A3PE3000L-FG484 vs A3PE3000L-FG484M Comparaison
Comparaison détaillée côte à côte de A3PE3000L-FG484 par Microchip Technology et A3PE3000L-FG484M par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ ActifMicrochip Technology
A3PE3000L-FG484M - 3M Gate Low-Power Flash FPGA | Microchip
A3PE3000L-FG484M ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-FG484 | A3PE3000L-FG484M |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $112,00 | $129,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Flash-based FPGA) |
| System Gates | 3000000 | 3000000 (3.00E6) |
| Logic Cells / CLBs | 75264 | — |
| User I/Os | 341 | — |
| Maximum System Frequency | 250 MHz | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Technology | 130 nm CMOS flash, nonvolatile | — |
| Configuration | Flash-based, Instant On, single-chip | — |
| Low Power Feature | Flash*Freeze technology | — |
| Package Type | 484-ball FBGA (PBGA484) | FBGA-484, 1 mm pitch, 23 x 23 mm |
| Package Dimensions | 23 x 23 mm, 1 mm ball pitch | — |
| Package Height | 2.23 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Process | CMOS | — |
| Température de fonctionnement | [DATA_NEEDED: Operating Temperature] | 0 to 70 C |
| Supply Voltage I/O | [DATA_NEEDED: I/O supply voltage range] | — |
| Embedded Memory | [DATA_NEEDED: Embedded RAM block capacity] | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | — |
| Logic Elements (VersaTiles) | — | 75264 |
| True Dual-Port SRAM | — | 504 kbits |
| User I/O | — | 341 (up to 616 in larger packages) |
| Core Voltage | — | 1.2 V to 1.5 V |
| Process Technology | — | 130-nm, 7-layer metal (6 copper) flash-based CMOS |
| Logic Family | — | CMOS |
| Configuration Memory | — | Nonvolatile on-chip flash, live at power-up (Level 0) |
| Low-Power Feature | — | Flash*Freeze technology |
| Tension d'alimentation | — | 1.5 V |
| Pins / Balls | — | 484 |
| Single-Chip Solution | — | Yes (no external configuration device required) |