XC6SLX25-3FT256C - 24,051-Cell Spartan-6 LX FPGA | AMD
N.º de pieza: XC6SLX25-3FT256C ✓ ActivoXC6SLX25-3FT256C Descripción general
A field-programmable gate array is a semiconductor whose digital logic, interconnect, and I/O behavior are configured after manufacture. The Spartan-6 LX FPGA family belongs to the broader FPGA hierarchy, which sits between fixed-function logic ICs and programmable ASICs. It combines hardware parallelism, field-updatable configuration, and deterministic control capabilities for systems requiring custom logic, interface adaptation, or signal processing.
The verified device data identifies 3,758 adaptive logic modules, 1,879 configurable logic blocks, 936 kbit of embedded memory, and 186 I/O. Its 45 nm CMOS implementation operates from a 1.2 V core, making it appropriate for compact embedded systems where power, board area, and computational throughput must be balanced. The Spartan-6 architecture also supports programmable logic blocks, block RAM, digital signal processing resources, and dedicated input/output functions, although individual resource counts beyond those published here require confirmation in the manufacturer documentation.
The XC6SLX25 device is positioned between smaller Spartan-6 LX members and larger LX fabrics. Compared with the XC6SLX9, it provides substantially more configurable logic and embedded memory, making it suitable for multi-channel control, protocol bridging, and parallel data processing. The verified XC6SLX25 comparison data also lists a 667 MHz performance figure, but the exact relationship between that figure and the -3 speed suffix should be confirmed against the applicable AMD/Xilinx device documentation for the intended design.
Typical uses include industrial automation, communications equipment, embedded control, video and image processing, sensor acquisition, and compact embedded platforms. The 186 I/O provide substantial board-level connectivity, while the 936 kbit of embedded memory can support buffering, packet handling, and control functions without relying entirely on external memory. These resources make the device useful for designs combining a processor or microcontroller with dedicated high-speed or parallel logic.
Designers should use the official Spartan-6 package pinout and power-guidance documents rather than inferring BGA connectivity from a generic package drawing. PCB layout must provide the specified core and I/O supplies, decoupling, clocking, configuration storage, and exposed-pad thermal treatment. Because the supplied data does not contain the complete 256-ball pinout or recommended operating ranges, those details remain data-needed rather than being inferred.
This product page consolidates the verified 24,051-cell, 1.2 V, 45 nm, 256-pin device attributes, current distributor pricing, same-family drop-in candidates, and practical replacement guidance. It provides engineering context that is not available from a distributor inventory listing alone, while clearly separating verified facts from documentation that still requires confirmation.
Alternativas directas para XC6SLX25-3FT256C — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XC6SLX25-3FT256C (mismo factor de forma y huella) — difiere en Package, Device Type, Logic Cells, Mounting Type, RoHS Status.
XC6SLX25-3FTG256C
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XC6SLX25-3FT256I
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Ver hoja de datos →XC6SLX25-3FTG256I
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XC6SLX25-2FTG256C
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XC6SLX25-2FT256I
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Ver hoja de datos →XC6SLX25-3FT256C Valores máximos y características eléctricas
| Device Type | Spartan-6 LX field-programmable gate array |
| Logic Elements | 24,051 cells |
| Adaptive Logic Modules | 3,758 ALMs |
| Configurable Logic Blocks | 1,879 CLBs |
| Embedded Memory | 936 kbit |
| Input/Output Count | 186 I/O |
| Core Voltage | 1.2 V |
| Process Technology | 45 nm CMOS |
| Performance Figure | 667 MHz |
| Encapsulado | 256-pin FTBGA, 17 x 17 mm, 1 mm pitch |
| Terminal Count | 256 balls |
| Tipo de montaje | Surface mount |
| Package Shape | Square |
| Temperature Grading | Other |
| Lead-Free Status | Lead free |
| Unit Price | $24.3384 as of 2026-10-28 |
Guía de configuración de pines de XC6SLX25-3FT256C square
Configuración de pines para XC6SLX25-3FT256C (encapsulado square). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC6SLX25-3FT256C.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC6SLX25-3FT256C es adecuado para 6 aplicacións: Industrial Automation and Control, Communications and Protocol Bridging, Sensor Acquisition and Signal Conditioning, Embedded Video and Image Processing, Audio and Signal Processing, Secure Communications and Data Security.
Industrial Automation and Control
The XC6SLX25-3FT256C fits compact industrial automation systems that need programmable parallel control without the resource level of a larger FPGA. Its 24,051 logic elements, 3,758 adaptive logic modules, and 1,879 configurable logic blocks can support sequencing, interlocks, and interface translation, while 186 I/O provide substantial connectivity. The 936 kbit of embedded memory is useful for counters, status buffers, and deterministic local data handling. The 1.2 V core and 45 nm CMOS implementation make the device suitable for power-conscious embedded controllers. Before production release, confirm industrial temperature grade, isolation boundaries, EMC requirements, and the device-specific power and timing limits using official AMD/Xilinx documentation.
Recomendado
Communications and Protocol Bridging
XC6SLX25-3FT256C is appropriate for communications equipment that must combine parallel data processing with multiple external interfaces. The 24,051-cell fabric and 1,879 configurable logic blocks can implement protocol converters, framing logic, FIFO control, and data-rate adaptation, while the published 936 kbit of embedded memory supports packet buffering and flow control. Its 186 I/O allow direct connection to multiple bus or transceiver interfaces, and the 1.2 V core supports compact equipment designs. The part is particularly relevant where a microcontroller alone would lack deterministic parallel throughput. Designers must confirm supported I/O standards, I/O voltage requirements, timing margins, and pin assignments for the selected 256-pin FTBGA before schematic capture.
Recomendado
Sensor Acquisition and Signal Conditioning
The XC6SLX25-3FT256C can serve as a deterministic acquisition and conditioning engine when parallel sensor channels must be sampled and processed together. Its 1,879 configurable logic blocks and 3,758 adaptive logic modules can implement counters, comparators, digital filters, and channel multiplexing, while 936 kbit of embedded memory can hold captured samples and intermediate results. The 186 I/O provide more parallel connectivity than a small microcontroller package. A 1.2 V core and 45 nm CMOS process also align with compact embedded measurement platforms. Signal integrity and analog-interface design remain external to the FPGA, so the implementation should include verified amplifier or ADC components, controlled clocking, ground planning, and input-termination practices appropriate to the sensor bandwidth.
Recomendado
Embedded Video and Image Processing
XC6SLX25-3FT256C is suitable for compact image-processing pipelines where parallel pixel operations, line buffering, and interface conversion are required. The 24,051 logic cells and 1,879 configurable logic blocks can support preprocessing, color or threshold processing, and data-format conversion, while the 936 kbit of embedded memory can provide limited line or frame buffers for carefully selected resolutions. Its 186 I/O can connect parallel sensors, display interfaces, or external memory when board-level timing and pin constraints are satisfied. The 1.2 V core supports low-voltage operation, but video designs must account for memory bandwidth, output timing, clock-domain crossing, and PCB signal integrity. Because the supplied data does not identify specific supported video protocols, protocol suitability should be verified against the device's official I/O and timing documentation.
Recomendado
Audio and Signal Processing
The XC6SLX25-3FT256C can implement parallel digital signal processing in compact audio, communications, or instrumentation systems. Its 1,879 configurable logic blocks and 936 kbit of embedded memory are useful for filters, sample-rate conversion, echo or channel processing, and local buffering, while the 186 I/O support parallel converters and clock interfaces. The 1.2 V core provides a low-voltage implementation base, and the FPGA architecture allows deterministic pipelines that are difficult to reproduce with a general-purpose microcontroller. Design effort should focus on clock quality, converter timing, and synchronous design practices. The supplied information does not confirm dedicated DSP coefficients or audio interfaces, so the expected arithmetic and sample-rate performance should be proven in simulation and timing analysis before hardware release.
Recomendado
Secure Communications and Data Security
XC6SLX25-3FT256C can be used in communication appliances that require hardware-assisted packet handling, parallel crypto pipelines, or dedicated data-path logic alongside a general-purpose processor. The 24,051 logic elements and 936 kbit of embedded memory provide room for finite-state machines, buffering, bit manipulation, and parallel processing, while 186 I/O allow direct attachment to network or storage interfaces. The 1.2 V core and 256-pin FTBGA support compact boards, although BGA routing and thermal design require careful planning. Security claims must be based on the implemented algorithm and protocol rather than the FPGA family name alone. Review side-channel resistance, key storage, update mechanisms, and product security requirements, and confirm timing closure for the selected clock and I/O configuration.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC6SLX25-3FT256C — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC6SLX25-3FTG256C | XC6SLX25-3FT256I | XC6SLX25-3FTG256I | XC6SLX25-2FTG256C | XC6SLX25-2FT256I |
|---|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | 256-pin FTBGA | 256-LBGA, same package | 256-pin FTBGA, same package | 256-LBGA, same package | 256-LBGA, same package | 256-pin FTBGA, same package |
| Logic Elements | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells |
| Adaptive Logic Modules | 3,758 ALMs | 3,758 ALMs | 3,758 ALMs | 3,758 ALMs | 3,758 ALMs | 3,758 ALMs |
| Configurable Logic Blocks | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs |
| Embedded Memory | 936 kbit | 936 kbit | 936 kbit | 936 kbit | 936 kbit | 936 kbit |
| Input/Output Count | 186 I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Speed/Ordering Grade | -3 FT256C | -3 FTG256C | -3 FT256I | -3 FTG256I | -2 FTG256C | -2 FT256I |
Diferenciadores clave
- Exact -3 performance ordering code (frente a XC6SLX25-2FTG256C)
- Specific FT256C ordering code (frente a XC6SLX25-3FTG256C)
- High logic and I/O density in one 256-pin package (frente a XC6SLX25-2FT256I)
Notas de diseño
Design the power tree from the official XC6SLX25 power-estimation data rather than applying a generic 1.2 V regulator rating. The verified core voltage is 1.2 V, but total current depends on logic utilization, configuration state, clocking, memory activity, and I/O switching. Separate the core and I/O rails, verify allowable sequencing and ramp limits, and place the required bulk and high-frequency decoupling directly at the relevant power balls. Because the supplied data does not state I/O voltage ranges or current limits, those values must be obtained from the manufacturer documents before schematic approval.
Treat the 256-pin FTBGA exposed thermal structure as an essential heat path rather than an optional copper feature. The device has 186 I/O and can consume power dynamically as logic and interfaces operate, so a nominal ambient temperature cannot be translated into junction temperature without the package thermal model. Use the official thermal data, model PCB copper and airflow, and keep high-current routes away from sensitive clock or configuration areas. The supplied records do not contain theta-JA, theta-JC, maximum junction temperature, or power limits, so no thermal value should be assumed.
Use the official AMD Spartan-6 package-device pinout files as the controlling source for all 256 ball assignments. Confirm the FT versus FTG and C versus I ordering-code meanings against the AMD ordering guide before freezing the PCB footprint. Preserve the manufacturer-defined land pattern, solder-mask and paste layers, via arrangement, and exposed-pad geometry. A 1 mm pitch square 17 x 17 mm BGA also requires careful assembly capability review, including X-ray inspection and design rules for possible solder bridging.
Plan clock, configuration, and high-speed I/O routing as separate constraint groups. Use shortest practical clock paths, provide return paths beneath interfaces, and follow AMD/Xilinx guidance for configuration pins such as clock, data, and programming signals. External memory, converters, and transceivers should be placed according to their own reference layouts rather than treated as generic BGA neighbors. Since the supplied data omits supported I/O standards, slew, timing, and drive specifications, these must be checked before assigning a pin or selecting termination.
Do not treat a same-package FPGA as a guaranteed drop-in replacement. The XC6SLX25-3FTG256C has matching published capacity, I/O count, and package, but the FTG suffix may alter the ordering or qualification class. The -2 speed grades can have different timing performance even with identical logic resources. For every proposed substitution, verify the exact package drawing, temperature grade, speed grade, status, configuration memory compatibility, bitstream behavior, and timing closure. The supplied web evidence contains no cross-brand pin-compatible replacement.
Información de cumplimiento
The supplied comparison record explicitly describes XC6SLX25-3FT256C as lead free. It does not explicitly verify RoHS, REACH, halogen-free, conflict-minerals, or AEC-Q100 status, so those fields remain unknown. Current AMD/Xilinx environmental and quality documentation should be checked for the exact ordering code.
