ATSAMA5D21C-CU vs ATSAMA5D22C-CU Comparaison
Comparaison détaillée côte à côte de ATSAMA5D21C-CU par Microchip Technology et ATSAMA5D22C-CU par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
ATSAMA5D21C-CU - 500MHz Cortex-A5 MPU | Microchip 196-TFBGA
ATSAMA5D21C-CU ✓ ActifMicrochip Technology
ATSAMA5D22C-CU - 500MHz Cortex-A5 MPU, 196-TFBGA | Microchip
ATSAMA5D22C-CU ✓ ActifComparaison des spécifications
| Paramètre | ATSAMA5D21C-CU | ATSAMA5D22C-CU |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $9,85 | $7,14 |
| Manufacturer | Microchip Technology | — |
| Series | SAMA5D2 | — |
| Core Processor | ARM Cortex-A5 | — |
| Number of Cores | 1 | — |
| Bit Width | 32-bit | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| L1 Instruction Cache | 32 KB | 32 KB |
| L1 Data Cache | 32 KB | 32 KB |
| L2 Cache | 128 KB | 128 KB |
| Boîtier | 196-TFBGA 11x11 mm, 0.8 mm pitch | 196-TFBGA (CSBGA) 11x11 mm |
| Integrated DRAM | Up to 1 Gbit DDR2 or 2 Gbit LPDDR2 SDRAM (SiP) | — |
| External Memory Bus | DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, eMMC, SD/MMC | — |
| Ethernet | 10/100/1000 Mbps with IEEE 1588 PTP | Dual 10/100 Mbps EMAC with 1588 PTP |
| USB | USB HS Host + Device, USB FS Host + Device | USB HSIC + USB Host/Device |
| CAN | 2x CAN-FD | Dual CAN-FD |
| Other Connectivity | 2x SD/SDIO/MMC, I2C, SPI, UART, I2S | — |
| ADC | 12-bit ADC | — |
| Graphics | LCD controller (up to 1024x768) | — |
| Crypto Accelerators | AES, SHA, TRNG, secure boot, tamper detection | — |
| Audio | Class D amplifier, I2S, S/PDIF | — |
| Backup Mode Current | 5 uA | — |
| Plage de température de fonctionnement | -40C to +85C (industrial) | — |
| Grade | Industrial (green, MRLC) | — |
| Type de montage | Surface Mount (TFBGA) | Surface Mount (BGA) |
| Niveau MSL | 3 | — |
| Statut RoHS | Compliant | Compliant |
| Core Architecture | — | ARM Cortex-A5 (32-bit) |
| Core Count | — | 1 |
| NEON Media Engine | — | Yes |
| External Memory Support | — | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC |
| 2D Graphics Engine | — | Yes (up to WXGA 1366x768) |
| LCD Interface | — | 24-bit, up to 1366x768 |
| Ball Pitch | — | 0.8 mm |
| Température de fonctionnement | — | -40C to +85C (industrial) |
| Cryptographic Accelerator | — | AES, SHA, TRNG (hardware) |
| Peripheral Touch Controller | — | PTC (embedded) |
| Audio Subsystem | — | Embedded (I2S, SSC) |