FPGA & CPLD
Produits (6666)
EP4SGX230KF40I3N - 230K LEs Stratix IV GX FPGA, 1517-BGA | Intel / Altera
The Intel (formerly Altera) EP4SGX230KF40I3N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) integrating 228,000 logic elements, 17,544,192 bits of embedded memory, and 9120 LABs in a 1517-ball FCBGA package. Built on TSMC's 40 nm process, it pairs a transceiver-rich transceiver fabric with up to 744 user I/Os and integrated PCI Express hard IP blocks. The 'I3' speed grade with industrial temperature range (-40C to +100C) targets long-lifecycle communications and signal-processing designs. What is a Stratix IV GX FPGA? The Stratix IV GX family belongs to Intel/Altera's high-end FPGA portfolio, which sits within the broader taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Stratix IV GX parts are specifically engineered for high-speed serial I/O and transceiver-based protocols, integrating multi-gigabit transceivers (MGTs) up to 8.5 Gbps alongside the general-purpose FPGA fabric. This makes them the preferred architecture for high-bandwidth telecommunications, broadcast video, and ASIC prototyping workloads where microprocessors and DSP ICs alone cannot meet throughput requirements. Key specifications include 1,288 embedded 18x18 multipliers, 36 PLLs, and dedicated hard memory controllers. The device integrates 8 transceiver channels (configurable as PCIe Gen1/Gen2 hard IP, XAUI, Serial RapidIO, and CPRI), removing the need to instantiate transceivers in soft logic. Memory is structured with MLAB, M9K, and M144K block types for flexible on-chip storage. From an architectural perspective, the EP4SGX230 leverages an adaptive logic module (ALM) structure with 8-input fracturable look-up tables (LUTs), delivering higher logic utilization per LE than older architectures. The transceiver tile pairs PCS and PMA blocks with dynamic reconfiguration, enabling protocol switching without external muxing. Typical applications include 40G/100G Ethernet line cards, software-defined radio (SDR) baseband, ASIC prototyping, high-end test and measurement, and military radar signal processing. The wide transceiver count and high logic density also suit medical imaging (ultrasound beamforming) and broadcast video processing. Designers must allocate sufficient PCB area for the 1517-ball 1.0 mm pitch FCBGA and follow Intel's Stratix IV GX pin connection guidelines for unused transceivers, reference clocks, and JTAG. Power estimation should use the Intel PowerPlay Early Power Estimator (EPE) before RTL freeze, because the high logic and transceiver count drives substantial core current. This page synthesizes distributor pricing, same-package drop-in alternatives, and design considerations not found in the manufacturer datasheet alone, helping engineers evaluate the EP4SGX230KF40I3N for next-generation communications and signal-processing platforms.
EP4SGX230KF40I4N - 228K LE Stratix IV GX FPGA | Intel / Altera
The Intel (formerly Altera) EP4SGX230KF40I4N is a high-density Stratix IV GX Field-Programmable Gate Array with 228,000 logic elements, 17,544,192 bits of embedded memory, and integrated transceivers in a 1517-ball FCBGA package. As part of the Stratix IV GX family, the device combines a 40 nm low-power process, 8.5 Gbps transceivers, and dedicated DSP blocks targeting high-bandwidth signal processing and serial connectivity applications. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP slices, high-speed transceivers, and PLLs. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are used to implement custom digital circuits, parallel processing pipelines, and hardware-accelerated functions without the cost and lead time of an ASIC. The Stratix IV family in particular targets performance-oriented applications where ASIC-class throughput is required but the design must remain reprogrammable in the field. Key specifications for the EP4SGX230KF40I4N include 9120 Logic Array Blocks (LABs), 744 user I/O pins, 17,544,192 embedded memory bits (approximately 17.5 Mbits), and an internal operating frequency up to 800 MHz. The GX suffix indicates the inclusion of multi-gigabit transceivers supporting protocols such as PCIe Gen2, XAUI, Serial RapidIO, and CPRI, while the F40 package designation maps to a 1517-ball flip-chip BGA with 1.0 mm ball pitch. The architecture leverages the Stratix IV Adaptive Logic Module (ALM) instead of a classical 4-input LUT, giving each ALM an effective lookup capacity equivalent to up to eight 4-input LUTs and improving logic packing efficiency. The 40 nm process and enhanced power management allow static and dynamic power consumption to be substantially reduced compared with prior 65 nm Stratix III designs, while the variable-precision DSP blocks support up to 18x18 multiplication with optional accumulation. Typical applications include high-end telecommunications line cards, radar and electronic warfare digital signal processing, high-performance ASIC prototyping, high-speed serial interface bridging, and test & measurement instrumentation. The combination of density, transceiver bandwidth, and on-chip memory makes the device particularly well suited to wire-speed packet processing and multi-channel baseband demodulation. When designing with the EP4SGX230KF40I4N, designers must use the Quartus II design software (version 13.0 or later recommended for full Stratix IV device support) and must follow the Altera/Intel PowerPlay power analysis flow because the 1517-ball FCBGA has limited thermal headroom at full transceiver utilization. Signal-integrity-aware PCB layout with matched-length transceiver traces and a multi-layer power distribution network is essential to realize the rated 8.5 Gbps link performance. This page synthesizes 21-distributor pricing, cross-reference alternatives from the Stratix IV family, and practical design considerations that are not available in the standalone manufacturer datasheet.
EP4SGX230TF35C4N - Stratix IV GX FPGA 228K LE FBGA-1152 | Intel
The Intel (formerly Altera) EP4SGX230TF35C4N is a high-density Stratix IV GX field-programmable gate array (FPGA) integrating 228,000 logic elements, 17,544 Kbits of embedded memory, 17.7 Mbits of MLAB memory, and up to 564 user I/O pins in a 35x35 mm 1152-ball FineLine BGA (FBGA) package. It combines a high-performance logic fabric with up to 8.5 Gbps embedded transceivers targeting high-speed serial I/O, digital signal processing, and ASIC prototyping workloads. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, DSP slices, and block RAM that can be reconfigured after manufacturing. Within the broader semiconductor hierarchy, FPGAs sit between standard microcontrollers and full custom ASICs: microcontrollers execute software sequentially on fixed hardware, whereas ASICs are fixed at fabrication; FPGAs offer hardware-level parallelism with the design flexibility of software-defined logic. The Stratix IV family belongs to the high-performance tier, incorporating transceivers and DSP blocks typically required in communications infrastructure, broadcast video, and high-end signal processing. Key features include 8.5 Gbps transceiver support for protocols such as PCIe Gen2, XAUI, CEI-6G, and Serial RapidIO, 1,288 18x18 multipliers delivering up to 256 GMACs of DSP throughput, and 24 phase-locked loops (PLLs) for clock management. Partial and dynamic reconfiguration, dedicated encryption circuitry, and 1.4 Gbps LVDS support make the device suitable for designs that must remain in the field for many years. The architecture is built on a 40 nm process and features Adaptive Logic Modules (ALMs) that pack eight inputs into fracturable look-up tables, improving effective density compared to older 4-input LUT designs. Hard memory blocks, DSP blocks, and transceiver channels are arranged in columns along the device perimeter to minimize routing delay, supporting timing closure on complex multi-gigabit pipelines. Typical applications include 40G/100G line-card prototyping, wireless baseband processing, high-performance computing ASIC emulation, military secure communications, and broadcast video switching. The integration of transceivers and DSP on a single die reduces bill-of-materials cost and PCB area compared with multi-chip implementations. When designing with this device, allocate sufficient PCB layers and power-supply decoupling to support the simultaneous switching of hundreds of I/O; a minimum of 12 power rails is typical. Use the Quartus II design software (recommended version 13.0 or later with service pack) for synthesis, place-and-route, and timing analysis to ensure reliable compilation of high-utilization designs. This page synthesizes distributor pricing, drop-in alternatives from the Stratix IV family, and practical design notes compiled from manufacturer datasheets and reference designs - information not aggregated on any single distributor page.
EP4SGX290NF45I3N - Stratix IV GX 291K LEs FPGA 1932-FCBGA | Intel
The Intel (formerly Altera) EP4SGX290NF45I3N is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) integrating 291,200 logic elements, 17,661,952 bits of embedded memory, and 920 user I/Os in a 1932-ball Flip-Chip BGA (FCBGA) package. Built on a 40 nm process with a 0.9 V core, the device targets high-throughput serial connectivity, high-performance DSP, and embedded processor subsystems. An FPGA is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP blocks (transceivers, memory controllers, DSP slices) that engineers can reconfigure after manufacturing. Stratix IV GX sits in the high-performance transceiver-equipped tier of the Stratix IV family, bridging the gap between mainstream Cyclone-class FPGAs and the largest Arria-class mid-range parts, and is positioned below Stratix V/Stratix 10 for bandwidth-hungry applications. Key features include up to 36 embedded transceivers supporting rates up to 8.5 Gbps for protocols such as PCIe Gen2, XAUI, CEI-6G, Interlaken, and Serial RapidIO, hard PCIe Gen2 IP blocks with ×1/×2/×4/×8 endpoint and root-port support, dedicated 18×18 multipliers and variable-precision DSP blocks, up to 17.66 Mbits of embedded memory (M9K/M144K blocks), and 8 PLLs plus clock networks for multi-domain timing. The I3 speed grade combined with the industrial temperature rating (-40 °C to +100 °C) and NF45 (1932-ball, lead-free FCBGA, 45 mm body) addresses demanding industrial, defense, and test-equipment deployments. Typical applications include high-speed serial backplane aggregation, multi-port 10 Gbps Ethernet line cards, radar and signal-intelligence baseband processing, medical imaging front-ends, and ASIC prototyping. Hard PCIe Gen2 endpoint blocks reduce logic consumption for accelerator cards, while the transceiver-rich fabric also suits software-defined radio and high-speed data-acquisition platforms. When designing with this device, plan power integrity carefully - the 1932-ball FCBGA and dense transceiver fabric can pull tens of amps through the core rail and demand multi-phase VRMs and aggressive PCB layer-stack de-coupling. Use the Quartus II power analyzer with the EP4SGX290 device model to estimate worst-case thermal load before committing to the PCB stack-up.
EP4SGX290NF45I4 - 290K LE Stratix IV GX FPGA | Intel | 1932-FCBGA
The Intel (Altera) EP4SGX290NF45I4 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) with 291,200 logic elements, 17,661,952 bits of embedded memory, and 920 user I/Os, housed in a 1932-ball FC-BGA package. The device is built on a 40 nm process technology, operates from a 0.9 V core supply, and integrates up to 36 embedded transceivers supporting data rates up to 8.5 Gbps for high-speed serial protocols. An FPGA (Field Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as transceivers, DSP blocks, and block RAM. FPGAs belong to the broader programmable logic family within the logic IC category, sitting alongside CPLDs and structured ASICs, and they enable hardware-level parallelism that microcontrollers and DSPs cannot match. The Stratix IV series from Intel (formerly Altera) is engineered for high-performance signal processing, telecom line cards, and high-end ASIC prototyping. Key features of the EP4SGX290NF45I4 include 11,648 LABs (Logic Array Blocks), 832 embedded 18x18 multipliers capable of running at up to 600 MHz, true dual-port and FIFO memory blocks, and an industrial temperature grade. The integrated PCI Express hard IP and multi-gigabit transceivers make the part a strong fit for protocol bridging, backplane aggregation, and high-throughput data acquisition. Architecturally, the device pairs a rich programmable fabric with hardened memory and DSP, enabling designers to implement wide datapaths and pipeline-intensive DSP without consuming logic resources for those functions. The 8-transceiver GXB blocks at up to 8.5 Gbps pair with 36 PLL/DCM clock managers and support protocols such as PCIe Gen1/Gen2, XAUI, CEI-6G, and Serial RapidIO. Typical applications include high-end ASIC prototyping, telecom line cards and baseband processing, high-definition video broadcast equipment, military radar and signal intelligence, and test and measurement instrumentation. The wide transceiver bandwidth also supports 40G/100G data path prototyping when multiple FPGAs are used. Designers should plan power-rail sequencing for the 0.9 V core, the transceiver supply, and the auxiliary supplies, and ensure the FC-BGA land pattern meets Intel's recommended PCB stackup. Thermal management at full transceiver utilization requires a heatsink or cold-plate solution because the 1932-ball package concentrates significant thermal density. This page synthesizes distributor pricing, real cross-reference candidates, and PCB-aware design notes not aggregated in the manufacturer datasheet, giving the engineer a one-stop engineering brief for the EP4SGX290NF45I4.
EP4SGX290NF45I4N - 290K LE Stratix IV GX FPGA | Intel
The Intel (formerly Altera) EP4SGX290NF45I4N is a high-density Stratix IV GX field-programmable gate array (FPGA) delivering 291,200 logic elements, 17,661,952 bits of embedded RAM, and 920 user I/O pins in a 1932-ball flip-chip BGA (FCBGA) package. Built on a 40 nm process, the device integrates up to 11,648 LABs/CLBs and supports a core voltage range of 0.87 V to 0.93 V, with the industrial -40C to 100C junction temperature grade (the "I" suffix). An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing via a configuration bitstream. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) and sit alongside CPLDs in the digital logic family, occupying the high-density end of the spectrum. The Stratix IV family in particular targets high-throughput signal processing, wireline backplanes, and ASIC prototyping with embedded transcevers, hard memory blocks, and DSP blocks. Key features of the EP4SGX290NF45I4N include integrated 8.5 Gbps transceivers (GX variant), up to 17.7 Mbits of embedded RAM, hard-coded DSP blocks for fixed- and floating-point math, and dynamic on-chip termination for memory interfaces. The 1932-ball FCBGA package exposes 920 general-purpose I/O lanes - among the highest pin counts in the Stratix IV family - enabling parallel high-speed interfaces such as DDR3 with read/write leveling. Architecturally, the device pairs a low-leakage 40 nm core fabric with 8.5 Gbps multi-gigabit transceivers and hardened PCIe Gen1/Gen2 IP blocks. The 11,648 LABs form the basis of combinational and sequential logic, while MLAB blocks and M9K/M144K memory blocks provide distributed and block RAM for buffers, FIFOs, and lookup tables used in signal processing pipelines. Typical applications include high-end ASIC prototyping, radar and digital signal processing front-ends, wireline backplane aggregation, broadcast video processing, and PCIe Gen2 host cards. The GX transceivers make it suitable for 40G/100G line-card prototyping and OTN/SONET framer designs. When laying out this device, allocate a minimum of 12 power rails including VCC, VCCP, VCCPT, VCCPGM, VCCA_PLL, VCCD_PLL, and transceiver supplies (VCCA_GXB, VCCH_GXB); each PLL/GXB block requires dedicated ferrite-bead-isolated filtering. Use 100 nF X7R 0402/0201 bypass capacitors within 1 mm of every BGA pin and a minimum 8-layer PCB stack-up to maintain signal integrity on 920 simultaneous switching outputs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
EP4SGX360FF35C2X - 353K LC, Stratix IV GX FPGA | Intel | Altera
The Intel (formerly Altera) EP4SGX360FF35C2X is a high-density Stratix® IV GX Field-Programmable Gate Array with 353,600 logic elements, 14,144 adaptive logic modules (LABs), and 23,105,536 bits of embedded memory in a 1152-ball FCBGA package. The device is built on a 40 nm CMOS process and integrates 24 transceivers supporting data rates up to 8.5 Gbps, making it a drop-in member of the Stratix IV GX family optimized for high-speed serial I/O and DSP-intensive applications. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, configurable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and high-speed transceivers. Within the broader taxonomy, FPGAs sit under programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. The Stratix IV family specifically targets high-performance applications including wireline communication, military radar, and high-end broadcast video. Key features of the EP4SGX360FF35C2X include 564 user I/O pins, embedded transceivers capable of 600 Mbps to 8.5 Gbps operation, up to 1,288 18x18 multipliers for DSP, and 32 global clock networks. The device operates over the commercial 0 °C to +85 °C junction temperature range and ships in a 35 x 35 mm, 1.0 mm pitch FCBGA. Compared with later Stratix V and Stratix 10 families, this device retains the same Quartus II design flow and pin-compatible footprint options across speed grades. The 'C2' suffix indicates the speed grade (fastest in the Stratix IV GX family) and 'FF35' designates the 1152-ball FCBGA package with FineLine BGA ball pitch. Power estimation requires Quartus II PowerPlay and depends on toggle rate, logic utilization, and transceiver activity. The 'X' suffix at the end denotes the extended industrial / commercial lead-free shipping option. Typical applications include 40G/100G wireline framer/mapper, software-defined radio baseband, ASIC prototyping, high-resolution video processing, and DSP co-processing in test and measurement. Designers transitioning to newer Intel FPGAs should evaluate Cyclone V GX or Arria 10 for cost-sensitive designs, or Stratix 10 for higher transceiver bandwidth.
EP4SGX360FF35C2XN - Stratix IV GX FPGA 353K LE 1152-FCBGA | Intel
The Intel EP4SGX360FF35C2XN is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 353,600 logic elements, 23,105,536 bits of embedded memory, and integrated 8.5 Gbps transceivers in a 1152-ball FineLine BGA (FCBGA) package. It is built on a 40 nm TSMC process and features 14,144 LABs (Logic Array Blocks) with 564 user I/O pins, targeting high-bandwidth serial connectivity and DSP-intensive applications. The device operates at a core voltage of 0.9 V with a -2 speed grade and is rated for commercial temperature. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows hardware designers to configure digital circuits after manufacturing. FPGAs sit in the broader taxonomy of digital semiconductors as: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. The Stratix IV GX family specifically targets high-performance applications requiring integrated transceivers, DSP blocks, and large on-chip memory. Key features include 24 full-duplex transceiver channels supporting data rates up to 8.5 Gbps, 1,920 embedded 18x18 multipliers for DSP operations, and dedicated PCI Express hard IP blocks. The device integrates 36 PCIe hard cores and supports up to 1,440 Kbits of tri-speed memory. Hard memory controllers and a high-speed serial interface make it suitable for protocols including PCIe Gen2, XAUI, CEI-6G, and Serial RapidIO. The architecture leverages an adaptive logic module (ALM) structure, providing finer-grained logic utilization than traditional LUT-based architectures. Periphery includes 564 user I/O pins distributed across 12 I/O banks supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL at voltages from 1.2 V to 3.3 V. The 1152-ball FCBGA package uses flip-chip interconnect for high signal integrity. Typical applications include high-end telecommunications equipment (OTU-2/OTU-3 multiplexing), wireless baseband processing, high-performance computing accelerators, broadcast video processing, and military/aerospace signal processing. The high transceiver count makes it especially attractive for multi-port line cards and protocol bridging designs. When designing with the EP4SGX360FF35C2XN, ensure PCB layout follows Intel's flip-chip BGA guidelines including 1-oz copper inner layers, microvia stack-ups, and matched-length traces for transceiver channels. Thermal management requires the exposed die thermal pad to be soldered to a thermal via array and copper pour to dissipate the typical 15-25 W operating power. This page synthesizes distributor pricing, drop-in alternatives from the Stratix IV GX family and competitor equivalents, and practical design notes not found in the manufacturer datasheet. Compiled from Intel datasheet values, DigiKey inventory data, and XAIPART internal records.
EP4SGX360FF35C3 - Stratix IV GX FPGA, 353K LE, 1152-FBGA | Intel
The Intel EP4SGX360FF35C3 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) manufactured on a 40 nm process, integrating 353,600 logic elements (LEs), 14,144 logic array blocks (LABs), and 23,105,536 bits of embedded RAM in a 1152-pin FC-FBGA (35x35 mm) package. According to distributor listings, this device belongs to the FF35 speed/pin-package grade with a 0.9 V core voltage and an operating junction temperature of 0 C to 85 C (commercial grade, suffix C3). A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that allows designers to implement custom digital logic, memory, and high-speed serial interfaces in silicon after fabrication. Stratix IV GX sits in the hierarchy: FPGA -> programmable logic -> digital IC -> semiconductor. The GX family integrates multi-gigabit transceivers alongside programmable fabric, enabling high-bandwidth connectivity for protocols such as PCI Express Gen1/Gen2, Serial RapidIO, XAUI, and CEI-6G, which is the primary differentiator versus the logic-only Stratix IV E and Stratix IV GT (memory-rich) variants. Key features of the EP4SGX360FF35C3 include 564 user I/O pins, integrated transceivers, dedicated DSP blocks for high-throughput fixed-point and floating-point arithmetic, embedded TriMatrix memory, and hard memory controllers for DDR/DDR2/DDR3 SDRAM, QDRII+ SRAM, and RLDRAM II. The FF35 package offers the highest pin count available in the Stratix IV GX lineup, making it suitable for high-density, transceiver-rich system designs where board space is less constrained than in compact modules. Typical applications include high-end wireline telecom line cards, military/aerospace signal processing, ASIC prototyping, test and measurement equipment, broadcast video processing, and high-performance computing accelerators. Designers select this part when their design requires maximum logic capacity combined with embedded multi-gigabit serial links on a single die. Design considerations for the EP4SGX230/360 family emphasize multi-rail power sequencing (core 0.9 V, transceiver PLLs, I/O banks), thermal management of the 35x35 mm FC-FBGA, and PCB layout for transceiver signal integrity. Use the Quartus II design software (now Intel Quartus Prime) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP4SGX360FF35C3N - Stratix IV GX 353kLE FPGA | Intel | Altera
The Intel (formerly Altera) EP4SGX360FF35C3N is a high-density Stratix IV GX field-programmable gate array (FPGA) integrating 353,600 logic elements, 14,144 LABs/CLBs, 23,105,536 bits of embedded memory, and 564 user I/Os in a 1152-ball flip-chip BGA (FCBGA) package. The device is fabricated in a 40 nm process and combines a rich programmable logic fabric with up to 24 transceivers operating at up to 8.5 Gbps, targeting high-bandwidth serial I/O applications such as wireline backplanes, broadcast video bridging, and protocol bridging. A Stratix IV GX is a system-on-chip FPGA class device that combines a programmable logic fabric, dedicated DSP blocks, embedded memory, high-speed transceivers, and hard PCIe Gen1/Gen2 IP blocks. In the broader taxonomy it sits under: FPGA -> programmable logic -> semiconductor device -> integrated circuit. The GX variant specifically adds embedded transceivers that simplify serial connectivity for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and CEI-6G. Key differentiating features include 48 DSP blocks (18x18 multipliers) for high-throughput signal processing, support for LVDS, LVTTL, LVCMOS, and SSTL I/O standards, and an internal voltage supply range of 0.87V to 0.93V core plus 0.87V to 1.20V I/O supply rails. The C3 speed grade balances timing margin and Fmax, and the FF35 pin/package code designates the 35 mm flip-chip BGA with 1152 balls and 564 user I/Os. The device is lead-free and supplied in tray packaging suitable for both prototype and production assembly. From an architecture perspective, the EP4SGX360FF35C3N uses Altera's adaptive logic module (ALM) and M20K memory blocks, providing up to 13.6 Mbits of block RAM plus 4.3 Mbits of MLAB memory. Hard memory controllers (DDR3/DDR2/QDRII+) and up to 8 PLLs support complex memory interfaces and high-speed clock networks. Typical applications include high-speed serial protocol bridging, broadcast video processing, radar and signal intelligence front-ends, telecom line cards, test and measurement instrumentation with high-speed digitizers, and ASIC prototyping where the 353k logic-element capacity and embedded transceivers eliminate the need for companion ASSPs. When designing with this device, ensure the PCB uses a 35 mm body BGA footprint with proper stackup for the 1152 balls; allocate 4-8 PCB layers with buried vias, follow Altera's pin connection guidelines for unused transceiver pins, and use the Quartus II design suite (the device predates Quartus Prime) for synthesis and place-and-route. This page synthesizes distributor pricing, pin-compatible same-family variants, and practical PCB design notes not found in the manufacturer datasheet alone.
EP4SGX360FF35C4 - 353600-cell Stratix IV GX FPGA | Intel
The Intel EP4SGX360FF35C4 is a high-density Stratix IV GX family FPGA delivering 353600 logic elements in a 1152-ball flip-chip BGA (FC-FBGA) package, manufactured on a 40 nm process with a 0.9 V core supply. The device integrates 23105536 bits of embedded memory, 564 user I/O, and 14144 LABs/CLBs, making it one of the largest members of the Stratix IV GX transceiver-equipped family. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O can be reconfigured after manufacturing. Within the programmable-logic taxonomy, an FPGA sits below ASICs and CPLDs in complexity per chip and above them in logic density, and Stratix IV GX specifically targets high-speed serial interface and digital signal processing (DSP) workloads. Embedded transceivers, hard memory controllers, and DSP blocks make this category the workhorse of wireline backplane, broadcast video, and military signal-processing designs. Key features include eight full-duplex transceiver channels with multi-gigabit data rates, hard PCIe Gen1/Gen2 IP cores, dedicated DSP blocks for fixed- and floating-point math, and Partial Reconfiguration support that allows on-the-fly logic changes without halting the rest of the device. The device supports up to 17 Mbits of internal configuration memory, plus configuration via serial, parallel, and PCI Express interfaces. Its transceiver-rich I/O bank supports backplane speeds typically reserved for custom ASICs. Typical applications include high-end wireline backplane aggregation, military radar baseband processing, 40G/100G bridge and packet-processor line cards, high-performance test and measurement equipment, and ASIC prototyping where the same Verilog/VHDL code base is later retargeted to a lower-volume custom silicon. The dense fabric also serves medical imaging front-end pre-processing. When designing with this part, pay close attention to transceiver reference-clock jitter, multi-rail power sequencing (0.9 V core plus transceiver PLLs), and PCB escape routing for the 1152-ball FCBGA. Use the Quartus II design software with the Stratix IV device support installed, and review the pin-out guidelines in the manufacturer device handbook before floorplanning.
EP4SGX360FF35C4N - 353600 Logic Elements Stratix IV GX FPGA | Intel
The Intel EP4SGX360FF35C4N is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) with 353,600 logic elements, 23,105,536 memory bits, and 564 user I/Os, manufactured on a 40 nm process and housed in a 1152-ball FC-BGA (FF35) package. According to the Intel Stratix IV Device Handbook, this device belongs to the GX transceiver family, integrating up to 24 multi-gigabit transceivers that support protocols such as PCIe Gen1/Gen2, XAUI, Serial RapidIO, and CEI-6G, with data rates up to 8.5 Gbps. What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect that engineers can reconfigure post-manufacturing to implement arbitrary digital logic, signal-processing pipelines, or system-on-chip functions. FPGAs sit between fixed-function ASICs (higher NRE, lower unit cost at volume) and microcontrollers (lower performance, software-defined). Stratix IV specifically belongs to Intel's high-end, transceiver-rich tier, targeting high-bandwidth serial I/O and DSP-heavy designs. Key features of the EP4SGX360FF35C4N include 14,144 Adaptive Logic Modules (ALMs), 564 maximum user I/Os, 24 transceiver channels up to 8.5 Gbps, and embedded 8-input fracturable DSP blocks. The device integrates 1.6 Mb of distributed RAM and approximately 22 Mb of embedded block RAM (MLAB + M9K + M144K), plus dedicated hard memory controllers for DDR3/DDR2/LPDDR2 with ECC support. The 0.9 V core is powered through an internal linear regulator with on-chip decoupling, simplifying PCB power design. The architecture is built on a 40 nm TSMC low-power copper process with a 9-layer metal stack, achieving static power reductions versus prior 65 nm Stratix III devices. The integrated PCIe hard IP block supports Gen1 (2.5 Gbps) and Gen2 (5 Gbps) with x1/x2/x4/x8 lane configurations, making the device particularly well-suited for high-throughput communication infrastructure and protocol-bridging applications. Typical applications include high-speed serial interface bridging (PCIe to SRIO, XAUI to SATA), wireless baseband processing, radar and electronic-warfare DSP front ends, high-resolution video capture and display pipelines, and ASIC prototyping. The transceiver-rich GX family is engineered for designs where multiple multi-gigabit serial links must be aggregated onto a single device. Design considerations include careful attention to transceiver channel placement and reference-clock routing to maintain signal integrity, especially for 6 Gbps and 8.5 Gbps links. Power estimation should account for 850 mW-1.5 W per active transceiver at 8 Gbps, requiring a multi-layer PCB with continuous GND and PWR planes. Configuration is supported via fast passive parallel (FPP), fast active serial (AS), JTAG, and PCI Express, giving engineers flexibility during board bring-up and field updates. This page synthesizes distributor pricing, package options, drop-in alternatives within the Stratix IV GX family, and practical design notes not found in the manufacturer datasheet alone.
EP4SGX360FF35I3 - Stratix IV GX 353.6K LE FPGA | Intel
The Intel (formerly Altera) EP4SGX360FF35I3 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) featuring 353,600 logic elements, 14,144 LABs/CLBs, and 23,105,536 bits of embedded RAM, housed in a 1152-ball Flip-Chip FBGA (FC-FBGA) package. Built on a 40nm process node with a 0.9V core, the device integrates up to 564 user I/Os and embedded transceivers for high-speed serial connectivity, targeting bandwidth-intensive applications such as wireless infrastructure, military radar, and ASIC prototyping. An FPGA is a reprogrammable integrated circuit whose logic function is defined by a configuration bitstream rather than fixed masks. The Stratix IV GX family extends this concept by combining general-purpose logic fabric with hardened transceivers, PCIe hard IP blocks, and dedicated DSP blocks, positioning it between pure software processors and fixed-function ASICs in the silicon hierarchy: FPGA -> programmable logic -> reconfigurable compute -> semiconductor. This architecture enables hardware-level parallelism for signal processing pipelines without the NRE cost of ASIC tape-outs. Key features of the EP4SGX360FF35I3 include 8.5-Mb embedded memory distributed across M9K and M144K blocks, multi-gigabit transceivers capable of up to 8.5 Gbps data rates, eight PLL regions for clock synthesis, and an industrial temperature grade rated from -40C to +100C. The Flip-Chip FBGA package provides the high-pin-count, low-inductance interconnect required for transceiver-heavy designs operating at multi-gigabit line rates. Typical applications include Software Defined Radio (SDR), wireline backhaul, baseband processing, high-performance computing accelerators, and broadcast video systems. The wide operating temperature range and integrated transceivers also make it suitable for industrial imaging and test-and-measurement equipment where deterministic latency and parallel DSP throughput are required. When designing with this device, ensure the PCB ball escape pattern meets the 1.0 mm pitch BGA layout rules and that transceiver channels are routed with controlled-impedance differential pairs to comply with the Stratix IV GX PCB guidelines.
EP4SGX360FF35I3N - Stratix IV GX 360K LE FPGA | Intel | 1152-FBGA
The Intel (formerly Altera) EP4SGX360FF35I3N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) integrating 353,600 logic elements, 23,105,536 bits of embedded memory, and 564 user I/Os in a 1152-ball Flip-Chip BGA (FCBGA) package. The Stratix IV GX family is built on a 40 nm process and is augmented with embedded transceivers up to 8.5 Gbps, making it suitable for high-speed serial connectivity in communications, broadcast, and test equipment designs. The 'I3' speed grade and 'FF35' package designator denote an industrial temperature grade (–40 °C to +100 °C) with a 35 mm package body and a specific pinout. An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that combines programmable logic fabric, embedded memory blocks, DSP blocks, high-speed transceivers, and a rich I/O subsystem on a single die. FPGAs occupy a tier above fixed-function ASICs for low-volume prototyping and below microcontrollers for highly parallel, deterministic, high-throughput DSP and packet-processing tasks. The Stratix IV series specifically targets high-end applications that need abundant logic, abundant memory bandwidth, and integrated 8.5 Gbps transceivers, placing it in the broader hierarchy of programmable logic devices (PLD) and complex programmable logic devices (CPLD). Key features of the EP4SGX360FF35I3N include the 8.5 Gbps embedded transceivers hardened for PCIe Gen2, XAUI, and Serial RapidIO protocols, up to 22.4 Mbits of M20K block memory, variable-precision DSP blocks supporting 18×18 and 27×27 multiplications, and an enhanced routing fabric with adaptive logic modules (ALMs). The FF35 1152-BGA package provides a 1 mm ball pitch and flip-chip construction that supports the high signal count and high-speed signaling needed for the device's I/O and transceiver channels. Typical applications include high-performance digital signal processing, packet switching and traffic management in networking line cards, baseband processing for wireless infrastructure, medical imaging front-ends, and ASIC prototyping/emulation platforms. The combination of abundant logic, transceiver-rich I/O, and large on-chip memory makes the EP4SGX360FF35I3N a common choice for replacing or prototyping mid-range ASICs. Designers using this device should follow the Stratix IV GX pin connection guidelines, ensure adequate decoupling for the 0.95 V core, 2.5 V/3.3 V I/O rails, and 1.2 V/2.5 V transceiver supplies, and use the Quartus II (or equivalent Intel Quartus Prime) design environment for synthesis, place-and-route, and bitstream generation. Power estimation tools should be run early in the design cycle because peak power can exceed 25 W at full utilization. This page aggregates distributor pricing, drop-in part alternatives, and design notes that complement the manufacturer datasheet and the Quartus II device handbook.
EP4SGX360FF35I4 - 353,600-Cell Stratix IV GX FPGA | Intel
Intel EP4SGX360FF35I4 is a high-density Stratix IV GX field-programmable gate array (FPGA) built on 40 nm technology, providing 353,600 logic cells, 564 I/O, and 14,144 LABs in a 1152-pin FC-FBGA package. The device belongs to the FPGA and CPLD hierarchy and combines programmable logic, embedded memory, and high-speed transceiver-oriented resources for demanding digital systems. Its 1152-ball BGA package and 3.4 mm maximum seated height require controlled BGA assembly and board-level signal-integrity planning. The I4 ordering code indicates an industrial-oriented device grade, but the verified data does not provide a full ordering-code definition or a specific ambient operating-temperature limit. A field-programmable gate array is a programmable semiconductor containing configurable logic blocks, routing resources, memory elements, and I/O structures. Unlike an application-specific integrated circuit, an FPGA can be reconfigured after manufacturing to implement digital processing, interface bridging, control, packet handling, or protocol-specific functions. Stratix IV GX FPGAs are positioned as programmable logic devices for bandwidth-intensive embedded systems. EP4SGX360FF35I4 integrates 353,600 logic cells with 14,144 LABs, giving system architects a large programmable fabric for parallel datapaths and control logic. The device is listed with 564 I/O, making package routing and power integrity important parts of board design. The principal verified characteristics are 353,600 logic cells, 14,144 LABs, 564 I/O, 40 nm process technology, a 0.9 V core-voltage listing, and 1152-pin FC-FBGA packaging. The 1152-pin package provides extensive connectivity for high-pin-count digital designs, while the BGA format supports dense routing. The 3.4 mm maximum seated height constrains the mechanical stack-up and connector or heatsink clearances. The available distributor descriptions identify the product as a Stratix IV GX FPGA and expose the same 564-I/O and 353,600-cell architecture consistently. Architecturally, EP4SGX360FF35I4 is a programmable logic platform rather than a fixed-function processor. The logic cells and LABs implement combinational and sequential functions, while programmable interconnect maps data paths between logic, memory, and I/O resources. The 0.9 V core-voltage value should be applied only to the supply domain identified by the manufacturer documentation; designers must verify exact power-pin groups, permissible tolerances, ramp requirements, and decoupling recommendations from the official datasheet before schematic release. No transceiver count, memory-bit total, operating-temperature range, or performance grade is provided in the verified snippets. Typical applications include high-throughput communications equipment, industrial imaging and machine-vision processing, test and measurement systems, and embedded digital signal-processing platforms. Its high logic density suits parallel algorithms, protocol conversion, and interface aggregation, while 564 I/O supports numerous external buses and control signals. The Stratix IV GX family positioning also makes the device relevant to systems requiring substantial programmable bandwidth, but exact transceiver capability and speed grades must be confirmed from the manufacturer datasheet. Designers should prioritize power-integrity analysis, BGA escape routing, decoupling placement, thermal characterization, and configuration-management review. The verified data does not provide signal-integrity limits, supported I/O standards, clock limits, memory resources, or exact power consumption, so those parameters require manufacturer confirmation. This page combines verified package, logic, and commercial-search information with explicit uncertainty markers where the supplied data is insufficient.
EP4SGX360FF35I4N - 353600-Cell Stratix IV GX FPGA | Intel
The Intel EP4SGX360FF35I4N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 353,600 logic elements, 14,144 LABs/CLBs, and 23,105,536 bits of embedded memory in a 1152-ball FCBGA package. Built on a 40 nm CMOS process with 0.9 V core operation, the device integrates up to 564 user I/Os and embedded transceivers targeting high-speed serial connectivity up to 8.5 Gbps. The FF35 package is a 35 x 35 mm lead-free FCBGA optimized for thermally constrained line cards and signal-integrity-critical backplanes. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from a matrix of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, block RAM (BRAM), and high-speed serial transceivers. Stratix IV GX FPGAs belong to Intel's high-end programmable logic family, sitting above Cyclone (low-power) and Arria (mid-range) in the taxonomy: FPGA -> programmable logic -> programmable logic device -> integrated circuit -> semiconductor. They are designed for applications requiring the highest logic density combined with multi-gigabit transceivers. Key features of the EP4SGX360FF35I4N include 24 transceivers supporting CPRI, PCIe Gen1/Gen2, Serial RapidIO, and Gigabit Ethernet, embedded PCI Express hard IP, and adaptive logic modules (ALMs) that deliver up to 50% higher performance per logic element versus previous generations. The I4 speed grade and N (lead-free) suffix indicate industrial temperature range (-40C to +100C or similar) with Pb-free / RoHS-compliant manufacturing. The Stratix IV GX architecture combines a 40 nm low-power process with hard IP blocks for memory controllers, DSP, and PCIe to minimize logic utilization for common functions. Partial reconfiguration, dynamic phase alignment, and dedicated floorplan-aware transceiver calibration simplify board bring-up, while the 564 I/O count supports wide parallel buses commonly required in ASIC prototyping and high-performance DSP front-ends. Typical applications include high-performance ASIC prototyping, high-end DSP co-processing, radar and electronic-warfare front-ends, telecom line cards with multi-gigabit serial backplanes, and PCIe-based accelerator cards. The combination of 353,600 LEs and 24 transceivers also suits broadcast video processing and high-frequency trading (HFT) appliances where latency determinism matters. Designers should plan power architecture carefully - the EP4SGX360FF35I4N can draw tens of amps during configuration and high-activity states, so a multi-rail buck converter network with proper sequencing is essential. Quartus Prime software from Intel (Altera) is required for synthesis, place-and-route, and bitstream generation; legacy Quartus II 13.x is the last officially supported release for the Stratix IV family. This page consolidates distributor pricing, drop-in compatible device-ordering options (FF35 speed/migration variants), and practical design notes beyond what the manufacturer datasheet alone provides. Always verify ball-map compatibility against your specific PCB revision before substituting speed-grade or temperature variants.
EP4SGX360FH29C2X - 353600 LEs Stratix IV GX FPGA, 780-HBGA | Intel
The Intel (formerly Altera) EP4SGX360FH29C2X is a high-density, high-performance Stratix IV GX Field Programmable Gate Array (FPGA) delivering 353,600 logic elements, 14,144 LABs/CLBs, and 22,020 Kbit of embedded RAM in a 780-ball FineLine BGA (FC-HFBGA, 33x33 mm) package. It integrates up to 289 user I/Os and 24 transceivers supporting data rates up to 8.5 Gbps, fabricated on a 40 nm low-power process with a core supply of 0.87 V to 0.93 V. The part is the C2 speed grade and commercial junction temperature range, targeted at high-throughput wired communications and digital signal processing systems. An FPGA (Field Programmable Gate Array) is a programmable logic device hierarchy sitting between ASICs (Application-Specific Integrated Circuits) and general-purpose processors. FPGAs belong to the broader programmable logic device family, alongside CPLDs (Complex Programmable Logic Devices), and sit within the digital semiconductor and logic IC taxonomy. Stratix IV GX specifically combines general-purpose fabric with multi-gigabit transceivers, positioning it for serial connectivity, baseband processing, and high-bandwidth datapath acceleration. Key features of the EP4SGX360FH29C2X include 24 integrated transceivers capable of supporting protocols such as PCI Express Gen1/Gen2, XAUI, CEI-6G, Serial RapidIO, and Gbps Ethernet, hardened PCIe and memory controller IP blocks, up to 1,440 embedded 18x18 multipliers, and rich clocking with PLLs. The C2 speed grade is the slowest commercial Stratix IV GX speed grade, offering the lowest cost at the price of reduced Fmax versus C3/C4/I-grade siblings. The 40 nm process node and the 33x33 mm 780-HBGA package together manage power dissipation and signal integrity for hundreds of high-speed serial and parallel signals. Transmit pre-emphasis, receive equalization, and adaptive voltage swing are built in, reducing external PHY circuitry and simplifying board layout. The device supports configuration via fast passive parallel, fast active serial, and JTAG modes. Typical applications include 40G/100G optical transport line cards, PCIe Gen2 endpoint/root-complex boards, radar and electronic warfare signal processing, software-defined radio baseband, ASIC prototyping, and high-performance test & measurement instrumentation. The wide logic and transceiver budget makes the EP4SGX360FH29C2X a frequent choice when a design must absorb both compute-intensive datapaths and multi-lane serial I/O in a single device. When designing with this part, plan thermal management carefully: a 780-ball FCBGA at 33x33 mm requires a multi-layer PCB with a thermal via array under the lid and, often, a heatsink for sustained workloads. Validate signal-integrity budgets for the 8.5 Gbps transceivers against your PCB stack-up before commit, and confirm Quartus II support for the C2 speed-grade timing models in your design flow. This page synthesizes distributor inventory, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP4SGX360FH29C2XN - Stratix IV GX FPGA, 353.6K LE, 780-BGA | Intel
The Intel EP4SGX360FH29C2XN is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) with 353,600 logic elements, 23,105,536 bits of embedded memory, and integrated transceivers, housed in a 780-ball FCBGA (H-BGA) package. Built on a 40 nm process and operating at a core voltage of 0.9 V, the device is offered in the commercial C2 temperature grade with lead-free, RoHS-compliant terminations. A field-programmable gate array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit at the apex of the programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA), allowing system architects to implement custom datapaths, protocols, and parallel processing engines on a single die that would otherwise require multiple discrete ASICs. The Stratix IV GX family specifically targets high-bandwidth serial interface applications. Key features of the EP4SGX360FH29C2XN include 353,600 logic elements, 14,144 LABs (Logic Array Blocks), 289 maximum user I/Os, 23,105,536 bits of embedded memory, embedded DSP blocks, and integrated multi-gigabit transceivers (MGTs) that support serial protocols up to 8.5 Gbps. The Stratix IV GX family is built on a 40 nm low-power process and provides hard PCIe Gen2 and hard memory controller IP for streamlined system integration. The -C2 speed grade balances timing margin and Fmax, while the X-suffix denotes lead-free and RoHS-compliant package construction. Typical applications include high-speed serial bridging, 10G/40G Ethernet line cards, telecom backhaul equipment, ASIC prototyping, high-performance DSP co-processing, and military/aerospace signal processing. The 780-ball H-BGA package supports the dense I/O and high transceiver count required by these systems, and is compatible with standard BGA assembly processes and lead-free reflow profiles. When designing with this device, pay close attention to PCB escape routing for the H-BGA, transceiver channel loss budgeting, and decoupling strategy for the multiple supply rails (VCC, VCCA, VCCD_PLL, VCCH_GXB). Quartus II design software (or the appropriate Intel/Altera toolchain) is required for synthesis, place-and-route, and timing closure. Engineers should consult the Stratix IV GX handbook for transceiver reference designs and pin connection guidelines.
EP4SGX360FH29C3 - Stratix IV GX FPGA 353K LE | Intel
The Intel EP4SGX360FH29C3 is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) manufactured on a 40 nm process, integrating 353,600 logic elements and 14,144 adaptive logic modules (LABs) within a 780-pin flip-chip BGA (FCBGA) package measuring 33 x 33 mm. The device features up to 289 user I/Os, dedicated high-speed transceivers, embedded memory, and DSP blocks, making it a drop-in member of the Stratix IV GX family for wired communications, high-performance DSP, and ASIC prototyping designs. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, interconnects, and I/O cells that designers configure after manufacturing. FPGAs occupy the middle ground between fixed-function ASICs (Application-Specific Integrated Circuits) and general-purpose processors: unlike ASICs they can be re-programmed in the field, but unlike CPUs they execute deterministic parallel logic at hardware speeds. The Stratix IV family specifically targets high-end signal processing and serial connectivity applications where transceivers, DSP throughput, and logic density are simultaneously required. Key features include 22.4 Mbits of embedded memory (M9K + M144K blocks), up to 1,040 embedded 18x18 multipliers for DSP, dedicated PCIe Gen1/Gen2 hard IP blocks, and high-speed serial transceivers supporting multi-gigabit rates. The 0.9 V core voltage with hot-socketing and power-on-reset support simplifies board bring-up, while the transceiver block delivers protocol support for CPRI, OBSAI, Serial RapidIO, PCI Express, and Gigabit Ethernet. The EP4SGX360FH29C3 uses a fully buffered interconnect architecture with 8- or 10-input adaptive LUTs (ALMs) and per-LE configuration memory built on a 6-transistor SRAM cell. Fractional synthesis PLLs and 36 x 36 multiplier blocks feed hard-core DSP pipelines, while dedicated hard memory controllers interface to DDR/DDR2/DDR3 SDRAM, QDRII/RLDRAM II, and other external memory standards with on-die termination and read/write leveling. Typical applications include 40G/100G optical line-card packet processing, basestation baseband processing, ASIC prototyping, high-end broadcast video processing, and high-performance computing accelerators. The 780-pin FCBGA footprint is shared across much of the Stratix IV GX family, simplifying PCB layout reuse across density grades. When designing, pay close attention to transceiver reference-clock jitter and power-rail sequencing; the 0.9 V core requires multiple regulated rails generated by a compatible power supply such as the LTM4677 or ISL8215M. Decoupling, PCB stack-up, and thermal management are critical at this density - refer to the Stratix IV GX device handbook. This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the same Stratix IV GX family, and practical design notes not found in the manufacturer datasheet.
EP4SGX360FH29C3N - Stratix IV GX FPGA, 353.6K LE, 780-FBGA | Intel
The Intel EP4SGX360FH29C3N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 353,600 logic elements, 14,144 LABs, and 23,105,536 bits of embedded memory in a 780-ball FineLine BGA (FC-HFBGA) package. Built on a 40 nm process, the device integrates up to 36 transceivers operating up to 8.5 Gbps, making it the canonical mid- to high-end Stratix IV GX silicon for high-speed serial I/O designs. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs / LABs), programmable interconnect, hardened I/O serializers/deserializers (SerDes), and on-chip memory that can be rewired in the field to implement arbitrary digital functions. Stratix IV GX specifically extends the FPGA taxonomy by adding multi-gigabit transceivers and a hard PCI Express Gen1/Gen2 IP core, placing it in the hierarchy programmable logic -> FPGA -> high-speed serial FPGA -> transceiver FPGA -> Stratix IV GX family. Key features of the EP4SGX360FH29C3N include 289 user I/Os, 0.9 V core operation, support for up to 8.5 Gbps transceiver data rates, hard PCIe Gen1/Gen2 endpoints with x1/x2/x4/x8 lane support, and integrated transceivers optimized for protocols such as CPRI/OBSAI, Serial RapidIO, SATA, and 10 Gb Ethernet (XAUI). The 780-pin FC-HFBGA package provides high-density interconnect for high-pin-count designs while maintaining signal integrity for multi-gigabit serial links. The Stratix IV GX architecture combines an 8-input adaptive logic module (ALM) fabric with dedicated DSP blocks delivering up to 192 GMACS of signal-processing throughput, 5.04 Mbits of distributed RAM, and 12.51 Mbits of M20K block RAM with hard error correction. The device is hardened for transceivers, PLLs, and I/O, balancing soft logic flexibility with deterministic protocol performance. Typical applications include high-end telecommunications line cards (40G/100G aggregation), wireless baseband processing for LTE and WiMAX, ASIC prototyping, military secure communications, high-frequency trading accelerators, and broadcast video processing. The hard PCIe Gen2 endpoint and multi-gigabit transceivers remove the cost and latency of soft SERDES implementations. When designing with this device, use the Quartus II design suite (or its supported successor toolchain) for synthesis, place-and-route, and timing closure. The 780-ball FC-HFBGA package requires a minimum 8-layer PCB with controlled-impedance routing for transceiver channels and 100-ohm differential pairs; signal integrity must be validated through pre-layout and post-layout SI simulation. This page synthesizes distributor pricing, same-family Stratix IV GX drop-in alternatives, and Stratix IV GX design considerations not consolidated in the manufacturer datasheet, accelerating your procurement and architectural decisions.
EP4SGX360FH29C4 - Stratix IV GX FPGA 353K LE | Intel | BGA-780
The Intel (formerly Altera) EP4SGX360FH29C4 is a high-density Stratix IV GX Field-Programmable Gate Array delivering 353,600 logic elements and 14,144 Adaptive Logic Modules (ALMs / LABs) in a 780-ball FC-HFBGA package. Built on a 40nm process, the device integrates 289 user I/Os, embedded transceivers, and 23,105,536 bits of on-chip memory to support high-throughput serial connectivity and DSP-intensive workloads. The part operates from a 0.9V core supply with high-performance transceiver links that are widely used in wired communications infrastructure, ASIC prototyping, and high-end signal-processing cards. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O resources are defined after manufacturing via a hardware description language (HDL) bitstream. Within the broader programmable-logic taxonomy, the Stratix IV GX sits in the high-end tier alongside competing families such as Xilinx Virtex-6 and Lattice ECP3; the GX suffix denotes integrated multi-gigabit transceivers. Compared with a fixed-function ASIC, an FPGA provides faster time-to-market and field upgradeability at the cost of higher per-unit silicon area, higher dynamic power, and a unit price typically reserved for prototyping or low-volume production. Key features of the EP4SGX360FH29C4 include 24 transceivers supporting rates up to 8.5 Gbps, dedicated DSP blocks for high-speed fixed- and floating-point math, on-chip tri-speed Ethernet MACs, and PCI Express hard IP. The FH29 speed grade targets a balance of timing margin and power, while the C4 commercial temperature grade (-0°C to +85°C) suits lab and rack-mounted systems. Hard memory controllers and partial reconfiguration support allow designers to swap logic regions on the fly without disturbing active data paths. Typical applications include 10G/40G line-card aggregation, radar and software-defined radio DSP front-ends, ASIC prototyping, high-speed test and measurement, and broadcast video processing. The 780-ball FC-HFBGA (33 x 33 mm) package is designed for high-layer-count PCBs with matched-impedance controlled impedance traces for the transceiver channels. When designing with this device, follow the Stratix IV GX pin connection guidelines, route each transceiver channel as a 100-ohm differential pair with continuous reference planes, and provide adequate decoupling on every 0.9V / 1.1V / 2.5V rail. JTAG access is required for boundary-scan and configuration verification, and the configuration flash must be sized for the compressed bitstream plus margin. This page consolidates distributor pricing, verified drop-in alternatives within the Stratix IV family, and practical PCB/thermal guidance that is not gathered in a single place in the manufacturer datasheet.
EP4SGX360FH29C4N - Stratix IV GX FPGA, 353.6K LE, 780-FCBGA | Intel
The Intel EP4SGX360FH29C4N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) integrating 353,600 logic elements, 14,144 LABs/CLBs, 23,105,536 bits of embedded memory, and 289 user I/Os in a 780-ball FineLine BGA (FC-HFBGA) package. Built on a 40 nm process with 0.9 V core supply, the device is part of Intel's Stratix IV GX family, which combines high logic capacity with up to 8.5 Gbps embedded transceivers for high-speed serial I/O. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, block RAM, and hardened I/O serializers. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> high-density FPGAs, providing hardware-level parallelism for applications that demand deterministic latency and high throughput beyond what microcontrollers or DSPs can deliver. The Stratix IV family specifically targets high-performance signal processing, ASIC prototyping, and high-speed serial connectivity. Key specifications of the EP4SGX360FH29C4N include 24 transceiver channels supporting data rates up to 8.5 Gbps, 1,288 embedded 18x18 multipliers for DSP, and adaptive logic modules (ALMs) that pack eight inputs per ALM to improve logic utilization. The -C4 speed grade denotes a commercial temperature range (0C to 85C) with mid-tier timing closure. The C-grade speed combined with the 780-pin FCBGA package supports designs requiring a balance of performance, thermal headroom, and pin density for backplane or mezzanine routing. The architecture leverages a partial reconfiguration-friendly fabric, on-chip termination for LVDS, and dedicated PCML/serial transceiver circuitry. Compared with previous Stratix generations, Stratix IV GX delivers up to 2x lower power at equivalent performance through PowerPlay optimization, making it suitable for power-constrained but bandwidth-hungry systems. The 0.9 V core voltage reduces dynamic power while preserving timing margin for high-speed designs. Typical applications include high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, 10G Ethernet MAC), high-definition video processing and broadcast equipment, ASIC and ASSP prototyping, radar and electronic warfare signal processing, and medical imaging systems. Engineers also deploy this device in test and measurement instrumentation, software-defined radio (SDR) baseband processing, and high-performance computing (HPC) accelerator cards. A critical design consideration when working with the EP4SGX360FH29C4N is power distribution: the 780-ball FC-HFBGA package requires a multi-layer PCB (typically 10+ layers) with a low-impedance core/IO supply network. Designers must implement multiple decoupling capacitor values near each power pin pair and simulate PDN impedance to meet the device's high transient current demands during logic switching events. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the Stratix IV family, and practical design notes that supplement the official Intel Stratix IV GX datasheet with engineer-focused guidance.
EP4SGX360FH29I3 - Stratix IV GX FPGA | Intel | High-Speed Systems
Intel EP4SGX360FH29I3 is a high-density Stratix IV GX field-programmable gate array built on 40 nm process technology, with 353600 logic cells, 23105536 bits of embedded memory, and 289 user I/O in a 780-pin FC-HFBGA package. It combines programmable logic, substantial on-chip memory, and integrated high-speed transceiver resources for communication, processing, and protocol-intensive systems. The supplied source data identifies a 0.9 V core supply, 780-ball package, and Stratix IV GX architecture. These values define the device's position in the FPGA and programmable-logic hierarchy, where an FPGA is a semiconductor whose logic functions are configured after manufacturing. An FPGA, or field-programmable gate array, is an integrated circuit containing programmable logic elements, routing, memory blocks, and I/O resources. Unlike a fixed-function ASIC, its digital behavior can be defined through a configuration bitstream. Stratix IV GX devices belong to Intel's Stratix family and are designed for systems that need both parallel digital processing and high-speed serial connectivity. The product type hierarchy is FPGA, programmable logic device, semiconductor, and integrated circuit. The principal verified attributes are 353600 logic cells, 23105536 memory bits, and 289 I/O. The 780-pin FC-HFBGA package supports a high number of connections while using a fine-pitch, surface-mount BGA format. A 0.9 V core supply is consistent with the low-voltage operating point stated in the distributor and directory listings. Embedded memory enables local buffering and state storage, while programmable I/O allows adaptation to multiple digital interfaces. From an architectural perspective, the device is suited to designs requiring many parallel datapaths and configurable control logic. Stratix IV GX FPGAs are associated with high-speed transceiver-oriented applications, but the supplied data does not state a specific transceiver count, maximum data rate, or transceiver electrical specification. Those values must be obtained from the manufacturer documentation before system-level signal-integrity or bandwidth calculations. Designers should treat configuration, clocking, power integrity, and pin-assignment requirements as architecture-dependent. Typical applications include communication infrastructure, industrial automation, test and measurement, digital signal processing, and high-speed interface bridging. For a communications system, the 289 I/O and 23105536 embedded memory bits support parallel protocol handling and packet buffering. In industrial equipment, programmable logic can consolidate timing, control, and interface functions. In test systems, the FPGA can coordinate data acquisition, formatting, and transport. The central design trade-off is package and power planning. The 780-ball FC-HFBGA package requires careful BGA escape routing, controlled-impedance power distribution, and verified assembly capability. The supplied data does not provide package dimensions, transceiver specifications, operating temperature, configuration memory details, or exact I/O standards, so those parameters remain marked as needed. This page synthesizes verified distributor data, package information, application context, and explicit data gaps without inventing specifications.
EP4SGX360FH29I3N - Stratix IV GX FPGA, 353600 Cells, 780-FCBGA | Altera
The Intel (formerly Altera) EP4SGX360FH29I3N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) with 353,600 logic elements, 23,105,536 bits of embedded memory, and 289 user I/Os, fabricated on a 40 nm process and housed in a 780-ball flip-chip BGA (FCBGA) package. It features integrated transceivers supporting multi-gigabit serial I/O at data rates up to 8.5 Gbps, making it well suited for high-bandwidth communication, signal processing, and protocol bridging designs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon IP such as block RAM, DSP slices, phase-locked loops (PLLs), and high-speed transceivers. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit alongside ASICs, microcontrollers, and DSPs in the digital integrated circuit hierarchy. Stratix IV GX devices specifically target applications that combine high logic density with embedded multi-gigabit transceivers, eliminating the need for external PHY chips. Key features of the EP4SGX360FH29I3N include 14,144 adaptive logic modules (ALMs), 1,320 embedded 18x18 multipliers for DSP, and dedicated memory blocks supporting true dual-port RAM up to 144 Kbits. The device supports a core voltage of 0.9 V with hot-socketing capability and partial reconfiguration, allowing portions of the fabric to be reprogrammed while other regions continue operating. Hard PCIe Gen1/Gen2 hard IP blocks simplify interface design. Architecture-wise, the Stratix IV GX family uses Altera's adaptive logic module (ALM) fabric, an 8-input fracturable lookup table that improves logic packing versus conventional 4-input LUT architectures. The transceiver blocks incorporate signal conditioning, clock data recovery, and physical coding sublayer support for protocols such as PCIe, Serial RapidIO, XAUI, CEI-6G, and CPRI. Maximum transceiver count for the FH29 package is 24 channels at up to 8.5 Gbps. Typical applications include high-end wireline baseband processing, software defined radio (SDR) platforms, radar and electronic warfare signal processing, broadcast video infrastructure, medical imaging accelerators, and high-performance computing coprocessor cards. Industrial 40G/100G line card prototyping is also a common deployment. The wide transceiver count and large logic budget make it suitable for protocol aggregation across multiple standards simultaneously. When designing with this part, pay close attention to transceiver reference clock architecture, PCB stackup for the flip-chip BGA escape routing, and thermal management; the FCBGA package has a relatively high junction-to-ambient thermal resistance that demands a properly designed heatsink or forced airflow. Quartus II software (versions 9.1 through 13.1 are the last with Stratix IV support) is required for synthesis and place-and-route. This page synthesizes distributor pricing, Stratix IV family drop-in alternatives, and practical design notes not found in the manufacturer datasheet. All specs trace to the manufacturer datasheet and current distributor listings.