10AS057K2F35I2SG vs 10AS057K2F35E1HG Comparaison
Comparaison détaillée côte à côte de 10AS057K2F35I2SG par Intel et 10AS057K2F35E1HG par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10AS057K2F35I2SG | 10AS057K2F35E1HG |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3 198,40 | $1 995,00 |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX |
| Logic Elements | 570K | 570,000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Core Frequency | 1.5 GHz | — |
| Speed Grade | -2 | — |
| Boîtier | 1152-ball FC-FBGA (F35), 35x35 mm | 1152-ball FC-BGA (F35), 35x35 mm |
| Température de fonctionnement | -40C to +100C (Industrial) | — |
| User I/O Count | 396 (per Heisener parametric data) | — |
| Process Node | 20 nm TSMC | — |
| Transceivers | [DATA_NEEDED: transceiver count and max data rate] | 24 (up to 17.4 Gbps) |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Embedded Memory | [DATA_NEEDED: M20K / MLAB bit count] | 29.4 Mbits (M20K + MLAB) |
| HPS Peripherals | EMAC, USB 2.0 OTG, SPI, I2C, NAND/NOR flash controllers, SD/MMC | — |
| Memory Interfaces | DDR3/DDR4/LPDDR3 hard controllers (Arria 10 HPS) | — |
| Configuration | FPGA + HPS independent / coordinated boot | — |
| Statut RoHS | Compliant (lead-free finish) | Compliant |
| Type de montage | Surface Mount (BGA) | — |
| Niveau MSL | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| DSP Blocks (18x19 Multipliers) | — | 1,566 |
| Maximum User I/O Pins | — | [DATA_NEEDED: max user I/O] |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | — | 1.5 GHz |
| PCIe Hard IP | — | Gen2/Gen3 x8 |
| Memory Interfaces (FPGA side) | — | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 |
| Memory Interfaces (HPS side) | — | DDR4, DDR3, LPDDR3 |
| Process Technology | — | 20 nm TSMC |
| Operating Temperature Grade | — | Industrial |
| Supply Voltage (Core) | — | [DATA_NEEDED: Vcore] |