XC7K160T-1FF676C - 162240-Cell Kintex-7 FPGA | AMD
N.º de pieza: XC7K160T-1FF676C ✓ ActivoXC7K160T-1FF676C Descripción general
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic and interconnect can be configured after fabrication. FPGAs occupy the hierarchy between programmable logic devices and application-specific integrated circuits. Unlike a fixed-function ASIC, an FPGA permits design changes, hardware acceleration, and product differentiation without fabricating a new custom chip. The Kintex-7 family balances substantial logic capacity with high-speed serial, parallel, and memory interfaces.
The XC7K160T configuration provides 162,240 logic cells and 12,675 configurable logic blocks according to the device listing and family comparison material. A 1.096 GHz-class maximum clock figure is associated with the -1FFG676I ordering information, while the target part uses the -1 speed grade. Its 676-ball FCBGA package supports dense board-level integration, and the listed 400-user I/O count supports parallel digital connectivity. Exact I/O standards and performance depend on the selected bank voltage and the FPGA configuration.
The 28 nm Kintex-7 architecture is intended for designs requiring substantial parallel processing without the cost and schedule of a custom ASIC. Programmable logic can implement protocol handling, packet processing, data acquisition, control, or test logic, while dedicated hard resources support clocking, memory, and high-speed serial communication. Designers can evaluate different clock rates and pin assignments before committing a final bitstream, making the device suitable for both prototype development and production control systems.
Typical uses include industrial machine vision, communications infrastructure, test and measurement, radar or signal processing, high-speed data acquisition, and embedded video processing. The large logic inventory is especially useful for parallel datapaths that would otherwise require several smaller programmable devices. System partitioning should account for clocking, memory bandwidth, serial transceiver requirements, power budget, and PCB-routing constraints.
A critical design consideration is that FCBGA assembly requires a dense, multilayer PCB with short, impedance-controlled escape routes and carefully planned power and ground planes. Decoupling, simultaneous-switching-noise control, thermal management, and BGA assembly capability can determine whether the FPGA achieves its intended performance. The -1 speed grade should be matched to timing constraints without assuming that a higher-grade alternative is necessary.
This page combines the exact XC7K160T-1FF676C package identity with practical ordering guidance, same-package Kintex-7 alternatives, parameter comparisons, and design-focused selection criteria. It also distinguishes genuine drop-in options from device names that use a different package or ball map and therefore require PCB-level qualification.
Alternativas directas para XC7K160T-1FF676C — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XC7K160T-1FF676C (mismo factor de forma y huella) — difiere en Maximum Clock Frequency, Speed Grade.
XC7K160T-1FFG676C
✅ Sustitución directaConsulte el precio
XC7K160T-2FFG676C
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7K160T-1FFG676I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7K160T-L2FFG676I
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
XC7K160T-2FF676I
✅ Sustitución directaConsulte el precio
Ver hoja de datos →XC7K160T-1FF676C Valores máximos y características eléctricas
| Product Type | Field-Programmable Gate Array (FPGA) |
| FPGA Family | Kintex-7 |
| Logic Cells | 162,240 cells |
| Configurable Logic Blocks | 12,675 CLBs |
| Process Technology | 28 nm |
| Speed Grade | -1 |
| Temperature Grade | Commercial |
| Core Voltage | 1 V |
| Frecuencia de reloj máxima | 1,098 MHz |
| User I/O | 400 I/O |
| Encapsulado | 676-ball FCBGA |
| Ball Count | 676 balls |
| Tipo de montaje | Surface Mount |
| Programmable Logic | 162,240 logic cells |
| Architecture | Kintex-7 FPGA architecture |
| Estado RoHS | No |
| REACH Status | Not compliant |
Guía de configuración de pines de XC7K160T-1FF676C 676-ball fcbga
Configuración de pines para XC7K160T-1FF676C (encapsulado 676-ball fcbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC7K160T-1FF676C.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC7K160T-1FF676C es adecuado para 6 aplicacións: Industrial Machine Vision, Communications Protocol Processing, High-Speed Data Acquisition, Test and Measurement, Radar and Signal Processing, Embedded Video Processing.
Industrial Machine Vision
The XC7K160T-1FF676C fits industrial machine-vision systems that combine parallel image capture, preprocessing, and real-time decision logic in one programmable device. Its 162,240 logic cells provide substantial capacity for parallel pixel pipelines, feature extraction, buffering, and control, while the 400 listed user I/O support camera, sensor, and actuator connectivity. The 676-ball FCBGA also allows high-density board routing for memory and high-speed interfaces. Engineers should reserve pins for configuration and clocks early, then verify each VCCO bank against the camera interface voltage. Timing closure must be completed at the -1 speed grade because image throughput, memory latency, and sensor overlap can create demanding multicycle paths.
Recomendado
Communications Protocol Processing
The XC7K160T-1FF676C is suitable for communications equipment requiring concurrent packet classification, framing, filtering, and traffic management. The 162,240-cell Kintex-7 resource pool can support multiple parallel datapaths or deep packet pipelines without relying on a fixed-function network ASIC. Its 400 user I/O allow direct connection to multiple low-speed interfaces, while dedicated high-speed resources can be allocated according to the selected configuration and package documentation. Designers should separate clock domains, constrain source-synchronous interfaces, and reserve bandwidth for monitoring and fault handling. Final timing should be verified at the -1 speed grade under the expected traffic pattern because logic utilization alone does not represent switching activity or routed delay.
Recomendado
High-Speed Data Acquisition
The XC7K160T-1FF676C is well matched to high-speed data-acquisition systems that must capture parallel data, perform real-time filtering, and transfer results into memory or processing logic. Its 162,240 logic cells can host parallel ADC interface logic, digital filters, decimation stages, and acquisition control. The 676-ball FCBGA supplies a large I/O and power-delivery footprint, allowing multiple interface voltage domains when supported by the device's bank architecture. Place decoupling close to each supply ball group, preserve the package escape geometry, and use controlled-length routes for source-synchronous interfaces. Validate setup and hold timing after placement because a correct schematic assignment does not compensate for routing delay introduced by the multilayer board.
Recomendado
Test and Measurement
The XC7K160T-1FF676C can implement complex test-and-measurement logic, including pattern generation, digital acquisition, timing analysis, and instrument control. Its high logic-cell count allows multiple instrument channels to be implemented concurrently instead of combining multiple discrete controllers. The 400 user I/O provide connections for test fixtures, trigger logic, status indicators, and communication links, while the large package supports planned memory and high-speed data paths. Because measurement accuracy depends on deterministic timing, engineers should use device-specific timing constraints, isolate analog circuitry from switching logic, and analyze power integrity across all supply domains. The -1 speed grade should be selected only after the complete routed design meets the required timing margin.
Recomendado
Radar and Signal Processing
The XC7K160T-1FF676C fits radar and electronic-warfare signal-processing designs that require parallel filtering, correlation, spectral analysis, and control in a compact programmable package. Its 162,240 logic cells allow multiple fixed-point processing channels to be time- or space-multiplexed, while the 676-ball FCBGA supports dense connection to converters, memory, and network interfaces. High-speed data converters can feed the FPGA through carefully constrained parallel buses, after which logic can perform digital downconversion and detection. Partition each clock domain, budget DSP and block-RAM resources, and estimate dynamic power from actual coefficients and traffic. Post-route timing and power analysis must confirm that the -1 grade meets mission timing and thermal limits.
Recomendado
Embedded Video Processing
The XC7K160T-1FF676C can support embedded video systems requiring parallel pixel processing, color conversion, scaling, and interface adaptation. The 162,240-cell device provides enough logic to combine several processing stages and control functions in a single FPGA, reducing external component count when the board area is constrained. Its 400 listed user I/O can connect image sensors, local memory, and display or network interfaces through appropriate VCCO banks. Designers should assign video clocks and packet interfaces early, reserve memory bandwidth, and verify that every high-speed bus has an implementable routing strategy. The commercial-grade ordering option should be matched to the enclosure temperature and the -1 speed grade should be validated against the required frame rate and video timing.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC7K160T-1FF676C — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC7K160T-1FFG676C | XC7K160T-2FFG676C | XC7K160T-1FFG676I | XC7K160T-L2FFG676I | XC7K160T-2FF676I |
|---|---|---|---|---|---|---|
| Package | 676-ball FCBGA | 676-ball FCBGA - same | 676-ball FCBGA - same | 676-ball FCBGA - same | 676-ball FCBGA - same | 676-ball FCBGA - same |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 |
| Logic Cells | 162,240 cells | 162,240 cells | 162,240 cells | 162,240 cells | 162,240 cells | 162,240 cells |
| Speed Grade | -1 | -1 | -2 | -1 | -2 low-power | -2 |
| Temperature Grade | Commercial | Commercial | Commercial | Industrial | Industrial | Industrial |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
Diferenciadores clave
- Direct -1 speed-grade ordering choice (frente a XC7K160T-2FFG676C)
- Commercial-temperature target with industrial alternatives (frente a XC7K160T-1FFG676I)
- Lower-power family option available without changing logic capacity (frente a XC7K160T-L2FFG676I)
Notas de diseño
Plan the 676-ball FCBGA power tree from the device power architecture rather than treating all balls as a single supply domain. The core operates at a nominal 1 V, while configurable I/O banks require suitable VCCO levels and auxiliary rails need their own distribution and decoupling. Place bulk and high-frequency decoupling close to the relevant ball groups, use multiple current paths to control impedance, and verify sequencing against the manufacturer guidance. Estimated: power dissipation equals the sum of each rail's voltage times current; calculate every rail separately because local I/O activity can dominate total dissipation.
Evaluate junction temperature using actual design activity and the PCB stack-up rather than a single nominal power value. The 676-ball package can conduct heat through numerous balls into inner ground planes, but only if the assembly process forms the required thermal connections and the board provides a suitable heat-spreading path. Run power analysis with realistic switching activity, clocking, and I/O toggling, then apply the resulting dissipation to the board-specific thermal model. Reserve copper away from sensitive analog areas and maintain airflow or conduction paths appropriate to the enclosure temperature.
A 676-ball FCBGA generally requires a multilayer PCB with short escape routing, symmetric power distribution, and controlled impedance for every high-speed interface. Follow the package ball map when defining pad stacks and vias, and preserve the manufacturer's keep-out and via-in-pad guidance for assembly yield. Separate sensitive clock and configuration routing from high-current switching paths where practical. Do not finalize a replacement ordering code until its mechanical drawing, ball map, and exposed-ball requirements have been compared against the existing PCB land pattern.
Constrain clocks, source-synchronous interfaces, and other timing-critical paths using the speed-specific device timing data rather than generic FPGA limits. Pay particular attention to clock-buffer placement, return paths, and the relationship between package crossings and board-layer transitions. For memory or converter interfaces, use the exact pin assignments and I/O standards for the selected package. After routing, inspect timing for the -1 speed grade and check hold violations across all supported VCCO combinations; faster or industrial ordering suffixes should not be treated as automatic timing or compliance fixes.
Avoid ordering-code confusion among XC7K160T variants that differ in speed, temperature class, low-power characterization, or package notation. A part with the same 676-ball description is not automatically a drop-in replacement; verify the ordering guide, package drawing, pin table, power architecture, and lifecycle designation. When substituting a -2 or industrial-temperature device, regenerate the bitstream and repeat timing, thermal, and board-level testing. Also avoid assuming that all 400 listed user I/O are simultaneously usable because fixed configuration, power, clock, and dedicated interface balls reduce general-purpose availability.
Información de cumplimiento
The Kintex-7 comparison record identifies RoHS status as No and REACH compliance as not compliant. No separate AEC-Q100, lead-free, halogen-free, or conflict-minerals declaration was identified for this ordering.