XC7K325T-1FB900I - 326K LE Kintex-7 FPGA | AMD
N.º de pieza: XC7K325T-1FB900I ✓ ActivoXC7K325T-1FB900I Descripción general
A field-programmable gate array, or FPGA, is a digital integrated circuit whose logic, interconnect, and I/O functions are configured after manufacture. An FPGA sits within the broader programmable-logic hierarchy and provides hardware-level parallelism for workloads that may be inefficient on a general-purpose processor. Kintex-7 devices extend the AMD Xilinx FPGA portfolio for communications, industrial control, test equipment, signal processing, and embedded systems requiring deterministic parallel logic.
The XC7K325T-1FB900I provides 326,080 logic elements and 50,950 adaptive logic modules, creating substantial configurable logic capacity. Its 500 I/O sites support interfaces to external memory, data converters, network transceivers, clocks, and control peripherals. The listed 900-BBGA FCBGA package also provides a 2.54 mm terminal pitch and a stated 31 mm package size, making high-density routing and multilayer PCB design essential.
The -1 designation identifies the device performance grade within the Kintex-7 family. The industrial suffix I identifies the intended temperature class. Reported operating information includes a -40 °C lower temperature and a 100 °C upper temperature, while the core supply information includes 1.03 V and a 970 mV value. Exact timing, current, memory capacity, and power figures should be selected from the manufacturer tables corresponding to the installed device and configuration.
Typical uses include high-throughput data acquisition, programmable interface consolidation, industrial automation, communications infrastructure, and embedded signal-processing systems. The large logic and I/O resources allow multiple independent pipelines to operate in parallel, while block RAM and DSP resources support buffering and fixed-point processing without relying on external processors for every operation.
PCB design must account for the 900-ball package, power distribution across multiple rails, and the demanding high-speed routing required by FPGA I/O. Use the manufacturer package-pinout files and reference design guidance to assign balls, implement complete power planes, and route sensitive clocks, memory interfaces, and differential pairs with controlled impedance and return paths.
This page organizes the verified device identity, package information, temperature and speed-grade details, engineering alternatives, and design guidance in one place. It also identifies comparison points that matter when deciding whether a different Kintex-7 speed grade or temperature grade can replace the target without changing the PCB footprint.
Alternativas directas para XC7K325T-1FB900I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
XC7K325T-1FBG900I
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC7K325T-2FBG900I
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC7K325T-2FBG900C
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC7K325T-1FBG900E
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC7K325T-1FBG900C
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC7K325T-1FB900I Valores máximos y características eléctricas
| Device Type | Kintex-7 FPGA |
| Logic Elements | 326,080 LE |
| Adaptive Logic Modules | 50,950 ALM |
| I/O Sites | 500 I/O |
| Encapsulado | 900-BBGA FCBGA |
| Package Size | 31 mm |
| Terminal Pitch | 2.54 mm |
| Terminal Count | 900 terminals |
| Speed Grade | -1 |
| Temperature Grade | Industrial |
| Minimum Operating Temperature | -40 °C |
| Maximum Operating Temperature | 100 °C |
| Core Supply Voltage | 1.03 V |
| Minimum Supply Voltage | 970 mV |
| RAM Size | 1 GB DDR3 |
| Tipo de montaje | Surface Mount |
| Maximum Peak Reflow Temperature Time | 30 s |
| Estado RoHS | Non-Compliant |
| Lead Finish | Lead, Tin |
| Programmability | Field-Programmable |
Guía de configuración de pines de XC7K325T-1FB900I 31 mm
Configuración de pines para XC7K325T-1FB900I (encapsulado 31 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC7K325T-1FB900I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC7K325T-1FB900I es adecuado para 6 aplicacións: High-Speed Data Acquisition, Industrial Automation and Control, Communications Infrastructure, Embedded Signal Processing, Test and Measurement Equipment, Aerospace and Defense Systems.
High-Speed Data Acquisition
The XC7K325T-1FB900I fits parallel data-acquisition systems that must combine wide interfaces with substantial real-time processing. Its 326,080 logic elements and 50,950 adaptive logic modules can host acquisition control, buffering, channel interleaving, trigger logic, and data-format conversion in one programmable device, while 500 I/O sites provide connectivity to converters, clocks, memories, and host interfaces. The -1 speed grade and industrial -40 °C to 100 °C range support industrial equipment where repeatable timing and controlled operating temperature are important. Design the board around the 900-ball FCBGA package, including multilayer escape routing and carefully decoupled supply rails.
Recomendado
Industrial Automation and Control
The XC7K325T-1FB900I is suitable for industrial controllers that coordinate sensors, actuators, motion logic, safety interlocks, and communications in real time. Its 500 I/O sites can reduce the need for external bridging logic, while the 326,080 logic elements allow deterministic parallel control tasks to execute concurrently. The industrial temperature designation and reported -40 °C to 100 °C operating range suit equipment operating beyond consumer-temperature environments. For dependable implementation, pair the programmable logic with isolated communication interfaces, deterministic external clocks, watchdogs, and a power-distribution network that meets the requirements of the manufacturer power guidelines.
Recomendado
Communications Infrastructure
The XC7K325T-1FB900I can implement high-throughput communications functions where parallel data paths, flexible interfaces, and programmable protocol handling are valuable. The 500 I/O sites support connections to transceivers, memories, network controllers, and timing references, while 50,950 adaptive logic modules allow multiple lanes or packet-processing stages to operate simultaneously. The -1 grade provides a defined performance class for timing design, and the industrial suffix addresses equipment with a controlled but extended operating environment. Confirm transceiver interface standards, reference-clock architecture, impedance-controlled routing, and signal-integrity margins before finalizing the PCB.
Recomendado
Embedded Signal Processing
The XC7K325T-1FB900I supports embedded DSP and filtering workloads that benefit from deterministic parallel execution rather than sequential processor operation. Its 326,080 logic elements can implement parallel arithmetic, correlation, modulation, and decision logic, while 500 I/O sites connect the pipeline to data converters, memory, and control circuitry. The -1 speed grade provides a common Kintex-7 performance class for timing closure, and the industrial range of -40 °C to 100 °C supports controlled industrial installations. Confirm exact DSP, block-RAM, clock, and power characteristics for the selected configuration using the manufacturer resource tables.
Recomendado
Test and Measurement Equipment
The XC7K325T-1FB900I is appropriate for modular test and measurement platforms requiring many parallel channels, flexible timing, and reconfigurable signal processing. Its 500 I/O sites can connect multiple acquisition or excitation channels, while 326,080 logic elements can implement triggering, sequencing, correction, and protocol conversion without relying on a separate high-performance processor for every real-time task. The industrial-grade ordering code and reported -40 °C to 100 °C range are appropriate for laboratory and production equipment operating in controlled environments. Pay particular attention to clock jitter, analog-interface isolation, thermal management, and high-density BGA assembly yield.
Recomendado
Aerospace and Defense Systems
The XC7K325T-1FB900I can serve as the programmable control core in aerospace, defense, and rugged embedded systems where deterministic parallel processing and a high pin count are valuable. The device exposes 500 I/O sites for sensor fusion, navigation data processing, communications framing, and redundant control functions, while the 326,080 logic elements support multiple concurrent operations. The standard -1 industrial grade should not be assumed to satisfy every aerospace qualification requirement; system engineers must assess radiation, environmental, reliability, and procurement criteria separately. An extended-temperature ordering code may be preferable when the platform specifies a wider ambient range.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC7K325T-1FB900I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC7K325T-1FBG900I | XC7K325T-2FBG900I | XC7K325T-2FBG900C | XC7K325T-1FBG900E | XC7K325T-1FBG900C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 900-BBGA FCBGA | 900-BBGA FCBGA | 900-BBGA FCBGA | 900-BBGA FCBGA | 900-BBGA FCBGA | 900-BBGA FCBGA |
| FPGA Family | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 |
| Speed Grade | -1 | -1 | -2 | -2 | -1 | -1 |
| Temperature Suffix | I - Industrial | I - Industrial | I - Industrial | C - Commercial | E - Extended | C - Commercial |
| Logic Elements | 326,080 LE | 326,080 LE | 326,080 LE | 326,080 LE | 326,080 LE | 326,080 LE |
| Adaptive Logic Modules | 50,950 ALM | 50,950 ALM | 50,950 ALM | 50,950 ALM | 50,950 ALM | 50,950 ALM |
| I/O Sites | 500 I/O | 500 I/O | 500 I/O | 500 I/O | 500 I/O | 500 I/O |
| Terminal Pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Pricing | Request a Quote | Request a Quote | Request a Quote | Request a Quote | Request a Quote | Request a Quote |
Diferenciadores clave
- Combines high logic density with extensive user connectivity (frente a XC7K325T-1FBG900C)
- Provides a defined -1 speed grade for timing-sensitive designs (frente a XC7K325T-2FBG900I)
- Matches the high-density 900-ball package used for extensive routing (frente a XC7K325T-1FBG900E)
Notas de diseño
Design the PCB as a multilayer, high-density BGA platform rather than adapting a generic two-layer layout. The 900-ball FCBGA package has a reported 2.54 mm terminal pitch, so every signal escaping the device may require a via strategy. Follow the AMD package and design-guidance files for layer construction, ball assignment, via-in-pad or microvia treatment, and the 30-second peak-reflow-time limit. Run assembly and impedance simulations before releasing the fabrication package.
Use the manufacturer power-guidance tables for every supply rail and apply the required sequencing before programming the device. The listed core-supply figures include 1.03 V and 970 mV, but these values alone do not define the complete power architecture. Provide local high-frequency decoupling, minimize supply-loop area, isolate noisy external circuits, and verify startup, shutdown, sequencing, and current limits on hardware. Estimated power dissipation must be calculated from the actual design activity and resource utilization rather than copied from a generic device value.
Assign every one of the 900 package balls from the AMD Kintex-7 package-pinout files and compare the resulting map with the selected schematic symbols. Keep configuration pins, clock inputs, high-speed memory interfaces, serial transceivers, and differential I/O on the shortest practical routes. Provide continuous return paths below high-speed signals and use controlled-impedance geometry for external interfaces. Do not use the FFG676 package data for this FB900 device because ball count and pin assignment are different.
Treat speed-grade and temperature-suffix substitutions as engineering changes, not procurement aliases. The -1 and -2 Kintex-7 grades can affect timing margin and power behavior, while I, C, and E suffixes identify different temperature classes. Before replacing XC7K325T-1FB900I, rerun timing analysis, verify the selected power and temperature tables, confirm the exact device identifier, and inspect the programmer configuration procedures. Use a formal engineering-change record to preserve traceability.
Información de cumplimiento
The device listing identifies a lead-and-tin finish and non-compliant RoHS status. Other environmental and material-compliance attributes require confirmation from current manufacturer documentation.
