XC5VLX50-3FF324C - 46,080-Cell Virtex-5 LX FPGA | AMD
N.º de pieza: XC5VLX50-3FF324C ✓ ActivoXC5VLX50-3FF324C Descripción general
A field-programmable gate array is a programmable logic device whose configurable logic blocks, routing network, and block resources are configured after manufacture. Virtex-5 LX devices belong to the broader FPGA hierarchy, combining programmable digital logic with hard resources for memory, DSP-oriented arithmetic, clocking, and high-speed serial connectivity. This makes the XC5VLX50 suitable for systems requiring parallel processing, flexible interfaces, or hardware adaptation without changing the PCB.
The XC5VLX50 architecture provides 46,080 logic cells organized into 3,600 CLBs. Its 220 I/O sites support integration with external memory, data converters, network transceivers, and industrial peripherals. A 65 nm CMOS process supports a compact, low-power implementation, while the large logic capacity supports parallel datapaths, protocol bridging, image processing, and control logic. The -3 grade is intended for designs requiring a higher performance grade than -1 or -2 versions of the same device family.
The 324-BBGA package uses a 19 mm by 19 mm array and a 1.00 mm ball pitch according to family-level product information for the XC5VLX50. A 324-terminal surface-mount package provides enough connection density for power, configuration pins, clocks, and high-speed I/O. PCB layout must nevertheless account for power-grid topology, decoupling, ball assignment, and the thermal behavior of a large BGA package.
Typical applications include industrial control systems, communications infrastructure, test and measurement equipment, high-speed data acquisition, embedded signal processing, and networking equipment. The combination of a large logic-cell count, flexible I/O, dedicated FPGA resources, and 65 nm implementation allows a single device to consolidate multiple fixed-function logic blocks. Configuration storage and programming requirements must also be considered when planning a production design.
A critical design consideration is power delivery. The 1 V core rail requires a low-noise, tightly regulated supply and effective high-frequency decoupling near the device. Because a 324-BBGA has substantial thermal and electrical complexity, engineers should follow the AMD package pinout files, evaluate worst-case utilization and speed requirements, and complete signal-integrity and thermal simulations before releasing the PCB.
This product record combines the exact device identity, package details, family-level electrical characteristics, and verified drop-in alternatives with practical selection guidance. It helps distinguish a true 324-pin pin-compatible replacement from lower-cost alternatives that require a different footprint, a different speed grade, or a different I/O budget.
Alternativas directas para XC5VLX50-3FF324C — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XC5VLX50-3FF324C (mismo factor de forma y huella) — difiere en Package.
XC5VLX50-3FFG324C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC5VLX50-2FF324C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC5VLX50-1FF324C
✅ Sustitución directaConsulte el precio
Ver hoja de datos →XC5VLX50-2FFG324C
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC5VLX50-1FFG324C
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC5VLX50-3FF324C Valores máximos y características eléctricas
| Device Type | Virtex-5 LX field-programmable gate array (FPGA) |
| Logic Cells | 46,080 cells |
| Configurable Logic Blocks | 3,600 CLBs |
| I/O Sites | 220 I/O |
| Process Technology | 65 nm CMOS |
| Nominal Core Supply Voltage | 1 V |
| Performance Grade | -3 |
| Encapsulado | 324-BBGA FCBGA, 19 mm x 19 mm |
| Terminal Count | 324 terminals |
| Terminal Pitch | 1.00 mm |
| Tipo de montaje | Surface mount |
| Package Shape | Square |
| Terminal Form | BGA ball |
| Technology Category | 65 nm CMOS programmable logic |
| Device Family | Virtex-5 LX |
Guía de configuración de pines de XC5VLX50-3FF324C square
Configuración de pines para XC5VLX50-3FF324C (encapsulado square). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC5VLX50-3FF324C.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC5VLX50-3FF324C es adecuado para 6 aplicacións: Industrial Control and Automation, Communications and Network Interface, Test and Measurement Equipment, High-Speed Data Acquisition, Embedded Signal Processing, Aerospace and Defense Control Systems.
Industrial Control and Automation
The XC5VLX50-3FF324C fits industrial controllers that combine deterministic sequencing, communication protocols, and real-time I/O. Its 46,080 logic cells and 3,600 CLBs allow control algorithms, state machines, and peripheral bridges to coexist in one programmable device, while 220 I/O sites provide connections to sensors, actuators, encoders, and communications transceivers. The -3 performance grade supports timing-sensitive logic when the design requires additional margin over lower speed grades. A production implementation should reserve I/O according to the AMD package pinout and validate the core and I/O power rails at worst-case utilization.
Recomendado
Communications and Network Interface
The XC5VLX50-3FF324C is appropriate for communications equipment that needs flexible parallel datapaths, packet handling, and board-level interface adaptation. The 3,600 CLBs can support protocol state machines, buffering, framing logic, and test instrumentation, while the 220 I/O sites can connect transceivers, memories, and parallel network devices. The -3 performance grade is useful where clock frequency or logic depth requires more timing margin. Designers should implement the AMD-recommended configuration scheme and use the package-specific ball assignments to maintain signal integrity on high-speed links.
Recomendado
Test and Measurement Equipment
The XC5VLX50-3FF324C can serve as the programmable control and data-processing core in modular test and measurement systems. Its 46,080 logic cells support acquisition sequencing, trigger logic, calibration tables, data compression, and instrument-control functions, and its 220 I/O sites provide broad connectivity to converters, memory, and interface circuits. The -3 grade is advantageous for pipelines that need higher clock rates or improved timing closure. A practical design should separate analog and digital grounding appropriately, provide deterministic clocking, and reserve configuration resources for reliable field updates.
Recomendado
High-Speed Data Acquisition
The XC5VLX50-3FF324C fits parallel data-acquisition architectures requiring programmable logic, timing control, and substantial I/O connectivity. Its 3,600 CLBs can implement acquisition pipelines, channel control, digital filtering, and buffer management, while 220 I/O sites can interface with ADCs, parallel memory, and capture devices. The -3 performance grade provides additional timing margin for demanding pipeline designs compared with -1 and -2 versions. Engineers should evaluate input timing, clock jitter, PCB channel skew, and power integrity together because no FPGA speed grade alone guarantees a functioning acquisition channel.
Recomendado
Embedded Signal Processing
The XC5VLX50-3FF324C is suitable for embedded signal-processing systems that benefit from parallel programmable datapaths and deterministic I/O. The 46,080 logic cells can host filters, correlation functions, fixed-point arithmetic pipelines, and control logic, while dedicated device resources can complement general programmable logic where supported by the selected design. Its 220 I/O sites make the device suitable for multi-channel data movement and memory interfaces. The -3 grade is preferred when processing clocks require extra timing margin, but the final choice should follow utilization, routing, and post-layout static timing analysis.
Recomendado
Aerospace and Defense Control Systems
The XC5VLX50-3FF324C can support programmable control, monitoring, and data-processing functions in aerospace and defense equipment when the required qualification level and operating conditions are satisfied. Its large logic capacity enables redundant control paths, fault monitoring, interface conversion, and configurable sequencing, while 220 I/O sites support external sensors and communication modules. The exact device qualification, temperature range, and procurement traceability must be confirmed for the required program. Engineering teams should evaluate radiation, environmental, obsolescence, and configuration-control requirements separately from ordinary commercial FPGA qualification.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC5VLX50-3FF324C — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC5VLX50-3FFG324C | XC5VLX50-2FF324C | XC5VLX50-1FF324C | XC5VLX50-2FFG324C | XC5VLX50-1FFG324C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 324-BBGA / FCBGA, 19 mm x 19 mm | 324-BBGA / FCBGA, 19 mm x 19 mm | 324-BBGA / FCBGA, 19 mm x 19 mm | 324-BBGA / FCBGA, 19 mm x 19 mm | 324-BBGA / FCBGA, 19 mm x 19 mm | 324-BBGA / FCBGA, 19 mm x 19 mm |
| Performance Grade | -3 | -3 | -2 | -1 | -2 | -1 |
| Logic Cells | 46,080 cells | 46,080 cells | 46,080 cells | 46,080 cells | 46,080 cells | 46,080 cells |
| Configurable Logic Blocks | 3,600 CLBs | 3,600 CLBs | 3,600 CLBs | 3,600 CLBs | 3,600 CLBs | 3,600 CLBs |
| Process Technology | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
| Nominal Core Supply Voltage | 1 V | 1 V | 1 V, 0.95 V to 1.05 V range | 1 V | 1 V | 1 V |
| Terminal Count | 324 terminals | 324 terminals | 324 terminals | 324 terminals | 324 terminals | 324 terminals |
Diferenciadores clave
- Highest listed performance grade in the direct FF324 replacement set (frente a XC5VLX50-2FF324C)
- Direct same-speed family alternative (frente a XC5VLX50-3FFG324C)
- Greater timing headroom than the lowest speed grade (frente a XC5VLX50-1FF324C)
Notas de diseño
Design the 1 V nominal core rail around the exact pinout and power-ball assignments for FF324. Place the required high-frequency decoupling capacitors directly adjacent to their associated supply and ground balls, and connect them through short, low-inductance paths. Separate core and I/O supply filtering where the device configuration requires it, and verify steady-state current, startup sequencing, and transient response at maximum supported clock and logic utilization.
Use the AMD Virtex-5 package pinout file as the controlling reference for every ball assignment. A 324-BBGA has dense escape routing requirements, so maintain the recommended ball-pitch and pad geometry, account for package and board warpage, and preserve via access beneath the device. Review both package and PCB stack-up before release to avoid solder-bridging, via-pitch, and assembly-yield problems.
Estimated: power dissipation equals the measured or calculated device power at the operating voltage. Evaluate junction temperature using the package thermal model, copper area, airflow, board construction, and the highest expected activity rate rather than a nominal operating mode. Validate the estimate with board-level thermal measurements, especially in compact enclosures where the 324-BBGA has limited convective surface area.
Assign clocks and high-speed interfaces according to the AMD package and design guidelines, including controlled-impedance routing, matched reference planes, and appropriate return paths. Simulate the complete board stack-up with realistic component and connector models. Pay particular attention to simultaneous-switching noise from the 220 I/O sites because power-grid bounce can affect both external link margins and internal FPGA timing.
Do not treat a lower speed grade as an automatic drop-in replacement. XC5VLX50-1 and -2 devices use the same 324-package family, but their timing performance is lower than the -3 grade, so static timing analysis must pass after substitution. Also verify configuration compatibility, operating-temperature requirements, package markings, and lead-free documentation rather than changing only the assembled MPN.
Información de cumplimiento
Compliance information for the exact FF324C suffix could not be established. The closely related XC5VLX50-3FFG324C is identified as RoHS compliant and lead-free, but that statement should not be applied automatically to XC5VLX50-3FF324C.
