A3P600-FGG484 vs A3P600-FG484I Comparaison
Comparaison détaillée côte à côte de A3P600-FGG484 par Microchip Technology et A3P600-FG484I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | A3P600-FGG484 | A3P600-FG484I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $44,75 | $25,40 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600K | 600K |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm CMOS | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| User I/O Count | 235 | — |
| Boîtier | 484-Pin FBGA (FGG484) | 484-FBGA |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Memory | Flash-based (non-volatile, single chip) | — |
| Terminal Form | Ball | — |
| Package Shape | Square BGA | — |
| Temperature Grade | Commercial | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Minimum | 0 C | — |
| Operating Temperature Maximum | [DATA_NEEDED: maximum operating temperature] | — |
| Statut RoHS | Lead Free | Compliant |
| Number of Logic Elements (LEs) | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM capacity] | — |
| Maximum Frequency | — | 231 MHz |
| Technology | — | 130nm Flash |
| User I/Os | — | 235 |
| Température de fonctionnement | — | -40C to +100C |
| Configuration | — | Flash-based, non-volatile |
| PLLs | — | 6 |
| Flash Memory | — | 128K bits |
| I/O Standards | — | LVCMOS, LVTTL, differential |
| Lifecycle | — | Active |