A3PE3000L-1FGG484I vs A3PE3000L-FG484 Comparaison
Comparaison détaillée côte à côte de A3PE3000L-1FGG484I par Microchip Technology et A3PE3000L-FG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484I ✓ ActifMicrochip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-1FGG484I | A3PE3000L-FG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $104,50 | $112,00 |
| Family | ProASIC3L | ProASIC3L (Low Power Flash FPGA) |
| Number of Gates | 3000000 | — |
| Total RAM Bits | 516096 | — |
| Number of I/O | 341 | — |
| Tension d'alimentation | 1.14 V to 1.575 V | — |
| Core Voltage (Nominal) | 1.2 V | — |
| Core Voltage Range (per datasheet) | 1.2 V to 1.5 V | — |
| Speed Grade | -1 | — |
| Boîtier / Format | 484-BGA | — |
| Supplier Device Package | 484-FPBGA (23x23) | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -40C to +100C (TJ) | [DATA_NEEDED: Operating Temperature] |
| Technology | 130 nm Flash | 130 nm CMOS flash, nonvolatile |
| Programmable Type | In System Programmable (flash-based, non-volatile) | — |
| Packaging | Tray | — |
| Statut RoHS | ROHS3 Compliant | [DATA_NEEDED: RoHS compliance] |
| Manufacturer Lead Time | 8 weeks | — |
| Product Status | Active | — |
| System Gates | — | 3000000 |
| Logic Cells / CLBs | — | 75264 |
| User I/Os | — | 341 |
| Maximum System Frequency | — | 250 MHz |
| Core Voltage Range | — | 1.2 V to 1.5 V |
| Configuration | — | Flash-based, Instant On, single-chip |
| Low Power Feature | — | Flash*Freeze technology |
| Package Type | — | 484-ball FBGA (PBGA484) |
| Package Dimensions | — | 23 x 23 mm, 1 mm ball pitch |
| Package Height | — | 2.23 mm |
| Process | — | CMOS |
| Supply Voltage I/O | — | [DATA_NEEDED: I/O supply voltage range] |
| Embedded Memory | — | [DATA_NEEDED: Embedded RAM block capacity] |