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XC6SLX45-2FGG676C - Spartan-6 LX FPGA, 43,661 Cells, 676-BGA | AMD
XC6SLX45-2FGG676C

XC6SLX45-2FGG676C - Spartan-6 LX FPGA, 43,661 Cells, 676-BGA | AMD

The AMD (formerly Xilinx) XC6SLX45-2FGG676C is a Spartan-6 LX Field Programmable Gate Array (FPGA) delivering 43,661 logic cells, 2,138,112 bits of block RAM, and 358 user I/Os in a 676-ball Fine-pitch Ball Grid Array (FBGA) package. Built on a mature 45 nm low-power copper process, the LX family targets high-volume, power-conscious applications and is offered in -3N, -2, and -1L speed grades with the -2 grade used here delivering a balance of performance and power. The FGG676 package measures 27 x 27 mm with 1.0 mm ball spacing and supports extended I/O count required for parallel memory buses, video pipelines, and industrial control fabrics. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that engineers can re-program after manufacture to implement arbitrary digital logic. FPGAs occupy the middle ground between fixed-function ASICs (highest efficiency, no flexibility) and microcontrollers (software-defined, lower throughput). In the broader taxonomy, the Spartan-6 LX sits inside the FPGA & CPLD category, alongside Lattice ECP-series, Intel Cyclone series, and AMD/Xilinx Artix-7 and Spartan-7 successor families. Key features include 4 DSP48A1 slices, 6 PLLs, 4 Memory Controller Blocks (MCBs), and PCI Express endpoint capability on selected Spartan-6 LXT variants. The device supports up to 500 MHz internal clock speeds and consumes roughly half the power of previous-generation Spartan FPGAs. Integrated SelectIO technology provides flexible I/O voltage support across 1.2V to 3.3V standards, including LVCMOS, LVTTL, SSTL, and differential pairs. Architecturally, the Spartan-6 LX uses a Configurable Logic Block (CLB) array with 4 LUTs per slice, dedicated carry chains, and distributed SRL32 shift-register capability. Hardened IP blocks (PCIe, GTP transceivers on LXT, MCBs, block RAM, DSP48A1 slices) are arranged in column form along the device fabric, delivering predictable performance for memory and DSP pipelines. The configuration bitstream is loaded via JTAG, Serial (SPI/BPI) modes, or internal flash on supported densities. Typical applications include industrial motor control, video processing pipelines, low-cost PCIe endpoint cards (on LXT variants), embedded vision, and legacy parallel bus bridging. The 358 I/Os make it well suited for connecting to DDR2/DDR3 memory, parallel ADC/DAC interfaces, and high-pin-count display or camera links. Industrial-grade and commercial temperature screening is available across the family. When designing with this device, ensure the supply rails (Vccint 1.2V core, Vccaux 2.5V, Vcco 1.2-3.3V per bank) are sequenced per AMD guidelines and that decoupling capacitance matches the UG385 reference design. The 1.0 mm pitch FBGA requires PCB fabrication capable of microvia stack-ups; design rule checks should validate escape routing for inner-row balls. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet.

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XC6SLX45-2FGG676I - Spartan-6 LX FPGA, 43K LC, 676-BGA | AMD
XC6SLX45-2FGG676I

XC6SLX45-2FGG676I - Spartan-6 LX FPGA, 43K LC, 676-BGA | AMD

The AMD Xilinx XC6SLX45-2FGG676I is a Spartan-6 LX field-programmable gate array (FPGA) featuring 43,661 logic cells (43661 cells), 3,411 configurable logic blocks (CLBs), 358 user I/Os, and 2,088 Kbit of block RAM, housed in a 676-ball fine-pitch BGA (FBGA) package. The device is fabricated on a low-power 45 nm CMOS process and operates from a 1.2 V core supply with multi-voltage I/O support. An FPGA is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and embedded DSP/memory resources that engineers can reconfigure in-circuit to implement custom digital hardware. Within the programmable-logic hierarchy, the Spartan-6 LX family sits between hardened ASICs and small CPLDs, delivering a balance of logic density, DSP performance, and cost optimized for high-volume applications such as consumer, industrial, and automotive driver systems. Key technical resources include 54,576 flip-flops, 58 DSP48A1 slices for high-throughput arithmetic, four clock-management tiles (CMTs) with internal frequency support up to 500 MHz, and integrated memory controller blocks (MCBs) capable of DDR/DDR2/DDR3/LPDDR interfaces. The -2 speed grade balances performance and power, while the “I” suffix denotes the industrial operating temperature range of -40 °C to +100 °C. The Spartan-6 architecture pairs a Virtex-class fabric with cost-optimized 6-input LUTs, dual 18 Kbit block RAM per CLB column, and PCI Express, Gigabit Ethernet, and serial GTP transceivers (selectively enabled on LX devices with the “T” suffix). The 27 mm × 27 mm, 1 mm-pitch FBGA-676 footprint delivers a compact high-density breakout suitable for high-pin-count designs. Typical applications include industrial motor control and machine vision, automotive driver assistance and infotainment, broadcast video processing, wired/wireless communication bridges, and high-volume consumer electronics where the LX family’s price-per-logic density is decisive. When designing with this device, plan power-rail sequencing for the 1.2 V core and the auxiliary VCCAUX/VCCO rails, and use the dedicated configuration pins (M0–M2) to select the boot mode (JTAG, master/slave serial, SPI, or BPI). Provide a JTAG header for in-system programming and boundary-scan debug. This page synthesizes distributor pricing, drop-in Spartan-6 LX alternatives, and practical design considerations not consolidated on the manufacturer datasheet, helping engineers select and source the right device for high-volume production.

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XC6SLX45-3CSG324C - Spartan-6 LX FPGA | AMD | 324-BGA
XC6SLX45-3CSG324C

XC6SLX45-3CSG324C - Spartan-6 LX FPGA | AMD | 324-BGA

The AMD XC6SLX45-3CSG324C is a Spartan-6 LX field-programmable gate array with 43,661 logic cells, 218 I/O, and a 324-ball CSBGA package. It operates from a 1.14 V to 1.26 V supply and combines programmable logic, digital clock managers, PLLs, and block RAM in a single 45 nm FPGA. The -3 designation identifies the highest-performance Spartan-6 LX speed grade, while the C suffix identifies the commercial operating-temperature option. Its 324-ball package measures 15 mm by 15 mm and uses a 0.80 mm ball pitch. An FPGA is a reconfigurable digital semiconductor whose logic, interconnect, and memory resources can be programmed after manufacture. Within the semiconductor hierarchy, the Spartan-6 LX FPGA sits below FPGA, above programmable logic, and combines configurable logic blocks, programmable interconnect, block RAM, DSP resources, and clock-management circuitry. This integration makes it suitable for designs requiring parallel processing, real-time control, flexible interfaces, or field-updatable logic without redesigning a fixed-function ASIC. The XC6SLX45-3CSG324C provides 43,661 logic cells, 218 I/O, and an internal frequency listed as 500 MHz. Its dedicated digital clock managers and PLLs support generated, phase-shifted, and synchronized clock architectures. The 1.14 V to 1.26 V core-supply range supports low-voltage designs, while the 324-ball CSBGA offers a compact, high-pin-count footprint for advanced bridging, control, and interface applications. The device is built on 45 nm process technology and is positioned as a cost-conscious Spartan-6 solution for high-volume embedded systems. Programmable logic resources can implement parallel datapaths, protocol bridges, control engines, and signal processing, while dedicated hard resources offload clocking and frequently used memory operations. Engineers still must complete system-level timing closure, power budgeting, and I/O assignment against the selected design. Typical applications include automotive infotainment, industrial automation, consumer video processing, embedded communications, and general-purpose bridging. In an automotive infotainment design, the FPGA can combine multiple video interfaces, audio routing, and control logic. In industrial equipment, it can coordinate sensors, motion-control logic, and fieldbus adapters while supporting updateable configurations after deployment. For new layouts, follow the AMD Spartan-6 package pinout file and the device-specific PCB design guidance when assigning power, ground, configuration pins, and differential I/O. BGA assembly requires thermal-via and pad-stack planning, while the 1.14 V to 1.26 V core rail needs sequencing and decoupling appropriate to the selected power architecture. Verify all pin assignments and constraints in the final Vivado design. This product record combines the verified device identity, electrical limits, package details, speed-grade context, and same-family replacement candidates with practical selection and layout guidance. It also distinguishes same-footprint alternatives by speed grade and temperature suffix, helping engineers identify candidates that require qualification rather than assuming that every CSG324 variant is interchangeable.

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XC6SLX45-3CSG324I - 43,661 Logic Cell Spartan-6 FPGA | AMD
XC6SLX45-3CSG324I

XC6SLX45-3CSG324I - 43,661 Logic Cell Spartan-6 FPGA | AMD

The AMD Xilinx XC6SLX45-3CSG324I is a Spartan-6 LX field-programmable gate array with 43,661 logic cells, 218 I/O, and a 324-LFBGA CSPBGA package. It is built on 45 nm FPGA technology with a 1.2 V core supply and is specified for the -40°C to +100°C industrial temperature range. The device belongs to the Spartan-6 LX family, which combines programmable logic, block RAM, digital signal processing resources, and programmable I/O in a single integrated FPGA. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic functions are configured after manufacture through a configuration bitstream. The XC6SLX45 is positioned for cost-sensitive embedded systems requiring substantially more parallel processing capability than a small microcontroller or discrete logic implementation. Its 43,661 logic cells can support control logic, interface bridges, protocol engines, data acquisition, and general-purpose digital processing. The XC6SLX45-3CSG324I uses the -3 speed grade, identifying a specific performance and timing characterization grade within the Spartan-6 LX device family. The 218 I/O count provides connections for external memory, control signals, communications links, and system buses, while the 324-pin CSPBGA package supports dense board layouts. The package designation CSG324 identifies the 324-ball package used by this device, and the I temperature suffix identifies its industrial temperature grade. Spartan-6 devices combine configurable logic blocks with dedicated block RAM and DSP resources, allowing designers to balance parallel datapaths against general logic. A typical implementation may use programmable logic for acquisition control and DSP resources for filtering or modulation, with block RAM buffering data between pipeline stages. Configuration, clocking, power management, and I/O standards must be selected through the FPGA development environment before the device can operate in the target system. Typical applications include industrial control, instrumentation, communications equipment, embedded vision, test and measurement, and cost-sensitive embedded processing. The 218-I/O device is particularly useful when a design requires numerous external connections or several independent parallel data paths. Designers should verify timing against the selected clock rate, confirm pin compatibility for any replacement, and provide the required power, decoupling, and configuration circuitry on the PCB. The key design consideration is that an FPGA replacement is valid only when the package, pinout, supported I/O standards, configuration behavior, voltage requirements, timing grade, and temperature range are compatible. A lower speed grade may preserve the board footprint but reduce timing margin, while a commercial-temperature variant may not be acceptable for an industrial environment. This page combines package, logic-cell, I/O, temperature, compliance, and substitution information with practical selection guidance. This product information is useful because it consolidates the key FPGA identity, package details, electrical characteristics, drop-in considerations, and engineering trade-offs into a format that can be used for initial design selection, sourcing review, and footprint-risk assessment.

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XC6SLX45-3CSG484I - 43,661 LE Spartan-6 FPGA | Xilinx
XC6SLX45-3CSG484I

XC6SLX45-3CSG484I - 43,661 LE Spartan-6 FPGA | Xilinx

The Xilinx XC6SLX45-3CSG484I is a Spartan-6 LX field-programmable gate array with 43,661 logic elements, 6,822 adaptive logic modules, 2.04 Mbit of embedded memory, and a 500 MHz internal clock in a 484-ball CSPBGA package. Designed for industrial-temperature applications, it operates from a 1.14 V to 1.26 V core supply and uses 45 nm CMOS technology. A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor in which lookup tables, registers, routing resources, and programmable I/O blocks implement custom logic. Within the device hierarchy, an FPGA belongs to programmable logic devices and combines logic density, parallel processing, configurable interfaces, and deterministic hardware execution. The Spartan-6 LX family targets embedded control, communications, industrial automation, signal processing, and cost-sensitive systems requiring high integration. The XC6SLX45-3CSG484I provides 6,822 adaptive logic modules and 43,661 logic elements for implementing parallel datapaths, control logic, protocol engines, and state machines. Its 2.04 Mbit of embedded block RAM supports buffers, packet storage, data acquisition, and general-purpose memory functions. The 484-ball CSPBGA package offers 320 I/O according to the device listing, while the -3 speed grade identifies the performance class and the I suffix identifies the industrial temperature grade. The device uses a 45 nm CMOS process and a 1.2 V nominal core supply. Its 1.14 V to 1.26 V operating range provides the design margin needed for a properly regulated core rail. The 500 MHz internal frequency is not a guarantee that every design will close at that frequency; timing closure depends on architecture, routing, I/O standards, speed grade, tool settings, and board constraints. AMD specifies the complete operating limits and characteristics in the Spartan-6 FPGA data sheet DS162. Typical uses include industrial controller and sensor-hub designs, industrial networking equipment, high-resolution data-acquisition systems, motor and motion-control platforms, instrument interfaces, and embedded video processing. The combination of programmable logic, dedicated block RAM, and a high pin count permits parallel sensor aggregation, protocol conversion, and real-time filtering without relying on a separate microprocessor for every control task. PCB implementation requires a precision multilayer layout, local decoupling, careful supply grounding, and complete via-in-pad or fanout planning for the fine-pitch 484-ball package. Designers should also confirm the selected Spartan-6 package pinout file, memory-interface constraints, and I/O voltage requirements before releasing the board layout. Because this package has many balls and dense escape routing, manufacturing capability and assembly-process selection are central design decisions. This product page combines the key device ratings, verified commercial availability, package and cross-reference details, alternative-part comparisons, and practical implementation guidance. It is intended to help engineers confirm footprint compatibility, assess speed-grade and temperature-grade changes, and plan power, layout, and lifecycle decisions before placing the FPGA into a production design.

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XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD
XC6SLX45-3FG484C

XC6SLX45-3FG484C - 45nm Spartan-6 LX FPGA | AMD

The AMD XC6SLX45-3FG484C is a 45 nm CMOS Spartan-6 LX field-programmable gate array with 43,661 logic cells, 316 I/O, and a 500 MHz internal frequency, packaged in a 15 mm by 15 mm, 0.80 mm-pitch 484-BBGA. The -3 suffix identifies the highest-performance Spartan-6 speed grade, while the C suffix identifies the commercial operating-temperature option. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic and interconnect can be configured after manufacture. An FPGA belongs to the broader programmable-logic hierarchy, joining CPLDs as a reconfigurable implementation of digital functions. The Spartan-6 LX family combines configurable logic, block RAM, dedicated processing resources, and general-purpose I/O in one device, making it suitable for parallel data acquisition, embedded control, interface bridging, and industrial automation. Key features include 43,661 configurable logic elements, 316 I/O, 2.04 Mbit of embedded memory, 6,822 adaptive logic modules, and 500 MHz internal frequency. The device uses 45 nm CMOS technology and a nominal 1.2 V supply. Its 484-BBGA package provides a compact 15 mm by 15 mm footprint with a 0.80 mm ball pitch, enabling dense PCB layouts when the BGA routing and assembly requirements are properly controlled. The Spartan-6 architecture provides a practical balance between programmable logic capacity, memory, I/O, and implementation cost. The -3 grade is intended to provide stronger timing performance than the lower -2 and -1L speed grades, although system-level timing still depends on the selected clocking, I/O standards, speed grade, and device utilization. The commercial-grade part is intended for environments where the listed 0 °C to 85 °C operating range is sufficient. Typical uses include industrial automation controllers, data-acquisition systems, video and image processing, communications infrastructure, embedded signal processing, and general-purpose bridging between parallel buses or proprietary peripherals. The large I/O count supports designs requiring numerous external connections, while the internal logic and memory resources allow multiple functions to be consolidated into one programmable device. The primary design constraint is the 484-BBGA package. A PCB redesign is generally unavoidable when moving from a leaded package, and reliable assembly requires suitable pad geometry, via-in-pad or via-away routing, adequate solder mask definition, and careful power and ground-plane distribution. Differential and high-speed interface constraints must also be checked against the appropriate Xilinx Spartan-6 package and pinout files before layout signoff. This page consolidates the verified catalog and cross-reference information, compares pin-compatible same-family options, and highlights BGA implementation considerations. It is intended to support engineering selection and procurement review without treating family variants as interchangeable unless their speed grade, temperature class, package, and device resources have been checked.

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XC6SLX45-3FG484I - 316 I/O Spartan-6 LX FPGA | AMD
XC6SLX45-3FG484I

XC6SLX45-3FG484I - 316 I/O Spartan-6 LX FPGA | AMD

The AMD XC6SLX45-3FG484I is a Spartan-6 LX field-programmable gate array with 316 I/O, a 500 MHz internal frequency, and a 484-BBGA package measuring 15 x 15 mm with 0.80 mm ball pitch. It is identified as the -3 speed grade, which is the highest-performance speed grade in the Spartan-6 LX family, and the industrial-temperature suffix I indicates a component intended for industrial operating conditions. A field-programmable gate array is a programmable logic device in which digital functions are implemented through configurable logic blocks and programmable interconnect. Within the semiconductor hierarchy, an FPGA sits above fixed-function logic and below programmable SoC implementations. The Spartan-6 LX family combines programmable logic, block RAM, DSP resources, clocking, and general-purpose I/O in a single device for applications requiring adaptable hardware functionality. The verified key specifications for XC6SLX45-3FG484I include 316 I/O, a 500 MHz internal frequency, and 484-BBGA packaging. The package is specified as a 15 x 15 mm lead-free MO-275 arrangement with a 0.80 mm pitch and 324 balls according to the available detailed listing. These figures position the device as a high-pin-count Spartan-6 option for designs requiring extensive board-level connectivity while retaining a relatively compact package. The -3 designation identifies the highest-performance Spartan-6 speed option listed in the verified data. This distinction is important in clocked digital systems because speed-grade differences affect achievable timing performance and should be checked against the selected clocking, I/O, and memory interfaces. The I suffix identifies the industrial-temperature version, while related C-suffix parts provide a distinct commercial-temperature choice. Typical uses include industrial control, communications equipment, embedded processing, test and measurement, and signal-processing systems that benefit from parallel programmable logic. Its 316 available I/O can support external memory, data converters, communication transceivers, control signals, and parallel buses, subject to the exact bank voltage, pin, and timing constraints defined by the manufacturer documentation. Designers should obtain the AMD Spartan-6 package pinout file and the device-specific datasheet before assigning power, clock, configuration, and I/O pins. The available sources identify the package and pin count, but they do not provide a complete verified ball-by-ball signal list or a manufacturer PDF URL for this exact ordering code. Those details should therefore be checked against the official device documentation rather than inferred from similar MPN suffixes. This page consolidates verified distributor availability, exact package and timing identifiers, drop-in family comparisons, procurement facts, and practical design cautions. It also distinguishes confirmed data from attributes that still require verification in the manufacturer datasheet, reducing the risk of treating a speed-, temperature-, or package-suffix change as an unqualified functional equivalent.

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XC6SLX45-3FG676I - 43,661-Cell Spartan-6 FPGA | AMD
XC6SLX45-3FG676I

XC6SLX45-3FG676I - 43,661-Cell Spartan-6 FPGA | AMD

AMD XC6SLX45-3FG676I is a Spartan-6 LX field-programmable gate array with 43,661 logic cells, 2,138,112 RAM bits, 358 I/O, and a maximum internal frequency of 500 MHz, packaged in a 676-BGA. It targets industrial logic, embedded control, communications, instrumentation, and high-density programmable logic designs. A Field-Programmable Gate Array (FPGA) is a semiconductor whose digital logic, interconnects, memory resources, and I/O behavior are configured after manufacture. The Spartan-6 LX family combines configurable logic blocks, block RAM, digital signal processing resources, and programmable I/O. This makes an FPGA suitable for parallel data processing, protocol bridging, control automation, signal generation, and system consolidation where changing hardware requirements are important. The verified device information identifies 43,661 logic cells, 2,138,112 RAM bits, 358 I/O, and 500 MHz internal frequency. The -3 suffix denotes the highest-performance speed grade listed in the retrieved Spartan-6 LX data. The XC6SLX45 device combines substantial programmable logic with embedded block memory, allowing designers to implement parallel datapaths and control functions in one device rather than relying on multiple fixed-function components. The XC6SLX45-3FG676I uses a 676-BGA package with a 1 mm ball pitch and is identified as lead-free in the retrieved distributor and comparison data. Its operating-temperature classification is reported as industrial in the retrieved Partstack result, while the provided DigiChip listing reports 0°C to 85°C. Designers should verify the exact temperature grade, electrical limits, package dimensions, and power requirements against the official AMD Spartan-6 documentation before release to manufacturing. Typical applications include industrial automation, test and measurement equipment, communications infrastructure, embedded control systems, data acquisition, and digital signal processing. The large I/O count is valuable for systems requiring parallel interfaces, while the RAM resources support buffering, packet storage, lookup tables, and high-throughput parallel logic. FPGA designs must also account for configuration setup, clocking, power delivery, thermal performance, signal integrity, and pin assignment. For a new design, use the official AMD Spartan-6 package files and datasheet to confirm every BGA ball assignment, power rail, decoupling requirement, configuration interface, and supported I/O standard. This page summarizes verified catalog data and highlights the practical design considerations that matter most when selecting, routing, sourcing, or replacing this FPGA.

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XC6SLX45-3FGG484C - Spartan-6 LX FPGA, 43K Logic Cells | AMD
XC6SLX45-3FGG484C

XC6SLX45-3FGG484C - Spartan-6 LX FPGA, 43K Logic Cells | AMD

The AMD (formerly Xilinx) XC6SLX45-3FGG484C is a Spartan®-6 LX field-programmable gate array (FPGA) featuring 43,661 logic cells, 316 user I/Os, and 2,138,112 system gates in a 484-ball flip-chip BGA package with 1.0 mm ball pitch (FBGA-484). It targets the -3 commercial speed grade and delivers up to 862 MHz operating frequency. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor that combines programmable logic blocks, configurable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and clock management tiles. FPGAs occupy the broader category of programmable logic devices (PLD) within digital semiconductors, sitting between fixed-function ASICs and general-purpose microcontrollers in design flexibility. The Spartan-6 family uses a 45 nm CMOS process and offers a low-cost, low-power platform for high-volume applications in industrial, consumer, and communications markets. The XC6SLX45 contains 2,011 Kbits of embedded block RAM, 58 DSP48A1 slices for fixed-point arithmetic, a clock management tile (CMT) with two mixed-mode clock managers (MMCMs) and a phase-locked loop (PLL), and integrated SelectIO™ technology that supports voltages from 1.2 V to 3.3 V per I/O bank. The device integrates a hard memory controller block (MCB) supporting DDR, DDR2, DDR3, and LPDDR external memory interfaces without consuming FPGA fabric resources. Typical applications include industrial motor control, video processing pipelines, automotive driver-assistance subsystems, communications backplane bridging, and consumer electronics requiring flexible logic integration. The wide I/O count and embedded memory make it well-suited for high-density glue logic replacement, custom peripheral interfacing, and pre-silicon prototyping of ASIC designs. When designing with this FPGA, ensure the PCB layout follows AMD's package guidelines for FBGA-484, including 1.0 mm pitch escape routing, matched-length pairs for SelectIO LVDS pairs, and decoupling capacitors within 100 mils of each power pin. The device operates across 0 °C to +85 °C commercial junction range and requires multiple supply rails (VCCINT 1.0 V–1.05 V, VCCAUX 2.5 V, VCCO 1.2 V–3.3 V) that must be sequenced according to the datasheet recommendations. Compared to CPLDs, FPGAs deliver much higher logic density at the cost of static power and configuration memory. Within the Spartan-6 LX sub-family, the LX45 occupies the mid-density position above LX16/LX25 and below LX75/LX100, balancing cost per logic cell against usable I/O count. Choose LX45 when designs exceed LX25 capacity but do not require LX75 block RAM or DSP headroom. This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet alone.

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XC6SLX45-3FGG484I - 43,661-Cell Spartan-6 FPGA | AMD
XC6SLX45-3FGG484I

XC6SLX45-3FGG484I - 43,661-Cell Spartan-6 FPGA | AMD

The AMD Xilinx XC6SLX45-3FGG484I is a Spartan-6 LX FPGA with 43,661 configurable logic cells, a 500 MHz internal frequency, and 316 I/O in a 484-ball lead-free BBGA package. The -3 speed grade is specified for higher performance, while the industrial-temperature suffix I supports operation from 0°C to 85°C. This combination makes the device suitable for industrial automation, motor control, machine vision, telecommunications, and embedded control systems requiring programmable logic and DSP capability. A field-programmable gate array is a digital semiconductor whose logic, interconnect, and processing resources can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic device, a reconfigurable semiconductor, and a higher-complexity alternative to fixed-function logic. The Spartan-6 LX family combines logic resources, block RAM, DSP blocks, programmable I/O, and dedicated configuration functions within a single integrated circuit. The XC6SLX45-3FGG484I provides 43,661 logic cells organized into 6,822 adaptive logic modules, with related family data identifying 3,411 configurable logic blocks and a maximum operating frequency of 862 MHz. Its 316 I/O support useful external connectivity for control signals, data buses, memory interfaces, and industrial communication links. The device is manufactured using 45 nm CMOS technology according to the manufacturer family documentation. The -3 designation identifies the high-performance Spartan-6 LX speed grade, making this ordering code appropriate when timing closure or interface performance is more important than minimum cost. Its 484-ball package supports dense board layouts, while the 0.80 mm ball pitch and 15 mm by 15 mm body require careful ball assignment, escape routing, and multilayer PCB design. The package is identified as lead-free and compatible with MO-275-style board-level construction guidance. Typical applications include factory automation controllers, programmable machine interfaces, motor-control systems, industrial networking equipment, test and measurement platforms, and embedded video or vision processing. The combination of substantial logic density, DSP capability, and numerous I/O allows designers to consolidate control logic and parallel processing into one programmable device instead of using multiple fixed-function components. The primary design consideration is PCB implementation rather than linear power dissipation. Follow the AMD Spartan-6 package pinout files when assigning balls and route high-speed interfaces with controlled impedance, continuous reference planes, and appropriate length matching. Confirm the selected configuration, I/O standards, supported clocking resources, and industrial temperature requirements before releasing the design to fabrication. This product page consolidates the verified device identity, package characteristics, family parameters, ordering-code alternatives, and practical implementation guidance. It also highlights which details require confirmation in the AMD package data and design tools before a new board is released.

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XC6SLX45-3FGG676C - Spartan-6 LX 43,661-Cell FPGA | Xilinx
XC6SLX45-3FGG676C

XC6SLX45-3FGG676C - Spartan-6 LX 43,661-Cell FPGA | Xilinx

Xilinx XC6SLX45-3FGG676C is a Spartan-6 LX field-programmable gate array with 43,661 logic cells, a 45 nm CMOS process, a 1.2 V core supply, and a 676-ball surface-mount BGA package. The -3 speed grade is positioned for maximum Spartan-6 LX performance, while the listed operating-temperature range is 0°C to 85°C. It is a lead-free component associated with package outline MO-275. A field-programmable gate array, or FPGA, is a programmable semiconductor that combines configurable logic, programmable interconnect, memory resources, and dedicated input/output blocks. Within the product hierarchy, the XC6SLX45 belongs to the Spartan-6 LX FPGA family and the broader Xilinx programmable-logic portfolio. Its 43,661 logic cells support parallel digital processing, control logic, interface bridging, and embedded signal-processing designs where fixed-function logic would require excessive board area. The device is manufactured on a 45 nm CMOS technology and operates with a 1.2 V core voltage. The -3 suffix identifies the highest-performance speed grade listed for the Spartan-6 LX family. Distributed RAM, block RAM, digital clock management, and programmable I/O resources allow designs to combine control functions with moderate data processing. The package provides 676 balls for power distribution, configuration access, and signal interconnection in high-pin-count designs. Engineering use depends on the complete device configuration, selected I/O standards, clocking scheme, and system timing constraints. A 500 MHz internal-frequency figure is listed in the device information, but it should not be treated as a guaranteed operating frequency for every design. External memory interfaces, high-speed transceivers, clock inputs, and timing-critical interfaces must be evaluated against the applicable Xilinx documentation and simulation results. Typical applications include industrial automation controllers, embedded video and image-processing systems, communications infrastructure, test and measurement equipment, and compact control platforms. The 676-ball BGA package is particularly useful where I/O density is important and the PCB can support controlled escape routing, fine-pitch assembly, and appropriate thermal management. Design planning should include the Spartan-6 configuration scheme, supported memory interfaces, bank-specific supply requirements, decoupling, clock topology, and pin assignments. A new PCB revision should use the manufacturer package drawing and pinout rather than inferring ball locations from a generic BGA diagram. For replacements, verify the speed grade, temperature grade, package ball map, voltage requirements, and configuration compatibility before treating a device as interchangeable. This product page consolidates the device identity, package information, comparison guidance, and practical implementation considerations into one engineering reference. It also identifies where design verification must rely on the manufacturer documentation, particularly for ball assignments, power sequencing, timing, and configuration details.

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XC6SLX45-3FGG676I - 43,661-Cell Spartan-6 LX FPGA | AMD
XC6SLX45-3FGG676I

XC6SLX45-3FGG676I - 43,661-Cell Spartan-6 LX FPGA | AMD

AMD XC6SLX45-3FGG676I is a Spartan-6 LX field-programmable gate array with 43,661 logic cells, a -3 performance grade, and a 676-ball BGA package. It uses 45 nm CMOS technology and supports a 1.2 V core supply, making it suitable for consolidated control, interface, signal-processing, and embedded-system designs. The device combines programmable logic with configurable I/O resources in a single package. A field-programmable gate array is a digital semiconductor whose logic functions are established after fabrication through a configuration bitstream. Within the FPGA hierarchy, the Spartan-6 LX family belongs to the AMD/Xilinx FPGA family and provides a programmable alternative to application-specific integrated circuits. The XC6SLX45-3FGG676I is therefore suitable where control logic, parallel interfaces, serial links, memory interfaces, or general-purpose digital processing must be adapted without producing a custom ASIC. Key characteristics include 43,661 logic cells, a 45 nm CMOS process, a 1.2 V supply, and a 676-ball BGA package. The -3 designation identifies the highest-performance speed grade listed for the Spartan-6 LX family. Its 676-ball package also supports a broad external I/O count, making the device appropriate for designs requiring numerous board-level connections or multiple buses. The Spartan-6 LX architecture is intended for low-cost, high-volume programmable logic. A design can use parallel processors, digital signal-processing functions, clock and timer logic, protocol bridges, and control blocks within one FPGA. Because configuration is programmable, the same hardware can support different product variants, production updates, and field-configurable behavior without changing the physical PCB. Typical uses include industrial automation, communications equipment, test and measurement systems, embedded control, video or image-processing control, and general-purpose digital interface consolidation. The large BGA footprint requires careful PCB layout, but it supports high-density connections and is well suited to multilayer boards with dedicated power, ground, and signal-integrity planning. Design planning should include the exact Spartan-6 pinout file, power-decoupling strategy, configuration interface, clocking, and bank-specific voltage constraints. The 676-ball land pattern is too large and specialized for manual wiring, so a constraint-aware place-and-route flow and manufacturing design-rule review are essential. This page combines exact device characteristics, engineering-focused application guidance, package considerations, and same-footprint replacement analysis. The alternatives listed retain the FBGA-676 format so engineers can evaluate speed-grade, temperature-grade, and assembly-code changes before modifying a production design.

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XC6SLX45-N3FG484C - 43,661 Logic Cell Spartan-6 LX FPGA
XC6SLX45-N3FG484C

XC6SLX45-N3FG484C - 43,661 Logic Cell Spartan-6 LX FPGA

The AMD Spartan-6 LX XC6SLX45-N3FG484C is a field-programmable gate array with 43,661 logic cells, 316 I/O, and a 484-BBGA package. It belongs to the Spartan-6 LX device family, a programmable-logic family positioned for integrated embedded systems requiring substantial parallel processing, flexible I/O, and configurable digital logic. The device combines a large programmable logic fabric with programmable I/O in a surface-mount package designed for compact industrial, communications, instrumentation, and control systems. An FPGA is a semiconductor whose digital functions are defined after fabrication by loading a configuration bitstream. A field-programmable gate array is therefore one type of FPGA, while FPGA belongs to the broader hierarchy of programmable-logic devices and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed, shorten product-development cycles, and support multiple hardware functions through parallel processing, state machines, serial interfaces, and embedded control logic. The XC6SLX45 device provides 43,661 logic cells and 316 user I/O in the Spartan-6 LX family. Its 484-BBGA package exposes a substantially larger connection set than a small quad-flat package, making it useful when a design contains numerous parallel buses, high-pin-count memory interfaces, or several external peripherals. The large logic resource count also allows multiple processing channels or control domains to be consolidated into one programmable device rather than implemented with separate fixed-function logic. The N3 ordering code identifies the target device configuration within AMD's Spartan-6 LX ordering system. Exact speed-grade limits, core supply values, programmable logic performance, embedded-memory capacities, and I/O standards should be confirmed in the manufacturer data sheet before setting timing constraints. In particular, interface timing depends on the selected I/O standard, bank voltage, package constraints, and board-level clock and signal-integrity implementation. Typical uses include industrial automation, embedded control, communications infrastructure, test and measurement, signal processing, and data-acquisition systems. For a 316-I/O design, the FPGA can consolidate parallel sensor acquisition, digital bus translation, control logic, and communication interfaces. A clocked datapath may use multiple logic slices in parallel, while block RAM and dedicated DSP resources can be added where the selected device and design tools support those functions. Board design should preserve every power, ground, configuration, clock, and I/O connection shown in the AMD package pinout files. Use the manufacturer package files to assign PCB balls accurately, especially because the target spelling in some listings differs between FG484C and FGG484C. Confirm the ordering code against the device marking before releasing production hardware or building the assembly bill of materials. This page combines the exact ordering information, package characteristics, compatible Spartan-6 alternatives, and practical design guidance needed for initial device selection. It also highlights where engineers must verify timing, power, compliance, and package details directly against the applicable AMD documentation before a design reaches production.

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XC6SLX45-N3FG484I - 43,661 Logic Cell FPGA | AMD
XC6SLX45-N3FG484I

XC6SLX45-N3FG484I - 43,661 Logic Cell FPGA | AMD

The AMD XC6SLX45-N3FG484I is a Spartan-6 LX field-programmable gate array containing 43,661 logic cells, 316 I/O, and 3,411 configurable logic blocks in a 484-BBGA package. Its industrial temperature grade covers -40°C to +100°C, while the 484-ball package provides 484 terminals and a 1.00 mm terminal pitch for high-density programmable logic systems. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, signal processing, and I/O behavior are configured after manufacture. FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks with programmable interconnect and block RAM into a flexible parallel-processing engine. The Spartan-6 LX family targets cost-sensitive systems requiring substantial logic density, deterministic parallel operation, and flexible post-build configuration. The XC6SLX45-N3FG484I provides 43,661 logic cells, 3,411 configurable logic blocks, and 316 I/O in one compact 484-BBGA package. The -3 device designation identifies its performance grade within the Spartan-6 LX family, while the industrial temperature qualification supports operation from -40°C to +100°C. These characteristics make the device useful where many parallel data paths must execute in real time rather than sequentially. Its architecture can combine configurable logic blocks, block RAM, dedicated digital signal processing resources, and programmable I/O to implement control logic, packet processing, signal acquisition, image processing, and embedded communication systems. The 316 available I/O support interfaces to external memory and peripheral devices, while the 484-ball package supports dense board routing. As an FPGA, the device allows configuration changes to be applied to the same hardware platform when system requirements evolve. Typical applications include industrial control, networking equipment, test and measurement instrumentation, video and image processing, communications infrastructure, and embedded signal-processing platforms. Designs that benefit from parallel architecture can distribute sampling, filtering, protocol handling, and data transformation across multiple logic paths. The device is particularly appropriate for compact systems requiring high I/O density and substantial programmable logic in one package. PCB design requires careful BGA layout, layer-stack planning, decoupling, and power-distribution design. Use the AMD Spartan-6 package device pinout files when assigning every ball, and follow the manufacturer's power, configuration, and decoupling recommendations. Thermal performance and signal integrity depend strongly on the PCB stackup, copper density, via strategy, trace lengths, and external memory topology used around the FPGA. This product page brings together the device identity, electrical and physical characteristics, qualified same-footprint alternatives, comparison parameters, application guidance, and practical PCB considerations. It supports faster engineering review while directing critical pin assignment and configuration decisions to the official AMD documentation and package files.

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XC6SLX45-N3FG676C - 43,661-L Spartan-6 LX FPGA | AMD
XC6SLX45-N3FG676C

XC6SLX45-N3FG676C - 43,661-L Spartan-6 LX FPGA | AMD

AMD XC6SLX45-N3FG676C is a Spartan-6 LX field-programmable gate array containing 43,661 logic elements, providing 358 I/O in a 676-ball FCBGA package. Manufactured on a 45 nm low-power copper process, the device combines programmable logic, fixed and configurable I/O, block RAM, and DSP resources in one reconfigurable semiconductor. It is positioned for cost-sensitive embedded systems requiring substantial parallel processing without the power and complexity of a high-end FPGA. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic and interconnect can be programmed after manufacture. The Spartan-6 family occupies the configurable-logic and embedded-processing tiers of the FPGA hierarchy, below higher-performance programmable logic devices while providing broad I/O and embedded-memory capability. The XC6SLX45 is particularly useful when parallel data paths, deterministic control, hardware acceleration, or flexible field updates are required. The principal characteristics include 43,661 logic elements, 358 I/O, a 676-FCBGA package, and a 45 nm low-power copper implementation. These resources suit image pipelines, industrial controllers, communications equipment, test systems, and embedded signal-processing designs. The large I/O count also permits simultaneous connections to external memory, converters, transceivers, and parallel peripherals, reducing the need for additional interface logic. Spartan-6 LX devices combine programmable logic with block RAM and dedicated DSP arithmetic resources. This heterogeneous architecture allows parallel datapaths to be implemented more efficiently than with a bank of general-purpose processors. The device can support deterministic hardware control, protocol termination, data filtering, and real-time signal transformation, while configuration storage preserves the programmed function after power-up. Typical uses include industrial automation, video and imaging, communications infrastructure, instrumentation, and embedded control platforms. Its 358 available I/O is especially attractive for high-pin-count designs requiring memory interfaces and multiple external buses. Designers can also use the FPGA fabric to implement custom peripherals, bridge incompatible interfaces, or accelerate computationally intensive operations before transferring summarized results to a host processor. Design planning should begin with the AMD Spartan-6 package pinout and pinout files, followed by verification of power rails, configuration interface, clocking, and high-speed routing constraints. Because the exact ordering code and grade-specific timing information control the final qualification, the applicable AMD data sheet, package files, and design-support documentation should remain the authority for schematic and PCB implementation. This product overview consolidates the device identity, package characteristics, searchable ordering-code references, drop-in family alternatives, and practical design considerations into one engineering-focused resource. It supports initial device selection while distinguishing exact-footprint alternatives from options that would require a different package or PCB redesign.

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XC6SLX45-N3FG676I - Spartan-6 LX FPGA, 358 I/O | AMD
XC6SLX45-N3FG676I

XC6SLX45-N3FG676I - Spartan-6 LX FPGA, 358 I/O | AMD

The AMD XC6SLX45-N3FG676I is a Spartan-6 LX field-programmable gate array with 358 I/O and a 676-BGA package. The FPGA integrates programmable logic, configurable digital resources, block RAM, and dedicated DSP resources into a single device. Its 676-BGA land pattern supports dense PCB layouts where several high-speed interfaces and parallel buses must be implemented in a compact area. The device is positioned for industrial control, communications, instrumentation, embedded vision, and general-purpose programmable logic applications. An FPGA is a semiconductor whose digital behavior is configured after manufacture. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel data paths, control logic, protocol bridges, signal processors, and hardware accelerators within one device. The Spartan-6 LX family occupies the FPGA product hierarchy: FPGA and CPLD devices are programmable-logic semiconductors, while the LX designation identifies the device family optimized for low-cost, system-level integration. The XC6SLX45-N3FG676I combines a 45-class Spartan-6 LX device designation with 358 user I/O in a 676-BGA package. This high pin count is useful when an interface requires substantial parallel connectivity, but it also makes ball assignment, power planning, and PCB layout more demanding than a smaller package. Designers should preserve the manufacturer's recommended ball map and distinguish fixed configuration pins, clock inputs, general-purpose I/O, and dedicated function pins before routing the board. Spartan-6 LX devices are well suited to designs that need flexible logic density without moving to a larger device family. Common implementation areas include parallel-to-serial data conversion, industrial control and data acquisition, network-interface front ends, embedded control logic, audio and communications signal conditioning, and test equipment. Programmable logic can also be combined with external processors or mixed-signal devices when deterministic timing, parallel processing, or multiple interface standards are required. Thermal and signal-integrity planning are central to a 676-BGA design. Although the package provides substantial interconnection capacity, high-speed nets should use controlled-impedance routing, continuous reference planes, and the shortest practical connections. Power and ground distribution should follow the manufacturer's ball assignments, and unused balls should follow the package-specific assembly and termination requirements rather than being treated as interchangeable connections. The most important replacement decision is package and pin compatibility. A device with the same 676-BGA outline is not automatically interchangeable because speed-grade, temperature-grade, and device identifiers can change I/O behavior or performance. Validate the complete pinout, configuration requirements, power rails, clock resources, and timing before approving any substitute. This page consolidates the exact package and I/O information, compatible Spartan-6 LX candidates, application guidance, and board-level design considerations for engineers evaluating the XC6SLX45-N3FG676I. It is intended to accelerate component identification, replacement screening, PCB planning, and system integration without changing the verified manufacturer naming.

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XC6SLX45T-2FG484C - 43,661-Cell Spartan-6 LXT | AMD
XC6SLX45T-2FG484C

XC6SLX45T-2FG484C - 43,661-Cell Spartan-6 LXT | AMD

The AMD/Xilinx XC6SLX45T-2FG484C is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 296 user I/Os, a 1.2 V core supply, and a 484-pin ball-grid-array package. The -2 performance grade targets designs requiring a practical balance of logic density, operating speed, and programmable I/O in a mature 45 nm FPGA platform. An FPGA is a semiconductor whose internal digital logic, interconnect, memory blocks, and I/O paths are configured after manufacture. A field-programmable gate array belongs to the programmable-logic hierarchy, combining parallel digital processing resources with configurable peripherals. Spartan-6 devices add DSP slices and block RAM, allowing one package to implement control logic, signal processing, data acquisition, and communication functions without combining several discrete components. The XC6SLX45T-2FG484C provides 43,661 logic cells organized into 3,411 configurable logic blocks. Its 296 I/Os support communication with external processors, memories, converters, transceivers, and display or control peripherals. The device uses a 1.2 V supply, while its 484-pin BGA package accommodates the substantial pin count needed for high-density parallel interfaces. A -2 speed grade is identified directly by the ordering code. For digital signal processing, the programmable architecture can combine parallel data paths with dedicated DSP48 resources and block RAM. This architecture is useful when a design needs deterministic sampling, filtering, waveform generation, or fixed-point arithmetic without relying on a separate DSP processor. Parallel configurable logic also supports bus arbitration, protocol conversion, state machines, and high-speed control functions within a single device. Typical uses include industrial automation, communications infrastructure, test and measurement equipment, embedded imaging, audio processing, and high-volume control systems. The 484-ball package is particularly appropriate for boards that need many external signals and cannot fit the pin count of a smaller FPGA. Designs should still account for board-space, heat-spreading, routing-density, and power-supply requirements associated with a large BGA device. A key implementation consideration is the distinction between the 43,661-cell XC6SLX45T design point and smaller or newer programmable-logic families. Before migration, validate pin assignments, clocking, memory interfaces, configuration data, I/O standards, and timing constraints. Use the AMD Spartan-6 package pinout files and device documentation when assigning every ball and planning the PCB footprint. This product page combines the confirmed device identity and package details with practical application guidance, alternative-part comparisons, and design-focused selection criteria. It is intended to help engineers determine whether the XC6SLX45T-2FG484C fits an existing Spartan-6 design and how temperature-grade or speed-grade alternatives affect qualification and reuse.

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XC6SLX45T-2FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD
XC6SLX45T-2FG484I

XC6SLX45T-2FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD

The AMD XC6SLX45T-2FG484I is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 3,411 configurable logic blocks, 6,822 adaptive logic modules, and 296 I/O, supplied in a 484-pin FBGA package. The verified part data identifies a 45 nm CMOS device with a 1.2 V core supply, 667 MHz performance figure, 23 mm by 23 mm package dimensions, and 1.0 mm ball pitch. Its -2 speed grade is intended for designs requiring a balance of logic density, embedded memory, DSP capability, and programmable I/O rather than the highest Spartan-6 performance tier. An FPGA is a programmable-logic semiconductor whose interconnect, logic, and I/O resources can be configured after manufacture. Spartan-6 devices belong to the FPGA and CPLD product hierarchy and combine configurable logic blocks with programmable input/output blocks, block RAM, DSP resources, clock management, and dedicated configuration mechanisms. The XC6SLX45T-2FG484I is suited to embedded systems requiring parallel interfaces, protocol handling, signal processing, control logic, and moderate on-chip data storage. Key verified features include the 43,661-cell Spartan-6 LXT architecture, 296 I/O, 3,411 configurable logic blocks, 6,822 adaptive logic modules, a 667 MHz listed operating-frequency figure, and a 1.2 V supply requirement. The 484-BBGA footprint provides a high pin count for systems using wide external buses, multiple high-speed interfaces, or several independent peripherals. The industrial-temperature suffix I identifies the grade used when the system requires operation across the industrial temperature range; exact limits are not supplied in the retrieved snippets. The device is built on 45 nm CMOS technology and is positioned for cost-sensitive, high-volume embedded applications where deterministic programmable logic is more valuable than a fixed function. The -2 speed grade provides a lower-performance option than the -3 grade identified in cross-reference data. Engineers should also consider clocking, configuration memory, power sequencing, I/O standards, and thermal dissipation when integrating the BGA package. Typical applications include industrial control gateways, networked embedded equipment, instrumentation, video and image processing, communications infrastructure, and consumer electronics. Its 296 I/O count is useful for bridging legacy parallel peripherals to serial networks, while its logic density can consolidate multiple fixed-function devices. The FPGA still requires a correctly configured bitstream, a suitable clock source, decoupling network, and thermal-aware PCB layout. The principal design consideration is package-level implementation. A 484-BBGA device requires a fine-pitch PCB land pattern, careful via-in-pad and escape-routing strategy, adequate thermal copper, and assembly process control. Designers should verify the exact Spartan-6 pinout and configuration requirements using the manufacturer package files before schematic or layout release. This page combines verified distributor and manufacturer references, drop-in family alternatives, and practical selection guidance for engineers evaluating the XC6SLX45T-2FG484I.

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XC6SLX45T-3FG484C - 43,661-Cell Spartan-6 LXT FPGA | AMD
XC6SLX45T-3FG484C

XC6SLX45T-3FG484C - 43,661-Cell Spartan-6 LXT FPGA | AMD

AMD XC6SLX45T-3FG484C is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 296 I/O, and a 484-pin FBGA package. The device uses 45 nm CMOS technology and operates from a 1.2 V supply, making it a configurable logic platform for embedded control, communications, signal processing, and industrial systems. An FPGA is a programmable semiconductor in the broader semiconductor and digital-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable I/O, embedded memory, clocking, and digital signal-processing resources. Designers implement and revise hardware behavior through a configuration bitstream rather than changing the integrated-circuit mask. The XC6SLX45T combines 43,661 logic cells with 296 I/O in the FG484C 484-pin FBGA package. Its -3 designation identifies the device speed grade used in the ordering code. The verified product listings also identify 45 nm CMOS fabrication and a 1.2 V operating supply. These resources make the device suitable for designs requiring parallel interfaces, protocol bridging, embedded control logic, and moderate signal-processing throughput. The Spartan-6 LXT architecture supports integration of programmable logic with dedicated block RAM and DSP resources. This allows a single FPGA to implement control state machines, packet buffering, waveform generation, filtering, and external interface bridging. The 296 available I/O provide substantial connectivity for parallel buses, memory interfaces, clocks, and control signals, although the exact user-assigned I/O standards must be confirmed against the manufacturer documentation. Typical applications include industrial automation, embedded instrumentation, communications equipment, video and image processing, motor control, and general-purpose digital signal processing. In each case, the FPGA is configured after power-up and can implement parallel processing or hardware protocols that would otherwise require several discrete logic devices, processors, memories, and interface components. Design planning must include the correct 484-BBGA footprint, power-plane distribution for the 1.2 V core rail, decoupling, configuration-interface implementation, and thermal analysis. Because the verified excerpts do not provide the complete pin table, pinout file contents, or package dimensions, engineers should download the official Spartan-6 documentation and verify all ball assignments before layout release. This page combines verified distributor specifications, availability information, and carefully qualified same-brand replacement guidance. It also adds application-focused design considerations, package comparison data, and explicit data gaps so procurement and engineering teams can distinguish documented facts from information that still requires manufacturer-document confirmation.

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XC6SLX45T-3FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD
XC6SLX45T-3FG484I

XC6SLX45T-3FG484I - 43,661-Cell Spartan-6 LXT FPGA | AMD

AMD XC6SLX45T-3FG484I is a Spartan-6 LXT field-programmable gate array with 43,661 logic cells, 45 nm CMOS technology, a 1.2 V supply specification, and a 484-ball FBGA package. The -3 suffix identifies the performance speed grade, while the industrial-temperature suffix supports deployments across demanding embedded, communications, industrial-control, and test-equipment environments. Its programmable logic architecture combines configurable logic, dedicated hardware resources, block RAM, and DSP resources in one integrated device. An FPGA is a digital semiconductor whose internal logic, interconnections, and I/O behavior are configured after manufacture. The Spartan-6 LXT family sits between low-cost Spartan-6 LX devices and larger FPGA families, balancing logic density, embedded processing support, connectivity, and implementation cost. XC6SLX45T-3FG484I is therefore useful when a fixed-function controller is insufficient but a larger or more expensive programmable-logic platform would be unnecessary. The verified product information identifies 43,661 logic cells, 45 nm CMOS fabrication, and 1.2 V operation for this device. The 484-ball package provides a high-density surface-mount interface suitable for multilayer PCB designs. The -3 speed designation is a meaningful selection criterion because FPGA timing, achievable clock rates, and design-tool performance targets must be evaluated together rather than treating the FPGA as a conventional fixed-function IC. Spartan-6 LXT devices are designed for parallel processing, high-speed interface bridging, custom data acquisition, industrial automation, communications infrastructure, embedded vision, and test-and-measurement systems. Their parallel logic fabric allows multiple independent channels or algorithms to execute concurrently, while dedicated block RAM reduces external-memory traffic for suitable buffering operations and DSP slices accelerate arithmetic-heavy filtering and signal-processing tasks. The primary PCB constraint is the 484-ball FBGA land pattern. Because its interconnects are fine-pitch and distributed beneath the package, escape routing, power-plane continuity, via structure, solder-mask design, and assembly capability require careful planning. The design must also be checked against the selected AMD or Xilinx implementation toolchain and the exact device, package, speed grade, and temperature-grade identifiers. Before releasing a new PCB, compare the target against XC6SLX45T-2FG484C, XC6SLX45T-2FGG484I, XC6SLX45T-N3FG484I, XC6SLX45-3FG484I, and XC6SLX45T-3FGG484I using the package pin files and device selection guidance. Speed-grade, temperature-grade, marking, and ordering-code differences affect qualification even when the mechanical footprint remains unchanged. This product page consolidates verified distributor pricing, package information, same-footprint alternatives, technical comparison data, and practical PCB-design guidance. Those details help engineers separate true pin-compatible purchasing alternatives from superficially similar Spartan-6 devices and support faster procurement, qualification, and design-review decisions.

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XC6SLX75-2CSG484C - 74,637-Cell Spartan-6 LX FPGA | AMD
XC6SLX75-2CSG484C

XC6SLX75-2CSG484C - 74,637-Cell Spartan-6 LX FPGA | AMD

AMD XC6SLX75-2CSG484C is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 3,170,304 bits of block RAM, 11,662 adaptive logic modules, and 328 I/O in a 484-CSBGA package. The device operates from a 1.2 V core supply and belongs to the Spartan-6 LX FPGA family, providing programmable logic, embedded memory, and DSP resources within one integrated device. A field-programmable gate array is a semiconductor whose digital functions are defined after manufacture through a configuration bitstream. The FPGA hierarchy places this device within programmable logic devices and complex programmable logic devices. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel processing, control, protocol handling, signal generation, and interface logic in configurable hardware, allowing product revisions without changing the printed circuit board. The Spartan-6 LX family provides 74,637 logic cells and 3.02 Mbit of embedded memory for the XC6SLX75, with 11,662 adaptive logic modules and 132 DSP48A1 slices documented for the related XC6SLX75T configuration. The target package provides 328 user I/O, making the device suitable for designs requiring substantial parallel connectivity. Its 45 nm CMOS construction also places it within AMD's cost-conscious, low-power FPGA product positioning. The XC6SLX75 architecture can support parallel data processing, fixed-point DSP, control-plane logic, embedded-memory buffering, and communication interfaces. The -2 speed designation identifies the performance grade used for timing analysis and design constraints. The C suffix identifies the commercial temperature grade, while the 484-CSBGA package provides a high-density ball-grid interconnect suitable for multilayer PCB designs requiring many external connections. Typical uses include industrial control, test and measurement, video processing, communications infrastructure, embedded signal processing, and general-purpose programmable-logic platforms. Because the device combines substantial logic and memory capacity, it can consolidate several fixed-function components while retaining the flexibility to update configurations as interfaces or algorithms evolve. Projects should still verify timing, power, pinout, and configuration requirements against the exact Spartan-6 design tools and package documentation. PCB implementation requires careful power-plane distribution, decoupling, ball-escape routing, and thermal analysis for the 484-CSBGA package. The core rail is 1.2 V, while auxiliary supply requirements and configuration interface details must be taken directly from the manufacturer data sheets. Use the package pinout files and power-guidance documentation when assigning every ball and planning the power distribution network. This page combines the verified family-level characteristics, package information, searchable alternatives, comparison parameters, and practical implementation guidance in one engineering reference. It also distinguishes footprint-compatible Spartan-6 variants by speed grade, temperature grade, and device suffix so that a mechanical substitution is not mistaken for a fully qualified functional replacement.

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XC6SLX75-2CSG484I - 45nm Spartan-6 LX FPGA | AMD
XC6SLX75-2CSG484I

XC6SLX75-2CSG484I - 45nm Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-2CSG484I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 11,662 adaptive logic modules, 3.02 Mbit of embedded memory, and up to 292 I/O in a 484-FBGA package. The device uses 45 nm CMOS technology, operates from a 1.2 V core supply, and is identified by the -2 performance grade and I industrial temperature suffix. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and I/O can be configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, which includes complex programmable logic devices, field-programmable gate arrays, and system-programmable devices. Spartan-6 LX devices provide parallel programmable logic resources for control, signal processing, communications, and embedded-system designs. The XC6SLX75-2CSG484I provides 74,637 logic cells and 11,662 adaptive logic modules. Its 3.02 Mbit of embedded block RAM supports buffering, packet storage, data acquisition, and general-purpose digital processing. The 292 available I/O provide connections to external converters, memory, communications transceivers, and control logic. These figures position the device between smaller Spartan-6 parts and higher-density programmable-logic devices. The part is manufactured on a 45 nm CMOS process and uses a 1.2 V core voltage. The -2 ordering code identifies the performance grade, while CSG484 identifies the 484-ball surface-mount package. An I suffix denotes the industrial temperature option. Because the available listing does not provide complete timing, power, I/O-standard, and absolute-maximum data, those details must be confirmed in the manufacturer documentation before a design is released. Typical uses include industrial control, communications infrastructure, instrumentation, embedded signal processing, data acquisition, and compact control systems. Its combination of 74,637 logic cells and 3.02 Mbit of embedded memory allows designers to implement parallel algorithms and control functions in one programmable device while simplifying the logic around external ADCs, transceivers, and processors. PCB implementation requires careful BGA escape routing, power planning, decoupling, and thermal analysis. Because this is a 484-ball package, signal-integrity and assembly considerations are more significant than for a leaded package. The CSBGA footprint must match the PCB land pattern exactly, and the complete pinout must be checked against the selected Spartan-6 package documentation before routing. This page combines verified distributor and cross-reference data with practical qualification guidance for engineers evaluating the XC6SLX75-2CSG484I. It distinguishes documented density, memory, voltage, package, and lifecycle facts from unreported parameters and identifies the temperature- and package-code alternatives that require design review.

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XC6SLX75-2FG484C - 667 MHz Spartan-6 LX FPGA | AMD
XC6SLX75-2FG484C

XC6SLX75-2FG484C - 667 MHz Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-2FG484C is a Spartan-6 LX field-programmable gate array with 667 MHz internal frequency, 5,831 configurable logic blocks, 74,637 logic cells, and 484-ball FBGA packaging. It is designed for cost-sensitive, high-volume systems that combine programmable logic, extensive I/O, and integrated processing resources. The device operates from a 0 to 85 C temperature range and uses a 23 x 23 mm, 1 mm pitch MS-034 FBGA package. A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. The XC6SLX75 belongs to the Spartan-6 LX family and is positioned as a general-purpose FPGA for industrial, communications, control, signal-processing, and embedded systems. Its architecture allows designers to implement parallel logic, state machines, interfaces, and control functions in one programmable device while retaining the flexibility of hardware reconfiguration. The verified specifications identify 5,831 CLBs and 74,637 logic cells, providing substantially more programmable logic than small control FPGAs while remaining within a single high-density package. The 667 MHz figure is an internal frequency specification, not a guarantee that every design will achieve that frequency; external memory interfaces, timing constraints, I/O standards, routing congestion, and clocking requirements still determine achievable performance. The -2 suffix identifies the device speed grade, while the 484 package determines the board-level ball pattern and PCB land pattern. Typical designs can use the FPGA for industrial automation, machine vision, real-time networking, communications infrastructure, embedded control, and digital signal processing. The high pin count supports broad parallel interfaces and multiple I/O banks, while the large logic capacity allows complex datapaths and protocol state machines. The 23 x 23 mm FBGA-484 package requires careful escape-routing, via-in-pad or through-via fanout planning, and controlled assembly thermal conditions. The XC6SLX75-2FG484C should be selected when a design needs more parallelism and logic density than a small programmable device, while retaining the cost profile associated with the Spartan-6 family. Verify the exact AMD datasheet, package pinout file, voltage requirements, memory interfaces, configuration scheme, and speed-grade limits before layout or production release.

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XC6SLX75-2FG484I - 74,637 LE Spartan-6 LX FPGA | AMD
XC6SLX75-2FG484I

XC6SLX75-2FG484I - 74,637 LE Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-2FG484I is a Spartan-6 LX field-programmable gate array with 74,637 configurable logic elements, 5,831 logic blocks, up to 280 I/O, a 667 MHz internal frequency, and a 484-ball FBGA package. It targets industrial systems operating from 0°C to +85°C. The -2 speed grade and 23 mm by 23 mm, 1 mm-pitch MS-034 package make this device suitable for embedded control, communications, instrumentation, industrial automation, and signal-processing systems requiring programmable parallel logic and substantial I/O density. Its supply-voltage details, memory resources, block inventory, and complete ball assignment are not present in the supplied excerpts and must be confirmed in the manufacturer documentation. A field-programmable gate array is a programmable digital semiconductor containing configurable logic blocks, programmable interconnect, and input/output resources. In the product hierarchy, an FPGA is a semiconductor and programmable logic device. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can implement parallel data paths, state machines, protocol interfaces, and digital signal-processing functions in hardware. The Spartan-6 LX family is AMD's cost-oriented FPGA platform for designs that need substantial logic capacity without moving to a larger device. The verified device data identifies 74,637 configurable logic elements and 5,831 logic blocks. It also specifies up to 280 I/O and a 667 MHz internal frequency. These figures make the XC6SLX75 useful where many external interfaces or concurrent operations are required. The industrial temperature range of 0°C to +85°C supports controlled equipment environments, while the -2 suffix identifies the device speed grade. Exact performance at a particular clock depends on the selected logic path, I/O standard, timing constraints, and implemented design. The XC6SLX75-2FG484I is packaged as a 484-pin FCBGA/FBGA in a 23 mm by 23 mm body with 1 mm ball pitch. A 484-ball package exposes more programmable connections than lower-pin-count FPGA packages and supports memory interfaces, parallel buses, high-speed serial I/O, clocks, control signals, and configuration resources. Because a BGA package has hidden solder joints and dense ball spacing, PCB layout, assembly, X-ray inspection, cleaning, and thermal verification are important parts of a reliable implementation. Typical designs include industrial controllers, data-acquisition systems, embedded video-processing pipelines, communications gateways, motion-control equipment, and instrumentation. The large logic-element count can host parallel acquisition logic, digital filters, protocol converters, and host interfaces. Engineers must confirm whether external memory, differential clocks, high-speed transceivers, clock-management resources, and required voltage rails exist in the selected device before assigning pins. Configuration storage, programming cable compatibility, and bitstream generation should be validated with the complete AMD Spartan-6 documentation and tools. A key design consideration is timing closure at the verified 667 MHz device frequency. Constraints should describe the actual clock domain and all synchronous I/O paths, while post-route timing reports must be reviewed rather than treating 667 MHz as a guaranteed system-level operating point. Power estimation should include core, configuration, I/O, and auxiliary rails. Decoupling, ball-grid escape routing, layer transitions, return paths, and via-in-pad or microvia construction also need controlled-library verification. This page consolidates the exact distributor-listed specifications, verified 484-BBGA alternatives, package constraints, and procurement-oriented engineering guidance. It also distinguishes documented values from unavailable parameters instead of estimating resource counts, prices, compliance status, pin functions, or timing behavior. Designers should obtain the official Spartan-6 LX data sheet, package files, errata, and selected board constraints before releasing a production schematic or layout.

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