Modules sans fil
Produits (6)
900-13767-0000-0A0 - Jetson Orin NX 16GB SOM, US Origin | NVIDIA
The NVIDIA 900-13767-0000-0A0 is a country-of-origin-specific variant of the Jetson Orin NX 16GB System-on-Module (SOM), built around a 1024-core NVIDIA Ampere GPU with Tensor Cores, an 8-core ARM Cortex-A78AE 64-bit CPU, and 16 GB of LPDDR5 memory, delivering up to 100 TOPS of AI performance in a compact SOM form factor. This particular SKU is the US-origin / TAA-compliant variant of the standard 900-13767-0000-000, identical in electrical and mechanical specifications but specified by NVIDIA for government, defense, and TAA-restricted deployments. An NVIDIA Jetson Orin module is a compact, high-performance embedded AI computing platform (system-on-module) that integrates CPU, GPU, memory, power management, and I/O onto a single board designed to plug into a carrier board. Jetson Orin NX belongs to the Jetson Orin family of edge AI modules, which in NVIDIA's product taxonomy sits within the Jetson embedded computing platform, a subfamily of NVIDIA's broader edge AI and robotics portfolio. The Jetson Orin NX delivers Ampere-generation AI inference at a fraction of the power and footprint of a discrete GPU workstation, enabling advanced computer vision, generative AI, and multi-sensor fusion workloads at the edge. Key features of the 900-13767-0000-0A0 include 100 TOPS of INT8 AI performance (sparse), up to 50 TOPS dense INT8, 1024 CUDA cores plus 32 Tensor cores in the Ampere GPU, an 8-core Arm v8.2 64-bit CPU complex with 2MB L2 + 4MB L3 cache, 16 GB 128-bit LPDDR5 memory at 102.4 GB/s, configurable TDP between 10W and 25W, dual MIPI CSI-2 camera interfaces, PCIe Gen 4 lanes, USB 3.2, and the standard 260-pin Jetson SO-DIMM connector for carrier-board mating. The module supports NVIDIA JetPack SDK, CUDA, TensorRT, and Isaac robotics frameworks out of the box. Typical applications for the 900-13767-0000-0A0 include US-government edge AI deployments, defense and aerospace vision systems, TAA-restricted industrial automation, multi-camera video analytics at the edge, autonomous mobile robots, drone-based inference payloads, and medical imaging devices where country-of-origin compliance is mandated by procurement rules. When designing in this part, verify the carrier board supports the Jetson Orin NX pinout (P3767 reference design) and that the cooling solution can dissipate the configurable 10-25W envelope at the target workload. The 0A0 suffix has no electrical difference from the 0A1 and 000 variants; the difference is solely country of origin and TAA/NDAA compliance documentation.
ATSAMB11ZR-XPRO - BLE 4.x SmartConnect Xplained Pro | Microchip
The Microchip ATSAMB11ZR-XPRO is a Bluetooth Smart 4.x Low Energy (BLE) 2.4GHz evaluation board built around the ATSAMB11-ZR210CA SmartConnect SiP/Module. The kit is part of Microchip's Xplained Pro evaluation platform and provides a complete out-of-the-box development environment for prototyping BLE peripherals, beacons, and IoT sensor nodes without external RF matching or antenna design. The board exposes the ATSAMB11 module's ultra-low-power Cortex-M0 based BLE SoC subsystem plus its integrated ARM Serial Wire Debug (SWD) interface, enabling engineers to prototype firmware using Atmel Studio / Microchip Studio and the Atmel BLE software stack. Bluetooth Low Energy (BLE), standardized as IEEE 802.15.1 and maintained by the Bluetooth SIG, is a short-range, ultra-low-power wireless technology targeting coin-cell and energy-harvesting applications such as fitness bands, smart-home sensors, beacons, and proximity tags. Compared to classic Bluetooth, BLE trades peak throughput for drastically reduced average current draw, allowing months-to-years of operation on a single coin cell. The ATSAMB11ZR-XPRO shortens time-to-prototype by integrating the RF matching network, crystal, and chip antenna on a certified module, so firmware engineers can focus on the application GATT profile rather than radio compliance. Key features of the ATSAMB11ZR-XPRO include the ATSAMB11-ZR210CA SiP/Module with on-module 32.768 kHz RTC crystal and 16 MHz main crystal, integrated DC-DC converter for sub-3V battery operation, and a Cortex-M0 application core with dedicated BLE link layer. The board adds a user pushbutton, user LED, mikroBUS socket expansion, Xplained Pro extension header for breadboarding and Atmel QT touch debug, plus a Virtual COM port over USB for SWD and serial console. The board is USB-powered and integrates an on-board debugger, removing the need for an external programmer. At the application layer, the ATSAMB11ZR-XPRO is widely used as a reference design platform for ATSAMB11 firmware development, BLE peripheral GATT services, proprietary 2.4GHz profiles for proprietary protocols, and as a building block for IoT sensor nodes that need a fully certified radio. It is also used in education and rapid prototyping where engineers need a quick way to verify BLE link behavior, throughput, and power consumption before committing to a custom PCB layout. For design considerations, the on-board debugger is selectable as either the board's embedded debugger or an external one via the standard Xplained Pro IDC header, so multi-board debug chains are supported. The kit is RoHS compliant and supported by Atmel/Microchip Studio, ASF (Atmel Software Framework), and the latest Microchip code configurator for Bluetooth Low Energy projects. Battery-profiling firmware and Atmel QTouch libraries can be evaluated on this board via the QT header. This page synthesizes Microchip product-page data, distributor pricing from DigiKey and Octopart, datasheet references, and design notes that go beyond the manufacturer datasheet to help engineers choose and deploy the kit.
DC-ME-Y402-C - Digi Connect ME 9210 SOM, ARM926 75MHz, 8MB SDRAM, 4MB Flash | Digi
The Digi International DC-ME-Y402-C is a compact wired embedded System-on-Module (SOM) from the Digi Connect ME 9210 family, integrating an ARM926EJ-S processor core (NS9210) running at 75 MHz with 8 MB SDRAM and 4 MB flash in a single-unit pack. It provides a 10/100 Mbit Ethernet MAC/PHY, plug-and-play network connectivity, and runs Digi NET+OS, making it a drop-in secure device-server building block for IP-enabled product designs. The module is targeted at embedded networking applications requiring secure, drop-in TCP/IP stack integration without a full custom design cycle. What is a System-on-Module (SOM)? A SOM is a small, pre-integrated computing module that combines a processor, memory, and key peripherals on a single board, designed to plug into a carrier board via a standardized high-density connector. SOMs belong to the broader category of embedded computing modules (subclass of embedded modules, within computer-on-module / CoM taxonomy), enabling OEMs to add complex functionality - here, secure networking - without designing the SoC hardware themselves. For engineers designing connected products, the DC-ME-Y402-C collapses the hardware stack of a 32-bit ARM9 networking node into a footprint suited for retrofit and new product designs. Key specifications include an ARM926EJ-S core (NS9210) at 75 MHz, 8 MB SDRAM, 4 MB on-module flash, 10/100 Mbps Ethernet, and an industrial operating temperature range of -40C to +80C. The module exposes the NS9210 peripheral set through the standard Digi Connect ME 9210 60-pin SMT connector, enabling reuse of existing carrier boards across the family. According to Digi product documentation, the DC-ME-Y402-C ships as a single-unit pack with NET+OS firmware support. The DC-ME-Y402-C uses the Digi NET+OS development environment, including the Platform object library, ThreadX RTOS-based runtime, and the Digi ESP IDE. Power input is 3.3 V typical via the carrier connector, and the module integrates the PHY magnetics center-tap requirements on-module, simplifying host board design. Typical applications include industrial automation gateways, building automation controllers, medical device networking, retail/POS terminals, and security/access control panels. Anywhere a 32-bit wired Ethernet node with a secure RTOS stack is needed, the DC-ME-Y402-C accelerates time-to-market. Design consideration: a critical design factor is the carrier board layout - the high-density 60-pin SMT connector footprint and routing constraints must be observed. The DC-ME-Y402-C shares its family footprint with other Connect ME 9210 variants, enabling migration paths without PCB rework. This page synthesizes Digi distributor pricing, drop-in family variants (DC-ME-Y402-S, DC-ME-Y402-MF), and practical design notes not found in the manufacturer datasheet alone.
DC-ME-Y413-LX - 9210 16MB/8MB Embedded Module | Digi
The Digi DC-ME-Y413-LX is a Digi Connect ME embedded module built around the NS9210 processor, integrating an ARM926EJ-S core running at 75 MHz with 16 MB of SDRAM and 8 MB of flash memory into a compact, RJ-45 form-factor-ready System-on-Module. The module integrates 10/100 Ethernet MAC, on-chip security acceleration, and flexible serial interfaces in a single SMT-friendly mezzanine, allowing engineers to add network connectivity to existing products without designing a full processor subsystem. The device exposes the full NS9210 signal set on a 1.27 mm pitch board-to-board mezzanine connector, simplifying host integration. A System-on-Module (SoM) is a pre-certified, production-ready processor and memory subsystem that drops onto a customer's carrier board. SoMs sit hierarchically above discrete MCUs but below full single-board computers, accelerating time-to-market by offloading the hardest parts of high-speed processor design: BGA fan-out, DDR routing, and EMC compliance. The Digi Connect ME family sits at the small-footprint end of the SoM spectrum, optimized for industrial Ethernet and device-server applications. Key features include the ARM926EJ-S 32-bit RISC core with memory management unit, 10/100 Mbps Ethernet MAC with integrated PHY on selected variants, hardware AES/SHA acceleration, dual high-speed UARTs, SPI, I2C, and GPIO. The module supports Digi's NET+OS or ThreadX development environments, providing POSIX-style APIs and proven TCP/IP stacks. Operating temperature spans -40C to +85C for industrial deployment, and the device carries RoHS compliance with lead-free soldering for global manufacturing. Typical applications include industrial Ethernet device servers, building automation controllers, point-of-sale terminals, secure remote management appliances, and edge-of-network sensor aggregators. The integrated Ethernet MAC and security engine make the DC-ME-Y413-LX especially attractive for legacy serial-to-Ethernet bridges, replacing dedicated serial-port servers with a programmable, firmware-upgradable platform. When designing a carrier board, observe the 1.27 mm pitch mezzanine keep-out, provide bulk decoupling on the host 3.3 V rail, and route the differential Ethernet pair as a 100-ohm controlled-impedance pair away from switching nodes. Module firmware image selection (development vs production) is controlled via NET+OS bootstrap pins; leave these accessible for field recovery. The DC-ME-Y413-LX is a mature, broadly deployed part with long-term availability through Digi's embedded product line. This page synthesizes distributor pricing, parametric alternatives, and design notes that go beyond the manufacturer datasheet by mapping the module's position within the System-on-Module ecosystem and clarifying what differentiates it from sibling parts in the Digi Connect ME/ME 9210 family.
Intel BE200 - Wi-Fi 7 2x2 M.2 2230 Module + BT 5.4 | Intel
The Intel BE200 (Gale Peak 2) is a Wi-Fi 7 (IEEE 802.11be) plus Bluetooth 5.4 combo M.2 module delivering dual-stream (2x2) Wi-Fi across 2.4 GHz, 5 GHz and 6 GHz bands in a compact 2230 Key E form factor. A wireless network module is an embedded radio subsystem that connects a host device to wireless networks. In the connectivity hierarchy it sits as a Wi-Fi/Bluetooth combo adapter above discrete antennas and below full wireless routers, typically interfacing to a host PC or embedded board through a PCIe bus for Wi-Fi and a USB 2.0 bus for Bluetooth. The M.2 2230 Key E standard defines the mechanical footprint and pin assignment used by laptops, mini PCs, industrial PCs and desktop adapters. Key features of the BE200 include tri-band 2x2 Wi-Fi 7 operation aligned with the Wi-Fi Alliance Wi-Fi 7 certification program, support for 320 MHz channels and Multi-Link Operation (MLO) under the 802.11be standard, Bluetooth 5.4 for low-energy peripherals, and integration with Intel vPro-capable platforms in the D2WG variant family (the BE200.D2WG.NV SKU is offered both with and without vPro per Mouser listings). Technically, the module uses an NGFF M.2 interface with PCIe transport for the Wi-Fi MAC/baseband and USB 2.0 for the Bluetooth controller. Wi-Fi 7 MLO allows the radio to aggregate 2.4 GHz, 5 GHz and 6 GHz links simultaneously, reducing latency and improving throughput in congested RF environments compared with single-link Wi-Fi 6E operation. The 6 GHz band provides clean spectrum and wide 320 MHz channels for multi-gigabit rates. Typical applications include Wi-Fi 7 upgrades for laptops and mini PCs with a spare M.2 Key E slot, desktop Wi-Fi via PCIe adapter cards (the module is the radio core of popular BE6500-class adapters), and embedded or industrial gateways requiring tri-band connectivity. Design consideration: the BE200 requires two external dual-band antennas connected via U.FL/IPEX MHF4 connectors, and the host must support PCIe M.2 Key E with 3.3V power; verify driver support (Windows 11 or Linux) for the 802.11be feature set before release. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the Intel product brief.
OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems
The Octavo Systems OSD3358-512M-ISM is a System-in-Package (SiP) module integrating a Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD processor running at 1 GHz, 512 MB of DDR3 memory, a TPS65217C PMIC, a TL5209 LDO, a 4 KB EEPROM, and all necessary passives into a single 21 mm x 21 mm 256-ball BGA package. The OSD3358-512M-ISM reduces the AM3358 design from a multi-chip board to a single component, eliminating discrete DDR3 routing complexity and shrinking the complete computer footprint to roughly the size of a postage stamp. A System-on-Module (SOM) or System-in-Package (SiP) is a pre-integrated computing block that combines a microprocessor, memory, power management, and supporting passives into a single package or small board. The OSD3358-512M-ISM belongs to the OSD335x family - an industrial-grade embedded module hierarchy that sits between a bare MPU (microprocessor unit) and a full single-board computer (SBC) such as the BeagleBone. Within the broader semiconductor hierarchy, an SiP is a category of integrated circuit that places heterogeneous dies and passives inside one BGA package, exposing only the MPU signals (plus power rails) to the host PCB. Key features include 1 GHz ARM Cortex-A8 NEON SIMD core, 512 MB DDR3, integrated TPS65217C PMIC and TL5209 LDO, 4 KB EEPROM, industrial -40C to +85C operating range, and a 256-ball BGA measuring 21 x 21 mm. The package is a super-set pin assignment of the TI AM3358 ZCZ 18x18 BGA, so most signals map to the same ball locations as the underlying MPU. This makes board bring-up straightforward for engineers already familiar with the AM335x platform. Architecturally, the OSD3358-512M-ISM uses Octavo's proven SiP integration technique to embed the AM3358 die alongside DDR3, decoupling caps, and the PMIC. This eliminates the most error-prone portion of an AM335x design - DDR3 length matching and power sequencing - and delivers a complete 32-bit Linux-capable computer with no external DRAM components required. Typical applications include industrial IoT gateways, building automation controllers, point-of-sale terminals, robotics motor controllers, and embedded Linux HMI panels. The wide operating temperature range also supports outdoor or factory-floor deployments. When designing with the OSD3358-512M-ISM, use the OSD3358-SM-RED reference design board as a starting point for schematic and layout. Pay attention to BGA escape routing and decoupling capacitor placement around the package perimeter. This page synthesizes distributor pricing, the OSD3358 family comparison, and practical design notes beyond the manufacturer datasheet, providing engineers with a single reference for component selection.