XC3S4000-5FG900C - 4M Gate Spartan-3 FPGA | AMD Xilinx
N.º de pieza: XC3S4000-5FG900C ✓ ActivoXC3S4000-5FG900C Descripción general
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after fabrication. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, embedded memory resources, and clock-management circuitry. This implementation density allows one device to replace many interconnected discrete logic devices while preserving the flexibility to update a design through its configuration interface.
The principal benefits of the XC3S4000-5FG900C are its 4 million-system-gate capacity, 62,208 logic cells, 633 I/O, and 725 MHz stated device performance. Its 1.2 V core supply suits modern low-voltage digital systems, while the 900-pin FBGA exposes a large number of user I/O for high-speed parallel interfaces, memory interfaces, control logic, and multi-channel data acquisition.
Technically, the device uses 90 nm CMOS fabrication and belongs to the Spartan-3 FPGA family. The speed-grade designation identifies the device performance class, while the final C suffix identifies the commercial-grade ordering option. A large-ball-grid-array package supports dense PCB routing but requires careful escape routing, power-plane design, thermal management, and assembly-process control because direct inspection of hidden board connections is difficult after soldering.
Typical applications include industrial control systems, communications infrastructure, instrumentation, video processing, embedded test equipment, and high-density digital interfaces. The large I/O count is especially useful when a design must connect multiple converters, memory devices, transceivers, clocks, and external control logic while maintaining predictable timing across the FPGA fabric.
A key design consideration is that the 900-pin package demands careful PCB stack-up and power planning. Follow the manufacturer's pinout, differential-pair rules, decoupling recommendations, and exposed thermal strategy exactly; incorrect ball assignment or return-path discontinuities can prevent reliable configuration even when the logic design itself is correct.
This product record combines the exact ordering code, core architecture, resource information, package details, temperature grade, and published device figures with procurement-focused comparisons. It also identifies same-footprint Spartan-3 options for speed-grade or temperature-grade changes while clearly distinguishing engineering fit from a guaranteed drop-in substitution.
Alternativas directas para XC3S4000-5FG900C — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XC3S4000-5FG900C (mismo factor de forma y huella) — difiere en Device Type, Mounting Type, Speed Grade.
XC3S4000-4FG900C
✅ Sustitución directaConsulte el precio
Ver hoja de datos →XC3S4000-4FG900I
✅ Sustitución directaConsulte el precio
Ver hoja de datos →XC3S4000-5FGG900C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC3S4000-4FGG900C
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC3S5000-4FGG900C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC3S4000-5FG900C Valores máximos y características eléctricas
| Device Type | FPGA |
| FPGA Family | Spartan-3 |
| System Gates | 4,000,000 gates |
| Logic Cells | 62,208 cells |
| Maximum Device Performance | 725 MHz |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| User I/O | 633 I/O |
| Encapsulado | 900-pin FBGA |
| Package Pin Count | 900 pins |
| Speed Grade | 5 |
| Temperature Grade | Commercial |
| Temperatura de funcionamiento | 0 °C to 85 °C |
| Tipo de montaje | Surface Mount |
| Lead-Free Status | Lead free |
Guía de configuración de pines de XC3S4000-5FG900C 900 pins
Configuración de pines para XC3S4000-5FG900C (encapsulado 900 pins). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC3S4000-5FG900C.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC3S4000-5FG900C es adecuado para 6 aplicacións: Industrial Control and Automation, Communications and Protocol Conversion, High-Speed Data Acquisition, Video and Image Processing, Embedded Test and Instrumentation, Network and Storage Interfaces.
Industrial Control and Automation
The XC3S4000-5FG900C fits industrial controllers that need to combine sequencing, machine-state logic, communications, and multiple peripheral interfaces on one device. Its 62,208 logic cells provide substantial capacity for parallel control paths, while 633 user I/O simplifies connection to sensors, motor-control stages, relays, human-interface circuitry, and isolated communication interfaces. The 1.2 V core supports modern low-voltage digital design practices. For equipment intended for controlled indoor environments, the listed 0 °C to 85 °C commercial range is appropriate. The 900-pin FBGA also requires a multilayer PCB, careful power-plane segmentation, and assembly capability capable of handling its fine-pitch ball grid.
Recomendado
Communications and Protocol Conversion
The XC3S4000-5FG900C can implement multiple protocol bridges, packet-processing paths, and parallel-to-serial interface engines within a single Spartan-3 FPGA. With 4 million system gates and 633 user I/O, the device can host substantial logic while connecting directly to transceivers, memories, clocks, and parallel buses. The 725 MHz listed device performance is relevant to clocked datapaths, although the implemented top-level clock must satisfy the selected speed-grade timing tables. A communications design should use the manufacturer's recommended differential I/O standards and controlled-impedance layout rules, particularly when high-speed serial or parallel links share the large FBGA footprint.
Recomendado
High-Speed Data Acquisition
The XC3S4000-5FG900C is suitable for parallel data-acquisition systems that must capture, buffer, filter, and route multiple high-speed channels. Its 633 I/O provide ample physical channels for converter data buses, clock distribution, capture control, and downstream processing, while the 62,208 logic cells support acquisition-state machines and real-time digital filtering. The 1.2 V core leaves board-level rails for external analog and interface circuitry, which must be planned separately. Practical implementations should constrain input timing, keep high-speed nets short, provide continuous reference planes, and validate the completed design with appropriate signal-integrity and timing analysis.
Recomendado
Video and Image Processing
The XC3S4000-5FG900C offers enough programmable logic for video timing generation, pixel routing, color processing, and interface bridging in embedded display systems. Its 4-million-system-gate capacity can accommodate multiple parallel video streams, while 633 user I/O supports pixel buses, synchronization signals, memory interfaces, and control channels. The 900-pin package provides the necessary connection density without relying on an external programmable-logic device for every interface function. Video designs should pay particular attention to clock-domain boundaries, pixel-clock jitter tolerance, output timing constraints, and board-level impedance control because those factors can dominate performance more than raw logic-cell count.
Recomendado
Embedded Test and Instrumentation
The XC3S4000-5FG900C can consolidate sequencing, pattern generation, measurement control, and instrument-bus logic in a compact FPGA platform. The large I/O count is valuable for connecting test fixtures, relay drivers, level converters, clocks, and status lines, while 62,208 logic cells support parallel test-vector engines and real-time control paths. Its 1.2 V core allows the device to share a modern mixed-signal board with external interface circuitry, provided each rail has its own filtering and regulation plan. For production instrumentation, use grounded power planes, local decoupling, and thermal analysis to prevent high I/O activity from producing rail disturbance or clock jitter.
Recomendado
Network and Storage Interfaces
The XC3S4000-5FG900C can implement storage controllers, protocol adapters, data movers, and network interface front ends where a high pin count and substantial logic depth are advantageous. With 633 user I/O, the FPGA can connect parallel memories, external transceivers, status buses, and multiple clock domains while its programmable fabric performs buffering and protocol conversion. The 900-pin FBGA supports dense routing but makes via transitions and ball-escape geometry important design variables. Separate clock domains should be constrained explicitly, memory interfaces should follow the applicable Spartan-3 timing and loading guidance, and unused balls should follow the manufacturer's prescribed connection requirements.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC3S4000-5FG900C — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC3S4000-4FG900C | XC3S4000-4FG900I | XC3S4000-5FGG900C | XC3S4000-4FGG900C | XC3S5000-4FGG900C |
|---|---|---|---|---|---|---|
| Brand | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx |
| Package | 900-pin FBGA | 900-pin FBGA | 900-pin FBGA | 900-pin FBGA | 900-pin FBGA | 900-pin FBGA |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| System Gates | 4,000,000 gates | 4,000,000 gates | 4,000,000 gates | 4,000,000 gates | 4,000,000 gates | 5,000,000 gates |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Speed Grade | 5 | 4 | 4 | 5 | 4 | 4 |
| Temperature Grade | Commercial, 0 °C to 85 °C | Commercial | Industrial | Commercial | Commercial | Commercial |
Diferenciadores clave
- Higher speed grade within the 4M Spartan-3 resource class (frente a XC3S4000-4FG900C)
- Commercial-temperature target versus industrial alternative (frente a XC3S4000-4FG900I)
- Matched speed grade and resource density (frente a XC3S4000-5FGG900C)
- Lower logic density than the larger same-package-class option (frente a XC3S5000-4FGG900C)
Notas de diseño
Treat the 900-pin FBGA as a multilayer-board design rather than a conventional perimeter package. Assign every ball from the manufacturer's package drawing, preserve the recommended stack-up and via-in-pad or escape strategy, and maintain continuous reference planes beneath the device where supported. Dense Xilinx device pinout is too large to reconstruct reliably from general memory, so PCB artwork and netlists must be checked directly against the exact package PDF before release.
Implement the 1.2 V core rail as a dedicated, low-impedance supply with local high-frequency decoupling and adequate bulk capacitance near the device. Follow the manufacturer's power-supply connection and sequencing table for every rail, especially configuration pins. Because the 1.2 V figure identifies only the core supply, do not infer the I/O voltage banks from this value; assign those from the complete electrical specification.
The 900-pin package can present a substantial heat-flow challenge even though its exposed-ball arrangement differs from a conventional exposed-pad package. Model the actual PCB stack-up, copper density, airflow, neighboring heat sources, and actual clocking activity. Validate the thermal solution with board-level measurements when possible, and avoid assuming that the nominal ambient-temperature range alone guarantees safe junction temperature under sustained logic utilization.
Constrain all external interfaces against the correct I/O-standard timing and loading conditions for the selected Spartan-3 speed grade. Route high-speed clocks and differential pairs with continuous reference planes and controlled impedance, and avoid unnecessary layer changes or stubs. Where multiple output standards share a bank, confirm voltage compatibility and static or dynamic limits before assigning pins.
Información de cumplimiento
The device listing identifies the part as lead free. RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals status require confirmation from the current manufacturer declaration or lot documentation.
