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A3P1000L-FG144

A3P1000L-FG144 - 1M Gate Low Power FPGA | Microchip Technology

The Microchip Technology A3P1000L-FG144 is a low-power flash-based Field Programmable Gate Array (FPGA) from the ProASIC3L family, offering 1,000,000 system gates, 24,576 logic elements (11KLEs), and 147,456 bits of RAM. It is housed in a 144-ball FBGA package with 97 user I/Os, supporting core voltages from 1.2V to 1.5V. This device is designed for high-performance, low-power applications requiring reprogrammability and single-chip integration. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits above CPLDs in complexity and below ASICs in customization. They are essential in rapid prototyping, low-to-mid volume production, and applications requiring field updates. The ProASIC3L family specifically uses flash-based configuration, meaning the device retains its programming without external memory and is instantly available on power-up. Key features of the A3P1000L-FG144 include 1,000,000 system gates, 24,576 logic elements, 147,456 bits of RAM, and 97 user I/Os. It operates with a core voltage of 1.2V to 1.5V, enabling low power consumption. The flash-based architecture provides security against reverse engineering and supports in-system programming (ISP). The device also offers up to 350 MHz performance, making it suitable for a wide range of applications. Technically, the A3P1000L-FG144 is built on a 130nm flash process, which combines the benefits of non-volatile configuration with low static power. Unlike SRAM-based FPGAs, it does not require a configuration PROM, reducing BOM cost and board space. The device includes advanced features such as clock conditioning circuits (CCC), phase-locked loops (PLLs), and dedicated memory blocks, enabling complex system-on-chip designs. Typical applications include industrial automation, automotive electronics, communications infrastructure, and consumer electronics. Its low power and instant-on capability make it ideal for battery-powered devices and safety-critical systems where immediate operation is required. The 97 I/Os support various I/O standards, including LVCMOS, LVTTL, and PCI, providing flexibility in system integration. When designing with this FPGA, consider the core voltage range and ensure proper decoupling of the 1.2V-1.5V supply. The flash-based configuration eliminates the need for external boot memory, but careful power sequencing is still recommended. Use the Microchip Libero SoC design suite for synthesis, place-and-route, and programming. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P1000L-FG144.

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A3P1000L-FG256

A3P1000L-FG256 - ProASIC3L FPGA, 1M Gates | Microchip

The Microchip Technology A3P1000L-FG256 is a low-power flash FPGA from the ProASIC3L family, offering 1 million system gates, 24,576 logic cells, and 177 user I/Os in a 256-ball FBGA package. It operates with a core voltage of 1.2V to 1.5V and supports clock frequencies up to 350 MHz, making it suitable for a wide range of low-power, high-reliability applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. FPGAs consist of programmable logic blocks, interconnects, and I/O blocks, allowing designers to create complex digital systems without the cost and lead time of ASICs. The ProASIC3L family is based on nonvolatile flash technology, providing instant-on operation, security, and low power consumption. Key features of the A3P1000L-FG256 include Flash*Freeze technology for ultra-low static power, 1.2V to 1.5V core voltage, and support for up to 350 MHz system performance. It offers 177 user I/Os, 24,576 logic cells, and 1 million system gates. The device is reprogrammable, enabling design updates and field upgrades. Its low power consumption makes it ideal for battery-powered and thermally constrained applications. The ProASIC3L architecture uses a flash-based switch fabric, eliminating the need for external configuration memory and providing instant-on capability. This nonvolatile technology also offers enhanced security against reverse engineering and bitstream interception. The device supports multiple I/O standards, including LVCMOS, LVTTL, and differential standards, providing flexibility in system integration. Typical applications include industrial control systems, cloud computing infrastructure, and consumer electronics. In industrial control, the FPGA's low power and high reliability are critical for 24/7 operation. In cloud computing, it can be used for protocol bridging and acceleration. In consumer electronics, its reprogrammability allows for firmware updates and feature enhancements. When designing with the A3P1000L-FG256, consider the power supply decoupling and PCB layout to minimize noise and ensure signal integrity. The device requires a 1.2V to 1.5V core supply and separate I/O supplies. Use the Flash*Freeze pin to enter a low-power state when the FPGA is idle, reducing static power consumption. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000L-FG256.

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A3P125-1VQG100I

A3P125-1VQG100I - ProASIC3 FPGA 125K Gates | Microchip

The Microchip Technology A3P125-1VQG100I is a ProASIC3 flash-based Field Programmable Gate Array (FPGA) with 125,000 system gates, 71 user I/Os, and 36,864 bits of RAM, housed in a 100-pin TQFP (VQG100) package. It operates from a 1.5V core supply and delivers system performance up to 231 MHz, making it a low-cost, low-power, single-chip solution for a wide range of applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without costly mask revisions. The ProASIC3 family uses nonvolatile flash technology, which means the configuration is stored on-chip and the device is 'Instant On' - it becomes active immediately upon power-up, without needing an external boot memory. This places the A3P125-1VQG100I in the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor. Key features of the A3P125-1VQG100I include 125K system gates, 71 user I/Os, 36,864 bits of RAM, and support for up to 231 MHz system performance. It is based on 130nm CMOS flash technology, offering low power consumption and high security with flash-based lock technology. The device supports multiple I/O standards including LVCMOS, LVTTL, and PCI, and includes PLLs for clock management. Its reprogrammability and single-chip nature reduce total cost of ownership (TOC) compared to SRAM-based FPGAs that require external configuration memory. Technically, the A3P125-1VQG100I integrates a flash-based switch matrix that is programmed via the IEEE 1149.1 (JTAG) interface. It features 3,072 logic tiles (1.5K logic elements), 36,864 bits of RAM, and one PLL. The device operates from a 1.5V core voltage with 3.3V I/O compatibility, and is available in industrial temperature grade (-40°C to +100°C). The 100-pin TQFP package has a 14x14 mm body with 0.5 mm pitch, making it suitable for space-constrained designs. Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. Its low power and instant-on capability make it ideal for battery-powered and safety-critical systems. The 71 I/Os allow flexible interfacing with sensors, memory, and microcontrollers. When designing with this device, ensure proper decoupling of the 1.5V core supply and 3.3V I/O supply. Use the JTAG interface for programming and configuration. The flash-based architecture eliminates the need for external configuration memory, simplifying the BOM and reducing board space. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P125-1VQG100I.

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A3P125-1VQG100T

A3P125-1VQG100T - 125K Gate ProASIC3 FPGA 272MHz | Microchip

The Microchip A3P125-1VQG100T is a ProASIC3 family flash-based FPGA with 125,000 equivalent gates (3,072 logic elements/CLBs), 71 user I/Os, and a system operating frequency of up to 272 MHz, housed in a 100-pin thin quad flat pack (TQFP/VQFP-100) package with 0.5 mm lead pitch and 14 x 14 mm body size. Manufactured on a 130 nm CMOS flash process with a 1.5 V core supply, it is a nonvolatile, single-chip, Instant-On programmable logic solution. A flash-based FPGA is a field programmable gate array whose configuration is stored in on-chip nonvolatile flash memory cells rather than SRAM. This places the ProASIC3 family in the broader hierarchy of programmable logic devices: FPGA -> programmable logic IC -> semiconductor. Unlike SRAM FPGAs, a flash FPGA requires no external configuration PROM, boots instantly at power-up, and offers inherently higher configuration security against cloning. Key features include reprogrammable nonvolatile flash fabric, single-chip operation with no boot-time configuration, small-footprint TQFP packaging for space-constrained designs, and low total cost of ownership. The ProASIC3 architecture provides abundant advanced features while delivering ASIC-level unit cost at low-to-mid volumes. Technically, the device uses Microchip (formerly Actel/Microsemi) 130 nm flash switch technology, combining the reprogrammability of SRAM FPGAs with the security and instant-on behavior of antifuse devices. The fabric supports system-level performance suitable for glue logic replacement, control-plane functions, and interface bridging. Typical applications include automotive subsystems, industrial control, portable instrumentation, and communication interface bridging where a single-chip, secure, low-density FPGA is required. Design consideration: verify I/O bank voltage compatibility with adjacent rail standards (e.g., 3.3 V LVCMOS) and confirm availability, as ProASIC3 low-density members are aging; plan a second-source or migration path early. This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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A3P125-2PQG208

A3P125-2PQG208 - ProASIC3 Flash FPGA 1.5KLE 208-PQFP | Microchip

The Microchip Technology (formerly Microsemi/Actel) A3P125-2PQG208 is a ProASIC3 family flash-based FPGA with 125,000 system gates, 1.5K logic elements (LEs), 133 user I/Os, and 36,864 bits of embedded memory, housed in a 208-pin PQFP (BFQFP) package measuring 28x28 mm and operating from a 1.5V core supply at system performance up to 310 MHz in speed grade -2. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory cells rather than an external configuration ROM. Within the programmable logic hierarchy, an FPGA sits above CPLDs in gate count and capability, and the ProASIC3 family is positioned for ultra-low-density, single-chip solutions where reprogrammability, instant-on startup, and low total cost of ownership (TOC) matter more than raw fabric size. Key differentiating features include single-chip operation with no external boot device, live-at-power-up behavior that eliminates configuration time, reprogrammability in-system, and small-footprint package options. The -2 speed grade supports system clock rates up to 310 MHz, adequate for glue logic, bus bridging, control-state machines, and moderate datapath functions. Architecturally, ProASIC3 is built on a 130 nm flash process with a Sea-of-Tiles fabric of versatile logic elements, each containing a lookup-table-based core with register capability. The flash switching technology is inherently nonvolatile and low-power at standby, and the fabric supports single-ended and differential I/O standards on its 133 available user pins. Typical applications include industrial control and automation, portable and handheld instrumentation, communications line-card glue logic, and military/aerospace subsystems where instant-on and configuration-store reliability are required. The 1.5V core with 3.3V-tolerant I/O banks fits standard board power trees. Design consideration: budget the 208-pin PQFP footprint carefully - at 28x28 mm with 0.5 mm pin pitch, thermal relief and fanout escape routing on 4+ layer PCBs should be planned early. This page synthesizes verified distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.

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A3P125-2PQG208I

A3P125-2PQG208I - ProASIC3 Flash FPGA 1.5KLE | Microchip

The Microchip Technology (formerly Microsemi) A3P125-2PQG208I is a ProASIC3 family flash-based FPGA providing 1,500 logic elements (125K gates), up to 133 user I/Os, and a maximum system performance of 310 MHz, fabricated on a 130 nm flash process with a 1.5V core supply in a 208-pin PQFP (BFQFP) package for industrial temperature ranges. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy, FPGAs sit above CPLDs and simple programmable logic devices, and the ProASIC3 family targets low-density, single-chip, instant-on designs that historically would have used ASICs or CPLDs. Key differentiating features include single-chip operation with no external boot PROM, because the flash fabric is inherently nonvolatile and Instant On at power-up; reprogrammability that supports in-field design updates; low total cost of ownership (TOC) versus masked ASICs; and live-at-power-up security that resists design theft compared with SRAM FPGAs that must load bitstreams externally. Architecturally, the A3P125 uses a sea-of-vanilla-modules fabric of versatile logic elements on a 130 nm CMOS flash process, with embedded memory blocks and flexible I/O standards. The -2 speed grade balances timing performance against power, and the industrial temperature rating (-40C to +100C junction) suits harsh deployments. Typical applications include industrial control and automation, secure single-chip glue logic and bridge functions, avionics and defense subsystems, and portable instrumentation where low power and instant-on operation matter. Design consideration: budget the 1.5V core rail and I/O bank supplies carefully, and confirm I/O standard assignments per bank before routing, since bank voltage rules constrain pin placement in the 208-pin QFP. This page synthesizes distributor availability, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.

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A3P125-2TQG144

A3P125-2TQG144 - ProASIC3 Flash FPGA 1.5KLE TQFP-144 | Microchip

The Microchip Technology (Microsemi) A3P125-2TQG144 is a ProASIC3 flash-based FPGA with 125,000 system gates, approximately 1,500 logic elements (LEs), 36,864 bits of embedded RAM, up to 100 user I/Os, and a system performance of 310 MHz, fabricated on a 130nm process and housed in a 144-pin TQFP package operating from a 1.5V core supply. A flash-based FPGA is a field-programmable gate array whose configuration data is stored in on-chip flash memory rather than an external configuration device or volatile SRAM. In the programmable-logic hierarchy, it sits between low-density CPLDs and high-end SRAM FPGAs, offering single-chip, nonvolatile, instant-on operation that simplifies power sequencing and removes the need for a boot flash, making it a power management and board-space friendly alternative to SRAM FPGA solutions. Key features include live-at-power-up nonvolatile flash programming, reprogrammability for in-field updates, low total cost of ownership through a single-chip solution, and a -2 speed grade suited to mid-speed logic, glue logic, bus bridging, and control applications. The 144-pin TQFP (20x20 mm) surface-mount package offers hand-solderable lead pitches for prototyping and avoids the complexity of ball-grid-array inspection. Architecturally, ProASIC3 uses a fine-grained VersaTile logic fabric in which each tile can act as a look-up table, a D flip-flop, or memory, combined with embedded flash blocks providing the 36,864 bits of distributed and FIFO-capable RAM. The 1.5V core with 3.3V-capable I/O banks integrates easily into legacy 3.3V systems. Typical applications include industrial control and automation, communications bridging, aerospace and defense porosable logic, medical instrumentation glue logic, and embedded system controller integration where instant-on and configuration security matter. Design consideration: verify I/O bank voltage assignment in Libero SoC before layout, since TQFP-144 pinout flexibility is limited compared to larger packages. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.

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A3P125-2TQG144I

A3P125-2TQG144I - ProASIC3 FPGA 125K Gates | Microchip

The Microchip Technology A3P125-2TQG144I is a 125,000-gate ProASIC3 flash-based FPGA with 3072 configurable logic blocks, up to 100 user I/Os, a 1.5V core supply (1.425V to 1.575V range), and a system speed grade of up to 310 MHz, housed in a 144-pin TQFP (TQG144) package rated for -40C to +85C industrial operation. A field-programmable gate array (FPGA) is a semiconductor device containing an array of programmable logic blocks and reconfigurable interconnects that designers configure after manufacturing. Unlike SRAM-based FPGAs, flash-based devices such as the ProASIC3 family retain their configuration in non-volatile flash cells, so they power up instantly, need no external configuration PROM, and offer higher single-event-upset immunity - placing this device in the hierarchy: FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. Key features include non-volatile flash programming for true single-chip operation, reprogrammability with no external boot memory, low total cost of ownership as promoted on the Microchip product page, a 130nm CMOS process, and industrial temperature qualification (-40C to +85C) making it suitable for harsh environments. The -2 speed grade balances performance and cost within the A3P125 family. Architecturally, the A3P125 implements 125K system gates across 3072 VersaTile logic modules on a 130nm flash-based fabric. On-chip RAM totals 36,864 bits distributed as variable-aspect-ratio blocks, and I/O banks support multiple single-ended and differential standards at 1.5V core supply with 0.5mm package pitch. Typical applications include industrial control and automation, Internet of Things (IoT) gateways, military/aerospace control logic, and glue-logic consolidation in embedded systems where single-chip, instant-on programmable logic reduces BOM count. When designing with the A3P125-2TQG144I, use Microchip Libero SoC tools for synthesis and place-and-route, and budget I/O banks carefully since only 100 of the 144 pins are user I/O. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.

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A3P125-PQ208

A3P125-PQ208 - 125K Gate Flash FPGA | Microchip Technology

Microchip Technology A3P125-PQ208 is a flash-based CMOS field-programmable gate array with 125,000 system gates, 3,072 logic cells, 36,864 RAM bits and 133 user I/Os. The device is supplied in a 208-pin plastic fine-pitch quad flat package measuring 28 x 28 mm with 0.50 mm lead pitch. It belongs to the ProASIC3 family of reprogrammable, nonvolatile FPGA devices. An FPGA is a programmable digital semiconductor used to implement control logic, interface bridging, signal processing and system-integration functions. In the product hierarchy, the A3P125-PQ208 is a flash-based FPGA, a programmable logic device, and a semiconductor. Its reprogrammability allows one physical device to support multiple logic configurations, while flash configuration storage supports a fast, deterministic boot sequence without an external configuration PROM. The principal capacity specifications include 125,000 typical system gates and 3,072 configurable logic blocks, commonly identified as logic cells. The device also provides 36,864 RAM bits and 133 configurable user I/O pins. Its 208-pin package exposes substantially more interface options than the logic capacity alone might suggest, making the part suitable for designs requiring parallel buses, control signals, communications links and mixed external interfaces. The ProASIC3 implementation uses 130 nm CMOS technology with a seven-layer metal structure containing six copper layers. This flash-based architecture places configuration data directly on the FPGA die. The large I/O count supports interface-intensive designs, while the embedded RAM permits practical state storage, buffering, packetization and small local data-processing functions without requiring separate external memory. Typical uses include industrial control and automation, communications interface consolidation, embedded protocol handling, test and measurement equipment, security and access-control logic, and general-purpose prototyping platforms. The 133 user I/Os are particularly useful when a design must bridge legacy parallel interfaces with newer serial peripherals while retaining deterministic control over board-level signals. Designers should assign pins from the manufacturer's package pin-assignment table, confirm bank-compatible supply voltage requirements for every external interface, and validate termination, direction and pull-up or pull-down requirements before layout. The 208-pin package also requires a controlled fanout strategy and careful decoupling across the programmable logic and I/O power domains. This product page combines the A3P125-PQ208 capacity, package, interface and technology data with drop-in family alternatives, comparison criteria and practical PCB guidance. It is intended to help engineers confirm footprint compatibility, assess logic and I/O resources, and determine whether the ProASIC3 device fits the target system before beginning board-level implementation.

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A3P125-TQ144

A3P125-TQ144 - 125K Gate Flash FPGA, 100 I/O | Microchip

The Microchip Technology A3P125-TQ144 is a 125K-gate flash-based field-programmable gate array in a 144-pin TQFP package, providing 100 user I/O, 1.5K logic elements, and 36,864 bits of configuration flash. It is a member of the ProASIC3 family, a reprogrammable FPGA platform designed for low- to medium-density logic, embedded control, signal conditioning, and industrial control designs. A field-programmable gate array is a programmable digital logic device in which the interconnect and logic configuration are stored in non-volatile flash memory. An FPGA belongs to the broader semiconductor hierarchy of programmable logic devices, combining configurable logic blocks, programmable routing, and user I/O in one integrated circuit. Unlike a fixed-function application-specific integrated circuit, an FPGA permits design changes through programming rather than a new photolithography mask. The A3P125-TQ144 offers 1.5K logic elements, 125K system gates, 100 user I/O, and up to 144 kbits of true dual-port SRAM within the ProASIC3 architecture. The device is manufactured using a 130 nm CMOS process with seven metal layers, and distributor listings identify a maximum operating frequency of 231 MHz and a 1.5 V core supply. Its flash configuration supports in-system reprogramming and retains the programmed logic when power is removed. The 144-lead TQFP package provides a surface-mount footprint with 0.5 mm pitch and dimensions of approximately 28 mm by 28 mm. Compared with a fine-pitch BGA, the TQFP package is easier to inspect and rework, which benefits prototype assembly and low-volume industrial systems. Its 144-position lead count also gives the design substantially more routing options than the smaller ProASIC3 packages. Typical uses include industrial control and automation, communications interfaces, embedded protocol bridges, test equipment, and low-power embedded controllers. The 100 available user I/O make the device suitable for designs that connect external sensors, memory devices, displays, and industrial bus transceivers. Its internal SRAM supports datapaths, packet buffering, and state-machine implementations that would otherwise require external memory. When laying out the board, treat the TQFP as a fine-pitch high-density package: use a PCB footprint checked against the mechanical drawing, place decoupling capacitors at every supply pin, and reserve a ground plane around the device. Confirm the selected ProASIC3 speed and temperature grade against the production temperature range, and review the pin-placement table in the manufacturer datasheet before assigning user I/O. This page combines device specifications, verified distributor listings, same-family drop-in candidates, application guidance, and PCB-focused design notes. It is intended to accelerate schematic capture, footprint verification, sourcing, and design-review for engineers evaluating the A3P125-TQ144.

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A3P125-VQ100T

A3P125-VQ100T - 125K Gate Flash FPGA | Microchip | 100-VQFP

The Microchip Technology A3P125-VQ100T is a 125,000-system-gate flash-based Field Programmable Gate Array (FPGA) from the ProASIC3 family, housed in a 100-pin VQFP (14x14 mm) package. It delivers 3,072 logic cells, 36,864 bits of true dual-port SRAM, and 71 user I/Os, operating from a 1.425V to 1.575V core supply. This device is AEC-Q100 qualified for automotive applications and supports an industrial temperature range of -40°C to 125°C. An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of programmable logic blocks and configurable interconnects that can be programmed after manufacturing to implement custom digital logic. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which themselves are a subset of integrated circuits (ICs) used in digital electronics. Unlike SRAM-based FPGAs that require external configuration memory at power-up, flash-based FPGAs like the ProASIC3 family are non-volatile, offering instant-on operation, lower standby power, and enhanced security against bitstream tampering. Key features of the A3P125-VQ100T include 125,000 system gates, 3,072 logic cells, and 36,864 bits of true dual-port SRAM. The device provides 71 user I/Os with support for multiple I/O standards, and its flash-based architecture eliminates the need for external boot memory. The 100-VQFP package measures 14x14 mm with a 0.5 mm pitch, enabling compact PCB designs. The device operates from a 1.425V to 1.575V supply and is AEC-Q100 qualified, making it suitable for automotive and other mission-critical applications. Built on a 130-nm, 7-layer metal (6 copper) flash-based CMOS process, the A3P125-VQ100T offers a single-chip solution with low total cost of ownership (TCO). The flash-based architecture provides instant-on capability, meaning the device is ready to operate immediately upon power-up without external configuration. This also provides inherent security advantages, as the configuration is stored on-chip and is resistant to unauthorized readback. The device supports optional soft ARM® processor cores, enabling system-on-chip (SoC) designs within a single FPGA. Typical applications include automotive electronics, industrial control systems, communications infrastructure, and consumer electronics. The A3P125-VQ100T is particularly well-suited for applications requiring instant-on operation, high reliability, and security, such as automotive body control modules, motor control, and secure communication interfaces. Its 71 user I/Os and 36,864 bits of SRAM provide sufficient resources for medium-complexity logic designs. When designing with this device, ensure adequate decoupling on the 1.5V core supply and follow the manufacturer's layout guidelines for the VQFP package. The device's non-volatile nature means no external configuration device is required, simplifying the BOM and reducing system cost. Consider the I/O standards supported by the device to ensure compatibility with your system's voltage levels. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P125-VQ100T in their designs.

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A3P125VQG100

A3P125-VQG100 ProASIC3 Flash FPGA 71 I/O TQFP-100 | Microchip

The Microchip (Microsemi) A3P125-VQG100 is a ProASIC3 flash-based FPGA with 1,500 logic elements (1.5K LEs), 71 user I/Os, and 36,864 bits of embedded dual-port SRAM, housed in a 100-pin TQFP (VQG100, 14x14 mm) surface-mount package. According to the ProASIC3 datasheet, the family provides 1 M system gates to 144 Kbits of true dual-port SRAM with 700 Mbps DDR, LVDS-capable I/Os on A3P250 and above. A flash-based FPGA is a type of field-programmable gate array that stores its configuration in on-chip nonvolatile flash memory rather than an external configuration ROM. Within the programmable-logic hierarchy, the A3P125 sits at the low end of the ProASIC3 family, below the A3P250, A3P600, and A3P1000, making it a power-management-friendly, single-chip programmable logic solution for glue logic and control applications. Key features include nonvolatile Flash technology that eliminates the external boot PROM and enables instant-on, single-chip operation; reprogrammability for field updates; live_SEE secure programming support within the ProASIC3 family; and low total cost of ownership (TOC) as highlighted by Microchip. The 1.5K-logic-element density suits state machines, bus interfaces, and control-plane logic that do not justify larger FPGAs. The ProASIC3 architecture uses a sea-of-vanilla-core logic fabric with optional Soft ARM support in the family, allowing small embedded controllers to be instantiated alongside user logic. Routing and timing are deterministic, and the flash cells retain configuration through power cycles without serial configuration devices. Typical applications include industrial control boards, communication interface bridging, portable instruments, and aerospace/defense systems where low power, instant-on flash configuration, and a compact 100-pin footprint are priorities. Design consideration: budget I/O banking rules and core voltage (1.5 V nominal for the ProASIC3 fabric) early in the schematic, since the 71 available I/Os constrain wide bus designs. This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing from DigiKey, Mouser, LCSC, and Octopart, same-package drop-in alternatives, and practical sourcing guidance for the A3P125-VQG100.

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A3P250-1FG144T

A3P250-1FG144T - ProASIC3 FPGA, 250K Gates | Microchip

The Microchip Technology A3P250-1FG144T is a flash-based Field Programmable Gate Array (FPGA) from the ProASIC3 family, offering 250,000 system gates, 97 user I/Os, and 36,864 bits of RAM in a 144-pin FBGA package. It operates at a core voltage of 1.5V and supports system performance up to 272 MHz, making it suitable for a wide range of low-density, high-reliability applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike microcontrollers, which execute software instructions sequentially, FPGAs provide parallel hardware execution, enabling high-speed data processing and flexible I/O interfacing. FPGAs are part of the programmable logic device (PLD) family, which also includes CPLDs and SoC FPGAs, and are widely used in prototyping, aerospace, automotive, and industrial applications where reconfigurability and deterministic timing are critical. Key features of the A3P250-1FG144T include its flash-based configuration, which retains the design without external boot memory, providing instant-on capability and enhanced security against reverse engineering. The device offers 97 user I/Os, 36,864 bits of RAM, and 272 MHz system performance, all in a compact 144-pin FBGA package. Its low power consumption and single-chip solution reduce total cost of ownership (TOC) compared to SRAM-based FPGAs that require external configuration devices. Technically, the A3P250-1FG144T is fabricated using 130nm flash technology, which provides non-volatile, reprogrammable logic with high reliability. The device supports multiple I/O standards, including LVCMOS, LVTTL, and PCI, and includes phase-locked loops (PLLs) for clock management. The flash-based architecture eliminates the need for configuration PROMs, simplifying board design and reducing component count. Typical applications include automotive electronics, industrial control, communications infrastructure, and aerospace systems where reliability and security are paramount. The device's 1.5V core voltage and 272 MHz performance make it ideal for glue logic, bus interfacing, and protocol bridging in embedded systems. When designing with this device, ensure proper decoupling of the 1.5V core supply and follow the manufacturer's layout guidelines for the FBGA package to minimize signal integrity issues. The device supports in-system programming, allowing field updates without removing the FPGA from the board. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P250-1FG144T.

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A3P250-1FGG144T

A3P250-1FGG144T - ProASIC3 FPGA 250K Gates FBGA-144 | Microchip

The Microchip Technology (Microsemi/Actel) A3P250-1FGG144T is a ProASIC3 family field programmable gate array with 250,000 system gates, 6,144 logic cells (CLBs), and 97 user I/Os, housed in a 144-ball Fine-Pitch Ball Grid Array (FBGA-144) with 1.0 mm ball pitch. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that the designer configures after manufacturing. Within the semiconductor hierarchy, the A3P250 belongs to the nonvolatile flash-based FPGA class, sitting under the broader categories of programmable logic devices and digital logic ICs. Unlike SRAM FPGAs, ProASIC3 devices store their configuration in on-chip flash, so they power up instantly as a single-chip solution with no external boot configuration PROM. Key features include flash-based live-at-power-up operation, 130 nm CMOS process technology, a 1.5 V core supply, and system performance up to 350 MHz per distributor specification data (FPGAkey lists 272 MHz typical for the -1 speed grade), making it suited for glue logic consolidation and low-power control paths. The device is reprogrammable in-system, reducing total cost of ownership by eliminating configuration devices and supporting design iteration late in production. The ProASIC3 architecture provides versatile logic fabric with embedded memory, and the -1 speed grade balances performance with lower static power. The FBGA-144 package occupies a small footprint suited to space-constrained industrial and communications boards, and the green package supports environmental compliance goals. Typical applications include industrial automation control, portable and battery-powered instruments, communications interface bridging, and aerospace/defense systems that benefit from flash FPGA immunity to configuration readback and single-event configuration upsets. When designing with this device, verify the 1.5 V core and 3.3 V-class I/O power rails against the ProASIC3 datasheet, and budget I/O assignments against the 97-user-I/O limit of the FBGA-144 package. This page synthesizes verified distributor data, drop-in same-package alternatives, and practical design guidance not found on a single manufacturer or distributor page.

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A3P250-1FGG256T

A3P250-1FGG256T - ProASIC3 Flash FPGA 250k Gates | Microchip

The Microchip Technology (Microsemi) A3P250-1FGG256T is a flash-based ProASIC3 field programmable gate array (FPGA) delivering 250,000 system gates (6144 CLBs) with up to 157 user I/Os in a 256-ball Fine-Pitch Ball Grid Array (FBGA-256) with 1 mm ball pitch, speed grade -1, supplied in tape and reel packaging. An FPGA is a semiconductor device containing a matrix of configurable logic blocks (CLBs) connected by programmable interconnects, allowing designers to implement custom digital logic after manufacturing. The ProASIC3 family from Microsemi (now Microchip Technology) is built on flash-based programmable logic technology, which distinguishes it from SRAM-based FPGAs: configuration is stored in on-chip flash cells, so the device is single-chip, instant-on at power-up, and needs no external configuration PROM. Key features include nonvolatile flash configuration enabling live-at-power-up operation, reprogrammability with high security (FlashLock), low total cost of ownership (TOC) with no boot PROM or configuration controller, and a small footprint package suited to space-constrained boards. The -1 speed grade supports system performance up to approximately 350 MHz toggle capability per distributor listings. Technically, the A3P250 integrates 6144 versatile VersaTiles in CMOS flash process technology. The fabric supports single-ended and differential I/O standards, and the architecture is targeted at glue logic consolidation, interface bridging, and control-plane functions where a single-chip, low-power, secure solution is preferred over SRAM FPGAs. Typical applications include industrial automation control, communications line cards, portable and battery-powered instruments, and aerospace/defense subsystems requiring secure, instant-on programmable logic. Design consideration: verify I/O bank voltage compatibility with adjacent chips and use Microchip Libero SoC design software for synthesis and place-and-route; flash FPGAs cannot be reconfigured in-flight like SRAM devices, so plan static configurations. This page synthesizes distributor pricing, drop-in family alternatives, design notes, and FAQ content not found in a single manufacturer datasheet.

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A3P250-1PQG208I

A3P250-1PQG208I - ProASIC3 FPGA, 250K Gates | Microchip

The Microchip Technology A3P250-1PQG208I is a ProASIC3 Field Programmable Gate Array (FPGA) with 250,000 system gates, 36,864 bits of flash-based RAM, and 151 user I/Os, housed in a 208-pin BFQFP (PQFP) package. It operates over the industrial temperature range of -40°C to +100°C and is lead-free (RoHS compliant). This device is part of Microchip's ProASIC3 family, which offers a single-chip, flash-based, reprogrammable solution with low total cost of ownership (TCO) and system performance up to 350 MHz. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. The ProASIC3 family uses flash-based configuration cells, which are non-volatile, meaning the device retains its configuration when power is removed. This makes it a secure, instant-on solution that is ideal for applications requiring high reliability and low power consumption. Key features of the A3P250-1PQG208I include 250,000 system gates, 36,864 bits of RAM, and 151 user I/Os. The device supports up to 350 MHz system performance and is reprogrammable, allowing for design updates in the field. The flash-based architecture provides inherent security against reverse engineering and configuration bitstream interception. The device also features low power consumption, making it suitable for battery-powered and thermally constrained applications. The ProASIC3 architecture is based on a flash-based switch matrix that connects logic tiles and routing resources. This architecture eliminates the need for external configuration memory, reducing system cost and board space. The device supports various I/O standards, including LVCMOS, LVTTL, and PCI, and includes phase-locked loops (PLLs) for clock management. The flash-based configuration is instant-on, providing immediate functionality upon power-up. Typical applications for the A3P250-1PQG208I include industrial control systems, communications infrastructure, avionics, and consumer electronics. Its low power and high reliability make it suitable for automotive and medical applications. The device is also used in ASIC prototyping and as a cost-effective alternative to ASICs in low-to-medium volume production. When designing with this device, consider the power supply requirements and decoupling. The FPGA requires multiple supply voltages, and proper decoupling capacitors should be placed near the power pins to ensure stable operation. The flash-based configuration is non-volatile, so no external configuration device is needed, simplifying the design. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P250-1PQG208I.

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A3P250-1VQ100M

A3P250-1VQ100M - ProASIC3 FPGA 250K Gates | Microchip

The Microchip Technology A3P250-1VQ100M is a ProASIC3 flash-based Field Programmable Gate Array (FPGA) with 250,000 system gates, 3,000 logic elements (3KLEs), and 68 user I/Os, housed in a 100-pin VQFP (VQ100) package. It operates at a core voltage of 1.5V and supports system performance up to 272 MHz, making it a low-power, single-chip solution for cost-sensitive applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic. Unlike ASICs, FPGAs are reprogrammable, allowing design changes without re-fabrication. The ProASIC3 family uses flash-based configuration, which retains the program even when power is removed, providing instant-on capability and enhanced security. This places the A3P250-1VQ100M in the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor. Key features include 250K system gates, 3K logic elements, 68 user I/Os, and 36,864 bits of RAM. The device supports multiple I/O standards including LVCMOS, LVTTL, and PCI, and includes a PLL for clock management. Its flash-based architecture offers low power consumption, with a typical static power of only 0.02W, and is inherently immune to configuration bitstream corruption, making it ideal for safety-critical applications. The A3P250-1VQ100M is built on a 130nm flash process, providing a balance of performance and power. It features a single-chip solution with no external boot memory required, reducing BOM cost and board space. The device is reprogrammable, allowing field updates, and includes security features to prevent reverse engineering. Its 272 MHz system performance supports a wide range of digital designs. Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. In industrial settings, the FPGA can implement motor control, sensor interfacing, and protocol bridging. In automotive, it supports in-vehicle networking and driver assistance systems. Its low power and small footprint make it suitable for portable and battery-powered devices. When designing with this device, ensure proper power supply decoupling with 0.1uF and 10uF capacitors near the VCC and GND pins. The core voltage is 1.5V, and I/O banks can operate at 1.5V, 1.8V, 2.5V, or 3.3V depending on the bank voltage. Use the PLL for clock generation and consider the 68 I/O limit when planning pin assignments. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P250-1VQ100M.

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A3P250-1VQG100M

A3P250-1VQG100M - ProASIC3 FPGA 250K Gates 100-TQFP | Microchip

The Microchip Technology A3P250-1VQG100M is a ProASIC3 flash-based FPGA with 250K system gates, 68 user I/Os, 36864 bits of embedded fabric memory, and a 272 MHz system performance rating, housed in a 100-pin TQFP (VQG100) package. Fabricated on a 130 nm flash process and operating from a 1.5V core supply, it delivers a single-chip, nonvolatile programmable logic solution. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash cells rather than an external configuration PROM. Unlike SRAM FPGAs, flash FPGAs are Instant On at power-up, require no boot device, and are inherently more secure because the bitstream is never exposed externally. ProASIC3 sits in Microchip's (formerly Actel/Microsemi) low-density flash FPGA hierarchy, below the ProASIC3E and IGLOO families. Key features include nonvolatile flash programming that eliminates external configuration storage, low total cost of ownership (TOC) through a single-chip solution, reprogrammability for design updates in the field, and small-footprint 100-TQFP packaging suited to space-constrained boards. The 68 user I/Os support common single-ended standards, and the fabric includes embedded RAM blocks totaling 36864 bits for FIFOs and buffering. Architecturally, ProASIC3 uses a sea-of-gates fabric of Versatile tiles on a 130 nm process with a 1.5V core. The '-1' speed grade balances performance and cost, supporting system speeds up to 272 MHz, adequate for glue logic, bus bridging, and control-plane functions. Typical applications include industrial control and automation, portable and battery-operated instruments benefiting from low static power, communication interface bridging, and ASIC prototyping or low-volume production where mask costs are prohibitive. For design, the '-1' speed grade limits maximum fabric performance compared to '-2' variants; verify timing closure in Libero SoC before committing. The commercial temperature grade (no 'I' suffix) restricts use to 0C to +70C environments. This page synthesizes distributor pricing tiers, drop-in alternatives within the same 100-TQFP footprint, and practical design notes not consolidated in the manufacturer datasheet.

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A3P250-1VQG100T

A3P250-1VQG100T - ProASIC3 FPGA 250k Gates TQFP-100 | Microchip

The Microchip Technology (formerly Microsemi/Microsemi Corporation) A3P250-1VQG100T is a ProASIC3 flash-based FPGA with 250,000 system gates (6144 CLBs / 6144 cells), 68 user I/O, 36864 bits of embedded RAM, and system performance up to 350 MHz, housed in a 100-pin VQFP/TQFP (14x14 mm, 0.5 mm pitch) surface-mount package. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration device. Within the programmable logic hierarchy, the A3P250 sits in the low-density tier of the ProASIC3 family: FPGA -> flash FPGA -> ProASIC3 -> A3P250. Because the configuration data is nonvolatile and live-at-power-up, no external boot flash or microcontroller supervisory logic is required, making it a true single-chip solution. Key features include reprogrammable flash fabric (secure, low total cost of ownership), 1.425V to 1.575V single core supply (1.5V nominal), an automotive grade designation in this ordering option, and an industrial operating range of -40C to +125C (TA). The 68 user I/O support common single-ended standards, and the 36864-bit embedded RAM supports small FIFOs and buffers in glue-logic and control designs. The ProASIC3 architecture uses a sea-of-vanadium-gate flash switch fabric with fine-grained VersaTiles, delivering deterministic performance suitable for control-plane logic, state machines, bus bridging, and power-up-critical functions. The device is programmed with Microchip Libero SoC design suite and supports in-system reprogramming. Typical applications include industrial automation control, automotive subsystems (this is an automotive-grade ordering option), power-up sequencers and glue logic, and portable/instrumentation designs needing a single-chip nonvolatile FPGA. Design consideration: keep the 1.5V core supply within the 1.425V to 1.575V window with a dedicated regulator; the TQFP-100 leads require careful solder-joint inspection (0.5 mm pitch). This page synthesizes distributor pricing, drop-in same-footprint family alternatives, and practical design notes not found in the manufacturer datasheet.

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A3P250-2FGG144

A3P250-2FGG144 - ProASIC3 Flash FPGA 250K Gates | Microchip

The Microchip Technology (Microsemi) A3P250-2FGG144 is a ProASIC3 flash-based FPGA with 250K system gates, 97 user I/Os, a maximum system performance of 310 MHz, and a 1.5 V core supply, housed in a 144-ball Fine-Pitch Ball Grid Array (FBGA-144) package supplied in a tray. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory cells rather than an external configuration ROM. Within the digital logic hierarchy, it sits as a programmable logic device -> FPGA -> programmable SoC platform component. Because the configuration is retained in flash, ProASIC3 devices power up instantly with no external boot device, are inherently single-chip solutions, and are resistant to configuration corruption from radiation or power glitches. Key features of the A3P250-2FGG144 include its 130 nm flash process technology for low static power, speed grade -2 performance up to 310 MHz for system-level timing closure, 97 user I/Os supporting common single-ended standards, and reprogrammability that eliminates obsolete-configuration risk in fielded systems. Microchip also lists low total cost of ownership and optional soft ARM support for the ProASIC3 family. Architecturally, ProASIC3 combines versatile fabric tiles with flash-based switching and logic elements, delivering deterministic routing and secure, live-at-power-up operation. The absence of a configuration bitstream load time improves system availability, and on-chip flash enables secure field upgrades without an external flash memory on the PCB. Typical applications include industrial control and automation, bridging and glue logic consolidation, portable and space-constrained instrumentation, and secure boot or configuration-management functions where instant-on operation is mandatory. Design consideration: the 1.5 V core requires a clean, low-noise core rail with proper decoupling, and the FBGA-144 land pattern demands careful BGA rework capability; confirm bank I/O voltage assignments early in pin planning. This page synthesizes distributor pricing and stock signals, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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A3P250-2FGG144I

A3P250-2FGG144I - ProASIC3 FPGA 250K Gates | Microchip

The Microchip Technology (formerly Microsemi/Actel) A3P250-2FGG144I is a ProASIC3 family flash-based FPGA with approximately 250K gates, 6144 logic elements (3K clusters per distributor listings), up to 97 user I/Os, 36864 bits of embedded memory, and a 310 MHz system performance figure, housed in a 144-ball Fine-Pitch BGA (FGG144) package for industrial temperature ranges (-40C to +85C). A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, the FPGA sits above CPLDs and below ASICs, offering reprogrammability with single-chip boot. ProASIC3 devices use a 130 nm flash process, which gives them inherent instant-on behavior and resistance to configuration upset compared to SRAM FPGAs. Key features include a 1.5 V core supply, non-volatile flash programming that eliminates the external boot device, reprogrammability for field updates, and low total cost of ownership as highlighted by Microchip. The -2 speed grade balances performance and cost within the A3P250 family, supporting system clock rates up to 310 MHz in fabric-rich designs. Architecturally, the A3P250 combines VersaTiles (fine-grained logic tiles), embedded SRAM blocks totaling 36 Kbits, and flexible I/O banks supporting multiple single-ended and differential standards. The flash cell-based switch fabric removes the need for configuration controllers and simplifies power sequencing. Typical applications include industrial automation control, motor drive interface logic, communications protocol bridging, aerospace and defense glue logic, and secure single-chip designs where non-volatile configuration matters. Design consideration: budget the 1.5 V core and 3.3 V I/O rails separately, and verify I/O bank voltage assignments against the 97 available user I/Os before pin locking in Libero SoC. This page synthesizes distributor pricing, same-package alternatives, and practical design notes not found in the manufacturer datasheet.

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A3P250-2PQG208

A3P250-2PQG208 - ProASIC3 Flash FPGA, 250K Gates | Microchip

The Microchip Technology A3P250-2PQG208 is a ProASIC3 flash-based field programmable gate array (FPGA) with approximately 250,000 system gates, a maximum operating frequency of 310 MHz, and 151 user I/O pins, housed in a 208-pin PQFP (208-BFQFP) surface-mount package operating at a 1.5V core voltage on a 130nm flash process. A flash-based FPGA is a programmable logic device that stores its configuration in non-volatile on-chip flash memory rather than the volatile SRAM cells used by most mainstream FPGAs. Because configuration data is retained in the device itself, a flash FPGA powers up instantly as a single-chip solution with no external boot PROM, no configuration controller, and no configuration-time window that could be disturbed in radiation-prone or security-sensitive environments. Within the programmable logic hierarchy, the ProASIC3 family sits in the low-to-mid density class, bridging CPLDs and larger SRAM FPGAs. Key features of the A3P250 include single-chip, reprogrammable flash fabric with low total cost of ownership, system performance up to 310 MHz, and an abundance of advanced features including optional soft ARM support per the ProASIC3 family datasheet. The 151 available user I/O support common single-ended standards, enabling glue logic, bus bridging, and control-plane designs. Technically, the ProASIC3 fabric is built on a 130nm flash process with a sea-of-modules architecture of versatile logic elements; the -2 speed grade denotes the faster of the commercial speed grades for this density. The non-volatile fabric eliminates configuration storage and improves board-level reliability and security relative to SRAM FPGAs. Typical applications include industrial automation control, aerospace and defense subsystems, secure embedded controllers, power sequencing and board management, and communications line-card glue logic - all use cases that benefit from instant-on, low-profile, single-chip programmable logic. Design consideration: plan the 1.5V core and I/O bank supplies with proper decoupling, and verify I/O banking rules in Microchip Libero SoC before fixing pin assignments on the 208-pin PQFP footprint. This page synthesizes distributor pricing, drop-in alternatives within the same 208-pin PQFP footprint, and practical design notes not found in the manufacturer datasheet.

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A3P250-2PQG208I

A3P250-2PQG208I - ProASIC3 FPGA 250K Gates | Microchip

The Microchip Technology (Microsemi/Actel) A3P250-2PQG208I is a ProASIC3 family flash-based FPGA with 250K gates, 3K logic elements (LEs), 36864 bits of user flash, and 151 user I/Os, housed in a 208-pin fine-pitch PQFP (PQG208) package with an industrial temperature rating of -40C to +85C and a 1.5V core supply. A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, the ProASIC3 sits at the low-density end of the FPGA taxonomy, below mid-range SRAM FPGAs, and functions as a single-chip system glue logic, control, and interface device. Key features include non-volatile flash programming that eliminates the external boot PROM and enables instant-on operation, reprogrammability for in-field updates, 130nm flash process technology, system performance up to 310 MHz, and low total cost of ownership thanks to the single-chip solution and small-footprint package options. The ProASIC3 architecture uses a sea-of-vanilla-gates (Voic) logic fabric built from VersaTiles, each configurable as a lookup table or D flip-flop, with dedicated flash switches holding the configuration. The -2 speed grade balances timing performance with power, and the low 1.5V core voltage keeps dynamic power low. Live reprogramming via JTAG supports design iteration without soldering changes. Typical applications include industrial automation control, aerospace and defense secure logic, medical instrumentation, communications bridging, and power-on instant-on embedded control where configuration volatile memory is undesirable. Design consideration: bond all recommended VCCA, VCCI, and GND pins per the manufacturer datasheet and follow Microchip power-decoupling guidance; use Libero SoC software for synthesis, place-and-route, and timing signoff. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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A3P250-2VQG100

A3P250-2VQG100 - ProASIC3 FPGA, 68 I/O, 1.5V | Microchip

The Microchip Technology A3P250-2VQG100 is a ProASIC3 flash-based FPGA offering 68 user I/Os, 36864 bits of embedded memory, a 1.5V core supply, and up to 310 MHz system performance, housed in a 100-pin TQFP (VQFP-100) surface-mount package. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that the designer programs after manufacturing. Unlike SRAM-based FPGAs that require an external configuration device, the ProASIC3 family stores its configuration in on-chip flash, making it a true single-chip solution within the broader hierarchy of programmable logic devices (FPGA -> programmable logic IC -> digital IC). Key differentiating features include flash-based, live-at-power-up operation with no external boot device, low total cost of ownership, reprogrammability for in-field updates, and small-footprint packaging. The 1.5V core keeps dynamic power low, while the -2 speed grade delivers up to 310 MHz internal performance for compact control and glue-logic designs. The ProASIC3 architecture uses fine-grained VersaTiles with 3-input look-up tables, backed by embedded flash blocks providing the 36864 bits of on-chip memory. The single-chip, instant-on nature eliminates configuration PROMs, improving board reliability and reducing BOM cost, and the flash cell is inherently resistant to configuration upset compared with SRAM fabrics. Typical applications include industrial control and automation, portable and battery-powered instruments, aerospace and defense secure designs, communications bridge logic, and medical diagnostic equipment - anywhere a compact, low-power, instant-on programmable device is preferred over a larger SRAM FPGA. When designing with the A3P250-2VQG100, decouple the 1.5V core and 3.3V I/O supplies with appropriate ceramic capacitor networks, and confirm commercial-grade temperature limits (0C to +70C) against the intended environment - industrial-temperature variants use different ordering codes. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers a one-stop selection reference.

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A3P250-1VQ100M - ProASIC3 FPGA 250K Gates | Microchip

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A3P250-1VQG100T - ProASIC3 FPGA 250k Gates TQFP-100 | Microchip

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A3P250-2FGG144I - ProASIC3 FPGA 250K Gates | Microchip

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A3P250-2PQG208I - ProASIC3 FPGA 250K Gates | Microchip

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