TLE7258DXUMA1 - 20kbps LIN Transceiver | Infineon
N.º de pieza: TLE7258DXUMA1 ✗ Fin de vidaTLE7258DXUMA1 Descripción general
A LIN transceiver is an interface IC that connects a host microcontroller or slave node to the single-wire Local Interconnect Network used in automotive and low-speed serial networks. LIN sits within the broader hierarchy of transceiver, communication interface IC, and semiconductor categories. Its single-wire physical layer reduces wiring compared with a multiwire bus while supporting predictable frame-based communication between automotive electronic control units.
The TLE7258DXUMA1 provides a 1/1 transmitter-to-receiver arrangement, a 20 kbps maximum LIN data rate, and 120 mV receiver hysteresis. The 120 mV hysteresis helps distinguish valid logic levels when the bus is noisy. Integrated wake-up functionality supports low-power vehicle networks, while integrated protection features increase robustness against the electrical conditions encountered in automotive wiring harnesses.
The device is designed around a 5.5 V to 18 V operating-supply range. This range allows the transceiver to operate from a conventional automotive low-voltage supply while providing margin relative to the nominal 12 V vehicle rail. The integrated architecture places the LIN physical-layer driver and receiver in a compact exposed-pad package, allowing the PCB to provide both electrical connection and a thermal path during operation.
Typical uses include LIN slave nodes, body-control modules, door and seat controllers, climate-control interfaces, ambient-light sensors, and other automotive accessory networks. The part is appropriate when a controller needs a standards-based LIN physical-layer interface and the network operates at 20 kbps or below. A host microcontroller still handles frame construction, checksums, scheduling, diagnostics, and higher-level application logic.
For PCB design, place the transceiver close to the LIN connection and route the bus away from switching nodes and high-current paths. The exposed pad should be connected to the ground-plane structure specified by the manufacturer and thermal design should be checked across the full -40°C to 150°C operating range. Input and output component selection must follow the manufacturer application circuit rather than generic interface assumptions.
This product record combines verified distributor information, manufacturer-series compatibility data, lifecycle evidence, pricing references, and practical design guidance. It also distinguishes verified electrical facts from parameters that still require confirmation from the exact ordering code and manufacturer datasheet, helping engineers shorten obsolete-part assessment without implying unverified drop-in equivalence.
Alternativas directas para TLE7258DXUMA1 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con TLE7258DXUMA1 (mismo factor de forma y huella) — difiere en Mounting Type, Package, Product Type, Protection Features.
TLE7259-3LE
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Ver hoja de datos →TLE7258DXUMA1 Especificaciones
| Product Type | LIN bus transceiver |
| LIN Bus Data Rate | Up to 20 kbps |
| Number of Drivers | 1 driver |
| Number of Receivers | 1 receiver |
| Tensión de alimentación de funcionamiento | 5.5 V to 18 V |
| Receiver Hysteresis | 120 mV |
| Rango de temperatura de funcionamiento | -40°C to +150°C |
| Encapsulado | PG-TSON-8-1, 8-TDFN with exposed pad |
| Tipo de montaje | SMD surface mount |
| Delivery Packaging | Reel |
| Protocol Compliance | ISO 17987-4 |
| Automotive Qualification | AEC-Q100 |
| Wake-Up Feature | Integrated wake-up |
| Protection Features | Integrated protection |
| Primary Network | Local Interconnect Network (LIN) |
| Reference Price | $1.85000 as of 2026-10-28 |
Guía de configuración de pines de TLE7258DXUMA1 pg-tson-8-1, 8-tdfn with exposed pad
Configuración de pines para TLE7258DXUMA1 (encapsulado pg-tson-8-1, 8-tdfn with exposed pad). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para TLE7258DXUMA1.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
TLE7258DXUMA1 es adecuado para 6 aplicacións: Automotive LIN Slave Node, Body Control Module Interface, Door and Seat Control Network, Automotive Climate-Control Interface, Automotive Ambient Sensor Interface, Obsolete LIN Platform Maintenance.
Automotive LIN Slave Node
The TLE7258DXUMA1 fits a LIN slave-node design because it provides a 1/1 LIN driver-receiver arrangement, supports operation up to 20 kbps, and operates from 5.5 V to 18 V. It connects the vehicle's single-wire LIN network to a host microcontroller while leaving frame formatting and checksum handling in firmware. The verified 120 mV receiver hysteresis improves decision margin in an electrically noisy harness, and the exposed-pad package supports compact body-module layouts. Engineers must implement the LIN bus, supply, and wake-up paths according to the Infineon reference circuit.
Recomendado
Body Control Module Interface
A body-control module can use the TLE7258DXUMA1 as the physical interface for low-bandwidth LIN accessories that share a vehicle network. Its 20 kbps maximum data rate matches the intended LIN network class, while the 5.5 V to 18 V supply range provides operating margin around a nominal 12 V automotive rail. The integrated wake-up and protection functions support practical harness-connected modules, although the application still needs correct bus termination and transient-energy handling. The -40°C to +150°C range suits the documented automotive operating environment.
Recomendado
Door and Seat Control Network
The TLE7258DXUMA1 is applicable to a LIN-connected door or seat controller when the required command rate does not exceed 20 kbps. Its single driver and single receiver implement the LIN physical layer without requiring the host processor to handle analog bus thresholds directly. The receiver's 120 mV hysteresis provides a defined transition region for signals arriving through a long vehicle harness. Integrated wake-up functionality can reduce system-level standby demand, while the compact PG-TSON-8-1 exposed-pad package supports compact electronics packages.
Recomendado
Automotive Climate-Control Interface
A climate-control peripheral or controller interface can employ the TLE7258DXUMA1 for LIN communication carrying configuration commands, sensor values, and status information at rates up to 20 kbps. This bandwidth is appropriate for supervisory control rather than bulk multimedia traffic. The device's 5.5 V to 18 V supply operation accommodates automotive power-system variation, while its integrated protection functions help the interface withstand harness conditions. For a new platform, engineers should select a current part after reviewing the full datasheet because the TLE7258DXUMA1 is identified as obsolete.
Recomendado
Automotive Ambient Sensor Interface
The TLE7258DXUMA1 can serve as the LIN physical layer for an ambient-light, seat-presence, or similar low-bandwidth automotive sensor node. LIN is well suited to modest sensor-reporting rates, and the transceiver's 20 kbps ceiling is more than adequate for periodic measurements and configuration commands. The integrated wake-up feature supports networks where nodes must remain mostly asleep, while the 120 mV receiver hysteresis improves robustness in the vehicle electrical environment. The sensor node must still observe LIN timing, wake-up patterns, bus capacitance, and grounding requirements.
Recomendado
Obsolete LIN Platform Maintenance
The TLE7258DXUMA1 is relevant to maintenance programs that must preserve an already validated LIN board rather than redesign the entire controller. Its verified 1/1 transceiver configuration, 20 kbps rate, 5.5 V to 18 V supply, and PG-TSON-8-1 footprint allow an existing schematic and PCB to remain unchanged. A service buyer should assess remaining inventory age and traceability and compare the exact pin data with the manufacturer-stated pin-compatible TLE7259-3LE. For long-lived production, obsolete status makes a planned cross-reference migration more reliable than indefinite stockpiling.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para TLE7258DXUMA1 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | TLE7259-3LE |
|---|---|---|
| Package | PG-TSON-8-1, 8-TDFN with exposed pad | PG-TSON-8-1 - manufacturer-stated pin-to-pin compatible |
| Brand | Infineon Technologies | Infineon Technologies |
| Product Type | LIN bus transceiver | LIN bus transceiver |
Diferenciadores clave
- Direct manufacturer-backed family migration path (frente a TLE7259-3LE)
- Automotive-grade interface capability (frente a TLE7259-3LE)
- Defined low-bandwidth LIN performance (frente a TLE7259-3LE)
Notas de diseño
Use the exact Infineon PG-TSON-8-1 footprint and verify pad dimensions against the current package drawing before release. Connect the exposed pad to the recommended ground-plane structure and preserve the manufacturer's component placement and thermal-via guidance. Route the LIN connection directly toward the connector and keep switching-power paths and high-current edges away from the bus trace to reduce coupled noise.
Design the 5.5 V to 18 V supply path for automotive transients and ensure the transceiver's local decoupling follows the Infineon reference circuit. Validate startup, sleep, and wake-up behavior across the complete supply range. Because this part is obsolete, preserve the original schematic and layout for field maintenance, but qualify any migration candidate against input capacitance, wake-up timing, and bus protection rather than assuming generic LIN compatibility.
Treat the exposed pad as both an electrical connection and a thermal path. Use the manufacturer's recommended copper and via arrangement, then verify junction temperature across ambient conditions up to +150°C and worst-case vehicle operating conditions. Do not estimate reliability from package exposure alone; use the device's verified dissipation and thermal data together with the final PCB copper geometry. Keep the connector and enclosure from restricting heat transfer.
Do not substitute a generic transceiver based only on protocol or data rate. Pin compatibility includes named not-connected pins, and the manufacturer explicitly limits its compatibility statement to the covered series devices. Confirm that unused not-connected pins can remain open, verify package dimensions, and check LIN sleep/wake-up behavior. The obsolete lifecycle status also requires a supply-chain review so a last-time buy or channel-inventory assumption is not mistaken for ongoing production.
Información de cumplimiento
Arrow identifies TLE7258DXUMA1 as automotive AEC-Q100 qualified, and the Infineon series information states ISO 17987-4 compliance. No verified RoHS, REACH, lead-free, halogen-free, or conflict-minerals declaration was supplied for this exact ordering code.
