XC7A75T-3FGG484E - Artix-7 FPGA, 75520 Logic Cells, 285 I/O | AMD
N.º de pieza: XC7A75T-3FGG484E ✓ ActivoXC7A75T-3FGG484E Descripción general
An FPGA is a programmable logic device: a semiconductor whose internal array of configurable logic blocks, block RAM, DSP slices, and I/O banks is re-programmed by the user to implement any digital circuit from a hardware description written in Verilog or VHDL. In the product hierarchy, an FPGA sits above a CPLD: FPGAs offer far higher logic density, dedicated hard multipliers, high-speed serial transceivers, and memory resources, while CPLDs are simpler, lower-capacity devices. The Artix-7 family occupies the cost-optimized tier of the Xilinx 7 series, below the Kintex-7 and Virtex-7 performance tiers, and above the small Zynq-7000 SoCs with integrated ARM processors.
The "-3" in the part number is the speed grade, indicating the maximum operating performance class of the device, while the trailing "E" designates the extended commercial temperature qualification. The FGG484 package is a 17 x 17 mm, 0.8 mm-pitch flip-chip BGA that supports up to 285 user I/O in the FGG484 configuration. Compared with the larger FGG676 and FF676 packages, FGG484 trades I/O count for a smaller board footprint, which is attractive for compact industrial, communications, and test-and-measurement equipment.
Because the device is SRAM-based, configuration data must be loaded at every power-up from a flash PROM, SPI flash, or a host processor such as a Zynq or MicroBlaze. AMD supplies the Artix-7 package pinout files in ASCII and CSV formats per UG475, which are the authoritative reference for board-level symbol generation and ball assignment.
Typical applications for the XC7A75T-3FGG484E include industrial Ethernet and serial protocol bridges, data acquisition and control systems, video timing and scaler pipelines, instrumentation and test equipment, and low-cost embedded processing subsystems with an external host processor. Its 484-ball FBGA also makes it a natural fit for multi-die mixed-signal boards where a mid-density FPGA handles protocol conversion and local buffering.
A key design consideration is power and thermal budget: a 28 nm Artix-7 device dissipating several watts in a 17 x 17 mm BGA requires careful via-in-pad and copper-pour thermal design on the PCB, and the specified junction temperature limits of the -3E grade must be respected with margin. When a smaller footprint is acceptable, the FGG484 package is often paired with a companion XC7A50T or XC7A35T device on the same board to split protocol and DSP workloads without changing the PCB footprint family.
This page consolidates distributor pricing as of 2026-10-30, same-package drop-in alternatives drawn from the Artix-7 and Kintex-7 families, a parameter-by-parameter comparison, and practical board-level design guidance that is not reproduced in the manufacturer datasheet.
Alternativas directas para XC7A75T-3FGG484E — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XC7A75T-3FGG484E (mismo factor de forma y huella) — difiere en Logic Cells, Mounting Type, Package, Speed Grade.
XC7A75T-2FGG484E
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC7A75T-1FGG484I
✅ Sustitución directaConsulte el precio
Ver hoja de datos →XC7A75T-2FGG484I
✅ Sustitución directaConsulte el precio
Ver hoja de datos →XC7A75T-1FGG484C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7A100T-3FGG484E
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7A50T-3FGG484E
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7A75T-3FGG484E Valores máximos y características eléctricas
| Device Type | Field Programmable Gate Array (FPGA), SRAM-based |
| FPGA Family | Artix-7 |
| Logic Cells | 75,520 |
| User I/O | 285 |
| Frecuencia de reloj máxima | 628 MHz |
| Speed Grade | -3 (performance grade) |
| Encapsulado | 484-FBGA (FGG484), 17 mm x 17 mm, 0.8 mm pitch |
| Tipo de montaje | Surface Mount |
| Logic Process Technology | 28 nm |
| Configuration Memory Type | SRAM (volatile, requires reconfiguration at power-up) |
| Number of Package Balls | 484 |
| Unit Price (1 unit) | $35.8458 as of 2026-10-30 (LCSC) |
Guía de configuración de pines de XC7A75T-3FGG484E 484
Configuración de pines para XC7A75T-3FGG484E (encapsulado 484). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC7A75T-3FGG484E.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC7A75T-3FGG484E es adecuado para 6 aplicacións: Industrial Protocol Bridge and Gateway, Data Acquisition and Instrumentation, Video Timing, Scaler and Display Processing, Test and Measurement Equipment, Embedded Control Subsystem with Host Processor, Communications and Networking Line Cards.
Industrial Protocol Bridge and Gateway
The XC7A75T-3FGG484E suits multi-protocol gateways because its 285 user I/O in the 484-ball FGG484 package allows parallel industrial Ethernet, RS-485/232, and discrete I/O to be consolidated on one device. A 75,520-logic-cell fabric at up to 628 MHz can terminate multiple protocol engines concurrently, run Modbus or PROFINET bridges, and add data conditioning without offloading work to a host processor. Because the FGG484 land pattern is the same across the Artix-7 75T family, a gateway platform can be scaled from the XC7A50T-3FGG484E to the XC7A100T-3FGG484E without a layout change. Cost control matters in volume gateway builds, which is where the -3 speed grade helps: it delivers the required throughput at a lower unit price than -1 graded parts while remaining SRAM-configurable from a single serial flash.
Recomendado
Data Acquisition and Instrumentation
With 285 user I/O and 75,520 logic cells, the XC7A75T-3FGG484E can absorb the parallel data path of a multi-channel instrument - ADC strobes, parallel ADC and DAC buses, trigger routing, and timing state machines - rather than forcing a slow discrete glue-logic FPGA. At up to 628 MHz the fabric supports wide parallel capture and DSP-assisted filtering without a separate accelerator. The 484-ball FBGA offers enough ball count for dedicated banks of user I/O plus configuration and JTAG, and the small 17 x 17 mm outline keeps instrument front panels compact. Designers should note the trade-off: the SRAM configuration means a boot flash and a load sequence are needed at power-up, so reserve board area and I/O for the configuration PROM. A 628 MHz fabric also requires careful clocking and via stitching to keep the acquisition pipeline deterministic.
Recomendado
Video Timing, Scaler and Display Processing
Artix-7 devices are widely used as timing generators and scalers because the fabric provides enough parallel pixel logic to absorb wide data buses without stalling on I/O. The XC7A75T-3FGG484E delivers 285 user I/O, enough for a 10/20-bit parallel RGB interface plus a second video path, while the 628 MHz fabric clock supports pixel clocking and horizontal/vertical blanking generation with margin. For multi-display products, the same FGG484 footprint appears on the XC7A50T and XC7A100T, enabling a single PCB to host single-, dual-, or four-panel variants. Designers should watch the I/O bank voltage budget: LVDS and CMOS interfaces must be planned per bank, and the small FBGA forces disciplined escape routing, so use microvias and length matching for every video differential pair. The -3 grade is typically sufficient for 1080p-class pipelines but should be re-validated for very high pixel rates.
Recomendado
Test and Measurement Equipment
Instrumentation front ends benefit from placing pattern generation, acquisition, and analysis logic in one Artix-7 device. At 75,520 logic cells and up to 628 MHz, the XC7A75T-3FGG484E can host multiple parallel test channels, DSP-style filtering, and a soft-core control path, while its 285 I/O in the FGG484 package provide direct access to the device under test. The -3 speed grade is a common choice for production test equipment because throughput requirements are met without paying for -1 timing, and the extended commercial (E) temperature suffix covers industrial and laboratory ambient conditions. Key engineering cautions: this is an SRAM-based part, so each instrument needs a reliable configuration path and a bitstream stored in serial flash; and the 17 x 17 mm FBGA demands a thermal via array and solid ground pour to keep junction rise within limits at multi-watt loading.
Recomendado
Embedded Control Subsystem with Host Processor
The XC7A75T-3FGG484E is frequently paired with an external host processor, with the Artix-7 acting as the real-time I/O and coprocessor engine while the host runs networking, storage, and a user interface. In this architecture the FPGA handles encoder decoding, motor timing, or high-rate sampling, and communicates over a high-speed serial link rather than a slow shared bus, which is exactly the strength of a 628 MHz Artix-7 fabric with 285 I/O. Choosing the -3E grade keeps BOM cost low for cost-sensitive embedded equipment while the E temperature qualification covers wider ambient envelopes than the commercial C grade. The main trade-off versus a Zynq-7000 SoC is that there is no integrated ARM processor, so the design must add an external processor and a separate configuration flash. The identical FGG484 footprint of the XC7A50T and XC7A100T allows a single PCB to cover product tiers.
Recomendado
Communications and Networking Line Cards
Artix-7 FPGAs are used for line-card aggregation because a single fabric can terminate several low-rate serial interfaces while adding framing logic and packet buffers. The XC7A75T-3FGG484E, with 75,520 logic cells and 285 user I/O in a 484-ball FBGA, fits line cards that need many parallel lanes plus a wide backplane interface, and its 628 MHz maximum clock supports timing closure on moderately complex protocol engines. The -3 speed grade is widely accepted for these designs, since line-card designs are usually volume-driven and cost-sensitive; the FGG484 package also keeps the card thin, which matters in 1U/2U chassis. Practical guidance: keep high-speed transceiver or SerDes lanes on dedicated banks with matched reference clocks, and remember that no configuration memory is embedded, so each card needs flash or a network-boot path for the bitstream.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC7A75T-3FGG484E — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC7A75T-2FGG484E | XC7A75T-1FGG484I | XC7A75T-2FGG484I | XC7A75T-1FGG484C | XC7A100T-3FGG484E | XC7A50T-3FGG484E |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (FGG484) | 484-FBGA (FGG484) - same | 484-FBGA (FGG484) - same | 484-FBGA (FGG484) - same | 484-FBGA (FGG484) - same | 484-FBGA (FGG484) - same | 484-FBGA (FGG484) - same |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Logic Cells | 75,520 | 75,520 (same die) | 75,520 (same die) | 75,520 (same die) | 75,520 (same die) | 101,440 (about 34% higher density) | 52,160 (about 31% lower density) |
| Speed Grade | -3 | -2 | -1 | -2 | -1 | -3 | -3 |
| Temperature / Qualification Code | E (extended commercial) | E (extended commercial) | I (industrial) | I (industrial) | C (commercial) | E (extended commercial) | E (extended commercial) |
| FPGA Family / Device Type | Artix-7, SRAM-based FPGA | Artix-7, SRAM-based FPGA | Artix-7, SRAM-based FPGA | Artix-7, SRAM-based FPGA | Artix-7, SRAM-based FPGA | Artix-7, SRAM-based FPGA | Artix-7, SRAM-based FPGA |
Diferenciadores clave
- Same-die, same-package drop-in family with multiple speed grades available (frente a XC7A75T-2FGG484E)
- Extended commercial (E) temperature qualification at the -3 grade (frente a XC7A75T-1FGG484C)
- Capacity headroom for DSP and memory-heavy designs on the same footprint (frente a XC7A50T-3FGG484E)
- Cost-effective middle ground against the 100T density option (frente a XC7A100T-3FGG484E)
Notas de diseño
Estimated: Artix-7 XC7A75T power depends heavily on fabric utilization, I/O toggle rate, and the enabled GTP transceivers. Design the board for a multi-watt worst case and derive the rail from the highest transient case rather than typical. Because the FGG484 BGA supplies the core through a dedicated power ball grid, use a solid, uninterrupted ground plane and stitch the ball rows with via arrays directly under the device. Keep the 0.8 mm-pitch BGA escape traces short so that switching current loops do not add to the drop across the power distribution network, and decouple each supply rail locally at the device.
Estimated: with a 17 x 17 mm FGG484 package and a thermal via array in the BGA land, keep the estimated junction temperature below the grade limit by budgeting roughly 1 W per 10 C of junction rise above ambient once vias and copper spread heat. Practical steps: place a dense via array (3x3 or better) in the ground pad, provide top and bottom copper pours connected to the thermal vias, avoid cutting thermal planes under the FPGA with other routing, and check the design in the AMD power estimator and thermal analysis flow. Do not assume the small FBGA can shed multi-watt loads without an explicit thermal path.
The 484-ball FGG484 package at 0.8 mm pitch requires 6-mil or finer routing and rules out through-hole vias on inner layers under the escape area. Plan the board stack so that at least two signal layers are dedicated to BGA escape, route configuration pins (CFGBIN, CFGBPRE, CCLK, DONE) away from noisy user I/O, and place the configuration flash PROM close to the relevant balls to minimize configuration time and signal integrity risk. Because all Artix-7 75T/100T/50T FGG484 parts share the same ball pattern, keep pad stackups identical to preserve upgrade paths between density variants.
The most common errors on this device are configuration and thermal. First, the XC7A75T-3FGG484E is SRAM-based: without a valid bitstream loaded from serial flash or a host processor, the device does not operate, and configuration pins must be managed correctly per the AMD configuration guide. Second, designers routinely substitute a lower-density XC7A50T for cost reasons and then hit DSP or BRAM limits; verify utilization per resource type, not just logic cells. Third, speed-grade mixing between -3 and -1 or -2 parts changes timing closure, so re-run static timing analysis after any substitution even though the pinout is identical.
Información de cumplimiento
No explicit RoHS, REACH, lead-free, or halogen-free statements were present in the verified web data for this MPN; these fields are marked unknown rather than assumed. The device is an FPGA and is not AEC-Q100 qualified in this ordering code (AEC-Q100 automotive grade is a separate suffix in AMD nomenclature).
