A3PE3000L-FG896I vs A3PE3000L-1FG896I Comparaison
Comparaison détaillée côte à côte de A3PE3000L-FG896I par Microchip Technology et A3PE3000L-1FG896I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip
A3PE3000L-FG896I ✓ ActifMicrochip Technology
A3PE3000L-1FG896I - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FG896I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-FG896I | A3PE3000L-1FG896I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $0,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Flash FPGA) |
| System Gates | 3000000 | 3,000,000 |
| Logic Cells | 75264 | 75,264 |
| User I/O | 620 | 620 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| I/O Voltage (minimum) | 1.2 V | — |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | On-chip Flash (non-volatile, single chip) |
| Low Power Feature | Flash*Freeze technology (40% dynamic / 50% static power reduction) | Flash*Freeze Technology |
| Boîtier | 896-BGA (FBGA-896) | 896-ball FBGA (FG896), 1.00 mm pitch |
| Type de montage | Surface Mount | Surface Mount |
| Temperature Grade | Industrial (-I suffix) | — |
| Reprogrammability | Yes (in-system reprogrammable) | Live reprogrammable |
| Statut RoHS | RoHS Non-Compliant (per distributor listing) | [DATA_NEEDED: RoHS status] |
| Lead Free Status | Contains Lead (per distributor listing) | — |
| Speed Grade | [DATA_NEEDED: speed grade / grade code] | -1 |
| Plage de température de fonctionnement | [DATA_NEEDED: exact operating temperature range in C] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM block capacity] | — |
| Process Technology | — | 130 nm CMOS flash |
| Maximum Frequency | — | 892.86 MHz |
| Température de fonctionnement | — | -40C to +85C (Industrial) |
| JTAG Boundary Scan | — | IEEE 1149.1 |
| Input Options | — | Schmitt trigger option on single-ended inputs |
| Pull Options | — | Weak pull-up / pull-down |