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محصولات (38,000+)

XC3090L-8TQ176I - 5000 Gates FPGA, 320 CLBs, 80 MHz | Xilinx
XC3090L-8TQ176I

XC3090L-8TQ176I - 5000 Gates FPGA, 320 CLBs, 80 MHz | Xilinx

The Xilinx XC3090L-8TQ176I is a CMOS Field-Programmable Gate Array from the legacy XC3000 series offering 320 Configurable Logic Blocks (CLBs), a maximum of 5000 equivalent gates, and up to 6000 usable gates, housed in a 176-pin TQFP (TQ176) surface-mount package with industrial temperature grading. The device is built on a 0.6 um CMOS process and operates from a single 5V supply with a maximum clock frequency of 80 MHz and a combinatorial CLB delay of 6.7 ns at the -8 speed grade. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a perimeter of user-configurable I/O Blocks (IOBs) with a core array of Configurable Logic Blocks (CLBs) and programmable interconnect, all controlled by an SRAM-based configuration program store. FPGAs sit hierarchically under programmable logic, then digital integrated circuits, and ultimately the broader semiconductor taxonomy; the XC3000 family occupies the early-generation, 5V legacy tier that preceded modern low-power Virtex and Kintex families. Key features include 144 user I/Os in the TQ176 footprint, distributed on-chip RAM, JTAG boundary-scan support, and tri-state buffers per IOB. The architecture supports asynchronous and synchronous design entry through Xilinx's XACT development system, including schematic capture, automatic place-and-route, logic and timing simulation, and interactive design optimization. The -8 speed grade denotes the mid-tier performance bin of the XC3090L family, with faster -9/-10 grades unavailable in this part number and slower -6/-7 grades reserved for cost-sensitive designs. Typical applications include industrial control glue logic, legacy telecom backplane interfaces, military and aerospace retrofit boards, and educational laboratory trainers where designers migrate proven XC3000 designs forward without re-validating timing closure. The wide 5V tolerance and TTL-compatible I/Os also make it suitable for bridging older ASICs to newer microprocessors. When designing with this part, treat the 6.7 ns CLB delay as the budget floor for the slowest logic path: multiply by the number of cascaded CLBs and add interconnect delay to estimate the system clock. Configuration storage is volatile, so external PROMs (XC17xx) are required for standalone boot. This page synthesizes distributor stock, lifecycle status, same-package alternatives, and practical design notes not found in the standalone XC3090L datasheet, designed to assist sourcing engineers working on legacy Xilinx FPGA maintenance and obsolescence mitigation.

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XC3090L-8TQG176C - 320 CLB FPGA, 6K Gates, 80MHz, TQFP-176 | Xilinx
XC3090L-8TQG176C

XC3090L-8TQG176C - 320 CLB FPGA, 6K Gates, 80MHz, TQFP-176 | Xilinx

The Xilinx XC3090L-8TQG176C is a 3.3 V, low-voltage CMOS Field Programmable Gate Array from the Xilinx XC3000L Logic Cell Array family, packaged in a 176-pin Thin Quad Flat Pack (TQFP). It contains 320 Configurable Logic Blocks (CLBs), delivers approximately 5,000 equivalent gates (with up to 6,000 usable gates), and supports system clock rates up to 80 MHz. What is an FPGA? A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement custom digital circuits by configuring an array of logic blocks and routing resources after manufacturing. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) within the semiconductor category, alongside Complex PLDs (CPLDs). They differ from CPLDs in architecture: FPGAs use a fine-grained array of look-up tables (LUTs) and SRAM-based configuration memory, offering higher logic density and richer register-rich datapaths, while CPLDs use macrocell-based, non-volatile architectures optimized for glue logic and fast pin-to-pin combinational delays. The Xilinx XC3000L family specifically targets low-voltage (3.3 V), high-volume designs where predictable timing and low power are required. Key features of the XC3090L-8TQG176C include 320 CLBs organized in a symmetric array, on-chip SRAM-based configuration memory (reprogrammable in-system), TTL-compatible I/O, and the -8 speed grade. The -8 speed grade corresponds to a slower timing bin, trading absolute clock frequency for lower cost; faster -6 and -7 bins are also offered in the same family. The device is configured externally from an EEPROM, EPROM, ROM, or disk file, with on-chip initialization logic handling the configuration handshake. Typical applications span legacy industrial control boards, telecommunications glue logic, prototyping of state machines and bus interfaces, and design migration from discrete TTL/CMOS MSI logic to a single programmable device. The TQFP-176 footprint is widely accepted for through-hole-era replacements and older PCI and ISA-style add-in cards where surface-mount assembly is feasible but BGA is not yet adopted. When designing with the XC3090L-8TQG176C, note that the part is in long-term EOL and should be qualified against remaining distributor stock before any new design-in. Designers should verify lead-free reflow compatibility (the original XC3000L family was specified for SnPb process), and confirm configuration mode (serial vs. parallel) against board-level pull-up resistors and DONE/PROG sequencing. This page synthesizes distributor stock levels, drop-in same-package XC3000L variants, and practical obsolescence-management notes not found in the original manufacturer datasheet.

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XC3090L-8TQG176I - 9000 Gates FPGA, 80 MHz, 176-pin LQFP | Xilinx
XC3090L-8TQG176I

XC3090L-8TQG176I - 9000 Gates FPGA, 80 MHz, 176-pin LQFP | Xilinx

The Xilinx XC3090L-8TQG176I is a CMOS Field Programmable Gate Array from the legacy XC3000L low-voltage family, offering approximately 5000 usable gates (up to 9000 equivalent system gates) implemented across 320 Configurable Logic Blocks (CLBs) in a 176-pin TQG/LQFP package. It supports a maximum clock frequency of 80 MHz with a CLB combinatorial delay of 6.7 ns at the -8 speed grade, targeting high-density glue-logic, prototyping, and industrial control applications where ASIC-class integration is not yet justified. What is an FPGA? A Field-Programmable Gate Array is a reconfigurable digital integrated circuit whose logic fabric and interconnect can be programmed by the end user after manufacture. Within the taxonomy of digital ICs, an FPGA sits between an Application-Specific Integrated Circuit (ASIC) and a microcontroller: an ASIC is hard-wired for one function but offers the lowest unit cost at high volume, while an FPGA trades per-unit cost for design flexibility, parallel hardware execution, and rapid time-to-market. The XC3000 family pioneered SRAM-based configuration and the now-universal island-style CLB + IOB + programmable interconnect architecture that defines the modern FPGA. Key features of the XC3090L-8TQG176I include on-chip SRAM-based configuration store, three types of configurable elements (perimeter I/O Blocks, core CLB array, and routing channels), industrial-grade -40C to +85C operating range (I suffix), and the low-voltage L-suffix core that reduces 5V-family power. The device is housed in a 176-terminal LQFP/TQFP package on a 0.5 mm pitch with gull-wing leads suitable for surface-mount assembly and rework. Technically, the XC3000L family uses a 5V-tolerant I/O structure with 3.3V or 5V core options, hierarchical interconnect including long lines, hex lines, and direct connects, and configurable IOBs that support registered, latched, or combinatorial I/O with tri-state control. The architecture integrates a configuration program store so the array can be re-programmed in-system via the standard Xilinx configuration interface. Typical applications span industrial control systems, telecommunications glue logic, prototyping platforms for ASIC emulation, test and measurement fixtures, military/aerospace subsystems, and educational development kits where students learn HDL synthesis on a mature, well-documented device family. The TQG176 package is the highest-density option for this die. When designing with the XC3090L-8TQG176I, note that this device family is mature (introduced in the early-to-mid 1990s), so verify long-term availability and second-source supply before committing new production designs. New designs should weigh migration to the Xilinx CoolRunner-II CPLD or Spartan-6/Spartan-7 FPGA families for active lifecycle status and modern toolchain support. This page synthesizes distributor pricing, XAIPART in-stock tiers, pin-compatible Xilinx drop-in alternatives drawn from the XC3000L family, and practical design notes on configuration, I/O banking, and legacy toolchain compatibility not found in the original datasheet.

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XC3090LTM-100PC84C - 6K Gate, 320-Cell FPGA 5V 84-PLCC | Xilinx
XC3090LTM-100PC84C

XC3090LTM-100PC84C - 6K Gate, 320-Cell FPGA 5V 84-PLCC | Xilinx

The Xilinx XC3090LTM-100PC84C is a CMOS Field Programmable Gate Array (FPGA) from the legacy XC3000 Logic Cell Array family, delivering approximately 6,000 usable gates and 320 Configurable Logic Blocks (CLBs) in an 84-pin Plastic Leaded Chip Carrier (PLCC) package. Operating at 5V CMOS technology with a 100 MHz internal performance grade, the device is rated for commercial temperature conditions and targets low-voltage logic integration where fine-grained parallel logic is required. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that combines the density of gate arrays with the design flexibility of in-system programmability. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA -> SoC FPGA) and are widely used to implement custom digital logic, glue logic, bus interfaces, and parallel datapaths without committing to a masked ASIC. The XC3000 family is the third-generation Xilinx architecture that introduced distributed Configurable Logic Blocks with look-up table-based logic, complemented by a programmable interconnect matrix and I/O blocks. Key features of the XC3090LTM-100PC84C include 320 CLBs, a typical gate count range of 5,000 to 6,000 gates, 100 MHz system performance, and 5V CMOS core technology. The PLCC-84 (PC84) package uses J-lead surface-mount terminals in a square ceramic/plastic body, supporting legacy through-hole-style PCB assembly processes. The XC3000 family pioneered SRAM-based configuration, allowing infinite re-programmability via an external configuration PROM or microcontroller bitstream load. From an architecture perspective, the XC3000L family uses 5V-tolerant I/O buffers, distributed RAM capability in select CLB modes, and a hierarchical interconnect that routes signals between logic blocks with predictable delay. The 'LTM' suffix designates the low-voltage / commercial temperature variant in the XC3000 family. Compared with modern 28nm or 16nm FPGAs, the XC3090LTM-100PC84C delivers modest logic density but remains useful for legacy board retrofits, education platforms, and industrial systems where proven long-life silicon is required. Typical applications include industrial control glue logic, legacy telecommunications interfaces, military and aerospace retrofits (through QML equivalents), educational FPGA training platforms, and digital signal preprocessing where low-cost parallel logic suffices. The 84-pin PLCC footprint is socket-compatible with the broader XC3000/XC3100/XC3300 84-pin PLCC family, simplifying board reuse across multiple design generations. When designing with this device, ensure proper configuration circuitry is included - the SRAM-based XC3000 family requires a configuration bitstream at every power-up. Plan for 5V supply decoupling, and verify I/O voltage compatibility with downstream CMOS or TTL peripherals. Engineers targeting new designs should consider the device's NRND/EOL status and confirm lifetime-buy availability for production runs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing a single reference for engineers evaluating the XC3090LTM-100PC84C for both new designs and legacy support scenarios.

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XC3090LTM-125PC84C - 5000 Gates XC3000L FPGA, 125MHz, PLCC-84 | Xilinx
XC3090LTM-125PC84C

XC3090LTM-125PC84C - 5000 Gates XC3000L FPGA, 125MHz, PLCC-84 | Xilinx

The Xilinx XC3090LTM-125PC84C is a 5000-gate, 125 MHz Field Programmable Gate Array (FPGA) from the legacy XC3000L Low-Voltage Logic Cell Array family, housed in an 84-pin Plastic Leaded Chip Carrier (PLCC-84) package. It delivers approximately 5000 equivalent gates, 320 Configurable Logic Blocks (CLBs), and 928 flip-flops, with a maximum clock frequency of 125 MHz. The 'L' suffix denotes the low-voltage 3.3 V core variant, and 'TM' indicates the commercial plastic-leaded chip carrier package grade. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic functions using an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic devices (PLDs), which sit between fixed-function ASICs and discrete logic ICs in flexibility and integration. The XC3000L family was Xilinx's third-generation low-voltage FPGA line, succeeding the original XC3000 by operating from 3.0 V to 3.6 V supplies instead of 5 V, enabling lower power consumption for portable and battery-powered designs of the 1990s. Key features include 320 CLBs, 928 flip-flops, 138 user I/Os, 4.75 V to 5.25 V supply range for the I/O bank, an internal 3.3 V core, and a 125 MHz maximum toggle/clock frequency. The device supports JTAG-based boundary-scan testing, on-chip configuration memory, and tri-state output buffers per I/O. The PLCC-84 through-hole package provides robust mechanical mounting suitable for industrial and legacy equipment designs. Technically, the XC3090LTM-125PC84C uses SRAM-based configuration cells, meaning the bitstream must be loaded from an external ROM or microcontroller at every power-up. This volatile configuration enables unlimited re-programming cycles in the field, but requires a separate configuration PROM such as the XC1736 or compatible serial-loader device. The architecture implements a symmetrical array of CLBs surrounded by perimeter I/O blocks (IOBs), which was the industry-standard FPGA floorplan of that era. Typical applications include industrial control logic, telecom interface glue logic, legacy peripheral adapters, and test-and-measurement custom instrumentation. The wide I/O count (138) supports parallel buses and high-pin-count glue-logic designs. When designing with this FPGA, allocate at least 4 clock-pad pins for global clock distribution and ensure the configuration PROM timing aligns with the XC3090LTM power-on reset sequence. For new designs, consider migrating to a modern Xilinx 7-series or Spartan-6 device, since the XC3000L family is no longer recommended for new designs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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XC3090LTM-8PC84C - XC3000L FPGA, 6K Gates, 84-PLCC | Xilinx
XC3090LTM-8PC84C

XC3090LTM-8PC84C - XC3000L FPGA, 6K Gates, 84-PLCC | Xilinx

The Xilinx XC3090LTM-8PC84C is a member of the legacy XC3000L Low Voltage Logic Cell Array family, delivering approximately 6,000 usable gates in an 84-pin Plastic Leaded Chip Carrier (PLCC) package. The device is built on a 0.8-micron CMOS SRAM-based architecture and operates from a 3.0 V to 3.6 V core supply, with the "L" suffix designating low-voltage operation relative to the original 5 V XC3000 series. The "TM" suffix indicates a specific speed/grade combination within the XC3000L family. A Field Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells. The user-defined logic function is loaded into on-chip static memory cells from an external boot source such as an EEPROM, EPROM, ROM, or microprocessor. Once configured, the FPGA behaves as a dedicated custom digital circuit. The XC3000 family was Xilinx's pioneering commercial FPGA line, establishing the FPGA architecture still dominant in the industry today, and the XC3000L variant extends that architecture to lower-voltage 3.3 V systems where power dissipation is a primary concern. Key features of the XC3090LTM-8PC84C include approximately 320 Configurable Logic Blocks (CLBs), 64,160 bits of distributed configuration memory, and an 84-pin PLCC package with J-lead surface-mount terminations. The device supports in-system configuration via the Xilinx XC3000 configuration bitstream and is footprint-compatible with other XC3090L members that share the PC84 pinout. Logic delays are typically in the 5-10 ns range, sufficient for moderate-speed glue logic, bus interfacing, state-machine implementation, and small processor prototyping on 3.3 V rails. Typical applications include legacy 3.3 V digital glue logic replacement, prototype ASIC emulation, custom peripheral interfacing for microcontrollers, parallel bus arbitration, and industrial control subsystems where 5 V FPGAs are no longer acceptable. The 84-PLCC package also supports through-hole and socket-based prototyping, which is convenient for engineering development and low-volume production. Designers should note that the XC3000L family is legacy silicon - the Xilinx WebPACK and modern Vivado tools do not support these devices. Programming requires the legacy XACT or older Foundation toolchains, and configuration bitstreams generated for XC4000, Spartan, or 7-series FPGAs are incompatible. Engineers maintaining legacy systems should verify the configuration PROM and toolchain availability before committing to new designs.

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XC3S1000-4FG676I - 1M Gate Spartan-3 FPGA | AMD/Xilinx
XC3S1000-4FG676I

XC3S1000-4FG676I - 1M Gate Spartan-3 FPGA | AMD/Xilinx

AMD/Xilinx XC3S1000-4FG676I is a Spartan-3 field-programmable gate array with 1,000,000 system gates, 442,368 logic cells, 17,280 slices, and 391 user I/O, packaged in a 676-ball fine-pitch ball grid array. The device operates from a 1.14 V minimum supply, uses 1.2 V core technology, and is built on a 90 nm process. An FPGA is a programmable-logic semiconductor whose configurable logic blocks, programmable input/output blocks, embedded resources, and routing fabric can be configured after manufacture. Within the semiconductor hierarchy, the XC3S1000 belongs to the FPGA and CPLD family, specifically the Spartan-3 low-cost logic-device series. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement multiple digital functions in one device and can be reprogrammed for design revisions, prototypes, and product variations. The principal device characteristics are 630 MHz advertised operating speed, 442,368 logic cells organized into 17,280 slices, 1,000,000 system gates, and 391 user I/O. Its 676-ball FBGA package provides a large, fine-pitch connection interface suitable for systems requiring substantial external connectivity. The -4 speed designation identifies one of the device's supported performance grades, while the I suffix identifies the industrial ordering variant. Spartan-3 devices combine configurable logic with dedicated arithmetic, block RAM, and digital signal processing resources. These resources allow parallel datapaths, embedded memories, state machines, communication interfaces, and control logic to be consolidated into a single programmable component. The architecture is useful when a design must evolve faster than an application-specific ASIC mask set or when field updates are required after deployment. Typical uses include industrial control, communications equipment, instrumentation, embedded test systems, video processing, and general-purpose digital prototyping. The 391 I/O count can support external memory, data converters, network transceivers, clocks, and displays, although a complete design must account for bank-specific supply requirements, dedicated configuration pins, and I/O-standard constraints. PCB implementation requires a fine-pitch 676-ball BGA footprint, careful power and ground distribution, and controlled-impedance routing. Configuration storage, decoupling, clocking, and JTAG access must also be planned according to the Spartan-3 configuration and power-architecture guidance. The large BGA also complicates prototype assembly and inspection. This page organizes the verified electrical, logical, packaging, and sourcing characteristics of the XC3S1000-4FG676I, compares same-footprint Spartan-3 speed and temperature-grade variants, and provides practical guidance for migration, power planning, BGA layout, configuration, and system integration.

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XC3S1000-5FG676C - 1M Gate 676-BGA Spartan-3 FPGA | AMD
XC3S1000-5FG676C

XC3S1000-5FG676C - 1M Gate 676-BGA Spartan-3 FPGA | AMD

AMD XC3S1000-5FG676C is a Spartan-3 field-programmable gate array with 1,000,000 system gates, 17,280 logic cells, and 391 user I/Os, packaged in a 676-ball fine-pitch BGA. It operates from a 1.2 V core supply and is manufactured using 90 nm CMOS technology. The device combines programmable logic, dedicated block RAM, and a broad user-I/O interface in a 27 mm by 27 mm surface-mount package. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, and interconnect resources are configured after manufacture. In the broader hierarchy, an FPGA belongs to programmable logic devices, alongside complex programmable logic devices, and operates as a configurable element within an embedded control or signal-processing system. This flexibility allows one physical device to implement multiple hardware functions and supports product revisions without changing the printed circuit board. The Spartan-3 architecture provides 442,368 total RAM bits alongside 17,280 logic cells. Its 391 user I/Os support integration with external memory, converters, clocks, communications links, and control peripherals. The -5 speed designation identifies the device's performance grade, while the C suffix denotes the commercial temperature grade associated with an operating range of 0°C to 85°C. The 676-ball FBGA package supports dense board routing while requiring careful escape routing and multilayer PCB construction. Technical complexity increases with the number of available logic and I/O resources. Designers must account for clock-domain constraints, supported I/O standards, memory bandwidth, pin placement, and the finite routing capacity of the selected FPGA. Configuration data controls the implemented circuit, so the bitstream, configuration interface, clock source, startup behavior, and reset strategy should be validated as one complete design rather than treated as isolated device features. Typical uses include industrial automation, communications equipment, embedded video control, test and measurement, and general-purpose digital signal processing. In an industrial controller, the FPGA can combine parallel interface logic, protocol conversion, and deterministic sampling in one device. In communications equipment, the same programmable fabric can adapt to different framing and signaling requirements while providing 442,368 RAM bits for buffering or packet processing. PCB implementation is the principal practical consideration for this 676-ball package. Use a board stackup that supports the required escape-routing density, place decoupling close to every supply ball, and follow the manufacturer's ball-map and layout guidance for power, ground, and configuration pins. Confirm the selected footprint and pin assignments against the package drawing before releasing the design. This product page combines the device specifications, same-footprint replacement options, engineering guidance, application fit, and package-related constraints into a practical engineering reference. It also distinguishes exact published attributes from parameters that still require confirmation before schematic or PCB sign-off.

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XC3S100E-4TQ144I - 2,160-Cell Spartan-3E FPGA | Xilinx
XC3S100E-4TQ144I

XC3S100E-4TQ144I - 2,160-Cell Spartan-3E FPGA | Xilinx

The Xilinx XC3S100E-4TQ144I is a Spartan-3E field-programmable gate array with 2,160 logic cells, 240 logic blocks, 73,728 RAM bits, and 108 user I/O pins. It operates from a nominal 1.2 V core supply, supports a 1.14 V to 1.26 V voltage range, and is packaged in a 144-pin TQFP. The -4 speed grade supports operation up to 572 MHz. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, and I/O behavior can be configured after manufacture. The XC3S100E belongs to the Spartan-3E FPGA family, which sits within the broader hierarchy of FPGA, programmable logic, digital semiconductor, and embedded-electronics components. This makes it suitable for designs requiring parallel logic, control, data acquisition, interface bridging, or programmable signal processing. The device provides 50,000 system gates and 2,160 logic cells, providing a practical capacity for control logic, protocol interfaces, state machines, and small embedded signal-processing functions. Its 73,728 RAM bits can support data buffering, packet storage, lookup tables, and configuration or working memory. The 108 user I/O pins give a system designer substantial connectivity for buses, counters, serial links, and external data acquisition devices. The XC3S100E-4TQ144I uses a 1.2 V CMOS core and is specified for an industrial temperature range of -40°C to +100°C. The -4 designation identifies its performance grade, while the 144-pin TQFP package provides a conventional leaded surface-mount format with exposed thermal and thermal-pad considerations that must be handled according to the package drawing. Its 90 nm Spartan-3E process generation emphasizes low-cost programmable logic rather than the very high performance of larger modern FPGA families. Typical applications include industrial control and automation, data-acquisition front ends, communications protocol converters, embedded test equipment, instrumentation, and compact embedded-processing subsystems. The device can implement parallel-to-serial conversion, FIFO-based data movement, state-machine control, and custom peripheral functions while allowing firmware or logic revisions without changing the PCB. When assigning this FPGA, verify the exact pin assignments, bank supply requirements, configuration interface, clock topology, and I/O standards against the Spartan-3E family data sheet. The industrial temperature grade makes the part appropriate for temperature-challenged equipment, but the legacy 90 nm process and 2,160-cell limit should be considered against system timing, memory, and current design requirements. This product record combines manufacturer-family technical data with practical distinctions between temperature-grade, lead-free, and extended-temperature ordering variants. It also documents drop-in footprint considerations, configuration and design guidance, and application-specific fit so engineers can evaluate the XC3S100E-4TQ144I against other 144-pin Spartan-3E devices before committing to a design.

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XC3S100E-5TQ144C - Spartan-3E 100K FPGA | AMD
XC3S100E-5TQ144C

XC3S100E-5TQ144C - Spartan-3E 100K FPGA | AMD

The AMD XC3S100E-5TQ144C is a Spartan-3E field-programmable gate array with 2,160 logic cells, 108 user I/O pins, and 73,728 RAM bits in a 144-pin TQFP package. The -5 speed grade operates with a 1.14 V to 1.26 V core supply and is positioned for designs requiring up to 657 MHz device performance. A field-programmable gate array is a configurable digital semiconductor whose logic, memory, and I/O can be programmed after fabrication. The FPGA hierarchy extends from configurable logic blocks and look-up tables through the Spartan-3E family to the broader FPGA and programmable-logic-device categories. This flexibility allows one physical package to support multiple interfaces, control functions, and signal-processing implementations. Key device resources include 2,160 logic cells, 240 logic array blocks, 108 user I/O pins, and 73,728 RAM bits. The 144-lead surface-mount package provides substantially more I/O than the smaller Spartan-3E package options. The listed operating temperature range of 0°C to 85°C suits commercial equipment, while the C designation identifies the commercial product grade. The Spartan-3E architecture combines programmable logic, dedicated block RAM, and configurable I/O in a single CMOS device. Its 90 nm CMOS implementation is identified in the manufacturer-family documentation, while the -5 suffix denotes the performance grade used in the ordering code. Engineers should distinguish the device's maximum characterized clock frequency from the frequency actually achievable by a specific design, because routing, timing constraints, logic utilization, and I/O requirements determine the final operating point. Typical uses include industrial control, embedded instrumentation, communication interfaces, digital signal conditioning, and compact embedded systems. The 108 available user I/O positions are especially useful for parallel buses, status and control signals, counters, and multi-channel acquisition systems. The 73,728 RAM bits also permit local buffering, packet storage, counters, and small state-machine implementations without depending entirely on external memory. A critical design consideration is the limited I/O voltage relationship of this legacy FPGA family. Confirm the bank-specific supply requirements, decoupling, clock topology, configuration source, and termination network against the Spartan-3E datasheet before layout release. A 144-pin TQFP also demands careful escape routing between its 0.5 mm pitch leads, so a stable multilayer stack-up and adequate ground-plane continuity are important. This product page combines verified device parameters, same-package replacement options, application guidance, and design-focused comparison information. It also highlights which characteristics are confirmed for the exact XC3S100E-5TQ144C ordering code and which engineering details must be checked in the Spartan-3E documentation before a new board is released.

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XC3S1500-4FG676C - 1.5M Gate Spartan-3 FPGA | AMD
XC3S1500-4FG676C

XC3S1500-4FG676C - 1.5M Gate Spartan-3 FPGA | AMD

The AMD XC3S1500-4FG676C is a Spartan-3 field-programmable gate array with 1,500,000 system gates, 487 I/O, and a 1.2 V core operating voltage, supplied in a 676-ball BGA package. It is designed for applications requiring substantial configurable logic resources, parallel digital interfaces, and deterministic programmable behavior. The FPGA combines programmable logic, block RAM, dedicated DSP resources, and programmable I/O within one integrated device. A field-programmable gate array is a semiconductor device whose digital circuit is defined after manufacture. The FPGA category sits between fixed-function application-specific integrated circuits and software-programmable processors. Unlike an ASIC, it allows logic, interfaces, and signal-processing functions to be revised without changing the PCB. The Spartan-3 FPGA family targets cost-sensitive embedded, communications, industrial, and test applications where reconfigurability and integration are more important than the absolute performance of the largest programmable-logic devices. The XC3S1500-4FG676C provides 1,500,000 system gates and 487 I/O in a compact 676-ball BGA. Its 1.2 V core voltage identifies it as a modern FPGA architecture relative to older, higher-voltage programmable devices. The -4 speed designation indicates the device's performance grade, while the commercial -C suffix identifies its intended temperature and product grade. Because the BGA package contains 676 terminals, its PCB layout, assembly process, and inspection requirements require more advanced manufacturing support than a leaded or small-outline package. Spartan-3 devices support parallel logic implementation, high-speed I/O, internal block memory, and dedicated arithmetic resources for DSP-oriented signal processing. These characteristics make the family suitable for embedded control, data acquisition, communications gateways, industrial monitoring, video processing, and instrument-control systems. Designers should map the required clocking, memory, serial links, and I/O standards before selecting the package, because unused balls do not automatically become available for additional interfaces. Typical deployments include industrial sensor aggregation, data-acquisition front ends, network protocol conversion, embedded video pipelines, and digital test equipment. The large I/O count can reduce the need for external interface expanders in parallel architectures, while the high logic density allows multiple digital functions to be consolidated into one programmable device. The principal design consideration is BGA implementation. Use the manufacturer's pinout, recommended power planes, decoupling arrangement, and PCB stack-up guidance, and verify assembly capability with the fabricator before release. Configuration storage, clocking, JTAG access, and I/O voltage planning must also be addressed early because these requirements can affect the supporting circuitry and board-level test strategy. This product page combines the verified device identity, package information, search-query language, pin-compatible family options, and practical design guidance into one engineering-oriented reference. It is intended to help designers locate the correct datasheet, assess a drop-in replacement, plan the BGA layout, and select the most suitable Spartan-3 device without relying on vague family-level descriptions.

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XC3S1500-4FG676I - 1.5M Gate Spartan-3 FPGA | AMD
XC3S1500-4FG676I

XC3S1500-4FG676I - 1.5M Gate Spartan-3 FPGA | AMD

AMD XC3S1500-4FG676I is a Spartan-3 field-programmable gate array with 1.5 million system gates, 29,952 logic cells, up to 487 user I/O, and a 1.2 V supply in a 676-pin BGA package. The -4 speed designation corresponds to the listed 630 MHz performance, while the I suffix identifies the industrial-temperature ordering option. A field-programmable gate array, or FPGA, is a programmable digital semiconductor used to implement control logic, signal processing, interface bridging, and embedded systems through a configurable logic and interconnect fabric. FPGAs occupy the programmable-logic portion of the integrated-circuit hierarchy and can shorten development cycles by replacing application-specific gate arrays with reconfigurable devices. The Spartan-3 architecture provides 29,952 configurable logic cells and 487 user I/O in this 676-BGA configuration. Its 1.2 V core supply and 630 MHz listed performance make it useful for demanding parallel data paths, protocol handling, instrumentation, communications, and embedded control. The package offers substantial pin and routing capacity compared with smaller FPGA packages. The XC3S1500 combines programmable logic cells, programmable I/O blocks, dedicated memory resources, internal clocking, and configurable interconnect within one device. This architecture permits parallel datapaths and deterministic control logic to coexist on the same FPGA, reducing external component count compared with a design assembled from separate logic devices. Typical uses include industrial automation, communication equipment, test and measurement, video or image processing, embedded storage systems, and high-performance controller prototypes. Designers can also use it to consolidate several fixed-function logic functions into one reconfigurable device while preserving software or configuration-based field updates. PCB implementation requires careful BGA-layout practices, including the manufacturer-recommended land pattern, multilayer board construction, controlled-impedance routing, complete power and ground planes, and decoupling close to supply pins. Configuration memory, clocking, JTAG access, I/O standards, and bank-specific voltage requirements must be planned before schematic capture. This product page combines the listed device specifications, a focused package-aware comparison, practical design guidance, and ordering information for engineers evaluating the XC3S1500-4FG676I for programmable-logic designs.

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XC3S1500-5FG676C - 1.5M Gate Spartan-3 FPGA | AMD
XC3S1500-5FG676C

XC3S1500-5FG676C - 1.5M Gate Spartan-3 FPGA | AMD

The AMD/Xilinx XC3S1500-5FG676C is a Spartan-3 field-programmable gate array with 1,500,000 system gates, 29,952 configurable logic cells, and a 676-ball FBGA package. The device operates from a 1.2 V core supply, is manufactured on a 90 nm process, and is specified in the -5 speed grade with a stated performance level of 725 MHz. A field-programmable gate array, or FPGA, is a semiconductor device containing programmable logic, routing, input/output, and memory resources. FPGA design flow combines hardware description languages, synthesis, place-and-route tools, timing analysis, and device programming. The Spartan-3 family occupies the FPGA category within programmable logic devices and is positioned for designs requiring substantial parallel processing in a single package. The XC3S1500 device provides 29,952 logic cells, 589,824 RAM bits, and 487 I/O positions according to its product listing. Its 676-ball surface-mount package supports dense connections among the configurable fabric, dedicated memory, and external circuitry. The -5 designation identifies the performance grade, while the C suffix identifies the commercial temperature class. Spartan-3 devices use a configurable architecture rather than a fixed logic function, allowing designers to implement parallel datapaths, state machines, interfaces, and control systems in one device. The 90 nm fabrication process and 1.2 V core supply place the component within the technology and power characteristics of the Spartan-3 generation. Performance also depends on the selected design, package speed characteristics, memory interface, and external circuitry. Typical applications include industrial automation, communications infrastructure, instrumentation, embedded control, video processing, and general-purpose digital signal processing. The large logic-cell count and 487 I/O positions are useful when a design must combine parallel computation with numerous external interfaces, while the integrated RAM resources support buffers, lookup tables, and moderate data-storage functions. A critical design step is power planning because FPGA configuration and dynamic switching activity can create substantial board-level power demand. Decoupling, supply sequencing, clock integrity, and thermal management should be reviewed against the Spartan-3 design guidance. Because the -5 part is a -5 speed-grade device, timing closure should use the appropriate device speed file and the worst applicable operating conditions. This product record combines the exact ordering code with package, logic-resource, process, and speed information, alongside drop-in same-family options, application guidance, and engineering-focused comparison data that help shorten component identification and design-review work.

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XC3S1600E-4FG484I - 1.6M Gate Spartan-3E FPGA | AMD Xilinx
XC3S1600E-4FG484I

XC3S1600E-4FG484I - 1.6M Gate Spartan-3E FPGA | AMD Xilinx

The AMD Xilinx XC3S1600E-4FG484I is a Spartan-3E family Field Programmable Gate Array (FPGA) delivering 1.6 million system gates, 33,192 logic cells, and 376 user I/Os in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package. Fabricated on a 90nm CMOS process with a 1.2V core supply, this industrial-temperature device (I suffix, -40C to +100C) runs at speed grade -4 and integrates 29,504 registers and 648 Kbits (663,552 bits) of distributed and block RAM. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs) and programmable interconnects that the designer configures in the field via HDL (VHDL/Verilog). Within the programmable logic hierarchy, the FPGA sits above CPLDs in capacity and sits alongside ASSPs as a core digital logic implementation platform for system-on-chip prototyping and production designs. Key features of the XC3S1600E include 3,688 CLBs/LABs providing high logic density, 572MHz maximum toggle capability supported by dedicated digital clock managers (DCMs), and abundant block RAM for FIFOs and dual-port memories. The 376 I/Os support multiple I/O standards with configurable banks, enabling wide data-path interfaces. Architecturally, the Spartan-3E platform uses a 4-input look-up table (LUT) based fabric with dedicated carry logic, multiplier blocks, and DCMs for clock conditioning - well suited to cost-sensitive control, glue logic, and DSP-lite tasks. The 90nm process keeps core power low at 1.2V while retaining robust routing flexibility. Typical applications include industrial control and automation, embedded system prototyping, data acquisition glue logic, motor control interfaces, and communications line cards. The wide 376-I/O budget makes it a natural fit for bus bridging and parallel-to-serial adaptation. A key design consideration: the Spartan-3E family is mature, so plan configuration via a platform Flash PROM (such as XCF-series) and verify 1.2V core, 3.3V auxiliary, and I/O bank rails meet sequencing guidance in the datasheet. This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.

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XC3S1600E-5FGG320C - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx
XC3S1600E-5FGG320C

XC3S1600E-5FGG320C - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx

The AMD (Xilinx) XC3S1600E-5FGG320C is a Spartan-3E family FPGA with 1.6 million system gates, 33,192 logic cells, and 250 user I/Os, fabricated on 90nm CMOS process technology and housed in a 320-ball fine-pitch BGA (FGG320, 19x19 mm) package. It operates from a 1.2V core supply (1.14V to 1.26V) with a commercial temperature range of 0C to 85C junction, and speed grade -5. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), embedded memory, and programmable interconnects that designers configure via a hardware description language such as Verilog or VHDL. Within the semiconductor hierarchy, an FPGA sits under programmable logic devices, alongside CPLDs and ASICs, and is used to implement custom digital logic without fabricating a custom chip. Key features of the XC3S1600E include a large 1.6M-gate fabric for mid-density designs, 250 user I/Os supporting multiple I/O standards, Spartan-3E cost-optimized architecture, and availability of configuration via platform flash devices such as the XCF32P. The Spartan-3E family was widely adopted in telecommunications, industrial control, and consumer electronics, per Microchip USA product data. Architecturally, the Spartan-3E fabric uses 4-input look-up tables (LUTs), dedicated carry logic, block RAM, and embedded multipliers, enabling DSP datapaths, glue logic consolidation, bus interfaces, and control sequencing on a single chip. Typical applications include industrial control systems, telecommunications line cards, test equipment, motor control interfaces, and legacy system sustenance where a proven mid-density FPGA is already designed in. Design consideration: this part is officially obsolete and no longer manufactured, per DigiKey lifecycle data, so new designs should evaluate AMD 7-series (Spartan-7, Artix-7) or cross-brand alternatives; existing designs should secure stock or a qualified migration path. This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and practical design notes not consolidated in the manufacturer datasheet.

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XC3S1600EFG400 - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx
XC3S1600EFG400

XC3S1600EFG400 - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx

The AMD/Xilinx XC3S1600EFG400 is a member of the Spartan-3E family of Field Programmable Gate Arrays (FPGAs), offering a high-density programmable logic solution with 33,192 logic cells and an equivalent gate count of 1,600,000. Housed in a 400-ball FBGA package (FG400), this device provides 304 user I/O pins and 663,552 bits of block RAM, making it suitable for a wide range of digital designs. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. FPGAs consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing the implementation of complex digital circuits without the need for custom fabrication. They are a subset of programmable logic devices (PLDs) and are widely used in prototyping, low-to-medium volume production, and applications requiring reconfigurability. Key features of the XC3S1600EFG400 include 33,192 logic cells, 663,552 bits of block RAM, and support for a maximum clock frequency of 572 MHz. The device operates from a 1.2V core voltage and is manufactured using advanced CMOS technology. The FG400 package offers 400 balls with a 1.00 mm pitch, providing a compact footprint for space-constrained designs. The Spartan-3E architecture is optimized for high performance and low cost, featuring dedicated multipliers, digital clock managers (DCMs), and support for various I/O standards including LVCMOS, LVTTL, and differential standards. The device also includes configuration support via JTAG, SPI, and SelectMAP interfaces, enabling flexible system integration. Typical applications for the XC3S1600EFG400 include industrial control, automotive infotainment, consumer electronics, and communication systems. Its balance of logic density, I/O count, and cost makes it ideal for bridging ASIC prototyping and production. When designing with this FPGA, careful attention must be paid to power supply decoupling and configuration bitstream storage. The 1.2V core requires stable power, and the configuration data is typically stored in an external SPI flash, which must be selected for compatibility.

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XC3S200-4FT256C - 200K Spartan-3 FPGA | AMD / Xilinx
XC3S200-4FT256C

XC3S200-4FT256C - 200K Spartan-3 FPGA | AMD / Xilinx

AMD XC3S200-4FT256C is a Spartan-3 field-programmable gate array with 200000 system gates, 4320 cells, and a 256-LBGA package. The -4 speed grade operates at up to 630 MHz, while the device uses a nominal 1.2 V core supply and is manufactured in 90 nm process technology. These headline characteristics position the FPGA between fixed-function logic and larger programmable-logic devices for cost-sensitive, moderate-complexity embedded systems. A field-programmable gate array is a programmable logic device in which configurable logic blocks, programmable input/output blocks, and programmable interconnect form a user-defined digital circuit. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, alongside CPLDs and mask-programmable logic. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can be reconfigured after manufacture to implement control, interface, protocol, signal-processing, or security functions in parallel. The Spartan-3 architecture provides 480 configurable logic blocks and 4320 cells according to the supplied distributor and comparison data. Its 256-ball package supports 256 terminals for device configuration, power, clocking, and user I/O. The -4 designation identifies the performance grade, while the commercial C suffix corresponds to the stated 0°C to 85°C operating-temperature range. A maximum supply voltage of 1.26 V and a nominal 1.2 V FPGA supply are also reported in the available data. The 90 nm Spartan-3 process supports a useful balance of logic capacity, static power, dynamic performance, and manufacturing cost. At up to 630 MHz, the XC3S200-4FT256C can satisfy clock-domain requirements that are more demanding than simple glue logic while remaining smaller and less complex than a high-end FPGA. Exact timing, I/O standards, supported memory interfaces, configuration options, and core-current limits require confirmation in the complete manufacturer datasheet before a new design is released. Typical uses include industrial control and automation, communications equipment, embedded test systems, consumer products, instrumentation, and compact control modules. Its parallel programmable resources can implement multiple finite-state machines, data acquisition logic, communication bridges, and auxiliary processors concurrently. The 256-terminal package also makes the device suitable for designs requiring more configuration and user I/O than a small CPLD, although board density and routing must be assessed at the schematic and PCB stages. Designers should treat the package, voltage rails, decoupling, configuration interface, clocking, and I/O standards as a coordinated system rather than isolated specifications. Place bypass capacitors close to the supply pins, preserve the required configuration path, and verify every ball assignment against the exact package drawing. Because the supplied snippets contain inconsistent secondary descriptions of package and cell data, the authoritative manufacturer pinout and datasheet should control any production implementation. This page combines the verified distributor specifications with engineering-focused application guidance, design notes, parameter comparisons, and same-family drop-in candidates. It also distinguishes confirmed values from unavailable electrical details, helping engineers identify the correct replacement without mistaking a similar FPGA for a guaranteed production substitute.

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XC3S200-4FT256I - 200K Spartan-3 FPGA | AMD | FTBGA-256
XC3S200-4FT256I

XC3S200-4FT256I - 200K Spartan-3 FPGA | AMD | FTBGA-256

The AMD XC3S200-4FT256I is a 200K-gate Spartan-3 field-programmable gate array (FPGA) with 4,320 logic cells, a 630 MHz maximum clock frequency, and a 256-terminal FineLine BGA package measuring 17 mm by 17 mm. The device uses 90 nm FPGA technology and operates from a 1.14 V to 1.26 V internal core supply. Its 256-terminal package provides a high pin count for dense programmable-logic designs while maintaining a compact board footprint. A field-programmable gate array is a configurable digital semiconductor containing programmable logic blocks, programmable interconnect, and input/output resources. An FPGA belongs to the semiconductor hierarchy, programmable-logic IC hierarchy, and Spartan-3 FPGA family. Unlike a fixed-function application-specific integrated circuit, an FPGA allows system designers to implement parallel logic, control functions, signal processing, and interface logic in hardware and later update the configuration through a configuration memory or JTAG programming path. The XC3S200-4FT256I combines 4,320 logic cells with 200K system gates and a maximum clock frequency of 630 MHz. The -4 speed designation identifies the performance grade, while the I suffix identifies the industrial temperature grade. The device is specified for 0 C to +85 C operation in the supplied distributor data, making it suitable for industrial and embedded control equipment where environmental requirements exceed consumer-grade conditions. The 17 mm by 17 mm FTBGA-256 package supports compact PCB layouts but requires careful escape routing, via-in-pad or via fan-out strategies, assembly-process control, and inspection. The 1.2 V core supply requires a regulated, low-noise supply rail and appropriate power-plane distribution. Because this is a legacy Spartan-3 FPGA, designers should also verify configuration memory availability, toolchain support, lifecycle status, and second-source requirements before committing a new production design. Typical applications include industrial control, instrumentation, data acquisition, communication interfaces, embedded signal processing, and prototype systems requiring configurable parallel logic. The high-pin-count package is particularly useful when the design needs numerous user I/O or dedicated interface resources, although the exact user I/O count is not provided in the verified data. A key design consideration is that replacing an XC3S200-4FT256I is not limited to matching its package. A true drop-in candidate must also preserve pin assignment, voltage requirements, configuration behavior, timing characteristics, and software support. This page summarizes verified distributor and manufacturer-linked information, compares documented drop-in candidates, and identifies engineering details that must be confirmed before PCB release.

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XC3S200-4FTG256C - 200K Spartan-3 FPGA | AMD
XC3S200-4FTG256C

XC3S200-4FTG256C - 200K Spartan-3 FPGA | AMD

AMD XC3S200-4FTG256C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, a 630 MHz maximum clocking frequency, and a 256-ball low-profile BGA package. Designed for cost-sensitive programmable-logic applications, the device combines configurable logic, block RAM, dedicated DSP resources, and a 1.2 V core supply in a single surface-mount package. The -4 speed designation identifies its performance grade, while FTG256C identifies the 256-ball package and commercial temperature option. A field-programmable gate array is a semiconductor whose digital logic is configured after manufacture rather than being permanently patterned. Within the FPGA hierarchy, an FPGA sits above fixed-function logic and below complex programmable systems such as SoCs and microcontrollers. Its configurable LUTs, routing fabric, dedicated memories, and I/O blocks allow one physical device to implement many digital functions, including control logic, interfaces, data acquisition, communications, and signal-processing pipelines. The XC3S200 family is identified by 200,000 system gates and includes 4,320 configurable logic cells according to the AMD Spartan-3 device information. A maximum clock frequency of 630 MHz supports demanding control and datapath designs, although attainable system performance depends on logic depth, routing, memory use, and timing constraints. The core operates from 1.2 V, reducing supply requirements in compact embedded systems. Its 256-LBGA package provides dense I/O connectivity while supporting high-density board layouts. The Spartan-3 architecture implements programmable logic through configurable lookup tables and programmable interconnect. Dedicated block RAM supports buffering, packet storage, and data-domain conversion, while DSP blocks accelerate multiply-accumulate operations used in filtering, modulation, and waveform processing. The -4 speed grade provides a defined timing-performance class for design planning, and the 90 nm fabrication technology places this device in an established, cost-oriented FPGA generation. Typical applications include industrial control, consumer electronics, video and image processing, communications interfaces, embedded data capture, educational platforms, and compact embedded systems. Its combination of 4,320 logic cells, dedicated resources, and 256-ball packaging makes it suitable for designs that need programmable functionality without the resource level of a larger FPGA. Designers should assign a pin-compatible clock, configure an appropriate Spartan-3 PROM or in-system configuration interface, and verify all I/O standards against the device datasheet. Dense BGA routing requires careful escape, via, and plane management, while clock, decoupling, and power-distribution networks should follow the AMD reference guidance to preserve timing and signal integrity. This product page combines device specifications, package information, pricing visibility, qualified drop-in candidates, and practical implementation guidance. It also distinguishes exact-footprint replacements from broader Spartan-3 alternatives, helping engineers confirm mechanical, electrical, lifecycle, and software-tool implications before changing a production bill of materials.

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XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx
XC3S200-4FTG256I

XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx

The Xilinx XC3S200-4FTG256I is a Spartan-3 family field programmable gate array (FPGA) offering 200,000 system gates and 4,320 logic cells in a 256-ball FineLine BGA (FTG256) package, with a 1.2V core voltage, industrial temperature rating of -40C to +100C, and a -4 speed grade supporting internal performance up to approximately 630 MHz. A field programmable gate array is a semiconductor device containing a fabric of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks that the designer configures after manufacturing. FPGAs sit within the broader programmable logic hierarchy: CLB -> FPGA -> programmable logic device -> digital IC. Unlike fixed-function ASICs, FPGAs allow field reprogramming, making them ideal for prototyping, low-to-medium volume production, and designs requiring in-service updates. Key features of the XC3S200 include 2,160 slices built on a 90nm process technology, 12 blocks of 18Kbit block RAM totaling 216 Kbits of embedded dual-port memory, four 18x18 hardware multipliers for DSP operations, a Digital Clock Manager (DCM) for clock deskew and frequency synthesis, and up to 173 user I/Os supporting multiple I/O standards such as LVTTL, LVCMOS, SSTL, and LVDS on bank-selectable VCCO rails. Technically, the Spartan-3 fabric uses a four-input lookup table (LUT) per slice logic cell with dedicated fast carry logic for arithmetic chains. The -4 speed grade denotes the fastest standard commercial/industrial timing bin of the Spartan-3 family. Configuration is performed via serial or parallel PROMs (Xilinx Platform Flash) in Master/Slave Serial or SelectMAP modes with JTAG boundary-scan support per IEEE 1149.1. Typical applications include industrial control and motor drive logic, communication protocol bridging, test and measurement instrumentation, and embedded coprocessing with the hardware multipliers for modest DSP tasks. The 17x17mm FTBGA footprint suits space-constrained boards requiring high I/O density. A key design consideration is power: the 1.2V core requires a dedicated regulator, and I/O bank VCCO supplies must match the connected logic standards; total power scales with clock frequency and toggle rates, so use the Xilinx power estimator early in design. This page synthesizes verified distributor data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.

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XC3S200-4PQ208C - 200K Spartan-3 FPGA | AMD / Xilinx
XC3S200-4PQ208C

XC3S200-4PQ208C - 200K Spartan-3 FPGA | AMD / Xilinx

The AMD / Xilinx XC3S200-4PQ208C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 480 configurable logic blocks, and 221,184 RAM bits in a 208-pin PQFP package. It operates from a 1.2 V core supply and is specified for the commercial temperature range of 0°C to 85°C. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O paths are configured after manufacture. Within the product hierarchy, the XC3S200-4PQ208C is an FPGA, then a programmable-logic device, and ultimately a semiconductor. Compared with fixed-function logic ICs, an FPGA lets engineers implement parallel processing, control, communications, and signal-generation functions in one reconfigurable device while retaining the same package and pinout across design revisions. The supplied product data identifies 141 I/O, 4,320 logic cells, 480 CLBs, 221,184 RAM bits, and 200,000 system gates. The “-4” speed designation and an associated listing report 630 MHz performance, while the commercial “C” suffix identifies the specified temperature grade. Its 208-pin PQFP package exposes substantially more device I/O than the smaller 100-pin Spartan-3A options, making it suitable for designs with wider external buses or more peripheral connections. The XC3S200-4PQ208C fits industrial control, communications infrastructure, embedded instrumentation, video processing, test equipment, and legacy embedded systems. A practical design can use its programmable logic for parallel data acquisition, protocol conversion, signal conditioning, and supervisory control while retaining configuration data in external nonvolatile flash. Engineers should verify every power rail, configuration interface, and high-speed I/O constraint against the complete Spartan-3 documentation before layout release. Power and termination design remain central to reliable FPGA implementation. Provide the specified core and I/O supplies, route each supply through its documented decoupling network, and use a configuration scheme that matches the board’s flash and control logic. Because the supplied excerpts do not provide full electrical limits, pin assignments, or power-budget data, those details require confirmation from the manufacturer’s official Spartan-3 documentation before schematic completion. This page consolidates verified distributor specifications, same-package family comparisons, commercial availability references, and application-specific engineering guidance. It distinguishes the XC3S200-4PQ208C from smaller Spartan-3 packages and higher-density PQFP208 devices, helping engineers determine whether the device’s logic, memory, I/O, and thermal requirements align with an existing 208-pin PCB design.

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XC3S200-4PQ208I - 200K-Gate Spartan-3 FPGA | AMD Xilinx
XC3S200-4PQ208I

XC3S200-4PQ208I - 200K-Gate Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S200-4PQ208I is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 141 user I/O, and a stated 630 MHz performance figure, supplied in a 208-pin PQFP package. The device operates from a 1.2 V core supply and is built on 90 nm CMOS process technology. Its -4 speed designation identifies a performance grade, while the PQ208 suffix denotes the 208-pin plastic quad flat package and I suffix identifies the industrial temperature option. A field-programmable gate array is a programmable semiconductor in which digital logic, interfaces, and system functions are configured after manufacture. Within the product hierarchy, an FPGA is a semiconductor and a programmable logic device. The Spartan-3 family targets cost-sensitive designs requiring more flexibility than fixed-function logic, while providing configurable logic blocks, dedicated arithmetic resources, block RAM, and programmable I/O within one integrated device. The XC3S200-4PQ208I combines 480 configurable logic blocks with 4,320 logic cells and 141 user I/O according to the supplied manufacturer-family data. Its 200,000-system-gate count describes the family device's logic-equivalent capacity rather than a fixed gate count. The 630 MHz figure likewise requires careful interpretation because achievable system performance depends on the selected design, timing constraints, clocking, I/O standards, routing, and the associated Xilinx toolchain. The 90 nm Spartan-3 architecture supports integration of control logic, data acquisition, communications glue logic, state machines, and modest parallel-processing functions. Reconfigurability allows design revisions to be implemented in the FPGA bitstream rather than through a PCB respin. Dedicated block RAM can buffer sampled or packet data, while programmable I/O can connect the device to external clocks, data buses, transceivers, displays, and industrial interfaces subject to voltage and timing constraints. Typical uses include industrial automation, programmable logic controllers, motor-control and sensor-processing systems, embedded communications, instrumentation, and cost-sensitive consumer or control electronics. The 208-pin PQFP provides more I/O than a small FPGA package, making it useful where parallel external buses, control signals, or multiple interfaces must coexist with the Spartan-3 logic fabric. Design planning should begin with the AMD/Xilinx Spartan-3 datasheet and the appropriate ISE or Vivado-era design flow for the installed device family. Verify the exact pinout, supported I/O standards, configuration requirements, decoupling, clock topology, and exposed thermal and power constraints on the selected package before layout release. This page consolidates verified distributor specifications, pricing references, same-family drop-in candidates, and practical selection considerations for engineers evaluating the XC3S200-4PQ208I.

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XC3S200-4TQ144C - 200K Gate Spartan-3 FPGA | Xilinx
XC3S200-4TQ144C

XC3S200-4TQ144C - 200K Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S200-4TQ144C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 97 I/Os, a 1.2 V core supply, and a 144-pin TQFP package. It is a -4 speed-grade device specified for a commercial operating temperature range of 0°C to 85°C. The configurable logic and dedicated input/output resources make it a practical FPGA platform for embedded control, parallel data processing, industrial automation, communication interfaces, and cost-sensitive custom digital systems. An FPGA is a user-programmable semiconductor in the broader integrated-circuit hierarchy. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable interconnect, memory resources, and I/O blocks into a device whose digital behavior can be defined after manufacture. The Spartan-3 architecture is part of the FPGA and programmable-logic-device family, offering a practical balance between logic capacity, I/O availability, device cost, and design flexibility. The XC3S200-4TQ144C provides 192 adaptive logic modules, which are organized into 4,320 logic cells. Its 97 available I/Os allow connections to external memory, sensors, communications transceivers, display controllers, and general-purpose digital peripherals. The verified family data identifies a maximum frequency of 725 MHz for the -4 device, while the exact AC timing limits for each I/O standard must be selected from the manufacturer datasheet. A 1.2 V core supply is typical for this 90 nm Spartan-3 generation, with auxiliary supply requirements depending on the selected I/O standards. The TQFP-144 package is a surface-mount plastic quad flat package that offers substantially more I/O than a compact QFP, while remaining easier to assemble and inspect than a large BGA. Its 144 leads include power, ground, configuration, clock, and user I/O functions. Exact lead assignments, configuration pins, and dedicated behavior depend on the package pinout and device datasheet, so board designers should use the official pin table rather than infer assignments from another package variant. Typical uses include industrial automation controllers, motor and motion-control logic, low-cost instrumentation, data acquisition, protocol bridging, educational FPGA platforms, and compact embedded systems that benefit from parallel hardware acceleration. The Spartan-3 device can implement finite-state machines, DSP-oriented datapaths, parallel-to-serial conversion, and interface control concurrently, reducing reliance on multiple fixed-function components. The primary design consideration is timing closure. Engineers should establish the target clock, external memory interface, I/O standards, and pin assignments early, then use the Xilinx synthesis, implementation, and timing-analysis flow. Decoupling, ground-plane continuity, clock routing, and I/O standard compatibility should be reviewed against the manufacturer guidance before schematic release. This page combines verified device specifications, commercial availability data, same-package replacement candidates, and practical selection guidance. It also distinguishes confirmed values from parameters that still require review in the complete manufacturer datasheet, helping engineers avoid treating incomplete distributor metadata as a complete design specification.

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XC3S200-4TQ144I - 200K Gate Spartan-3 FPGA | AMD | TQFP
XC3S200-4TQ144I

XC3S200-4TQ144I - 200K Gate Spartan-3 FPGA | AMD | TQFP

The AMD XC3S200-4TQ144I is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic elements, 221,184 bits of embedded RAM, and 97 I/O pins in a 144-pin TQFP package. The -4 speed grade is specified for operation up to 630 MHz, while the I suffix denotes the extended industrial-temperature option. The device uses a 90 nm process and operates from a 1.14 V to 1.26 V core supply. A Spartan-3 FPGA belongs to the configurable-logic hierarchy: FPGA > programmable logic device > field-programmable gate array > semiconductor. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA combines configurable logic blocks, block RAM, programmable I/O, dedicated clocking resources, and embedded hard processors in one reconfigurable device. This allows interface logic, control functions, and parallel data processing to be consolidated on a single PCB. The XC3S200-4TQ144I provides 4,320 four-input LUT-based logic elements and 221,184 embedded RAM bits. Verified listings identify 1,920 adaptive logic modules and 480 LAB/CLB resources for this device. Its 97 I/O pins support board-level connectivity, and the 144-lead TQFP package provides a surface-mount form factor compatible with conventional PCB assembly and inspection processes. The 90 nm Spartan-3 architecture combines programmable logic with dedicated block RAM and programmable interconnect. It is intended for cost-sensitive embedded systems where parallel processing, flexible interfaces, and field reconfiguration provide more value than a fixed logic implementation. The 1.14 V to 1.26 V core range reflects the device's internally regulated core operation, while external I/O requirements remain part of the complete board power architecture. Typical uses include industrial control, embedded communications, instrumentation, data acquisition, display interfaces, and compact embedded processing systems. Its 4,320 logic elements and 221,184 RAM bits make it appropriate for protocol bridging, parallel-to-serial conversion, control-plane logic, and modest algorithmic workloads. Designs requiring substantially greater logic density or memory bandwidth should use a larger FPGA family. Designers should verify the exact pinout, configuration interface, I/O standards, clock requirements, and decoupling recommendations against the manufacturer datasheet before layout release. Because the TQFP package has fine-pitch leads, PCB assembly and inspection require suitable paste, stencil, placement, and inspection processes. Legacy-device supply status and configuration-memory interface compatibility also deserve review before new production commitments. This page consolidates verified distributor specifications, same-family drop-in candidates, practical design guidance, and parameter-level comparisons. It distinguishes confirmed electrical and packaging facts from information that could not be extracted from the supplied web records, helping engineers evaluate the XC3S200-4TQ144I without relying on ambiguous distributor summaries.

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