A3PE3000L-FG484 vs A3PE3000L-1FG484I Comparaison
Comparaison détaillée côte à côte de A3PE3000L-FG484 par Microchip Technology et A3PE3000L-1FG484I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ ActifMicrochip Technology
A3PE3000L-1FG484I - ProASIC3L Low Power Flash FPGA | Microchip
A3PE3000L-1FG484I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-FG484 | A3PE3000L-1FG484I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $112,00 | $89,90 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3,000,000 gates |
| Logic Cells / CLBs | 75264 | — |
| User I/Os | 341 | — |
| Maximum System Frequency | 250 MHz | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Technology | 130 nm CMOS flash, nonvolatile | — |
| Configuration | Flash-based, Instant On, single-chip | On-chip flash, no external boot device |
| Low Power Feature | Flash*Freeze technology | — |
| Package Type | 484-ball FBGA (PBGA484) | — |
| Package Dimensions | 23 x 23 mm, 1 mm ball pitch | — |
| Package Height | 2.23 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Process | CMOS | — |
| Température de fonctionnement | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: exact min/max operating temperature range] |
| Supply Voltage I/O | [DATA_NEEDED: I/O supply voltage range] | — |
| Embedded Memory | [DATA_NEEDED: Embedded RAM block capacity] | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements (LEs) | — | 35 KLEs |
| Total RAM Bits | — | 516096 bits |
| Number of I/O | — | 341 |
| Core Voltage | — | 1.2 V (family supports 1.2 V to 1.5 V) |
| Process Technology | — | 130 nm flash |
| Special Features | — | Flash*Freeze technology, non-volatile single-chip |
| Speed Grade | — | -1 |
| Boîtier | — | 484-ball FBGA (FG484) |
| Terminal Form | — | Ball (BGA, square) |
| Temperature Grade | — | Industrial (I) |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O bank voltage range] |
| Packaging | — | Tray |