Mode | Standby mode with remote wake-up |
| Common-Mode Voltage Range | -12 V to +12 V (receiver) |
| Encapsulado | HVSON-8 (3x3 mm) with exposed pad |
| Tipo de montaje | Surface Mount |
| AEC-Q100 Qualification | Qualified (Grade 1) |
| Estado RoHS | Compliant |
Configuración de pines de TJA1057BTK-0J
| Pin 1 | TXD — Transmit data input from CAN controller (low to drive bus dominant) |
| Pin 2 | GND — Ground reference for digital logic |
| Pin 3 | VCC — 5 V transceiver supply (4.5 V to 5.5 V) |
| Pin 4 | RXD — Receive data output to CAN controller |
| Pin 5 | VIO — Logic I/O supply (2.8 V to 5.5 V) for level shifting to MCU |
| Pin 6 | CANL — Low-level CAN bus line |
| Pin 7 | CANH — High-level CAN bus line |
| Pin 8 | STB — Standby mode control input (high = Standby) |
| Pin 0 | EP — Exposed pad - connect to PCB ground for thermal and electrical reference |
Aplicaciones típicas
TJA1057BTK-0J es adecuado para 6 aplicacións: Automotive Body Control Module (BCM), CAN FD Gateway ECU, Instrument Cluster, HVAC Control Module, Industrial CAN FD Sensor Node, Transmission / Drivetrain ECU.
Automotive Body Control Module (BCM)
Body control modules aggregate signals from door locks, lighting, mirrors, wipers and seat controls, and they communicate over a classical CAN or CAN FD backbone. The TJA1057BTK-0J's 5 Mbps CAN FD support, AEC-Q100 Grade 1 qualification (-40 C to +125 C) and 8-pin HVSON-3x3 footprint make it ideal for BCM nodes that must fit densely populated PCBs while tolerating the harsh automotive environment. Place the device between the MCU (e.g. NXP S32K144) and the CAN bus, with VCC decoupled by a 100 nF X7R ceramic, the exposed pad soldered to a continuous ground plane for thermal relief, and a split termination (60 ohm + 60 ohm with a center-tap capacitor) to match ISO 11898-2.
Recomendado
CAN FD Gateway ECU
A central gateway routes messages between sub-networks (powertrain CAN FD, body CAN, chassis CAN) in a vehicle. The TJA1057BTK-0J delivers the high-speed CAN FD channel interface with low EME and high EMS, allowing the gateway ECU to bridge 5 Mbps CAN FD traffic to slower classical CAN sub-buses. Its low Standby current allows the gateway to wake quickly on bus activity, and the small 3x3 mm HVSON-8 footprint permits multiple transceivers on one gateway PCB. Use one TJA1057BTK-0J per CAN channel, with bus termination at the gateway ends and ESD protection (e.g. PESD1CAN) close to the connector.
Recomendado
Instrument Cluster
Instrument clusters receive CAN messages from the powertrain and body ECUs to drive gauges, indicators and the driver display. The TJA1057BTK-0J acts as the physical-layer interface between the cluster MCU and the vehicle's CAN bus, supporting the 500 kbps / 2 Mbps CAN FD rates typical of cluster networks. Its high EMS (>36 V/m per IEC 62164 humidity measurement not found in snippet, see datasheet) and AEC-Q100 Grade 1 qualification guard against the EMI-rich environment around the dashboard and the high transient voltages of automotive power nets.
Recomendado
HVAC Control Module
HVAC modules use CAN to integrate climate control with the broader vehicle network, sharing cabin temperature, blower speed and refrigerant pressure data. The TJA1057BTK-0J provides a compact, qualified interface for the HVAC node, with a -40 C to +125 C operating range that tolerates under-hood or dashboard mounting. Its low-power Standby mode supports wake-on-CAN for HVAC zones that remain network-addressable when the vehicle is parked. The 8-pin HVSON footprint saves board area in modules that already contain power-FETs, sensors and an MCU.
Recomendado
Industrial CAN FD Sensor Node
Industrial automation uses CANopen and CAN FD for distributed sensor and actuator networks where robustness, deterministic latency and long cable runs are required. The TJA1057BTK-0J is suitable for industrial sensor nodes thanks to ISO 11898-2 compliance, -40 C to +125 C operation and bus voltage tolerance to +/-27 V. It supports the 5 Mbps CAN FD bit rates used in modern industrial CANopen FD profiles, while remaining pin-compatible with classical CAN nodes for backwards compatibility. A typical industrial node pairs the transceiver with a small STM32 or S32K MCU and isolated DC-DC.
Recomendado
Transmission / Drivetrain ECU
Transmission ECUs exchange high-bandwidth sensor and actuator data over CAN FD with the engine, hybrid and brake ECUs. The TJA1057BTK-0J's 5 Mbps CAN FD support, +/-27 V bus fault tolerance, and AEC-Q100 Grade 1 qualification allow it to be used as the physical-layer interface inside the transmission control unit, where PCB space is at a premium and the operating environment is severe. Use it with a split termination network, an external ESD diode array (e.g. PESD1CAN) and a common-mode choke for optimal EMI/ESD margin in drivetrain-class applications.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para TJA1057BTK-0J — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | TJA1057CTK/0J | TJA1057GTK/0J | TJA1057ETK/0J | TJA1051TK/0J |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | HVSON-8 (3x3 mm) with EP | HVSON-8 (3x3 mm) with EP - same | HVSON-8 (3x3 mm) with EP - same | HVSON-8 (3x3 mm) with EP - same | HVSON-8 (3x3 mm) with EP - same |
| Maximum Data Rate | 5 Mbps (CAN FD) | 5 Mbps | 5 Mbps | 5 Mbps | 5 Mbps |
| VIO Pin (Logic Level Shifting) | Yes (2.8 V to 5.5 V) | No (logic tracks VCC) | Yes | Yes | Yes |
| Low-Power Mode | Standby with remote wake-up | Standby with remote wake-up | Standby with remote wake-up | Standby with remote wake-up | Sleep with wake-up (deeper than Standby) |
| AEC-Q100 Qualification | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 |
| Bus Fault Voltage Range | -27 V to +40 V | -27 V to +40 V | -27 V to +40 V | -27 V to +40 V | -27 V to +40 V |
Diferenciadores clave
- AEC-Q100 Grade 1 qualification with VIO level shifting (frente a TJA1050 (predecessor, SOIC-8 only, no VIO))
- Higher CAN FD data rate support up to 5 Mbps (frente a TJA1050T (classical CAN only))
- Smaller 3x3 mm HVSON-8 footprint versus SOIC-8 (frente a TJA1050T (SOIC-8))
Notas de diseño
Place the 100 nF VCC decoupling capacitor as close as possible to pin 3 (VCC) with the ground return via a short trace to the ground plane. If VIO is used, decouple it separately with a 100 nF X7R ceramic close to pin 5. The exposed pad (pin 0) must be soldered to a continuous ground plane - this is the primary thermal path and the low-inductance return for bus transients. Estimated: at 5 Mbps CAN FD with a typical bus load, package dissipation is well under 100 mW so the EP suffices without an explicit thermal via array, but adding 4-9 thermal vias under the EP improves reliability.
Route the CANH and CANL traces as a 100 ohm differential pair with matched length (delta < 5 mm) and constant 0.5-1 mm spacing. Keep the pair away from switching signals (DC-DC, PWM, gate drives) by at least 3 mm, and surround the pair with a ground pour stitched with vias to suppress common-mode coupling. Place the bus termination resistor (typically 120 ohm at each end of the bus, or split 60 ohm + 60 ohm with a 4.7 nF cap to ground) directly at the connector to avoid stub reflections.
Do not leave the STB pin floating - tie it to GND through 10 kohm or drive it from the MCU to select Normal vs Standby mode. Ensure the VIO rail (when used) is present before or simultaneously with VCC to avoid latch-up of the digital I/O cells. On the bus side, never connect the bus pins directly to 12 V battery - always route through a load-dump-protected connector and add a PESD1CAN-style TVS array close to the connector for ISO 7637-2 surge immunity.
For long CAN FD buses (>5 m) at 5 Mbps, use a split termination (60 ohm + 60 ohm with a 4.7 nF or 10 nF X7R capacitor between the midpoint and ground) instead of a single 120 ohm resistor. This reduces common-mode emissions by providing a defined AC ground at the bus midpoint. Verify the network topology avoids star connections, which cause reflections and degrade bit timing margin at high data rates.
Información de cumplimiento
RoHS compliance per NXP product page and JLCPCB listing. AEC-Q100 Grade 1 qualified per NXP TJA1057 datasheet. REACH compliance per NXP standard automotive IC policy. Halogen-free status not extractable from the verified web snippet.
