EP4SGX360FF35C3N - Stratix IV GX 353kLE FPGA | Intel | Altera
Référence : EP4SGX360FF35C3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9111.58 | $9 111,58 |
| 10 | $8832 | $88 320,00 |
| 100 | $8395 | $839 500,00 |
| 500 | $7960 | $3 980 000,00 |
| 1 000 | $7610 | $7 610 000,00 |
EP4SGX360FF35C3N Présentation
A Stratix IV GX is a system-on-chip FPGA class device that combines a programmable logic fabric, dedicated DSP blocks, embedded memory, high-speed transceivers, and hard PCIe Gen1/Gen2 IP blocks. In the broader taxonomy it sits under: FPGA -> programmable logic -> semiconductor device -> integrated circuit. The GX variant specifically adds embedded transceivers that simplify serial connectivity for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and CEI-6G.
Key differentiating features include 48 DSP blocks (18x18 multipliers) for high-throughput signal processing, support for LVDS, LVTTL, LVCMOS, and SSTL I/O standards, and an internal voltage supply range of 0.87V to 0.93V core plus 0.87V to 1.20V I/O supply rails. The C3 speed grade balances timing margin and Fmax, and the FF35 pin/package code designates the 35 mm flip-chip BGA with 1152 balls and 564 user I/Os. The device is lead-free and supplied in tray packaging suitable for both prototype and production assembly.
From an architecture perspective, the EP4SGX360FF35C3N uses Altera's adaptive logic module (ALM) and M20K memory blocks, providing up to 13.6 Mbits of block RAM plus 4.3 Mbits of MLAB memory. Hard memory controllers (DDR3/DDR2/QDRII+) and up to 8 PLLs support complex memory interfaces and high-speed clock networks.
Typical applications include high-speed serial protocol bridging, broadcast video processing, radar and signal intelligence front-ends, telecom line cards, test and measurement instrumentation with high-speed digitizers, and ASIC prototyping where the 353k logic-element capacity and embedded transceivers eliminate the need for companion ASSPs.
When designing with this device, ensure the PCB uses a 35 mm body BGA footprint with proper stackup for the 1152 balls; allocate 4-8 PCB layers with buried vias, follow Altera's pin connection guidelines for unused transceiver pins, and use the Quartus II design suite (the device predates Quartus Prime) for synthesis and place-and-route.
This page synthesizes distributor pricing, pin-compatible same-family variants, and practical PCB design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP4SGX360FF35C3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4SGX360FF35C3N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Process Technology, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4SGX360FF35C3
✅ Remplacement direct✓ En stock
$2285 / unité
Voir la fiche technique →EP4SGX360FF35C2XN
✅ Remplacement direct✓ En stock
$2600 / unité
Voir la fiche technique →EP4SGX360FF35C2X
✅ Remplacement direct✓ En stock
$3450 / unité
Voir la fiche technique →EP4SGX360FF35C3N Valeurs maximales et caractéristiques électriques
| Series | Stratix IV GX |
| Number of Logic Elements | 353,600 |
| Number of LABs/CLBs | 14,144 |
| Total RAM Bits | 23,105,536 |
| Number of User I/O | 564 |
| Boîtier | 1152-BBGA, FCBGA (FF35, 35 mm) |
| Type de montage | Surface Mount |
| Core Voltage Supply | 0.87 V to 0.93 V |
| Supply Voltage Range | 0.87 V to 0.93 V (core) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Speed Grade | C3 |
| Transceivers | Up to 24 channels at up to 8.5 Gbps |
| DSP Blocks | 48 (18x18 multipliers) |
| Lead-Free | Yes |
| Process Technology | 40 nm |
Guide de configuration des broches du EP4SGX360FF35C3N 1152-bbga, fcbga (ff35, 35 mm)
Configuration des broches du EP4SGX360FF35C3N (boîtier 1152-bbga, fcbga (ff35, 35 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4SGX360FF35C3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4SGX360FF35C3N convient pour 6 applications: High-Speed Serial Protocol Bridging, Broadcast Video Processing, Telecom Line Cards and Baseband Processing, Test and Measurement Instrumentation, ASIC Prototyping, Radar and Signal Intelligence Front-Ends.
High-Speed Serial Protocol Bridging
The EP4SGX360FF35C3N's 24 embedded transceivers operating up to 8.5 Gbps make it ideal for protocol-bridging applications such as PCI Express Gen1/Gen2 to Serial RapidIO, Gigabit Ethernet to XAUI, or CEI-6G to backplane interfaces. The 353,600 logic elements provide abundant capacity for custom bridging logic, flow-control FIFOs, and protocol-state machines between the two domains. With 23 Mbits of embedded RAM, large elastic buffers absorb clock-domain crossings without external memory. The FF35 package exposes 564 user I/Os for sideband signals, GPIO, and board management.
Recommandé
Broadcast Video Processing
Stratix IV GX FPGAs with 48 DSP blocks are widely deployed in broadcast video routers, format converters, and contribution encoders. The 48 18x18 multipliers and DSP block accumulators deliver the throughput needed for 3G-SDI, HD-SDI, and emerging 4K/UHD processing pipelines operating at sample rates exceeding 200 MHz. The 23 Mbits of embedded RAM provides line buffers and frame stores for chroma/luma interpolation and scaling filters. The 564 I/Os simplify interfacing to multiple SDI serializers/deserializers and audio embedding chips.
Recommandé
Telecom Line Cards and Baseband Processing
The 353,600 logic elements and 23 Mbits of block RAM support multi-channel baseband processing in telecom line cards, including OBSAI/CPRI framer implementations, channel aggregation, and forward-error-correction (FEC) encoders/decoders. The 8.5 Gbps transceivers handle CPRI line rates up to 6.144 Gbps and OBSAI RP3 at 6.144 Gbps. Hard PCIe Gen2 IP blocks simplify backplane connectivity to host processors. The 564 I/Os support SFP/SFP+ cages, clock distribution, and management interfaces.
Recommandé
Test and Measurement Instrumentation
High-speed logic analyzers, protocol analyzers, and oscilloscope digitizer cards leverage the EP4SGX360FF35C3N's combination of high logic density, 24 transceivers up to 8.5 Gbps, and 564 user I/Os to capture, buffer, and analyze multi-lane serial protocols. The 48 DSP blocks accelerate FFT-based spectrum analysis and modulation-domain processing. The 23 Mbits of embedded RAM provide deep acquisition memories for time-correlated captures. Industrial temperature variants exist (EP4SGX360FF35I3N/I4N) for harsh-environment deployments.
Recommandé
ASIC Prototyping
The 353,600 logic elements and abundant embedded memory make the EP4SGX360FF35C3N suitable for ASIC prototyping of mid-complexity SoCs. Multiple FF35-package devices can be partitioned on a multi-FPGA prototyping board to validate larger designs before tapeout. The 24 transceivers at 8.5 Gbps allow high-bandwidth chip-to-chip and chip-to-host connections that mirror the ASIC's SerDes links. Quartus II synthesis flows with co-emulation support simplify bring-up.
Recommandé
Radar and Signal Intelligence Front-Ends
Defense and aerospace applications use the EP4SGX360FF35C3N for radar digital receiver exciters and signal-intelligence intercept systems, where 48 DSP blocks deliver the multiply-accumulate throughput needed for channelization, beamforming, and pulse compression. The 564 I/Os accommodate multi-channel ADC/DAC interfaces (LVDS or JESD204B via external bridge). The commercial 0C to +85C temperature range fits many ground-based platforms; for harsher environments use the I3/I4 industrial variants.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4SGX360FF35C3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4SGX360FF35C3 | EP4SGX360FF35C2XN | EP4SGX360FF35C2X |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-BBGA, FCBGA (FF35) | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same | 1152-BBGA, FCBGA (FF35) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 |
| LABs/CLBs | 14,144 | 14,144 | 14,144 | 14,144 |
| Total RAM Bits | 23,105,536 | 23,105,536 | 23,105,536 | 23,105,536 |
| User I/Os | 564 | 564 | 564 | 564 |
| Speed Grade | C3 | C3 | C2 (slower) | C2 (slower) |
| Transceivers | Up to 24 at 8.5 Gbps | Up to 24 at 8.5 Gbps | Up to 24 at 8.5 Gbps | Up to 24 at 8.5 Gbps |
Principaux différenciateurs
- Pin-to-pin FF35 BGA compatibility across speed grades (vs EP4SGX360FF35C2XN)
- Lead-free/RoHS compliance designation (vs EP4SGX360FF35C3)
- Highest density Stratix IV GX in FF35 package (vs EP4SGX230TF35C4N)
Notes de conception
The 1152-ball FCBGA FF35 package requires an 8-12 layer PCB stackup with buried and micro vias. Follow Intel/Altera's Stratix IV GX pin connection guidelines for unused transceiver and I/O pin handling. Place decoupling capacitors as close as possible to each power pin pair; a typical design uses 100nF X7R ceramics plus bulk polymer tantalum capacitors on each supply rail.
Estimated: At maximum utilization (353kLE running at ~80% toggle rate, full transceivers at 8.5 Gbps), the EP4SGX360FF35C3N can consume 20-25 W. Design the VRM with 0.87V/0.93V core rails capable of 25-30 A peak, plus 1.2V and 2.5V auxiliary rails for transceivers and PLLs. Use Altera's PowerPlay early power estimator spreadsheet to refine budget before layout.
The 'N' suffix on EP4SGX360FF35C3N typically denotes lead-free/RoHS compliance per Altera naming conventions. When substituting EP4SGX360FF35C3 (without N), verify your assembly house accepts the part for your end-product compliance requirements. Also verify the C3 vs C2 speed grade impact on critical-path timing - C2 parts run approximately 10-15% slower Fmax.
Informations de conformité
RoHS compliance inferred from N suffix per Altera naming convention. Reach, halogen-free, and conflict minerals status not in provided data - set to unknown. Not AEC-Q100 qualified - this is a commercial-grade FPGA.
