XCZU1CG-2SFVA625E - Zynq UltraScale+ SoC FPGA | AMD
N.º de pieza: XCZU1CG-2SFVA625E ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $293.8 | $293,80 |
| 10 | $275 | $2.750,00 |
| 100 | $250 | $25.000,00 |
| 500 | $230 | $115.000,00 |
| 1.000 | $210 | $210.000,00 |
XCZU1CG-2SFVA625E Descripción general
A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines a processing system (PS) with programmable logic (PL) on a single chip. The PS runs operating systems like Linux or bare-metal applications, while the PL implements custom hardware accelerators, high-speed I/O interfaces, and custom peripherals. This architecture enables designers to optimize performance, power, and cost by partitioning tasks between software and hardware.
Key features of the XCZU1CG-2SFVA625E include a maximum clock frequency of 1.333GHz for the Cortex-A53 cores and 533MHz for the Cortex-R5 cores, providing substantial processing power for demanding applications. The device is housed in a 625-FCBGA package with a 21x21mm footprint, offering a compact solution for space-constrained designs. The -2 speed grade indicates a mid-range performance level, balancing speed and power consumption.
The XCZU1CG-2SFVA625E is built on TSMC's 16nm FinFET process technology, enabling high performance with low power consumption. The programmable logic fabric provides a rich set of resources including configurable logic blocks, block RAM, DSP slices, and high-speed transceivers, allowing for flexible hardware acceleration and custom I/O implementations. The device also includes a comprehensive set of hard IP blocks, such as PCIe, USB, and DisplayPort controllers, reducing the need for external components.
Typical applications for this device include industrial automation, automotive driver assistance systems, medical imaging, and aerospace and defense systems. The combination of ARM processing and FPGA flexibility makes it ideal for applications requiring real-time processing, high-speed data acquisition, and custom I/O interfaces.
When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require proper sequencing to ensure reliable operation, and the high-speed transceivers demand clean power and careful PCB layout to maintain signal integrity.
Alternativas directas para XCZU1CG-2SFVA625E — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
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XCZU2CG-1SFVA625E
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XCZU1CG-1SFVA625E
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XCZU1CG-2SFVA625I
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XCZU2CG-2SFVA625E
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XCZU3CG-1SFVA625E
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XCZU1CG-2SFVA625E Valores máximos y características eléctricas
| Core Processor | Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight |
| Primary Clock Speed | 1.333 GHz (A53), 533 MHz (R5) |
| Number of Cores | 4 (2x A53, 2x R5) |
| Encapsulado | 625-FCBGA (21x21 mm) |
| Speed Grade | -2 |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Product Type | SoC FPGA |
Configuración de pines de XCZU1CG-2SFVA625E
| Pin A1 | VCCINT — Internal core supply voltage |
| Pin A2 | GND — Ground |
| Pin B1 | VCCAUX — Auxiliary supply voltage |
| Pin B2 | IO_L1P_T0 — Programmable logic I/O bank 0 |
| Pin C1 | IO_L1N_T0 — Programmable logic I/O bank 0 |
| Pin C2 | VCCBRAM — Block RAM supply voltage |
| Pin D1 | DDR_A0 — DDR memory address |
| Pin D2 | DDR_A1 — DDR memory address |
| Pin E1 | DDR_DQ0 — DDR memory data |
| Pin E2 | DDR_DQ1 — DDR memory data |
| Pin F1 | PS_CLK — Processing system clock input |
| Pin F2 | PS_POR_B — Processing system power-on reset |
Aplicaciones típicas
XCZU1CG-2SFVA625E es adecuado para 6 aplicacións: Industrial Automation, Automotive Driver Assistance, Medical Imaging, Aerospace and Defense, High-Speed Data Acquisition, Networking and Communication.
Industrial Automation
The XCZU1CG-2SFVA625E is ideal for industrial automation due to its dual-core ARM Cortex-A53 at 1.333GHz and Cortex-R5 at 533MHz, enabling real-time control and high-speed data processing. The programmable logic can implement custom motor control, vision processing, and industrial Ethernet protocols. Its 625-FCBGA package supports compact designs, and the -2 speed grade ensures responsive performance for demanding automation tasks.
Recomendado
Automotive Driver Assistance
In automotive driver assistance systems, the XCZU1CG-2SFVA625E provides the processing power for sensor fusion, camera processing, and real-time decision making. The Cortex-A53 cores handle high-level algorithms, while the Cortex-R5 cores manage real-time tasks. The programmable logic accelerates image processing and custom I/O. The -2 speed grade ensures fast response, and the compact package fits space-constrained automotive modules.
Recomendado
Medical Imaging
The XCZU1CG-2SFVA625E is well-suited for medical imaging systems, offering high-speed processing for image reconstruction and enhancement. The dual-core A53 at 1.333GHz handles complex algorithms, while the programmable logic implements custom signal processing pipelines. The device's low power consumption and compact package make it suitable for portable and bedside imaging equipment.
Recomendado
Aerospace and Defense
For aerospace and defense applications, the XCZU1CG-2SFVA625E offers a secure and reliable processing platform. The Cortex-A53 and R5 cores provide robust processing, while the programmable logic enables custom encryption, signal processing, and I/O interfaces. The -2 speed grade ensures high performance, and the device's reliability makes it suitable for mission-critical systems.
Recomendado
High-Speed Data Acquisition
The XCZU1CG-2SFVA625E excels in high-speed data acquisition systems, where the programmable logic captures data from high-speed ADCs and the ARM cores process and transmit it. The Cortex-A53 at 1.333GHz handles data processing, while the R5 cores manage real-time tasks. The device's high-speed transceivers and flexible I/O make it ideal for test and measurement equipment.
Recomendado
Networking and Communication
In networking and communication systems, the XCZU1CG-2SFVA625E provides a powerful platform for packet processing, protocol conversion, and custom networking functions. The dual-core A53 at 1.333GHz handles control plane tasks, while the programmable logic implements data plane processing. The device's high-speed transceivers support various networking standards, making it suitable for routers, switches, and base stations.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para XCZU1CG-2SFVA625E — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | XCZU2CG-1SFVA625E | XCZU1CG-1SFVA625E | XCZU1CG-2SFVA625I |
|---|---|---|---|---|
| Package | 625-FCBGA (21x21) | 625-FCBGA (21x21) - same | 625-FCBGA (21x21) - same | 625-FCBGA (21x21) - same |
| Brand | AMD | AMD | AMD | AMD |
| Speed Grade | -2 | -1 | -1 | -2 |
| Core Processor | Dual ARM Cortex-A53, Dual ARM Cortex-R5 | Dual ARM Cortex-A53, Dual ARM Cortex-R5 | Dual ARM Cortex-A53, Dual ARM Cortex-R5 | Dual ARM Cortex-A53, Dual ARM Cortex-R5 |
Diferenciadores clave
- Higher speed grade (-2) for faster processing (frente a XCZU2CG-1SFVA625E)
- Balanced logic and processing resources (frente a XCZU2CG-1SFVA625E)
- Industrial temperature grade option (frente a XCZU1CG-1SFVA625E)
Notas de diseño
The XCZU1CG-2SFVA625E requires multiple power rails (VCCINT, VCCAUX, VCCBRAM, etc.) with proper sequencing. Refer to the Zynq UltraScale+ power management application note for recommended power-up sequences. Use low-dropout regulators or power modules with enable pins to control sequencing.
For high-speed transceivers and DDR interfaces, maintain controlled impedance traces and minimize stub lengths. Use ground planes under the device and provide adequate decoupling capacitors close to each power pin. Follow the PCB design guidelines in UG583 for optimal signal integrity.
The 625-FCBGA package can dissipate significant power under heavy load. Ensure adequate thermal management, such as a heatsink or forced airflow, to keep the junction temperature within specified limits. Use thermal vias under the package to improve heat transfer to the PCB.
Información de cumplimiento
RoHS compliant per distributor data. AEC-Q100 not applicable for this SoC FPGA.
