A3P600-2FGG484I vs A3P600-FGG484 Comparaison
Comparaison détaillée côte à côte de A3P600-2FGG484I par Microchip Technology et A3P600-FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3P600-2FGG484I - ProASIC3 FPGA 600K 235 I/O | Microchip
A3P600-2FGG484I ✓ ActifComparaison des spécifications
| Paramètre | A3P600-2FGG484I | A3P600-FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $31,80 | $44,75 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600000 | 600K |
| User I/O | 235 | — |
| On-chip Resource Bits | 110592 | — |
| Speed Grade | -2 (25% faster than standard) | — |
| Boîtier | 484-BGA (FGG484) | 484-Pin FBGA (FGG484) |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Memory | Flash (non-volatile, single-chip) | Flash-based (non-volatile, single chip) |
| Température de fonctionnement | -40C to +100C (industrial, I suffix) | — |
| I/O Banks | 4 (dedicated VCCIBx per bank) | — |
| Reprogrammability | Yes, in-system | — |
| Core Voltage | [DATA_NEEDED: core voltage] | — |
| Lead Free | Yes (per PCB Electronics: LEAD FREE) | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Lead Free |
| Niveau MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Architecture | CMOS flash-based FPGA sea-of-gates | — |
| Maximum System Frequency | — | 231 MHz |
| Process Technology | — | 130 nm CMOS |
| Core Supply Voltage | — | 1.5 V |
| User I/O Count | — | 235 |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |