10M04DAF256C7G vs 10M16DCF256I7G Comparaison
Comparaison détaillée côte à côte de 10M04DAF256C7G par Intel et 10M16DCF256I7G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10M04DAF256C7G | 10M16DCF256I7G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $9,45 | $24,95 |
| Family | MAX 10 FPGA | MAX 10 FPGA |
| Logic Elements (LE) | 4,000 | 16,000 |
| Maximum User I/Os | 178 | — |
| Embedded Memory (M9K blocks total) | 176 Kbits | — |
| User Flash Memory | 193,536 bits | 256 Kbits |
| Configuration Flash (on-die) | 1,178 Kbits (CFM0 + CFM1 dual-config) | — |
| Boîtier | 256-LBGA (F256) FineLine BGA, 17 mm x 17 mm | 256-ball FBGA (F256) |
| Temperature Grade (junction) | 0C to 100C (commercial) | — |
| Core Voltage | 1.2 V | — |
| Auxiliary Voltage | 2.5 V / 3.3 V | — |
| ADC | 1 x 12-bit, 1 Msps SAR | — |
| PLL | 1 (general-purpose) | — |
| Process Technology | 55 nm TSMC flash-based | 55 nm |
| LVDS Transmitter (max data rate) | 800 Mbps | — |
| Statut RoHS | Compliant | Compliant |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Lead-Free | Yes | — |
| Product Line | — | MAX 10 |
| Embedded Memory Bits | — | 562,176 bits |
| User I/O Count | — | 178 |
| Core Supply Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (I7: -40C to +100C) |
| Embedded Multipliers (18x18) | — | 45 |
| PLL Count | — | 4 |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| On-chip ADC | — | 12-bit, 1 MSPS, up to 18 analog inputs |
| Hard Memory Controller | — | DDR3 SDRAM |
| Configuration Method | — | Internal flash, instant-on |