XC3S50A-4VQ100C - 50K Spartan-3A FPGA | AMD | 100-TQFP
N.º de pieza: XC3S50A-4VQ100C ✗ Fin de vidaXC3S50A-4VQ100C Descripción general
A field-programmable gate array is a semiconductor device whose digital logic, memory, and I/O behavior are defined by a programmable configuration bitstream. An FPGA belongs to the programmable-logic hierarchy, alongside CPLDs, and provides reconfigurable parallel logic for cost-sensitive, I/O-intensive electronic products. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed during development or, where configuration technology permits, after deployment.
The Spartan-3A family targets high-volume designs requiring moderate logic density. This device includes 176 configurable logic blocks, 68 user I/Os, and 55,296 bits of block RAM. Supported configuration approaches include Master Serial mode using platform flash PROM, Master SPI mode using commodity serial flash, BPI mode using commodity parallel flash, Slave Parallel mode using SelectMAP or a processor, and Slave Serial mode. These interfaces allow the configuration source and board-level design to be selected according to cost, density, and update requirements.
The XC3S50A-4VQ100C is identified as a -4 speed-grade device with 667 MHz performance, a 1.2 V core, and a commercial operating-temperature range of 0°C to 85°C junction temperature. Its 100-terminal surface-mount package provides 68 user I/O positions according to the verified distributor data. Configuration data is retained externally in a PROM or flash device, so the FPGA's implemented logic is not fixed at manufacture.
Typical uses include industrial control interfaces, communication adapters, instrumentation, test equipment, embedded control, and general-purpose programmable logic. Its 68 I/Os make it appropriate for parallel data acquisition, control, bridging, and interface-conversion designs where a small pin count, legacy 90 nm economics, and reconfigurability are more important than the density offered by newer FPGA families.
The primary design consideration is that configuration storage, programming, clocking, decoupling, and I/O voltage compatibility must be planned before schematic capture. Designers should use the AMD Spartan-3A family data sheet for the exact package pinout and device-specific constraints, and should verify the selected configuration PROM against the supported bitstream and interface requirements.
This page consolidates the verified AMD and distributor specifications, exact package and resource information, commercially sourced alternatives, and practical replacement-selection guidance. It is intended to help engineers identify whether the XC3S50A-4VQ100C remains appropriate for an existing Spartan-3A design without overlooking temperature-grade or speed-grade differences.
Alternativas directas para XC3S50A-4VQ100C — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XC3S50A-4VQ100C (mismo factor de forma y huella) — difiere en Configuration Modes, Core Supply Voltage, Device Type.
XC3S50A-4VQG100C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC3S50A-4VQ100I
✅ Sustitución directaConsulte el precio
Ver hoja de datos →XC3S50A-4VQG100I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC3S50A-5VQG100C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC3S50A-4VQ100C Valores máximos y características eléctricas
| Device Type | Spartan-3A field-programmable gate array (FPGA) |
| Logic Cells | 1,584 cells |
| Logic Gates | 50,000 gates |
| Configurable Logic Blocks | 176 CLBs |
| Block RAM | 55,296 bits |
| User I/O | 68 I/Os |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Nominal Core Voltage | 1.2 V |
| Performance Grade | -4, 667 MHz |
| FPGA Technology | 90 nm |
| Temperatura de funcionamiento | 0°C to 85°C junction temperature |
| Encapsulado | 100-pin TQFP |
| Tipo de montaje | Surface mount |
| Number of Terminals | 100 terminals |
| Configuration Modes | Master Serial, Master SPI, BPI, Slave Parallel SelectMAP, processor, and Slave Serial |
| Package Code | TFQFP |
| Estado RoHS | unknown |
| REACH Status | unknown |
Guía de configuración de pines de XC3S50A-4VQ100C tfqfp
Configuración de pines para XC3S50A-4VQ100C (encapsulado tfqfp). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC3S50A-4VQ100C.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC3S50A-4VQ100C es adecuado para 6 aplicacións: Industrial Control Interfaces, Data Acquisition and Instrumentation, Communication Adapters and Protocol Conversion, Test and Measurement Equipment, Embedded Control and Bus Arbitration, Cost-Sensitive I/O-Intensive Products.
Industrial Control Interfaces
The XC3S50A-4VQ100C fits legacy industrial control boards that require reconfigurable logic and a relatively high I/O count in a compact 100-pin TQFP. Its 1,584 logic cells, 176 CLBs, and 68 user I/Os can coordinate discrete sensors, actuators, interlocks, status indicators, and communication logic without a fixed-function ASIC. The -4 grade is listed at 667 MHz, while the 0°C to 85°C junction-temperature range suits controlled indoor equipment. A designer should preserve the original configuration architecture and validate timing after any substitution. The principal engineering trade-off is that the 90 nm Spartan-3A device offers far less logic density and RAM than current FPGAs, so the design should remain constrained to the legacy system rather than be expanded without re-architecture.
Recomendado
Data Acquisition and Instrumentation
The Spartan-3A XC3S50A-4VQ100C is appropriate for parallel data-acquisition and instrumentation front ends where multiple sensor channels must be sampled, filtered, or converted into a downstream data stream. Its 68 user I/Os provide connections for multiplexers, ADC interfaces, clocks, triggers, and status signals, while 1,584 logic cells and 55,296 RAM bits support control and buffering functions. The listed -4 performance grade provides a 667 MHz device rating for legacy timing constraints. Designers should account for input thresholds, clock jitter, grounding, and analog-signal isolation outside the FPGA. The main limitation is that this is not a high-speed ADC data-processing platform, so acquisition rates and channel timing must remain compatible with the Spartan-3A I/O architecture and the available 55,296 RAM bits.
Recomendado
Communication Adapters and Protocol Conversion
XC3S50A-4VQ100C is well matched to communication adapters that bridge older parallel interfaces to serial or mixed-signal equipment. The 68 I/Os can support parallel buses, chip selects, interrupts, and handshaking, while 176 CLBs and 55,296 RAM bits are sufficient for moderate-width buffering, framing, and state-machine logic. Its externally programmed Spartan-3A architecture permits field updates when the selected configuration flash supports them. For networking equipment, the FPGA can work alongside a physical-layer device such as the LAN8720A-CP, while an I2C expander such as PCA9515AD can simplify port expansion. Engineering validation should include signal timing, bus loading, and configuration update procedures. The principal trade-off is that newer FPGAs offer greater throughput and resources, but this mature device can minimize redesign in equipment already built around Spartan-3A boards and bitstreams.
Recomendado
Test and Measurement Equipment
The XC3S50A-4VQ100C supports legacy test-and-measurement equipment that requires programmable sequencing, pattern generation, or fixture control in a 100-pin surface-mount package. Its 1,584 logic cells can implement control state machines and timing logic, and its 68 I/Os can connect to test points, trigger signals, counters, and status indicators. The device's listed 667 MHz -4 performance grade and reconfigurable architecture make it useful for preserving mature instrument behavior while avoiding a complete board redesign. The configuration bitstream should be stored in an approved external PROM or flash device, and all timing paths must be checked against the selected speed grade. Compared with modern high-performance FPGAs, the Spartan-3A offers less parallelism and memory, but it can be a lower-risk continuity choice where the PCB, configuration infrastructure, and test fixtures were designed around the original family.
Recomendado
Embedded Control and Bus Arbitration
The Spartan-3A XC3S50A-4VQ100C can implement deterministic bus arbitration, custom peripheral interfaces, and real-time control functions beside a host microcontroller in legacy embedded systems. Its 68 user I/Os are useful for address decoding, interrupt distribution, DMA-style handshakes, and programmable peripheral timing, while its reprogrammability allows logic revisions without changing the PCB. The commercial C temperature grade covers 0°C to 85°C junction temperature, making it appropriate for typical indoor industrial products when the enclosure temperature and dissipation budget are controlled. If the system also includes USB-to-serial conversion, the SP232ECT-L can provide a legacy RS-232 path, and the PCA9536DR can extend GPIO control. Design verification should include setup-and-hold margins, clock-domain crossings, and reset sequencing. The main trade-off is limited RAM and logic density compared with newer devices, making the part most suitable for bounded control tasks rather than expanding into a general-purpose accelerator.
Recomendado
Cost-Sensitive I/O-Intensive Products
The XC3S50A-4VQ100C is suitable for high-volume, cost-sensitive products where an ASIC development cycle would be uneconomic but modest programmable logic and numerous external connections are required. Its 1,584 logic cells, 176 CLBs, and 68 I/Os allow a small CPLD-like system to implement product-specific sequencing, interface adaptation, and diagnostic logic. The 100-pin TQFP package is supported by surface-mount assembly, while the 90 nm Spartan-3A process reflects the architecture's original cost positioning. Designers should compare this device with current low-cost FPGA families when starting a new product because newer devices may provide better resource efficiency. For an existing design, however, retaining Spartan-3A can avoid PCB changes and reuse verified configuration data. The key trade-off is reduced scalability: 55,296 RAM bits and 1,584 logic cells limit complex control-plane or video workloads, so feature expansion should be evaluated before committing the design.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC3S50A-4VQ100C — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC3S50A-4VQG100C | XC3S50A-4VQ100I | XC3S50A-4VQG100I | XC3S50A-5VQG100C |
|---|---|---|---|---|---|
| Package | 100-pin TQFP | 100-pin TQFP | 100-pin TQFP | 100-pin TQFP | 100-pin TQFP |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 1,584 cells | 1,584 cells | 1,584 cells | 1,584 cells | 1,584 cells |
| User I/O | 68 I/Os | 68 I/Os | 68 I/Os | 68 I/Os | 68 I/Os |
| Performance Grade | -4, 667 MHz | -4, 667 MHz | -4, 667 MHz | -4, 667 MHz | -5, 770 MHz |
| FPGA Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
Diferenciadores clave
- Closest verified family configuration (frente a XC3S50A-4VQG100C)
- Broader verified industrial temperature option (frente a XC3S50A-4VQG100I)
- Higher available performance grade without changing stated resources (frente a XC3S50A-5VQG100C)
Notas de diseño
Route the configuration interface, power rails, clock inputs, and user I/O according to the exact package-specific guidance in the AMD Spartan-3A family data sheet. The verified excerpts establish a 100-pin TQFP package but do not provide the complete pin table, so do not infer power, ground, or configuration terminals from the package count. Place the FPGA close to its external configuration PROM, use a short and quiet clock path, and provide local high-frequency decoupling on every applicable supply rail. Validate the final layout for signal integrity, return paths, and simultaneous switching noise.
Use the verified 1.14 V to 1.26 V core operating range and the listed 1.2 V nominal core voltage as the starting point for the supply design. The supplied data does not specify decoupling values, I/O supply limits, or power dissipation, so obtain those values from the manufacturer data sheet rather than copying values from another Spartan-3A package. Consider the configuration PROM, I/O devices, clock source, and termination networks when sizing the power system. Because this mature FPGA may be purchased from residual inventory, include voltage and timing verification in incoming inspection.
Do not treat every XC3S50A-4 package suffix as automatically interchangeable. Confirm the ordering table, package drawing, temperature grade, speed grade, and configuration requirements for the exact replacement MPN. In particular, a -5 speed grade has a listed 770 MHz rating rather than the target's 667 MHz, while an I-grade part changes the operating-temperature range. Validate the replacement against existing timing constraints and environmental requirements. The verified excerpts do not establish a cross-brand drop-in solution, so avoid conversions to a different family or pin count without a formal PCB redesign.
Preserve a stable configuration path between the external configuration memory and the FPGA because the Spartan-3A stores its logic configuration externally. Keep the configuration routing away from high-current switching nodes and noisy analog inputs, and use the manufacturer's recommended termination or series-resistor arrangements where specified. For clocked interfaces, route the clock before data signals and provide a low-impedance return path. If the board includes both the target and candidate suffix, compare their package drawings and pin tables mechanically as well as electrically before releasing a fabrication package.
Información de cumplimiento
The supplied verified excerpts do not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. No compliance claim has been inferred. The device is an FPGA rather than an automotive-qualified AEC-Q100 component in the verified data.
