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XC6SLX45-2FGG676C - Spartan-6 LX FPGA, 43,661 Cells, 676-BGA | AMD
XC6SLX45-2FGG676C

XC6SLX45-2FGG676C - Spartan-6 LX FPGA, 43,661 Cells, 676-BGA | AMD

The AMD (formerly Xilinx) XC6SLX45-2FGG676C is a Spartan-6 LX Field Programmable Gate Array (FPGA) delivering 43,661 logic cells, 2,138,112 bits of block RAM, and 358 user I/Os in a 676-ball Fine-pitch Ball Grid Array (FBGA) package. Built on a mature 45 nm low-power copper process, the LX family targets high-volume, power-conscious applications and is offered in -3N, -2, and -1L speed grades with the -2 grade used here delivering a balance of performance and power. The FGG676 package measures 27 x 27 mm with 1.0 mm ball spacing and supports extended I/O count required for parallel memory buses, video pipelines, and industrial control fabrics. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that engineers can re-program after manufacture to implement arbitrary digital logic. FPGAs occupy the middle ground between fixed-function ASICs (highest efficiency, no flexibility) and microcontrollers (software-defined, lower throughput). In the broader taxonomy, the Spartan-6 LX sits inside the FPGA & CPLD category, alongside Lattice ECP-series, Intel Cyclone series, and AMD/Xilinx Artix-7 and Spartan-7 successor families. Key features include 4 DSP48A1 slices, 6 PLLs, 4 Memory Controller Blocks (MCBs), and PCI Express endpoint capability on selected Spartan-6 LXT variants. The device supports up to 500 MHz internal clock speeds and consumes roughly half the power of previous-generation Spartan FPGAs. Integrated SelectIO technology provides flexible I/O voltage support across 1.2V to 3.3V standards, including LVCMOS, LVTTL, SSTL, and differential pairs. Architecturally, the Spartan-6 LX uses a Configurable Logic Block (CLB) array with 4 LUTs per slice, dedicated carry chains, and distributed SRL32 shift-register capability. Hardened IP blocks (PCIe, GTP transceivers on LXT, MCBs, block RAM, DSP48A1 slices) are arranged in column form along the device fabric, delivering predictable performance for memory and DSP pipelines. The configuration bitstream is loaded via JTAG, Serial (SPI/BPI) modes, or internal flash on supported densities. Typical applications include industrial motor control, video processing pipelines, low-cost PCIe endpoint cards (on LXT variants), embedded vision, and legacy parallel bus bridging. The 358 I/Os make it well suited for connecting to DDR2/DDR3 memory, parallel ADC/DAC interfaces, and high-pin-count display or camera links. Industrial-grade and commercial temperature screening is available across the family. When designing with this device, ensure the supply rails (Vccint 1.2V core, Vccaux 2.5V, Vcco 1.2-3.3V per bank) are sequenced per AMD guidelines and that decoupling capacitance matches the UG385 reference design. The 1.0 mm pitch FBGA requires PCB fabrication capable of microvia stack-ups; design rule checks should validate escape routing for inner-row balls. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet.

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XC6SLX45-2FGG676I - Spartan-6 LX FPGA, 43K LC, 676-BGA | AMD
XC6SLX45-2FGG676I

XC6SLX45-2FGG676I - Spartan-6 LX FPGA, 43K LC, 676-BGA | AMD

The AMD Xilinx XC6SLX45-2FGG676I is a Spartan-6 LX field-programmable gate array (FPGA) featuring 43,661 logic cells (43661 cells), 3,411 configurable logic blocks (CLBs), 358 user I/Os, and 2,088 Kbit of block RAM, housed in a 676-ball fine-pitch BGA (FBGA) package. The device is fabricated on a low-power 45 nm CMOS process and operates from a 1.2 V core supply with multi-voltage I/O support. An FPGA is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and embedded DSP/memory resources that engineers can reconfigure in-circuit to implement custom digital hardware. Within the programmable-logic hierarchy, the Spartan-6 LX family sits between hardened ASICs and small CPLDs, delivering a balance of logic density, DSP performance, and cost optimized for high-volume applications such as consumer, industrial, and automotive driver systems. Key technical resources include 54,576 flip-flops, 58 DSP48A1 slices for high-throughput arithmetic, four clock-management tiles (CMTs) with internal frequency support up to 500 MHz, and integrated memory controller blocks (MCBs) capable of DDR/DDR2/DDR3/LPDDR interfaces. The -2 speed grade balances performance and power, while the “I” suffix denotes the industrial operating temperature range of -40 °C to +100 °C. The Spartan-6 architecture pairs a Virtex-class fabric with cost-optimized 6-input LUTs, dual 18 Kbit block RAM per CLB column, and PCI Express, Gigabit Ethernet, and serial GTP transceivers (selectively enabled on LX devices with the “T” suffix). The 27 mm × 27 mm, 1 mm-pitch FBGA-676 footprint delivers a compact high-density breakout suitable for high-pin-count designs. Typical applications include industrial motor control and machine vision, automotive driver assistance and infotainment, broadcast video processing, wired/wireless communication bridges, and high-volume consumer electronics where the LX family’s price-per-logic density is decisive. When designing with this device, plan power-rail sequencing for the 1.2 V core and the auxiliary VCCAUX/VCCO rails, and use the dedicated configuration pins (M0–M2) to select the boot mode (JTAG, master/slave serial, SPI, or BPI). Provide a JTAG header for in-system programming and boundary-scan debug. This page synthesizes distributor pricing, drop-in Spartan-6 LX alternatives, and practical design considerations not consolidated on the manufacturer datasheet, helping engineers select and source the right device for high-volume production.

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XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD
XC6SLX45-3FG484C

XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD

The AMD XC6SLX45-3FG484C is a 45 nm CMOS Spartan-6 LX field-programmable gate array with 43,661 logic cells, 316 I/O, and a 500 MHz internal frequency, packaged in a 15 mm by 15 mm, 0.80 mm-pitch 484-BBGA. The -3 suffix identifies the highest-performance Spartan-6 speed grade, while the C suffix identifies the commercial operating-temperature option. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic and interconnect can be configured after manufacture. An FPGA belongs to the broader programmable-logic hierarchy, joining CPLDs as a reconfigurable implementation of digital functions. The Spartan-6 LX family combines configurable logic, block RAM, dedicated processing resources, and general-purpose I/O in one device, making it suitable for parallel data acquisition, embedded control, interface bridging, and industrial automation. Key features include 43,661 configurable logic elements, 316 I/O, 2.04 Mbit of embedded memory, 6,822 adaptive logic modules, and 500 MHz internal frequency. The device uses 45 nm CMOS technology and a nominal 1.2 V supply. Its 484-BBGA package provides a compact 15 mm by 15 mm footprint with a 0.80 mm ball pitch, enabling dense PCB layouts when the BGA routing and assembly requirements are properly controlled. The Spartan-6 architecture provides a practical balance between programmable logic capacity, memory, I/O, and implementation cost. The -3 grade is intended to provide stronger timing performance than the lower -2 and -1L speed grades, although system-level timing still depends on the selected clocking, I/O standards, speed grade, and device utilization. The commercial-grade part is intended for environments where the listed 0 °C to 85 °C operating range is sufficient. Typical uses include industrial automation controllers, data-acquisition systems, video and image processing, communications infrastructure, embedded signal processing, and general-purpose bridging between parallel buses or proprietary peripherals. The large I/O count supports designs requiring numerous external connections, while the internal logic and memory resources allow multiple functions to be consolidated into one programmable device. The primary design constraint is the 484-BBGA package. A PCB redesign is generally unavoidable when moving from a leaded package, and reliable assembly requires suitable pad geometry, via-in-pad or via-away routing, adequate solder mask definition, and careful power and ground-plane distribution. Differential and high-speed interface constraints must also be checked against the appropriate Xilinx Spartan-6 package and pinout files before layout signoff. This page consolidates the verified catalog and cross-reference information, compares pin-compatible same-family options, and highlights BGA implementation considerations. It is intended to support engineering selection and procurement review without treating family variants as interchangeable unless their speed grade, temperature class, package, and device resources have been checked.

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XC6SLX45-3FG484I - 316 I/O Spartan-6 LX FPGA | AMD
XC6SLX45-3FG484I

XC6SLX45-3FG484I - 316 I/O Spartan-6 LX FPGA | AMD

The AMD XC6SLX45-3FG484I is a Spartan-6 LX field-programmable gate array with 316 I/O, a 500 MHz internal frequency, and a 484-BBGA package measuring 15 x 15 mm with 0.80 mm ball pitch. It is identified as the -3 speed grade, which is the highest-performance speed grade in the Spartan-6 LX family, and the industrial-temperature suffix I indicates a component intended for industrial operating conditions. A field-programmable gate array is a programmable logic device in which digital functions are implemented through configurable logic blocks and programmable interconnect. Within the semiconductor hierarchy, an FPGA sits above fixed-function logic and below programmable SoC implementations. The Spartan-6 LX family combines programmable logic, block RAM, DSP resources, clocking, and general-purpose I/O in a single device for applications requiring adaptable hardware functionality. The verified key specifications for XC6SLX45-3FG484I include 316 I/O, a 500 MHz internal frequency, and 484-BBGA packaging. The package is specified as a 15 x 15 mm lead-free MO-275 arrangement with a 0.80 mm pitch and 324 balls according to the available detailed listing. These figures position the device as a high-pin-count Spartan-6 option for designs requiring extensive board-level connectivity while retaining a relatively compact package. The -3 designation identifies the highest-performance Spartan-6 speed option listed in the verified data. This distinction is important in clocked digital systems because speed-grade differences affect achievable timing performance and should be checked against the selected clocking, I/O, and memory interfaces. The I suffix identifies the industrial-temperature version, while related C-suffix parts provide a distinct commercial-temperature choice. Typical uses include industrial control, communications equipment, embedded processing, test and measurement, and signal-processing systems that benefit from parallel programmable logic. Its 316 available I/O can support external memory, data converters, communication transceivers, control signals, and parallel buses, subject to the exact bank voltage, pin, and timing constraints defined by the manufacturer documentation. Designers should obtain the AMD Spartan-6 package pinout file and the device-specific datasheet before assigning power, clock, configuration, and I/O pins. The available sources identify the package and pin count, but they do not provide a complete verified ball-by-ball signal list or a manufacturer PDF URL for this exact ordering code. Those details should therefore be checked against the official device documentation rather than inferred from similar MPN suffixes. This page consolidates verified distributor availability, exact package and timing identifiers, drop-in family comparisons, procurement facts, and practical design cautions. It also distinguishes confirmed data from attributes that still require verification in the manufacturer datasheet, reducing the risk of treating a speed-, temperature-, or package-suffix change as an unqualified functional equivalent.

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XC6SLX45-3FG676I - 43,661-Cell Spartan-6 FPGA | AMD
XC6SLX45-3FG676I

XC6SLX45-3FG676I - 43,661-Cell Spartan-6 FPGA | AMD

AMD XC6SLX45-3FG676I is a Spartan-6 LX field-programmable gate array with 43,661 logic cells, 2,138,112 RAM bits, 358 I/O, and a maximum internal frequency of 500 MHz, packaged in a 676-BGA. It targets industrial logic, embedded control, communications, instrumentation, and high-density programmable logic designs. A Field-Programmable Gate Array (FPGA) is a semiconductor whose digital logic, interconnects, memory resources, and I/O behavior are configured after manufacture. The Spartan-6 LX family combines configurable logic blocks, block RAM, digital signal processing resources, and programmable I/O. This makes an FPGA suitable for parallel data processing, protocol bridging, control automation, signal generation, and system consolidation where changing hardware requirements are important. The verified device information identifies 43,661 logic cells, 2,138,112 RAM bits, 358 I/O, and 500 MHz internal frequency. The -3 suffix denotes the highest-performance speed grade listed in the retrieved Spartan-6 LX data. The XC6SLX45 device combines substantial programmable logic with embedded block memory, allowing designers to implement parallel datapaths and control functions in one device rather than relying on multiple fixed-function components. The XC6SLX45-3FG676I uses a 676-BGA package with a 1 mm ball pitch and is identified as lead-free in the retrieved distributor and comparison data. Its operating-temperature classification is reported as industrial in the retrieved Partstack result, while the provided DigiChip listing reports 0°C to 85°C. Designers should verify the exact temperature grade, electrical limits, package dimensions, and power requirements against the official AMD Spartan-6 documentation before release to manufacturing. Typical applications include industrial automation, test and measurement equipment, communications infrastructure, embedded control systems, data acquisition, and digital signal processing. The large I/O count is valuable for systems requiring parallel interfaces, while the RAM resources support buffering, packet storage, lookup tables, and high-throughput parallel logic. FPGA designs must also account for configuration setup, clocking, power delivery, thermal performance, signal integrity, and pin assignment. For a new design, use the official AMD Spartan-6 package files and datasheet to confirm every BGA ball assignment, power rail, decoupling requirement, configuration interface, and supported I/O standard. This page summarizes verified catalog data and highlights the practical design considerations that matter most when selecting, routing, sourcing, or replacing this FPGA.

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XC6SLX45-3FGG484C - Spartan-6 LX FPGA, 43K Logic Cells | AMD
XC6SLX45-3FGG484C

XC6SLX45-3FGG484C - Spartan-6 LX FPGA, 43K Logic Cells | AMD

The AMD (formerly Xilinx) XC6SLX45-3FGG484C is a Spartan®-6 LX field-programmable gate array (FPGA) featuring 43,661 logic cells, 316 user I/Os, and 2,138,112 system gates in a 484-ball flip-chip BGA package with 1.0 mm ball pitch (FBGA-484). It targets the -3 commercial speed grade and delivers up to 862 MHz operating frequency. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor that combines programmable logic blocks, configurable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and clock management tiles. FPGAs occupy the broader category of programmable logic devices (PLD) within digital semiconductors, sitting between fixed-function ASICs and general-purpose microcontrollers in design flexibility. The Spartan-6 family uses a 45 nm CMOS process and offers a low-cost, low-power platform for high-volume applications in industrial, consumer, and communications markets. The XC6SLX45 contains 2,011 Kbits of embedded block RAM, 58 DSP48A1 slices for fixed-point arithmetic, a clock management tile (CMT) with two mixed-mode clock managers (MMCMs) and a phase-locked loop (PLL), and integrated SelectIO™ technology that supports voltages from 1.2 V to 3.3 V per I/O bank. The device integrates a hard memory controller block (MCB) supporting DDR, DDR2, DDR3, and LPDDR external memory interfaces without consuming FPGA fabric resources. Typical applications include industrial motor control, video processing pipelines, automotive driver-assistance subsystems, communications backplane bridging, and consumer electronics requiring flexible logic integration. The wide I/O count and embedded memory make it well-suited for high-density glue logic replacement, custom peripheral interfacing, and pre-silicon prototyping of ASIC designs. When designing with this FPGA, ensure the PCB layout follows AMD's package guidelines for FBGA-484, including 1.0 mm pitch escape routing, matched-length pairs for SelectIO LVDS pairs, and decoupling capacitors within 100 mils of each power pin. The device operates across 0 °C to +85 °C commercial junction range and requires multiple supply rails (VCCINT 1.0 V–1.05 V, VCCAUX 2.5 V, VCCO 1.2 V–3.3 V) that must be sequenced according to the datasheet recommendations. Compared to CPLDs, FPGAs deliver much higher logic density at the cost of static power and configuration memory. Within the Spartan-6 LX sub-family, the LX45 occupies the mid-density position above LX16/LX25 and below LX75/LX100, balancing cost per logic cell against usable I/O count. Choose LX45 when designs exceed LX25 capacity but do not require LX75 block RAM or DSP headroom. This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet alone.

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XC6SLX45-N3FG484C - 43,661 Logic Cell Spartan-6 LX FPGA
XC6SLX45-N3FG484C

XC6SLX45-N3FG484C - 43,661 Logic Cell Spartan-6 LX FPGA

The AMD Spartan-6 LX XC6SLX45-N3FG484C is a field-programmable gate array with 43,661 logic cells, 316 I/O, and a 484-BBGA package. It belongs to the Spartan-6 LX device family, a programmable-logic family positioned for integrated embedded systems requiring substantial parallel processing, flexible I/O, and configurable digital logic. The device combines a large programmable logic fabric with programmable I/O in a surface-mount package designed for compact industrial, communications, instrumentation, and control systems. An FPGA is a semiconductor whose digital functions are defined after fabrication by loading a configuration bitstream. A field-programmable gate array is therefore one type of FPGA, while FPGA belongs to the broader hierarchy of programmable-logic devices and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed, shorten product-development cycles, and support multiple hardware functions through parallel processing, state machines, serial interfaces, and embedded control logic. The XC6SLX45 device provides 43,661 logic cells and 316 user I/O in the Spartan-6 LX family. Its 484-BBGA package exposes a substantially larger connection set than a small quad-flat package, making it useful when a design contains numerous parallel buses, high-pin-count memory interfaces, or several external peripherals. The large logic resource count also allows multiple processing channels or control domains to be consolidated into one programmable device rather than implemented with separate fixed-function logic. The N3 ordering code identifies the target device configuration within AMD's Spartan-6 LX ordering system. Exact speed-grade limits, core supply values, programmable logic performance, embedded-memory capacities, and I/O standards should be confirmed in the manufacturer data sheet before setting timing constraints. In particular, interface timing depends on the selected I/O standard, bank voltage, package constraints, and board-level clock and signal-integrity implementation. Typical uses include industrial automation, embedded control, communications infrastructure, test and measurement, signal processing, and data-acquisition systems. For a 316-I/O design, the FPGA can consolidate parallel sensor acquisition, digital bus translation, control logic, and communication interfaces. A clocked datapath may use multiple logic slices in parallel, while block RAM and dedicated DSP resources can be added where the selected device and design tools support those functions. Board design should preserve every power, ground, configuration, clock, and I/O connection shown in the AMD package pinout files. Use the manufacturer package files to assign PCB balls accurately, especially because the target spelling in some listings differs between FG484C and FGG484C. Confirm the ordering code against the device marking before releasing production hardware or building the assembly bill of materials. This page combines the exact ordering information, package characteristics, compatible Spartan-6 alternatives, and practical design guidance needed for initial device selection. It also highlights where engineers must verify timing, power, compliance, and package details directly against the applicable AMD documentation before a design reaches production.

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XC6SLX45-N3FG484I - 43,661 Logic Cell FPGA | AMD
XC6SLX45-N3FG484I

XC6SLX45-N3FG484I - 43,661 Logic Cell FPGA | AMD

The AMD XC6SLX45-N3FG484I is a Spartan-6 LX field-programmable gate array containing 43,661 logic cells, 316 I/O, and 3,411 configurable logic blocks in a 484-BBGA package. Its industrial temperature grade covers -40°C to +100°C, while the 484-ball package provides 484 terminals and a 1.00 mm terminal pitch for high-density programmable logic systems. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, signal processing, and I/O behavior are configured after manufacture. FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks with programmable interconnect and block RAM into a flexible parallel-processing engine. The Spartan-6 LX family targets cost-sensitive systems requiring substantial logic density, deterministic parallel operation, and flexible post-build configuration. The XC6SLX45-N3FG484I provides 43,661 logic cells, 3,411 configurable logic blocks, and 316 I/O in one compact 484-BBGA package. The -3 device designation identifies its performance grade within the Spartan-6 LX family, while the industrial temperature qualification supports operation from -40°C to +100°C. These characteristics make the device useful where many parallel data paths must execute in real time rather than sequentially. Its architecture can combine configurable logic blocks, block RAM, dedicated digital signal processing resources, and programmable I/O to implement control logic, packet processing, signal acquisition, image processing, and embedded communication systems. The 316 available I/O support interfaces to external memory and peripheral devices, while the 484-ball package supports dense board routing. As an FPGA, the device allows configuration changes to be applied to the same hardware platform when system requirements evolve. Typical applications include industrial control, networking equipment, test and measurement instrumentation, video and image processing, communications infrastructure, and embedded signal-processing platforms. Designs that benefit from parallel architecture can distribute sampling, filtering, protocol handling, and data transformation across multiple logic paths. The device is particularly appropriate for compact systems requiring high I/O density and substantial programmable logic in one package. PCB design requires careful BGA layout, layer-stack planning, decoupling, and power-distribution design. Use the AMD Spartan-6 package device pinout files when assigning every ball, and follow the manufacturer's power, configuration, and decoupling recommendations. Thermal performance and signal integrity depend strongly on the PCB stackup, copper density, via strategy, trace lengths, and external memory topology used around the FPGA. This product page brings together the device identity, electrical and physical characteristics, qualified same-footprint alternatives, comparison parameters, application guidance, and practical PCB considerations. It supports faster engineering review while directing critical pin assignment and configuration decisions to the official AMD documentation and package files.

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XC6SLX45-N3FG676C - 43,661-L Spartan-6 LX FPGA | AMD
XC6SLX45-N3FG676C

XC6SLX45-N3FG676C - 43,661-L Spartan-6 LX FPGA | AMD

AMD XC6SLX45-N3FG676C is a Spartan-6 LX field-programmable gate array containing 43,661 logic elements, providing 358 I/O in a 676-ball FCBGA package. Manufactured on a 45 nm low-power copper process, the device combines programmable logic, fixed and configurable I/O, block RAM, and DSP resources in one reconfigurable semiconductor. It is positioned for cost-sensitive embedded systems requiring substantial parallel processing without the power and complexity of a high-end FPGA. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic and interconnect can be programmed after manufacture. The Spartan-6 family occupies the configurable-logic and embedded-processing tiers of the FPGA hierarchy, below higher-performance programmable logic devices while providing broad I/O and embedded-memory capability. The XC6SLX45 is particularly useful when parallel data paths, deterministic control, hardware acceleration, or flexible field updates are required. The principal characteristics include 43,661 logic elements, 358 I/O, a 676-FCBGA package, and a 45 nm low-power copper implementation. These resources suit image pipelines, industrial controllers, communications equipment, test systems, and embedded signal-processing designs. The large I/O count also permits simultaneous connections to external memory, converters, transceivers, and parallel peripherals, reducing the need for additional interface logic. Spartan-6 LX devices combine programmable logic with block RAM and dedicated DSP arithmetic resources. This heterogeneous architecture allows parallel datapaths to be implemented more efficiently than with a bank of general-purpose processors. The device can support deterministic hardware control, protocol termination, data filtering, and real-time signal transformation, while configuration storage preserves the programmed function after power-up. Typical uses include industrial automation, video and imaging, communications infrastructure, instrumentation, and embedded control platforms. Its 358 available I/O is especially attractive for high-pin-count designs requiring memory interfaces and multiple external buses. Designers can also use the FPGA fabric to implement custom peripherals, bridge incompatible interfaces, or accelerate computationally intensive operations before transferring summarized results to a host processor. Design planning should begin with the AMD Spartan-6 package pinout and pinout files, followed by verification of power rails, configuration interface, clocking, and high-speed routing constraints. Because the exact ordering code and grade-specific timing information control the final qualification, the applicable AMD data sheet, package files, and design-support documentation should remain the authority for schematic and PCB implementation. This product overview consolidates the device identity, package characteristics, searchable ordering-code references, drop-in family alternatives, and practical design considerations into one engineering-focused resource. It supports initial device selection while distinguishing exact-footprint alternatives from options that would require a different package or PCB redesign.

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XC6SLX45-N3FG676I - Spartan-6 LX FPGA, 358 I/O | AMD
XC6SLX45-N3FG676I

XC6SLX45-N3FG676I - Spartan-6 LX FPGA, 358 I/O | AMD

The AMD XC6SLX45-N3FG676I is a Spartan-6 LX field-programmable gate array with 358 I/O and a 676-BGA package. The FPGA integrates programmable logic, configurable digital resources, block RAM, and dedicated DSP resources into a single device. Its 676-BGA land pattern supports dense PCB layouts where several high-speed interfaces and parallel buses must be implemented in a compact area. The device is positioned for industrial control, communications, instrumentation, embedded vision, and general-purpose programmable logic applications. An FPGA is a semiconductor whose digital behavior is configured after manufacture. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel data paths, control logic, protocol bridges, signal processors, and hardware accelerators within one device. The Spartan-6 LX family occupies the FPGA product hierarchy: FPGA and CPLD devices are programmable-logic semiconductors, while the LX designation identifies the device family optimized for low-cost, system-level integration. The XC6SLX45-N3FG676I combines a 45-class Spartan-6 LX device designation with 358 user I/O in a 676-BGA package. This high pin count is useful when an interface requires substantial parallel connectivity, but it also makes ball assignment, power planning, and PCB layout more demanding than a smaller package. Designers should preserve the manufacturer's recommended ball map and distinguish fixed configuration pins, clock inputs, general-purpose I/O, and dedicated function pins before routing the board. Spartan-6 LX devices are well suited to designs that need flexible logic density without moving to a larger device family. Common implementation areas include parallel-to-serial data conversion, industrial control and data acquisition, network-interface front ends, embedded control logic, audio and communications signal conditioning, and test equipment. Programmable logic can also be combined with external processors or mixed-signal devices when deterministic timing, parallel processing, or multiple interface standards are required. Thermal and signal-integrity planning are central to a 676-BGA design. Although the package provides substantial interconnection capacity, high-speed nets should use controlled-impedance routing, continuous reference planes, and the shortest practical connections. Power and ground distribution should follow the manufacturer's ball assignments, and unused balls should follow the package-specific assembly and termination requirements rather than being treated as interchangeable connections. The most important replacement decision is package and pin compatibility. A device with the same 676-BGA outline is not automatically interchangeable because speed-grade, temperature-grade, and device identifiers can change I/O behavior or performance. Validate the complete pinout, configuration requirements, power rails, clock resources, and timing before approving any substitute. This page consolidates the exact package and I/O information, compatible Spartan-6 LX candidates, application guidance, and board-level design considerations for engineers evaluating the XC6SLX45-N3FG676I. It is intended to accelerate component identification, replacement screening, PCB planning, and system integration without changing the verified manufacturer naming.

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XC6SLX45T-2FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD
XC6SLX45T-2FG484I

XC6SLX45T-2FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD

The AMD XC6SLX45T-2FG484I is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 3,411 configurable logic blocks, 6,822 adaptive logic modules, and 296 I/O, supplied in a 484-pin FBGA package. The verified part data identifies a 45 nm CMOS device with a 1.2 V core supply, 667 MHz performance figure, 23 mm by 23 mm package dimensions, and 1.0 mm ball pitch. Its -2 speed grade is intended for designs requiring a balance of logic density, embedded memory, DSP capability, and programmable I/O rather than the highest Spartan-6 performance tier. An FPGA is a programmable-logic semiconductor whose interconnect, logic, and I/O resources can be configured after manufacture. Spartan-6 devices belong to the FPGA and CPLD product hierarchy and combine configurable logic blocks with programmable input/output blocks, block RAM, DSP resources, clock management, and dedicated configuration mechanisms. The XC6SLX45T-2FG484I is suited to embedded systems requiring parallel interfaces, protocol handling, signal processing, control logic, and moderate on-chip data storage. Key verified features include the 43,661-cell Spartan-6 LXT architecture, 296 I/O, 3,411 configurable logic blocks, 6,822 adaptive logic modules, a 667 MHz listed operating-frequency figure, and a 1.2 V supply requirement. The 484-BBGA footprint provides a high pin count for systems using wide external buses, multiple high-speed interfaces, or several independent peripherals. The industrial-temperature suffix I identifies the grade used when the system requires operation across the industrial temperature range; exact limits are not supplied in the retrieved snippets. The device is built on 45 nm CMOS technology and is positioned for cost-sensitive, high-volume embedded applications where deterministic programmable logic is more valuable than a fixed function. The -2 speed grade provides a lower-performance option than the -3 grade identified in cross-reference data. Engineers should also consider clocking, configuration memory, power sequencing, I/O standards, and thermal dissipation when integrating the BGA package. Typical applications include industrial control gateways, networked embedded equipment, instrumentation, video and image processing, communications infrastructure, and consumer electronics. Its 296 I/O count is useful for bridging legacy parallel peripherals to serial networks, while its logic density can consolidate multiple fixed-function devices. The FPGA still requires a correctly configured bitstream, a suitable clock source, decoupling network, and thermal-aware PCB layout. The principal design consideration is package-level implementation. A 484-BBGA device requires a fine-pitch PCB land pattern, careful via-in-pad and escape-routing strategy, adequate thermal copper, and assembly process control. Designers should verify the exact Spartan-6 pinout and configuration requirements using the manufacturer package files before schematic or layout release. This page combines verified distributor and manufacturer references, drop-in family alternatives, and practical selection guidance for engineers evaluating the XC6SLX45T-2FG484I.

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XC6SLX45T-3FG484C - 43,661-Cell Spartan-6 LXT FPGA | AMD
XC6SLX45T-3FG484C

XC6SLX45T-3FG484C - 43,661-Cell Spartan-6 LXT FPGA | AMD

AMD XC6SLX45T-3FG484C is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 296 I/O, and a 484-pin FBGA package. The device uses 45 nm CMOS technology and operates from a 1.2 V supply, making it a configurable logic platform for embedded control, communications, signal processing, and industrial systems. An FPGA is a programmable semiconductor in the broader semiconductor and digital-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable I/O, embedded memory, clocking, and digital signal-processing resources. Designers implement and revise hardware behavior through a configuration bitstream rather than changing the integrated-circuit mask. The XC6SLX45T combines 43,661 logic cells with 296 I/O in the FG484C 484-pin FBGA package. Its -3 designation identifies the device speed grade used in the ordering code. The verified product listings also identify 45 nm CMOS fabrication and a 1.2 V operating supply. These resources make the device suitable for designs requiring parallel interfaces, protocol bridging, embedded control logic, and moderate signal-processing throughput. The Spartan-6 LXT architecture supports integration of programmable logic with dedicated block RAM and DSP resources. This allows a single FPGA to implement control state machines, packet buffering, waveform generation, filtering, and external interface bridging. The 296 available I/O provide substantial connectivity for parallel buses, memory interfaces, clocks, and control signals, although the exact user-assigned I/O standards must be confirmed against the manufacturer documentation. Typical applications include industrial automation, embedded instrumentation, communications equipment, video and image processing, motor control, and general-purpose digital signal processing. In each case, the FPGA is configured after power-up and can implement parallel processing or hardware protocols that would otherwise require several discrete logic devices, processors, memories, and interface components. Design planning must include the correct 484-BBGA footprint, power-plane distribution for the 1.2 V core rail, decoupling, configuration-interface implementation, and thermal analysis. Because the verified excerpts do not provide the complete pin table, pinout file contents, or package dimensions, engineers should download the official Spartan-6 documentation and verify all ball assignments before layout release. This page combines verified distributor specifications, availability information, and carefully qualified same-brand replacement guidance. It also adds application-focused design considerations, package comparison data, and explicit data gaps so procurement and engineering teams can distinguish documented facts from information that still requires manufacturer-document confirmation.

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XC6SLX45T-3FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD
XC6SLX45T-3FG484I

XC6SLX45T-3FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD

AMD XC6SLX45T-3FG484I is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 45 nm CMOS technology, a 1.2 V supply specification, and a 484-ball FBGA package. The -3 suffix identifies the performance speed grade, while the industrial-temperature suffix supports deployments across demanding embedded, communications, industrial-control, and test-equipment environments. Its programmable logic architecture combines configurable logic, dedicated hardware resources, block RAM, and DSP resources in one integrated device. An FPGA is a digital semiconductor whose internal logic, interconnections, and I/O behavior are configured after manufacture. The Spartan-6 LXT family sits between low-cost Spartan-6 LX devices and larger FPGA families, balancing logic density, embedded processing support, connectivity, and implementation cost. XC6SLX45T-3FG484I is therefore useful when a fixed-function controller is insufficient but a larger or more expensive programmable-logic platform would be unnecessary. The verified product information identifies 43,661 logic cells, 45 nm CMOS fabrication, and 1.2 V operation for this device. The 484-ball package provides a high-density surface-mount interface suitable for multilayer PCB designs. The -3 speed designation is a meaningful selection criterion because FPGA timing, achievable clock rates, and design-tool performance targets must be evaluated together rather than treating the FPGA as a conventional fixed-function IC. Spartan-6 LXT devices are designed for parallel processing, high-speed interface bridging, custom data acquisition, industrial automation, communications infrastructure, embedded vision, and test-and-measurement systems. Their parallel logic fabric allows multiple independent channels or algorithms to execute concurrently, while dedicated block RAM reduces external-memory traffic for suitable buffering operations and DSP slices accelerate arithmetic-heavy filtering and signal-processing tasks. The primary PCB constraint is the 484-ball FBGA land pattern. Because its interconnects are fine-pitch and distributed beneath the package, escape routing, power-plane continuity, via structure, solder-mask design, and assembly capability require careful planning. The design must also be checked against the selected AMD or Xilinx implementation toolchain and the exact device, package, speed grade, and temperature-grade identifiers. Before releasing a new PCB, compare the target against XC6SLX45T-2FG484C, XC6SLX45T-2FGG484I, XC6SLX45T-N3FG484I, XC6SLX45-3FG484I, and XC6SLX45T-3FGG484I using the package pin files and device selection guidance. Speed-grade, temperature-grade, marking, and ordering-code differences affect qualification even when the mechanical footprint remains unchanged. This product page consolidates verified distributor pricing, package information, same-footprint alternatives, technical comparison data, and practical PCB-design guidance. Those details help engineers separate true pin-compatible purchasing alternatives from superficially similar Spartan-6 devices and support faster procurement, qualification, and design-review decisions.

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XC6SLX75-2CSG484C - 74,637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-2CSG484C

XC6SLX75-2CSG484C - 74,637-Cell Spartan-6 LX FPGA | AMD

AMD XC6SLX75-2CSG484C is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 3,170,304 bits of block RAM, 11,662 adaptive logic modules, and 328 I/O in a 484-CSBGA package. The device operates from a 1.2 V core supply and belongs to the Spartan-6 LX FPGA family, providing programmable logic, embedded memory, and DSP resources within one integrated device. A field-programmable gate array is a semiconductor whose digital functions are defined after manufacture through a configuration bitstream. The FPGA hierarchy places this device within programmable logic devices and complex programmable logic devices. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel processing, control, protocol handling, signal generation, and interface logic in configurable hardware, allowing product revisions without changing the printed circuit board. The Spartan-6 LX family provides 74,637 logic cells and 3.02 Mbit of embedded memory for the XC6SLX75, with 11,662 adaptive logic modules and 132 DSP48A1 slices documented for the related XC6SLX75T configuration. The target package provides 328 user I/O, making the device suitable for designs requiring substantial parallel connectivity. Its 45 nm CMOS construction also places it within AMD's cost-conscious, low-power FPGA product positioning. The XC6SLX75 architecture can support parallel data processing, fixed-point DSP, control-plane logic, embedded-memory buffering, and communication interfaces. The -2 speed designation identifies the performance grade used for timing analysis and design constraints. The C suffix identifies the commercial temperature grade, while the 484-CSBGA package provides a high-density ball-grid interconnect suitable for multilayer PCB designs requiring many external connections. Typical uses include industrial control, test and measurement, video processing, communications infrastructure, embedded signal processing, and general-purpose programmable-logic platforms. Because the device combines substantial logic and memory capacity, it can consolidate several fixed-function components while retaining the flexibility to update configurations as interfaces or algorithms evolve. Projects should still verify timing, power, pinout, and configuration requirements against the exact Spartan-6 design tools and package documentation. PCB implementation requires careful power-plane distribution, decoupling, ball-escape routing, and thermal analysis for the 484-CSBGA package. The core rail is 1.2 V, while auxiliary supply requirements and configuration interface details must be taken directly from the manufacturer data sheets. Use the package pinout files and power-guidance documentation when assigning every ball and planning the power distribution network. This page combines the verified family-level characteristics, package information, searchable alternatives, comparison parameters, and practical implementation guidance in one engineering reference. It also distinguishes footprint-compatible Spartan-6 variants by speed grade, temperature grade, and device suffix so that a mechanical substitution is not mistaken for a fully qualified functional replacement.

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XC6SLX75-2CSG484I - 45nm Spartan-6 LX FPGA | AMD
XC6SLX75-2CSG484I

XC6SLX75-2CSG484I - 45nm Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-2CSG484I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 11,662 adaptive logic modules, 3.02 Mbit of embedded memory, and up to 292 I/O in a 484-FBGA package. The device uses 45 nm CMOS technology, operates from a 1.2 V core supply, and is identified by the -2 performance grade and I industrial temperature suffix. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and I/O can be configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, which includes complex programmable logic devices, field-programmable gate arrays, and system-programmable devices. Spartan-6 LX devices provide parallel programmable logic resources for control, signal processing, communications, and embedded-system designs. The XC6SLX75-2CSG484I provides 74,637 logic cells and 11,662 adaptive logic modules. Its 3.02 Mbit of embedded block RAM supports buffering, packet storage, data acquisition, and general-purpose digital processing. The 292 available I/O provide connections to external converters, memory, communications transceivers, and control logic. These figures position the device between smaller Spartan-6 parts and higher-density programmable-logic devices. The part is manufactured on a 45 nm CMOS process and uses a 1.2 V core voltage. The -2 ordering code identifies the performance grade, while CSG484 identifies the 484-ball surface-mount package. An I suffix denotes the industrial temperature option. Because the available listing does not provide complete timing, power, I/O-standard, and absolute-maximum data, those details must be confirmed in the manufacturer documentation before a design is released. Typical uses include industrial control, communications infrastructure, instrumentation, embedded signal processing, data acquisition, and compact control systems. Its combination of 74,637 logic cells and 3.02 Mbit of embedded memory allows designers to implement parallel algorithms and control functions in one programmable device while simplifying the logic around external ADCs, transceivers, and processors. PCB implementation requires careful BGA escape routing, power planning, decoupling, and thermal analysis. Because this is a 484-ball package, signal-integrity and assembly considerations are more significant than for a leaded package. The CSBGA footprint must match the PCB land pattern exactly, and the complete pinout must be checked against the selected Spartan-6 package documentation before routing. This page combines verified distributor and cross-reference data with practical qualification guidance for engineers evaluating the XC6SLX75-2CSG484I. It distinguishes documented density, memory, voltage, package, and lifecycle facts from unreported parameters and identifies the temperature- and package-code alternatives that require design review.

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XC6SLX75-2FG484C - 667 MHz Spartan-6 LX FPGA | AMD
XC6SLX75-2FG484C

XC6SLX75-2FG484C - 667 MHz Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-2FG484C is a Spartan-6 LX field-programmable gate array with 667 MHz internal frequency, 5,831 configurable logic blocks, 74,637 logic cells, and 484-ball FBGA packaging. It is designed for cost-sensitive, high-volume systems that combine programmable logic, extensive I/O, and integrated processing resources. The device operates from a 0 to 85 C temperature range and uses a 23 x 23 mm, 1 mm pitch MS-034 FBGA package. A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. The XC6SLX75 belongs to the Spartan-6 LX family and is positioned as a general-purpose FPGA for industrial, communications, control, signal-processing, and embedded systems. Its architecture allows designers to implement parallel logic, state machines, interfaces, and control functions in one programmable device while retaining the flexibility of hardware reconfiguration. The verified specifications identify 5,831 CLBs and 74,637 logic cells, providing substantially more programmable logic than small control FPGAs while remaining within a single high-density package. The 667 MHz figure is an internal frequency specification, not a guarantee that every design will achieve that frequency; external memory interfaces, timing constraints, I/O standards, routing congestion, and clocking requirements still determine achievable performance. The -2 suffix identifies the device speed grade, while the 484 package determines the board-level ball pattern and PCB land pattern. Typical designs can use the FPGA for industrial automation, machine vision, real-time networking, communications infrastructure, embedded control, and digital signal processing. The high pin count supports broad parallel interfaces and multiple I/O banks, while the large logic capacity allows complex datapaths and protocol state machines. The 23 x 23 mm FBGA-484 package requires careful escape-routing, via-in-pad or through-via fanout planning, and controlled assembly thermal conditions. The XC6SLX75-2FG484C should be selected when a design needs more parallelism and logic density than a small programmable device, while retaining the cost profile associated with the Spartan-6 family. Verify the exact AMD datasheet, package pinout file, voltage requirements, memory interfaces, configuration scheme, and speed-grade limits before layout or production release.

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XC6SLX75-2FG484I - 74,637 LE Spartan-6 LX FPGA | AMD
XC6SLX75-2FG484I

XC6SLX75-2FG484I - 74,637 LE Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-2FG484I is a Spartan-6 LX field-programmable gate array with 74,637 configurable logic elements, 5,831 logic blocks, up to 280 I/O, a 667 MHz internal frequency, and a 484-ball FBGA package. It targets industrial systems operating from 0°C to +85°C. The -2 speed grade and 23 mm by 23 mm, 1 mm-pitch MS-034 package make this device suitable for embedded control, communications, instrumentation, industrial automation, and signal-processing systems requiring programmable parallel logic and substantial I/O density. Its supply-voltage details, memory resources, block inventory, and complete ball assignment are not present in the supplied excerpts and must be confirmed in the manufacturer documentation. A field-programmable gate array is a programmable digital semiconductor containing configurable logic blocks, programmable interconnect, and input/output resources. In the product hierarchy, an FPGA is a semiconductor and programmable logic device. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can implement parallel data paths, state machines, protocol interfaces, and digital signal-processing functions in hardware. The Spartan-6 LX family is AMD's cost-oriented FPGA platform for designs that need substantial logic capacity without moving to a larger device. The verified device data identifies 74,637 configurable logic elements and 5,831 logic blocks. It also specifies up to 280 I/O and a 667 MHz internal frequency. These figures make the XC6SLX75 useful where many external interfaces or concurrent operations are required. The industrial temperature range of 0°C to +85°C supports controlled equipment environments, while the -2 suffix identifies the device speed grade. Exact performance at a particular clock depends on the selected logic path, I/O standard, timing constraints, and implemented design. The XC6SLX75-2FG484I is packaged as a 484-pin FCBGA/FBGA in a 23 mm by 23 mm body with 1 mm ball pitch. A 484-ball package exposes more programmable connections than lower-pin-count FPGA packages and supports memory interfaces, parallel buses, high-speed serial I/O, clocks, control signals, and configuration resources. Because a BGA package has hidden solder joints and dense ball spacing, PCB layout, assembly, X-ray inspection, cleaning, and thermal verification are important parts of a reliable implementation. Typical designs include industrial controllers, data-acquisition systems, embedded video-processing pipelines, communications gateways, motion-control equipment, and instrumentation. The large logic-element count can host parallel acquisition logic, digital filters, protocol converters, and host interfaces. Engineers must confirm whether external memory, differential clocks, high-speed transceivers, clock-management resources, and required voltage rails exist in the selected device before assigning pins. Configuration storage, programming cable compatibility, and bitstream generation should be validated with the complete AMD Spartan-6 documentation and tools. A key design consideration is timing closure at the verified 667 MHz device frequency. Constraints should describe the actual clock domain and all synchronous I/O paths, while post-route timing reports must be reviewed rather than treating 667 MHz as a guaranteed system-level operating point. Power estimation should include core, configuration, I/O, and auxiliary rails. Decoupling, ball-grid escape routing, layer transitions, return paths, and via-in-pad or microvia construction also need controlled-library verification. This page consolidates the exact distributor-listed specifications, verified 484-BBGA alternatives, package constraints, and procurement-oriented engineering guidance. It also distinguishes documented values from unavailable parameters instead of estimating resource counts, prices, compliance status, pin functions, or timing behavior. Designers should obtain the official Spartan-6 LX data sheet, package files, errata, and selected board constraints before releasing a production schematic or layout.

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XC6SLX75-2FG676I - 74,637-Cell Spartan-6 LX FPGA
XC6SLX75-2FG676I

XC6SLX75-2FG676I - 74,637-Cell Spartan-6 LX FPGA

The AMD XC6SLX75-2FG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 408 I/O, and a stated internal frequency of 667 MHz, supplied in a 676-BGA package. It combines programmable logic, block RAM, and DSP resources in one reconfigurable semiconductor for embedded control, signal processing, communications, and industrial systems. A field-programmable gate array is a digital integrated circuit whose interconnect and logic functions are configured after manufacture. An FPGA sits above fixed-function logic in the hardware hierarchy: designers implement parallel datapaths, state machines, interfaces, and protocol engines using hardware description code. Unlike a microcontroller that primarily executes software, the XC6SLX75 can execute many operations concurrently, making it suitable for deterministic control and high-throughput digital processing. The verified source data identifies the device as a Spartan-6 LX FPGA with 74,637 logic cells, 5,831 configurable logic blocks, and up to 400 inputs or outputs according to one distributor result. The package is identified as 676-BGA by DigiKey and Mouser listings. One secondary result instead associates an FBGA-484 designation with the MPN, creating a source conflict; engineers should therefore validate the exact ball map and package drawing before releasing a PCB footprint. The -2 suffix identifies the performance-grade ordering used by the source listings, while the trailing I indicates the industrial temperature designation in the verified comparison data. One source reports an operating range of 0 to 85 C, while another distributor source reports -40 to 100 C. Because the range is inconsistent across retrieved snippets, use the manufacturer ordering guide and package drawing as the controlling documents for production qualification. Typical uses include industrial control, data acquisition, communications gateways, embedded vision, instrumentation, and digital signal processing. The large pin count supports broad parallel connectivity to external memory, transceivers, converters, and custom interfaces. FPGA designs still require careful partitioning for timing closure, clocking, power integrity, and thermal performance. A robust integration decision starts with AMD package pinout files, Vivado tool compatibility, memory-interface requirements, and I/O standards. Do not treat a distributor description as a substitute for the official Spartan-6 documentation. This page separates verified values, flags conflicts, and avoids asserting unverified voltage, pin-level, lifecycle, and compliance details.

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XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
XC6SLX75-2FGG484I

XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD

The AMD (formerly Xilinx) XC6SLX75-2FGG484I is a Spartan-6 LX Field Programmable Gate Array (FPGA) with 74,637 logic cells, 3,170,304 system gates, 280 user I/Os, and 4,824 Kbits of Block RAM, housed in a 484-ball fine-pitch BGA (FBGA-484) package at the -2 speed grade and industrial (I) temperature rating. It is built on a 45 nm CMOS process and operates from a 1.14 V to 1.26 V core supply, delivering up to 667 MHz internal performance. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, programmable interconnect, and dedicated silicon resources (Block RAM, DSP slices, PLLs, transceivers on some variants) that can be hardware-tailored after PCB assembly. FPGAs sit between fixed-function ASICs and software-programmable processors in the compute taxonomy: integrated circuit -> digital IC -> programmable logic -> FPGA -> Spartan-6 family -> LX (logic-optimized) sub-family. They are used when time-to-market, parallel processing, and hardware reconfigurability outweigh the unit-cost advantage of mass-produced ASICs. Key features of the XC6SLX75-2FGG484I include 11,650 logic slices (each containing four 6-input LUTs and eight flip-flops), 3,170 Kbits of dedicated Block RAM (180 18-Kbit blocks), 132 DSP48A1 slices for fixed- and floating-point arithmetic, six clock management tiles (CMTs) with PLL + DLL capability, integrated PCIe endpoint block (only on LXT, NOT on LX), and on-chip 100 MHz clock support with up to 667 MHz DCM/PLL output. The -2 speed grade balances performance and power versus the -3 (highest performance) and -1L (lowest power) grades. Industrial temperature grade (-40 °C to +100 °C ambient, with junction allowed up to +125 °C) supports harsh-environment deployment. Spartan-6 LX uses a 45 nm 9-metal-layer CMOS process and a power-optimized core that supports 1.2 V core operation. Hard IP blocks (Block RAM, DSP slices, multi-boot controller, JTAG/ICAP/SPI configuration ports) live alongside the programmable fabric, enabling deterministic single-chip solutions for bridging, motor control, video processing, and embedded compute. Typical applications include industrial automation controllers, automotive infotainment bridging, video processing pipelines, software-defined radio, portable medical imaging, LED video walls, and PCIe endpoint expansion bridges. The 280 user I/Os make the 484-BGA package especially well-suited for high-pin-count industrial designs where several external buses must be addressed simultaneously. When designing with this FPGA, allocate at least 0.5 A per 100 K logic cells for VCCINT, and follow AMD UG393 (Spartan-6 PCB Design Guide) for decoupling, pinout, and signal-integrity rules. Industrial-grade parts cost roughly 20-30 % more than commercial-grade XC6SLX75-2FGG484C and should be chosen only when the operating environment exceeds 0 °C to +85 °C. This page synthesizes distributor pricing, drop-in replacement candidates, and design notes that are not consolidated in the AMD Spartan-6 datasheet alone.

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XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD
XC6SLX75-2FGG676I

XC6SLX75-2FGG676I - 74,637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-2FGG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, and a maximum internal frequency of 667 MHz. The device is supplied in a lead-free 676-ball FBGA package measuring 27 mm by 27 mm with a 1 mm ball pitch, and its -2 speed grade supports a nominal 1 V supply. A field-programmable gate array is a programmable semiconductor in the FPGA category of digital logic devices. An FPGA combines configurable logic blocks, programmable interconnect, memory resources, and input/output blocks into an integrated circuit whose circuit behavior can be modified after manufacture. Within the broader semiconductor hierarchy, the Spartan-6 LX device provides a programmable alternative to application-specific integrated circuits when interfaces, parallel processing, or logic capacity must change between product variants. Principal device characteristics include 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, 667 MHz internal frequency, and operation from approximately -40°C to +100°C for the industrial-temperature ordering indicated by the I suffix. The 676-ball FBGA package supports dense board-level integration, while the lead-free construction is explicitly identified in the available product records. The -2 designation identifies the device's performance grade within the Spartan-6 LX family, which is manufactured on 45 nm CMOS technology. Its 676-ball package provides a high pin count for high-performance design implementations, including parallel data interfaces, embedded control, industrial automation, networking equipment, and general-purpose signal processing. System timing must still be evaluated against the specific clock, I/O, and resource requirements of each implemented design. Typical applications include industrial control systems, embedded video processing, communication infrastructure, test equipment, and high-density programmable logic. The combination of 408 I/O and 74,637 logic cells permits multiple interfaces to be consolidated in one device, reducing the need for separate programmable or discrete interface components when pin and performance requirements are satisfied. A primary design consideration is BGA assembly. The 1 mm pitch, 676-ball package requires a suitable land pattern, multilayer PCB construction, appropriate thermal management, and assembly-process controls. Designers should also confirm timing closure, power budget, configuration method, bank voltage requirements, and I/O standards against the manufacturer datasheet before releasing a production design. This page consolidates verified distributor specifications, package details, availability information, comparable Spartan-6 device options, and practical selection guidance. It supplements the manufacturer datasheet with decision-oriented information for engineers evaluating the XC6SLX75-2FGG676I as an industrial-grade, high-density FPGA.

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XC6SLX75-3CSG484C - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
XC6SLX75-3CSG484C

XC6SLX75-3CSG484C - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD

The AMD (formerly Xilinx) XC6SLX75-3CSG484C is a Spartan-6 LX family Field-Programmable Gate Array (FPGA) built on a 45 nm low-power copper CMOS process, integrating 74,637 logic cells and 3,170,304 system gates into a 484-ball Chip-Scale BGA (CSBGA) package measuring 23 x 23 mm with 1.0 mm ball pitch. It targets high-volume cost-sensitive applications requiring high logic density with low static and dynamic power. What is a Spartan-6 FPGA? The Spartan-6 family is the sixth generation of Xilinx's low-cost, high-volume FPGA line, sitting within the broader taxonomy of programmable logic devices (PLD) -> FPGA -> SRAM-based FPGA -> low-power FPGA. Built on a mature 45 nm process, Spartan-6 devices combine programmable logic fabric, Block RAM, DSP slices, and hard IP cores (clock management, PCIe, memory controllers) into a single die, offering ASIC-like integration at FPGA-like flexibility. Key features of the XC6SLX75 include 5831 Configurable Logic Blocks (CLBs), up to 309 Kbits of Block RAM, a maximum internal operating frequency of 667 MHz, and 328 user I/O pins. The device is offered in the -3 speed grade (the highest performance tier of the LX family), commercial temperature range (0 to 85 C), and supports supply voltages from 1.2 V core to 3.3 V I/O. Integrated hard IP includes DSP48A1 slices for fixed- and floating-point arithmetic, SelectIO with support for multiple I/O voltages, and a memory controller block for DDR, DDR2, DDR3, and LPDDR. The LX sub-family is positioned below the LXT (which adds transceivers) and above the Spartan-6 lower-density LX devices. Architecture highlights include 6-input LUTs, dual-port Block RAM with byte-wide parity, and dedicated 18 x 18 multipliers. The 45 nm process yields approximately 50% lower static power than the prior Spartan-3A generation while supporting higher clock rates through dedicated carry chains and pipelined DSP blocks. Typical applications for the XC6SLX75-3CSG484C include industrial motor control and machine vision, video processing pipelines (display controllers, surveillance DVRs), wireline communication bridges, automotive driver assistance, and consumer display interfaces. The 484-BGA footprint and high I/O count suit designs that need many LVCMOS or LVDS pairs. When designing with this device, provide multiple decoupling caps around the BGA and follow AMD's PCB layout guidelines for chip-scale BGAs (escape routing for the 1.0 mm pitch grid). Use the ISE Design Suite (iMPACT + ISE Project Navigator) or Vivado (legacy support) for bitstream generation and JTAG programming. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not typically aggregated on DigiKey or Mouser product pages.

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XC6SLX75-3CSG484I - 74637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-3CSG484I

XC6SLX75-3CSG484I - 74637-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-3CSG484I is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 5,831 configurable logic blocks, and a 484-pin CSBGA package. It operates from a 1.2 V core supply, reaches an internal frequency of 667 MHz according to the retrieved specifications, and supports a 0 to 85 °C operating-temperature range. The device combines programmable logic, block RAM, dedicated DSP resources, and high-speed serial transceivers in one package. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor whose internal digital circuitry is defined by a configuration bitstream rather than fixed mask programming. Within the product hierarchy, an FPGA belongs to the programmable-logic and semiconductor families. The Spartan-6 LX family is positioned for cost-sensitive embedded systems requiring substantial parallel processing, deterministic interfaces, and flexible hardware updates without changing the printed circuit board. The XC6SLX75 combines 74,637 configurable logic cells with 5,831 CLBs and 328 reported I/O locations in the 484-pin CSPBGA package. Its 45 nm CMOS construction supports integration of logic, memory, and DSP blocks, while its -3 speed grade identifies one of the higher-performance grades described for the Spartan-6 LX family. The CSBGA package has a 1 mm pitch and a reported body size of 23 × 23 mm according to the retrieved distributor data. Spartan-6 devices support parallel processing, serial connectivity, and programmable logic through configurable I/O resources. This device family can implement control logic, communication bridges, data acquisition pipelines, embedded processors, and hardware signal-processing functions. Because a complete system can be implemented in programmable logic, the FPGA can also support field upgrades, product differentiation, and reduced external-component count when its resources match the design requirements. Typical uses include industrial automation and factory control, networked communications, test and measurement equipment, embedded video processing, data acquisition, and embedded processing platforms. The 74,637-cell count is particularly useful for designs that need multiple parallel channels or a combination of control logic and DSP. Designers must still verify the exact pin assignments, power rails, supported I/O standards, memory configuration, and transceiver features against the applicable AMD package and device documentation. Board-level implementation requires careful high-speed layout, continuous supply planes, correct BGA escape routing, and decoupling near the package power and ground balls. The 1 mm-pitch CSPBGA also demands controlled assembly processes, including suitable stencil design, solder-paste inspection, and thermal verification. External memory interfaces, serial links, and user I/O should be routed according to the official package pinout files and device-specific layout guidance. This product record combines verified distributor specifications, package information, pricing references, and same-package replacement findings with practical selection guidance. The alternative list is intentionally limited to candidates supported by the supplied cross-reference results, avoiding unsupported cross-package substitutions or packaging-only variants presented as drop-in replacements.

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XC6SLX75-3FG484I - 74637-Cell Spartan-6 FPGA | AMD
XC6SLX75-3FG484I

XC6SLX75-3FG484I - 74637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-3FG484I is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 280 I/O, and a 484-ball FBGA package. The -3 speed grade is identified by the provided sources as the highest-performance Spartan-6 LX grade, while the I suffix denotes the industrial-temperature option listed at 0°C to 85°C. One distributor specification lists 5,831 configurable logic blocks and 667 MHz internal frequency, while another catalog listing states 862 MHz; engineers should verify the exact timing interpretation against the applicable AMD datasheet and selected device documentation before using either figure as a design limit. A field-programmable gate array, or FPGA, is a programmable logic device whose configurable logic blocks, programmable interconnect, block RAM, and digital signal-processing resources can be interconnected after manufacture. Within the semiconductor hierarchy, this device is a Spartan-6 FPGA, then a programmable-logic IC and digital semiconductor. Its large logic capacity and high pin count suit parallel control, protocol bridging, data acquisition, embedded signal processing, and industrial automation systems that need deterministic hardware parallelism. The verified listings identify 74,637 cells, 45 nm CMOS fabrication, a nominal 1.2 V supply, 280 user I/O, and a 23 mm by 23 mm FBGA-484 package with 1 mm pitch. The -3 grade provides the family’s highest performance positioning according to the supplied specification source. This matters in timing-sensitive designs, but nominal family speed alone does not determine achievable clock frequency; routing, resource type, voltage, temperature, timing constraints, and design effort remain decisive. The 484-ball package exposes substantially more interconnect than a typical low-pin-count FPGA, making it appropriate for high-bandwidth parallel systems and substantial external memory or peripheral interfaces. Conversely, it requires careful escape routing, via-in-pad-aware assembly, thermal analysis, and BGA-aware inspection. Configuration storage, bank supply requirements, supported I/O standards, and pin constraints must be checked in the official pinout and package files. Typical uses include industrial machine vision, robotics, test-and-measurement front ends, networking equipment, embedded video control, and high-throughput digital acquisition. The programmable resources allow parallel pipelines and multiple interfaces to coexist without relying entirely on a microcontroller for timing-critical control. For each deployment, engineers should validate memory-mapper resources, clocking, pin assignments, configuration mode, and timing closure in AMD development tools. A critical design step is to preserve BGA thermal and assembly margin by following AMD package guidelines and validating the completed PCB stack-up. Power rails should be decoupled according to the manufacturer guidance, while clocks and high-speed interfaces require controlled return paths. This page combines verified catalog specifications, sourcing data, and engineering guidance while clearly separating confirmed facts from values requiring further documentation.

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XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA
XC6SLX75-3FG676C

XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

The AMD Xilinx XC6SLX75-3FG676C is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, and a listed internal frequency of 667 MHz, housed in a 676-ball FBGA package. It is built on 45 nm CMOS technology and targets systems requiring high integration, programmable logic, and a broad range of I/O. The device is identified as a -3 speed-grade part, while its commercial operating-temperature range is listed as 0°C to 85°C. A field-programmable gate array is a semiconductor device whose digital logic and interconnect can be configured after fabrication. FPGAs belong to the programmable-logic hierarchy, alongside CPLDs, and are commonly used for rapid prototyping, embedded control, signal processing, interface bridging, and hardware acceleration. Unlike a fixed-function ASIC, an FPGA allows logic, memory, and interfaces to be changed during design revisions by updating the configuration bitstream. The XC6SLX75-3FG676C provides 74,637 logic cells and 5,831 CLBs according to the supplied distributor records. Its 676-ball package supports a large pin count for high-I/O designs, while the 45 nm Spartan-6 process provides programmable logic, block RAM, DSP resources, and selectable I/O standards. The listed internal frequency is 667 MHz, although achievable system clocking and interface rates depend on the selected clocking resources, I/O standards, timing constraints, and PCB implementation. Typical uses include industrial automation, automotive infotainment, consumer electronics, communications infrastructure, and embedded processing systems. The -3 grade is described in the supplied comparison material as the highest-performance Spartan-6 LX speed grade. A 676-BGA package also requires careful PCB layout, including adequate escape routing, controlled-length clock paths, solid power distribution, and thermal management for sustained operation. The most important design tradeoff is integration versus package complexity. The large FBGA footprint offers substantial programmable resources and I/O capacity, but it requires fine-pitch layout capability, via-in-pad or escape-routing strategies, and careful assembly controls. Before releasing a design, engineers should verify the exact pin assignments, configuration requirements, power rails, clocking plan, and I/O voltage limits against the manufacturer datasheet. This page combines verified distributor specifications, cross-reference results, package details, pricing context, and practical integration guidance. Because the supplied data does not include complete electrical tables or a validated manufacturing quote, unavailable values are explicitly identified rather than inferred.

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