XC7Z010-1CL225I - 667MHz Dual Cortex-A9 SoC | AMD
N.º de pieza: XC7Z010-1CL225I ✓ ActivoXC7Z010-1CL225I Descripción general
A Zynq-7000 SoC is a heterogeneous system-on-chip, combining an ARM microprocessor subsystem and programmable FPGA logic in one package. This integration reduces component count and allows software running on the Cortex-A9 processors to exchange data directly with hardware implemented in the FPGA fabric. The result is a flexible platform for systems that need deterministic parallel processing alongside a conventional embedded software environment.
The XC7Z010-1CL225I provides two ARM Cortex-A9 cores, 28K FPGA logic cells, and a 667 MHz processor frequency. Its 225-CSPBGA package measures 13 mm by 13 mm according to distributor product data. The device operates from a nominal 1 V supply, with a stated minimum of 0.95 V and maximum of 1.05 V, and is identified as RoHS compliant. These characteristics position it as an entry-level Zynq device for designs requiring more parallelism than a conventional microcontroller provides.
The architecture allows designers to partition a design between software and programmable logic. Software can manage operating-system tasks, control flow, and external interfaces, while the FPGA fabric can implement parallel data paths, custom interfaces, signal processing, or timing-critical functions. The available data identifies this device as a Zynq-7000 SoC with an Artix-7 FPGA fabric, but detailed block counts, memory interfaces, I/O counts, and power characteristics require confirmation from the AMD device documentation.
Typical applications include industrial automation controllers, networked embedded gateways, motor and motion-control systems, communications equipment, sensor-processing platforms, and cost-sensitive FPGA-assisted processors. The dual Cortex-A9 configuration supports concurrent software workloads, while the FPGA fabric can accelerate operations that would otherwise burden the processor or require separate programmable logic.
When designing a board around the XC7Z010-1CL225I, engineers must follow the AMD Zynq-7000 package pinout and power-sequencing guidance. The BGA footprint requires appropriate PCB layout, thermal analysis, and assembly process controls. Because the available distributor snippet provides limited electrical detail, final power budgeting, decoupling, DDR memory connectivity, and I/O standards must be verified against the official manufacturer documentation before release.
Alternativas directas para XC7Z010-1CL225I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con XC7Z010-1CL225I (mismo factor de forma y huella) — difiere en External ADC Signal Pairs, FPGA Logic Cells, Package, Processor Core, RoHS Status.
XC7Z010-1CLG225I
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Ver hoja de datos →XC7Z010-2CLG225I
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XC7Z010-1CLG225C
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC7Z010-1CLG225E
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC7Z010-2CLG225E
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
XC7Z010-1CL225I Valores máximos y características eléctricas
| Device Type | Zynq-7000 adaptive system-on-chip |
| Processor Core | Dual ARM Cortex-A9 MPCore |
| Maximum Stated Frequency | 667 MHz |
| FPGA Logic Cells | 28,000 cells |
| FPGA Family | Artix-7 |
| Encapsulado | 225-CSPBGA, 13 mm x 13 mm |
| Nominal Core Supply Voltage | 1 V |
| Minimum Core Supply Voltage | 0.95 V |
| Maximum Core Supply Voltage | 1.05 V |
| Minimum Operating Temperature | -40 °C |
| Maximum Operating Temperature | +100 °C |
| Debug Support | CoreSight |
| Tipo de montaje | Surface Mount |
| Package Pin Count | 225 pins |
| Estado RoHS | RoHS compliant |
| External ADC Signal Pairs | 4 differential pairs |
Guía de configuración de pines de XC7Z010-1CL225I 225 pins
Configuración de pines para XC7Z010-1CL225I (encapsulado 225 pins). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para XC7Z010-1CL225I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
XC7Z010-1CL225I es adecuado para 6 aplicacións: Industrial Automation Controller, Embedded Communications Gateway, Parallel Sensor Processing, Motor and Motion Control, Programmable Signal Acquisition, Cost-Constrained FPGA-Assisted Processor.
Industrial Automation Controller
The XC7Z010-1CL225I fits industrial automation controllers because it combines two ARM Cortex-A9 cores at 667 MHz with 28,000 Artix-7 logic cells in a 225-CSPBGA package. Software can coordinate control tasks, communications, and diagnostics, while FPGA logic can implement deterministic parallel channels, custom industrial interfaces, or timing-sensitive signal processing. Its verified -40°C to +100°C operating range supports industrial equipment where temperature variation exceeds consumer conditions. The main design consideration is power budgeting: although the supplied data does not state typical or maximum dissipation, the board must provide the device's complete AMD-specified supply rails and decoupling. The 13 mm by 13 mm BGA also requires a qualified PCB stack-up, assembly profile, and thermal path rather than conventional through-hole assembly.
Recomendado
Embedded Communications Gateway
The XC7Z010-1CL225I is suitable for an embedded communications gateway where a 667 MHz dual-core processor and programmable logic must coexist in a compact 225-CSPBGA package. The Cortex-A9 subsystem can run networking, protocol, and supervisory software, while the 28K-cell FPGA fabric can accelerate packet handling, framing, buffering, or custom interfaces. This separation can reduce the load placed on the general-purpose processors and provides a path to deterministic latency. The available data does not specify transceiver types, I/O counts, or power consumption, so interface selection and throughput claims must remain tied to the final design. Board planning should reserve pins and power for external communications hardware, follow the AMD Zynq-7000 package pinout, and validate high-speed signal integrity with the selected PHY and connector implementation.
Recomendado
Parallel Sensor Processing
The XC7Z010-1CL225I can support parallel sensor-processing systems that benefit from hardware acceleration without introducing a separate FPGA. Its 28,000 FPGA logic cells allow sampling, filtering, thresholding, or data reduction pipelines to be implemented beside ARM Cortex-A9 software. Software can aggregate results, configure the acquisition logic, and communicate with an upstream controller. The verified industrial range of -40°C to +100°C is useful for equipment operating away from controlled room conditions. A key engineering trade-off is the balance between programmable logic capacity and external interface requirements, which are not quantified in the supplied data. Designers should therefore map sensors to the exact available package pins, confirm supported I/O standards through AMD documentation, and reserve logic and memory resources during early architecture planning.
Recomendado
Motor and Motion Control
The XC7Z010-1CL225I is a credible platform for motor and motion-control subsystems that combine supervisory software with deterministic hardware timing. The dual ARM Cortex-A9 cores can execute control algorithms, diagnostics, and user-interface tasks, while the Artix-7 fabric can implement pulse generation, position capture, or parallel condition monitoring. This arrangement allows critical timing paths to remain in programmable logic while the processor handles less deterministic work. The available information confirms a 667 MHz processor rating and 28,000 logic cells but does not provide the number of timers, PWM channels, or motor-driver interfaces. Therefore, engineers must map the required encoder, PWM, and protection signals to the official package data before committing the design. Printed-board layout should also preserve clean return paths for switching nodes and provide local decoupling at every required supply pin.
Recomendado
Programmable Signal Acquisition
The XC7Z010-1CL225I can be used in programmable signal-acquisition equipment where flexible logic and embedded processing must share one compact device. Its four external ADC signal pairs, documented for the 7z010 CLG225 devices, provide dedicated analog-input interfaces, while the FPGA fabric can implement capture control, digital filtering, and data formatting. The Cortex-A9 subsystem can then manage buffering, configuration, analysis, and host communication. The verified package is a 225-CSPBGA measuring 13 mm by 13 mm, making miniaturization possible but increasing assembly complexity relative to leaded packages. Designers should verify the exact ADC characteristics, supported input ranges, and sample-rate limits in the official AMD documentation. PCB signal-integrity analysis and controlled return paths are essential when the acquisition front end includes fast edges or sensitive analog references.
Recomendado
Cost-Constrained FPGA-Assisted Processor
The XC7Z010-1CL225I fits cost-constrained FPGA-assisted processor platforms that need programmable logic without the resource level of a larger Zynq device. Its 28,000 logic cells and dual Cortex-A9 processors provide a balanced architecture for control software, small custom accelerators, and peripheral bridging in a 225-CSPBGA package. A verified starting price of $34.0505 as of 2026-10-28 may make it attractive for prototypes and volume industrial products, although real production cost depends on quantity and sourcing. The primary engineering constraint is resource planning: exact RAM, DSP, and I/O availability are not included in the supplied data and must be checked against the official device table. Teams should avoid assuming that every function implemented in software can be moved into the 28K-cell fabric without evaluating timing closure and external memory requirements.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XC7Z010-1CL225I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XC7Z010-1CLG225I | XC7Z010-2CLG225I | XC7Z010-1CLG225C | XC7Z010-1CLG225E | XC7Z010-2CLG225E |
|---|---|---|---|---|---|---|
| Package | 225-CSPBGA (13x13) | 225-CSPBGA (13x13) - same | 225-CSPBGA (13x13) - same | 225-CSPBGA (13x13) - same | 225-CSPBGA (13x13) - same | 225-CSPBGA (13x13) - same |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Maximum Stated Frequency | 667 MHz | 667 MHz | 766 MHz | 667 MHz | 667 MHz | 766 MHz |
| Operating Temperature Range | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | 0°C to +85°C | -40°C to +125°C | -40°C to +125°C |
Diferenciadores clave
- Processor and FPGA resources are integrated in one device (frente a XC7Z010-1CLG400I)
- Industrial operating range supports wider ambient conditions (frente a XC7Z010-1CLG225C)
- Higher-frequency same-package option is available when timing margin is required (frente a XC7Z010-2CLG225I)
Notas de diseño
Use the exact AMD Zynq-7000 package and pinout files for the selected device rather than relying on the generic BGA-225 library drawing. The supplied AMD resource states that package files are provided in TXT and CSV formats and references UG865 for their format. Review power, ground, configuration, high-speed, and user I/O assignments from the exact package file before routing the 225-CSPBGA footprint and defining assembly land patterns.
The verified data provides a nominal 1 V core supply with a 0.95 V to 1.05 V range, but it does not provide the complete external power-tree requirements or dissipation figures. Determine all required rails, sequencing, decoupling, and startup limits from the official AMD device documentation. Do not size a regulator from the core-voltage range alone, because processor, I/O, auxiliary, and memory-supply requirements are separate engineering constraints.
A 13 mm by 13 mm BGA package can concentrate heat around the device, particularly when the FPGA fabric and Cortex-A9 subsystem are active concurrently. The supplied data does not state junction temperature, thermal resistance, or power dissipation, so no numerical heatsink calculation can be made. Use the official power estimates and package thermal model, preserve thermal-via access beneath the device, and validate junction temperature across ambient temperature and workload conditions.
Do not treat XC7Z010-1CL225I and XC7Z010-1CLG225I as interchangeable without checking the AMD ordering guide. The retrieved distributor pages consistently document CLG225I while the requested MPN uses CL225I. Reconcile the suffix, speed grade, temperature grade, package code, and device marking against the manufacturer source before approving the BOM, footprint, or purchasing against a single-source commitment.
Información de cumplimiento
RoHS compliance is explicitly present in the retrieved LCSC and JLCPCB product snippets. The supplied data does not state REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status.
