AFS600-FGG256I vs M7AFS600-FG256I Comparaison
Comparaison détaillée côte à côte de AFS600-FGG256I par Microchip Technology et M7AFS600-FG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology
AFS600-FGG256I ✓ ActifMicrochip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ ActifComparaison des spécifications
| Paramètre | AFS600-FGG256I | M7AFS600-FG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| System Gates | 600,000 gates | 600K |
| Device Type | Fusion mixed-signal FPGA | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Configuration Memory | Nonvolatile flash | — |
| Power-Up Configuration | Live at Power-Up (LAPU) | — |
| System Performance Frequency | 350 MHz | — |
| Tension d'alimentation | 1.5 V | — |
| Logic Family | CMOS | — |
| Total Pin Count | 256 pins | — |
| Package Type | BGA-256 | — |
| Package Pitch | 1.0 mm | — |
| Package Form | Square | — |
| Terminal Type | Ball | — |
| Température de fonctionnement | 0°C to +70°C | — |
| Temperature Grade | Industrial | — |
| Programmable Analog Resources | Configurable analog blocks | — |
| Embedded Flash | Large flash memory blocks | — |
| Clock Management | Comprehensive clock generation and management circuitry | — |
| Programming Interface | [DATA_NEEDED: programming interface] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Maximum I/O Current | [DATA_NEEDED: maximum I/O current] | — |
| Junction Temperature | [DATA_NEEDED: junction temperature rating] | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Number of I/O | — | 119 I/O |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Boîtier / Format | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Style de montage | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |