10M08SAU169A7G vs 10M08SAU169C8G Comparaison
Comparaison détaillée côte à côte de 10M08SAU169A7G par Intel et 10M08SAU169C8G par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10M08SAU169A7G | 10M08SAU169C8G |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $10,50 | $10,20 |
| Series | MAX 10 | — |
| Logic Elements (LE) | 8,000 | — |
| Embedded Memory | 378 Kbits (≈46 Kbytes) | — |
| User I/Os | 130 | 130 |
| DSP Blocks / 18x18 Multipliers | 16 | — |
| PLLs | 4 | 4 analog PLLs + 2 fractional PLLs |
| On-chip Flash | Dual-configuration (1.4 Mbits user flash) | — |
| ADC | 12-bit, 1 MSPS, 17 analog inputs (hard IP) | — |
| Boîtier | 169-LFBGA (Ultra FineLine BGA, 11x11 mm) | 169-LFBGA (UBGA, 11x11 mm, 0.8 mm pitch) |
| Température de fonctionnement | -40C to +125C (automotive grade) | Commercial / Industrial (per device suffix) |
| Speed Grade | 7 (fast) | C8 (-8) |
| Process Technology | TSMC 55 nm embedded NOR flash | — |
| Type de montage | Surface Mount (BGA) | — |
| Niveau MSL | 3 (168 hours) | — |
| Statut RoHS | Compliant | Compliant |
| Configuration Memory | Internal flash (single-chip instant-on) | Dual-configuration on-chip flash (non-volatile, instant-on) |
| Family | — | MAX 10 |
| Logic Elements (LEs) | — | 8,000 |
| Embedded Memory (bits) | — | 387,072 (≈378 Kbits user flash + M9K block RAM) |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| M9K Block RAM (Kbits) | — | 173 (≈378 Kbits total embedded memory including user flash) |
| DSP Blocks | — | Yes (18x18 multiplier blocks) |
| On-chip ADC | — | Yes (single, 12-bit, 1 MSps equivalent — device dependent) |
| Core Voltage | — | 1.2 V |
| I/O Voltage Standards | — | LVCMOS/LVTTL up to 3.3 V |
| Process Node | — | 55 nm embedded flash |
| External Memory Interface | — | DDR3, LPDDR2, SRAM (hard IP) |
| PCIe Hard IP | — | Yes (PCIe Gen2 x1 hard IP block) |
| Configuration Mode | — | JTAG (1149.1) + Active Serial (AS) |
| Development Toolchain | — | Intel Quartus Prime |