XC2VP7-6FF672 - Virtex-II Pro FPGA, 11K Cells, 396 I/O | AMD Xilinx
N.º de pieza: XC2VP7-6FF672 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3.950,00 |
| 100 | $365 | $36.500,00 |
| 500 | $340 | $170.000,00 |
| 1.000 | $315 | $315.000,00 |
XC2VP7-6FF672 Descripción general
Virtex-II Pro FPGAs belong to the Platform FPGA family, which integrates hard IP such as multi-gigabit transceivers and embedded processor cores directly onto the programmable fabric. By combining hardware-accelerated serial I/O (RocketIO at up to 3.125 Gbps) with an embedded PowerPC 405 core, these devices enable designers to replace discrete ASSPs and reduce system BOM cost while accelerating time-to-market for networking, telecom, and embedded computing applications.
Key features include 1,1088 logic cells, 792 Kbit of distributed SelectRAM, dedicated 18x18 multipliers for DSP blocks, 8 RocketIO serial transceivers, 1 hard PowerPC 405 processor core running up to 400 MHz, 396 maximum user I/O, and 27mm x 27mm FF672 package with 1.0mm ball pitch. The device supports common logic families via 1.5V core supply, 2.5V/3.3V-tolerant I/O, and is available in commercial (C) and industrial (I) temperature grades.
The Virtex-II Pro architecture combines a configurable logic fabric (CLBs, slices, LUTs), block RAM, multipliers, DCM clock managers, and hard IP cores. The dual-process 0.13um/90nm CMOS process enables integration of the PowerPC 405 hard core and RocketIO transceivers, providing deterministic performance that soft processor cores on the fabric cannot match.
Typical applications include 10 Gigabit Ethernet line cards, software-defined radio base stations, high-speed serial backplanes, telecom multiplexer/demultiplexer equipment, and embedded computing platforms. The integrated PowerPC 405 makes the part particularly attractive for systems requiring firmware-driven control with hardware-accelerated DSP and serial I/O.
When designing with the XC2VP7-6FF672, use the Xilinx ISE Design Suite for synthesis, place-and-route, and bitstream generation. Multi-gigabit serial links require careful PCB layout with controlled-impedance differential traces; consult Xilinx application note XAPP681 for RocketIO board design guidelines.
This page synthesizes AMD Xilinx distributor pricing, same-family drop-in alternatives (XC2VP7-5FF672I and XC2VP7-7FF672I in the same FF672 BGA), and practical design notes not found in the manufacturer datasheet.
Alternativas directas para XC2VP7-6FF672 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
XC2VP7-5FF672I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC2VP7-5FF672C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC2VP7-7FF672I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC2VP7-6FF672C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC2VP7-6FF672 Valores máximos y características eléctricas
| Family | Virtex-II Pro |
| Logic Cells | 11,088 |
| System Gates | approximately 8.1M (per Xilinx datasheet DS083) |
| Maximum User I/O | 396 |
| Number of RocketIO Transceivers | 8 |
| Embedded Processor Cores | 1 x PowerPC 405 |
| Maximum DCM Modules | 4 |
| Block RAM (Kb) | 792 |
| 18x18 Hardware Multipliers | 44 |
| Process Technology | 0.13um/90nm dual-process CMOS |
| Core Supply Voltage | 1.5V (1.425V to 1.575V) |
| Encapsulado | 672-ball FCBGA (FF672), 27mm x 27mm, 1.0mm pitch |
| Tipo de montaje | Surface Mount |
| Rango de temperatura de funcionamiento | 0C to +85C (commercial) / -40C to +100C (industrial) |
| Lead Free Status | Contains Lead (per digchip) |
| Estado RoHS | Non-Compliant (per digchip datasheet snippet) |
| Speed Grade | -6 |
Guía de configuración de pines de XC2VP7-6FF672 672-ball fcbga (ff672), 27mm x 27mm, 1.0mm pitch
Configuración de pines para XC2VP7-6FF672 (encapsulado 672-ball fcbga (ff672), 27mm x 27mm, 1.0mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC2VP7-6FF672.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC2VP7-6FF672 es adecuado para 6 aplicacións: 10 Gigabit Ethernet Line Card, Software-Defined Radio Base Station, Embedded Computing / Industrial Control Platform, High-Speed Serial Backplane Switch, Aerospace and Defense Signal Processing, Medical Imaging Backend.
10 Gigabit Ethernet Line Card
The XC2VP7-6FF672 is suited for 10 Gigabit Ethernet (10GbE) line cards in core routers and Layer-2/3 switches. The part integrates 8 RocketIO transceivers operating up to 3.125 Gbps, allowing designers to implement 4-lane XAUI aggregation (4 x 3.125 Gbps) or a single XGMII-equivalent 8b/10b lane group directly on the chip. The 11,088 logic cells plus 44 hard 18x18 multipliers provide ample fabric for MAC, FIFO, and 10G SERDES PCS-state-machine functions. Designers typically pair the FPGA with an external 10GBASE-R PHY and use the Xilinx 10G Ethernet MAC core for layer-2 termination. Unlike an ASSP framers, this approach allows protocol customization for proprietary or multi-standard line cards.
Recomendado
Software-Defined Radio Base Station
The XC2VP7-6FF672 is widely deployed in 3G/4G base-station digital front ends and software-defined radio (SDR) cards. The 44 hardware 18x18 multipliers allow efficient implementation of DDC/DUC, FIR filters, and FFT/iFFT for OFDM and CDMA waveforms. The RocketIO transceivers carry digitized IF samples between the ADC/DAC card and the FPGA over high-speed serial links such as CPRI or OBSAI, eliminating parallel LVDS bus congestion. Combined with the embedded PowerPC 405, designers run PHY/MAC-layer firmware on-chip, reducing board space and BOMP versus discrete DSP+FPGA designs. System features such as carrier aggregation and digital predistortion require the FPGA's deterministic real-time response and the PowerPC for slow-path control.
Recomendado
Embedded Computing / Industrial Control Platform
The XC2VP7-6FF672's embedded PowerPC 405 core makes it a strong choice for industrial control platforms requiring both deterministic firmware control and FPGA fabric I/O handling. The PowerPC 405 runs Linux or VxWorks via the Xilinx Platform Reference Design, providing Ethernet, USB, and file-system support, while the FPGA fabric implements high-speed data acquisition, motor-control PWMs, or machine-vision pre-processing. Industrial temperature grade (-I suffix) versions operate from -40C to +100C, supporting outdoor and factory-floor deployments. The RocketIO transceivers enable backplane interconnect with other modules in distributed control systems, replacing parallel bus architectures with serial fabrics.
Recomendado
High-Speed Serial Backplane Switch
For telecom backplane switches and ATCA/AdvancedTCA carrier blades, the XC2VP7-6FF672 provides 8 RocketIO links that form the fabric-side interconnect, with the FPGA acting as a protocol bridge between shelf-management and the data plane. The fabric serves as the serializer/deserializer and link-training engine for each multi-gigabit lane, while the PowerPC 405 runs shelf-management firmware (ShMC, IPMI). The Virtex-II Pro's deterministic latency and protocol flexibility enable designers to implement proprietary backplane protocols alongside standards such as Serial RapidIO and PCIe. This avoids the fixed-function ASSPs and lets carriers quickly add custom diagnostic and protection switching features.
Recomendado
Aerospace and Defense Signal Processing
The XC2VP7-6FF672 is used in aerospace and defense systems such as radar data acquisition, electronic warfare, and MIL-STD-1553 bridges. The Virtex-II Pro family's radiation-tolerant variants and BGA package survive the shock/vibration profile of avionics and naval platforms, while the RocketIO transceivers enable high-throughput interfaces to RF digitizers. Industrial-grade (I-suffix) parts support extended-temperature operation. Designers must verify specific MIL-PRF or DO-254 qualifications with the manufacturer before each aerospace/defense deployment, as not all part-number/package combinations are on Qualified Parts Lists.
Recomendado
Medical Imaging Backend
Although less common than telecom, the XC2VP7-6FF672 serves niche medical imaging backends such as ultrasound beamforming, optical coherence tomography (OCT) data acquisition, and positron-emission tomography pre-processing. The 8 RocketIO lanes aggregate high-bandwidth image streams from front-end digitizers, the 11,088 logic cells implement image pre-processing (downsampling, beam steering, intensity normalization), and the PowerPC 405 operates as an image-display controller running embedded Linux. The Virtex-II Pro's deterministic fabric latency matches the real-time requirements of medical imaging pipelines, where drift or back-pressure artifacts degrade clinical quality. Compliance with IEC 60601/ISO 13485 must be verified at the system level rather than relying on FPGA specs alone.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC2VP7-6FF672 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC2VP7-5FF672I | XC2VP7-7FF672I | XC2VP7-6FF672C |
|---|---|---|---|---|
| Brand | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx |
| Package | 672-ball FCBGA (FF672), 27x27mm | 672-ball FCBGA (FF672) - same | 672-ball FCBGA (FF672) - same | 672-ball FCBGA (FF672) - same |
| Speed Grade | -6 (mid-tier) | -5 (standard, slower) | -7 (fastest, ~15% faster) | -6 (matching) |
| Temperature Grade | Industrial (-40C to +100C) per -I default; commercial grade available | Industrial (-I) | Industrial (-I) | Commercial (0C to +85C) |
| Logic Cells | 11,088 | 11,088 (identical) | 11,088 (identical) | 11,088 (identical) |
| RocketIO Transceivers | 8 (up to 3.125 Gbps) | 8 (identical) | 8 (identical) | 8 (identical) |
| PowerPC 405 Cores | 1 | 1 (identical) | 1 (identical) | 1 (identical) |
| User I/O | 396 | 396 (identical) | 396 (identical) | 396 (identical) |
| RoHS Status | Non-Compliant (per digchip snippet) | Non-Compliant (same era) | Non-Compliant (same era) | Non-Compliant (same era) |
Diferenciadores clave
- Mid-speed grade with full feature set (frente a XC2VP7-5FF672I vs XC2VP7-7FF672I)
- Same FF672 footprint across family variants (frente a XC2VP20-6FF672 and XC2VP30-6FF672)
- Embedded PowerPC 405 core eliminates external CPU (frente a Soft-core processors on Spartan-6 FPGAs)
Notas de diseño
The Virtex-II Pro requires sequenced power: VCCINT (1.5V core) must ramp before VCCAUX and VCCO, with monotonic rise times below 50ms per Xilinx DS083 power-on requirements. Use a multi-rail controller such as a TI TPS65051 or discrete supervisor with track-and-sequence capability. Decoupling: place 4.7uF bulk at the FPGA plus 0.1uF + 0.01uF MLCC bypass at every VCC and GND ball pair to suppress simultaneous switching noise from the RocketIO transceivers. A 27x27 mm FF672 part may dissipate 5 to 10W under typical designs; allocate thermal copper and check worst-case Tj for industrial temperature grade.
FF672 is a 27x27 mm flip-chip BGA with 1.0 mm ball pitch. Use at least 4 PCB layers with continuous GND and PWR planes under the BGA. Escape routing: 0.5 mm-diameter microvia HDI stack-up is recommended; for standard 1.0 mm-pitch BGA, a 4-2-4 or 6-layer stack with via-in-pad can route 0.8 mm-diameter fan-out. Maintain 50 ohm single-ended and 100 ohm differential impedance for RocketIO MGT lanes; reference the Xilinx application note on RocketIO board design (XAPP681-equivalent). Recommended stack-up: 0.25 mm dielectric between top layers and GND; total board thickness 1.6 mm with controlled-impedance cores.
RocketIO MGT lanes must be routed as differential pairs with 100-ohm nominal impedance, length-matched within 10 mils to within-pair and within 100 mils across the bonding clock pair. Avoid right-angle bends; use 2x bend radius microvias or gentle curves. Place AC-coupling capacitors within 50 mm of the MGT pins; Xilinx DS083 specifies 0.1 uF AC-coupling for refclk and data lanes. Place reference clock within 100 mm; route refclk with isolated ground (zone below) to avoid shared return currents with switching power or other high-speed data.
Do not use Vivado - it does not support Virtex-II Pro. Use Xilinx ISE 14.7 (the last Classic release) with a valid license; legacy toolchains require Windows or Linux ISE installations with specific license generators. Importing the FF672 pinout: ensure your UCF/XDC pin constraints match the FF672 ball map (not the FF668, FF676, or FG456 layout); misassigning constraints causes configuration failure. The Virtex-II Pro requires PlatformFlash or System ACE for bitstream storage - external SPI flash on the M2/M3 pins is not natively supported. For PowerPC 405 firmware, reserve a CPU-clocked region and use the IBM Virtex-II Pro APU/FPU MMM for floating-point operations.
Estimated: at full utilization (8 RocketIO lanes active, PowerPC 405 core at 400 MHz running loops, fabric filled at 80%), power dissipation for XC2VP7 in industrial-grade FF672 reaches 6 to 9 W. Estimating theta_JA for a 27x27 mm FCBGA on a 4-layer JEDEC test board at approximately 8 to 12 C/W, junction temperature rises 50 to 110 C above 25 C ambient, leaving the part at 75 to 135 C Tj under industrial conditions. For -I grade (100 C max Tj), derate to 50 C ambient or add forced-air cooling; for sealed enclosures, place the FPBGA on 5x5 cm of copper pour with thermal vias to the internal ground plane.
Información de cumplimiento
RoHS Non-Compliant and Contains Lead per digchip snippet for legacy manufacturing. AEC-Q100 is not applicable - FPGAs are not automotive qualified. REACH, halogen-free, and conflict-mineral status not explicitly documented; verify with AMD Xilinx authorized distributor before design-in.
