A3PE3000-1FGG484I vs A3PE3000L-FGG484 Comparaison
Comparaison détaillée côte à côte de A3PE3000-1FGG484I par Microchip Technology et A3PE3000L-FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-1FGG484I - Flash FPGA, 3M Gates | Microchip Technology
A3PE3000-1FGG484I ✓ ActifMicrochip Technology
A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip
A3PE3000L-FGG484 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-1FGG484I | A3PE3000L-FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 336,60 | $0,00 |
| Product Family | ProASIC3E | — |
| System Gates | 3,000,000 (3M) | 3,000,000 |
| Logic Elements | 35,000 | — |
| Embedded SRAM | 504 Kbits (516,096 bits) | — |
| User I/O (FGG484) | 341 | — |
| Total Balls | 484 | — |
| Boîtier | 484-ball FBGA, 1.0 mm pitch (FGG484) | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch |
| Logic Family | CMOS | — |
| Tension d'alimentation | 1.5 V | — |
| System Performance | 231 MHz | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| Température de fonctionnement | 0 to 70 C (per Digchip listing; confirm I-grade limits) | [DATA_NEEDED: operating temperature range] |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | Compliant (FGG green package) | Compliant (per Newark: RoHS Compliant: Yes) |
| Speed Grade | -1 | — |
| Max User I/O (Family) | 616 | — |
| Family | — | ProASIC3L (Low Power Flash FPGA) |
| Logic Cells | — | 75,264 |
| User I/O | — | 341 |
| Embedded RAM | — | 516,096 bits |
| Core Voltage | — | 1.2 V to 1.5 V |
| Configuration Technology | — | Nonvolatile flash, Instant On |
| Low Power Feature | — | Flash*Freeze technology |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O bank voltage range] |
| Packaging | — | Tray |
| Security | — | Single-chip, flash-based, secure nonvolatile configuration |